200927962 九、發明說明 【發明所屬之技術領域】 本發明是關於執行所期望之圖案蒸鍍用的遮罩’特別 是關於能夠精度佳執行極高精細圖案蒸鍍的蒸鍍遮罩° 此外，本發明是關於具備有執行所期望之圖案蒸鍍用 的蒸鍍遮罩之蒸鍍遮罩裝置，特別是關於具備有能夠精度 佳執行極高精細圖案之蒸鍍遮罩的蒸鍍遮罩裝置。 ^ 再加上，本發明是關於執行所期望之圖案蒸鑛用的蒸 鍍遮罩之製造方法，特別是關於能夠精度佳執行極高精細 圖案蒸鍍的蒸鍍遮罩之製造方法。 又加上，本發明是關於具備有執行所期望之圖案蒸鍍 用的蒸鍍遮罩之蒸鍍遮罩裝置的製造方法，特別是關於具 備有能夠精度佳執行極高精細圖案蒸鍍之蒸鍍遮罩的蒸鍍 遮罩裝置之製造方法。 另外’本發明是關於被使用在執行所期望之圖案蒸鍍 〇 用的蒸鍍遮罩之片狀構件的製造方法，特別是關於能夠精 度佳執丫了極局精細圖案蒸鑛的蒸鑛遮罩用片狀構件之製造 方法。 【先前技術】 習知’已知有使用具有以所期望圖案排列之孔的蒸鍍 用遮罩，以所期望之圖案形成薄膜的方法。接著，最近對 於例如有機EL顯示裝置製造時將有機材料蒸鍍在基板上 的作業等’強烈希望能夠經由蒸鍍執行極高精細的圖案製 -4- 200927962 作。 另外，上述的蒸鍍用遮罩，一般是對金屬板使用光刻 法技術的蝕刻形成孔，藉此製造出蒸鍍用遮罩（例如 JP2004-3 93 1 9A號公報）。此外，利用蝕刻在金屬板形成 孔的場合，有從金屬板兩方側的面進行蝕刻的方法，和只 從金屬板一方側的面進行蝕刻的方法。 〇 【發明內容】 然而，使用經蝕刻製作形成的蒸鍍遮罩時，有時會有 無法精度佳執行極高精細圖案蒸鍍的問題。本案發明人針 對該問題的原因進行了調查硏究的結果，確認有下述事項 〇 使用光刻法技術的鈾刻是從金屬板當中未覆蓋有抗蝕 膜的區域開始浸蝕。然後，浸蝕不僅是朝金屬板厚度方向 進行而已，還朝沿著金屬板板面的方向進行。因此，經由 〇 蝕刻在金屬板就會逐漸形成有前端細的孔。基於此，從金 屬板2兩方側的面進行蝕刻時，如第1 1圖所示，於金屬 板2厚度方向端部以外的部份在孔2a內會形成有剖面積 (開孔面積）最小的突出部3。接著，使用該狀態的蒸鍍 遮罩1執行蒸鍍後，成膜在基板4當中對應突出部3背側 的區域的蒸鍍膜5的膜厚是不穩定。其結果’蒸鏟圖案的 緣部會模糊不清（蒸鍍圖案輪廓不明顯）°此外’本來對 於形成在孔內的突出部之位置或剖面形狀的控制就屬困難 。基於上述原因，得知從兩方側的面進行金屬板蝕刻是無 -5- 200927962 法精度佳進行極高精細圖案蒸鍍。 另一方面，只從上方側的面進行金屬板蝕刻時，經由 浸蝕形成的前端概的孔，會殘留有經浸蝕使用後浸蝕能力 變低的飩刻液。然後，當金屬板的孔逐漸形成至下方側的 面時，至此爲止殘留在孔內的蝕刻液會從下方的面流出， 接著流入由浸鈾能力高的新鮮蝕刻液形成的孔內。此時， 剖面積（開孔面積）形成較小的孔內下方側的區域其液壓 0 會變高，使孔內下方側的區域受到新鮮蝕刻液激烈浸蝕。 其結果，和從金屬板兩側進行蝕刻的狀況相同，孔內還是 會形成有突出部。 此外，隔著抗蝕膜7只從金屬板6的下方側的面進行 蝕刻時’如第1 2圖所示，當經由浸蝕形成的前端細的孔 6a貫通金屬板6時，在上側面的孔周圍，有時會殘留有蝕 刻液8。其結果，殘留的蝕刻液也會從上方側的面開始浸 蝕金屬板，導致和從金屬板兩側進行蝕刻時的狀況相同， 〇 孔內還是會形成有突出部。 基於上述的狀況，即使是只從金屬板一方側的面進行 蝕刻還是會造成蒸鍍圖案模糊不清（蒸鍍圖案輪廓不明顯 )。此外’本來，從金屬板一方側的面進行蝕刻時，孔貫 通後蝕刻液開始流入時所產生的壓力有時就會導致孔剖面 形狀不齊。於是’在該狀況下，要精度佳形成有所期望形 狀的孔本來就屬困難。對於執行上述高精細圖案製作用的 蒸鍍遮罩，上述現象更爲明顯。基於上述，可得知即使是 只從金屬板一方側的面進行蝕刻還是無法精度佳執行極高 -6 - 200927962 精細圖案蒸鍍。 於是，本發明是有鑑於上述問題所硏創的發明’目的 是提供一種能夠執行極高精細圖案製作的蒸鍍遮罩。 此外，本發明是以提供一種具備有能夠執行極高精細 圖案製作之蒸鍍遮罩的蒸鍍遮罩裝置爲目的。 再加上，本發明是以提供一種製造能夠執行極高精細 圖案製作之蒸鍍遮罩的製造方法爲目的。 0 又加上，本發明是以提供一種製造備有能夠執行執行 極高精細圖案製作之蒸鍍遮罩的蒸鍍遮罩裝置之製造方法 爲目的。 另外，本發明是以提供一種被使用在能夠執行極高精 細圖案製作之蒸鍍遮罩之片狀構件的製造方法爲目的。 本發明的蒸鍍遮罩之製造方法，其特徵爲，具備：可 供應具有樹脂製薄片和層疊在上述樹脂製薄片上之金屬製 薄片的層疊體的層疊體供應步驟；對所供應的層疊體進行 φ 蝕刻，使金屬製薄片形成有多數孔的層疊體蝕刻步驟；及 蝕刻步驟後，從上述層疊體去除上述樹脂製薄片的樹脂製 薄片去除步驟。 本發明的蒸鍍遮罩之製造方法中，也可構成於上述層 疊體蝕刻步驟，使沿著一方向排列配置的多數孔形成爲各 個沿著正交於上述一方向的另一方向延伸的多數孔。如上 述蒸鍍遮罩之製造方法的上述樹脂製薄片去除步驟，也可 構成爲將上述金屬製薄片和上述樹脂製薄片沿著上述另一 方向逐漸分離。此外’如上述蒸鍍遮罩之製造方法，也可 200927962 構成爲將上述層疊體沿著上述另一方向供應。 另外，於本發明的蒸鍍遮罩之製造方法的上述層疊體 蝕刻步驟中，也可構成爲將以指定圖案配置有複數孔的有 孔區域複數形成在金屬製薄片，藉此製造出可具多面的蒸 鍍遮罩。 再加上，於本發明的蒸鍍遮罩之製造方法的上述層疊 體供應步驟中，也可構成爲所供應的層疊體具有經U V光 ❹ 照射就會降低其對上述金屬製薄片之黏合力的樹脂製薄片 ，於上述樹脂製薄片去除步驟中，對上述樹脂製薄片照射 UV光，使上述金屬製薄片和樹脂製薄片分離。 又加上，於本發明的蒸鍍遮罩之製造方法的上述層疊 體供應步驟中，也可構成爲對捲繞有上述層疊體的卷體進 行開卷藉此供應帶狀延伸的層疊體。 本發明的蒸鍍遮罩，其是上述任一製造方法所製造的 蒸鍍遮罩，其特徵爲，形成在上述蒸鍍遮罩的孔的剖面積 是從上述蒸鑛遮罩一方的面朝另一方的面逐漸變小。 本發明的蒸鍍遮罩中，針對正交於蒸鍍遮罩薄片面的 剖面’將上述孔的上述一方的面側的端部和上述另一方的 面側的端部連接形成的直線與上述另一方的面所形成的角 度爲6 0°以下。 本發明的蒸鍍遮罩裝置，其特徵爲，具備··上述任一 製造方法所製造的蒸鍍遮罩；及與上述蒸鍍遮罩安裝成固 定的框架’形成在上述蒸鍍遮罩的孔的剖面積是從上述蒸 鍍遮罩一方的面朝另一方的面逐漸變小。 -8- 200927962 本發明的蒸鍍遮罩裝置中，針對正交於蒸鎪遮罩薄片 面的剖面，也可形成上述孔的上述一方的面側的端部和上 述另一方的面側的端部連接形成的直線與上述另一方的面 所形成的角度爲60°以下。 本發明的蒸鍍遮罩裝置之製造方法，是一種具備有蒸 鍍遮罩及與蒸鍍遮罩安裝成固定的框架之蒸鍍遮罩裝置的 製造方法，其特徵爲，具備：可供應具有樹脂製薄片和層 Q 疊在上述樹脂製薄片上之金屬製薄片的層疊體的層疊體供 應步驟；對所供應的層疊體進行蝕刻，使金屬製薄片形成 有多數孔的層疊體蝕刻步驟；蝕刻步驟後，從上述層疊體 去除上述樹脂製薄片的樹脂製薄片去除步驟；及蝕刻步驟 後，將上述框架安裝在上述金屬製薄片的框架安裝步驟。 本發明的蒸鍍遮罩裝置之製造方法，也可構成爲在上 述樹脂製薄片去除後，實施上述框架安裝在上述上述金屬 製薄片的框架安裝步驟。或者，本發明的蒸鍍遮罩之製造 〇 方法，也可構成爲在上述框架安裝步驟後，實施上述樹脂 製薄片去除步驟。 本發明蒸鍍遮罩裝置之製造方法的上述層疊體蝕刻步 驟中，也可構成爲將沿著一方向排列配置的多數孔形成爲 各個沿著正交於上述一方向的另一方向延伸的多數孔。於 上述蒸鍍遮罩之製造方法的上述樹脂製薄片去除步驟中， 也可構成爲沿著上述另一方向使上述金屬製薄片和上述樹 脂製薄片逐漸分離。此外，於上述蒸鍍遮罩之製造方法中 ，也可構成爲將上述層疊體沿著上述另一方向供應。 -9- 200927962 此外，於本發明的蒸鍍遮罩裝置之製造方法的上述層 疊體蝕刻步驟中，也可構成爲以指定圖案配置有複數孔的 有孔區域是複數形成在金屬辱薄片，藉此製造出可具多面 的蒸鍍遮罩配置。 再加上，於本發明的蒸鍍遮罩裝置之製造方法的上述 層疊體供應步驟中，也可構成爲所供應的層疊體具有經 UV光照射就會降低其對上述金屬製薄片之黏合力的樹脂 ◎ 製薄片，於上述樹脂製薄片去除步驟中’對黏合層照射 UV光，就可使上述金屬製薄片和樹脂製薄片分離。 又加上，於本發明的蒸鍍遮罩裝置之製造方法的上述 層疊體供應步驟中’也可構成爲對捲繞有上述層疊體的卷 體進行開卷供應帶狀延伸的層疊體。 本發明的蒸鍍遮罩用片狀構件之製造方法，是一種製 造被使用在形成有多數孔之蒸鑛遮罩的片狀構件之蒸鑛遮 罩用片狀構件的製造方法’其特徵爲’具備：可供應具有 Φ 樹脂製薄片和層疊在上述樹脂製薄片上之金屬製薄片的層 疊體的層疊體供應步驟；對所供應的層疊體進行蝕刻，使 金屬製薄片形成有多數孔的層疊體鈾刻步驟；及蝕刻步驟 後，從上述層疊體去除上述樹脂製薄片的樹脂製薄片去除 步驟。 本發明的蒸鑛遮罩用片狀構件之製造方法的上述層疊 體鈾刻步驟，也可構成爲將沿著一方向排列配置的多數孔 形成爲各個沿著正交於上述一方向的另一方向延伸的多數 孔。如上述蒸鍍遮罩用片狀構件之製造方法的上述樹脂製 10- 200927962 薄片去除步驟，也可構成爲沿著上述另一方向使上述金屬 製薄片和上述樹脂製薄片逐漸分離。此外，如上述蒸鍍遮 罩用片狀構件之製造方法，也可;構成爲將上述層疊體沿著 上述另一方向供應。 此外，本發明的蒸鍍遮罩用片狀構件之製造方法的上 述層疊體蝕刻步驟，也可構成爲以指定圖案配置有複數孔 的有孔區域是複數形成在金屬製薄片，藉此製造出可具多 H 面的蒸鍍遮罩的薄片狀構件。 再加上，於本發明的蒸鍍遮罩用片狀構件之製造方法 的上述層疊體供應步驟中，也可構成爲所供應的層疊體具 有經UV光照射就會降低其對上述金屬製薄片之黏合力的 樹脂製薄片，於上述樹脂製薄片去除步驟中，對黏合層照 射UV光，就可使上述金屬製薄片和樹脂製薄片分離。 又加上，於本發明的蒸鍍遮罩用片狀構件之製造方法 的上述層疊體供應步驟中，也可構成爲對捲繞有上述層疊 〇 體的卷體進行開卷供應帶狀延伸的層疊體。 根據本發明時，所獲得的蒸鍍遮罩其剖面積從一方的 面朝另一方的面逐漸變小的同時高精度形成有另一方的面 的形狀。因此，採用該蒸鍍遮罩時，能夠精度佳執行極高 精細圖案蒸鍍。 【實施方式】 [發明之最佳實施形態] 以下’參照第1圖至第10圖對本發明的蒸鍍遮罩、 -11 - 200927962 蒸鍍遮罩裝置、蒸鍍遮罩之製造方法、蒸鍍遮罩裝置之製 造方法，及蒸鍍遮罩用片狀構件之製造方法的一實施形態 進行說明。於此，第1圖至第1 〇 i圖爲本發明的一實施形 態說明圖。另，以下的實施形態，是以有機EL顯示裝置 製造時將有機發光材料佈置形成所期望的圖樣在玻璃基板 上所使用的蒸鍍遮罩（蒸鍍用的金屬遮罩）、蒸鍍遮罩裝 置、蒸鍍遮罩之製造方法、蒸鍍遮罩裝置之製造方法，及 Q 蒸鍍遮罩用片狀構件爲例子進行說明。不過，本發明並不 限定於上述應用，還可應用在各種用途所使用的蒸鍍遮罩 (蒸鍍用的金屬遮罩）、蒸鍍遮罩裝置、蒸鍍遮罩之製造 方法、蒸鍍遮罩裝置之製造方法，及蒸鍍遮罩用片狀構件 〇 首先，主要先參照第1圖至第5圖對利用本發明蒸鍍 遮罩之製造方法及蒸鍍遮罩裝置之製造方法所製造獲得的 蒸鍍遮罩及蒸鍍遮罩裝置的一例進行說明。於此，第1圖 〇 爲表示蒸鍍遮罩及蒸鍍遮罩裝置的一例透視圖，第2圖爲 蒸鍍遮罩及蒸鍍遮罩裝置的使用方法說明圖。 如第1圖至第4圖所示，本實施形態的蒸鍍遮罩裝置 10，具備：矩形狀金屬製薄片形成的蒸鍍遮罩20;及安裝 在蒸鍍遮罩2 0周緣部的框架1 5。蒸鍍遮罩2 0是由形成有 多數孔25 (參照第4圖）的金屬製片狀構件形成。該蒸鍍 遮罩裝置10，如第2圖所示，其蒸鍍遮罩20是和玻璃基 板42成對面支撐在蒸鍍裝置40內。蒸鍍裝置40內，在 隔著該蒸鍍遮罩裝置1 〇位於玻璃基板4 2的下方，配置有 -12- 200927962 蒸鍍材料（其一例爲有機發光材料）48收容用的熔爐44 和熔爐44加熱用的加熱器46。熔爐44內的蒸鍍材料48 是經由加熱器46的加熱形成爲氣化或昇華附著在玻璃基 板42的表面。如上述，蒸鍍遮罩20形成有多數的孔25， 蒸鍍材料48是透過該孔25附著在玻璃基板42。其結果， 就能夠以蒸鍍遮罩20的孔25位置所對應的期望圖案使蒸 鍍材料48成膜在玻璃基板42的表面。 φ 如第1圖所示，本實施形態中，蒸鍍遮罩20，其平面 方向爲大致四角形的形狀，再加上，正確地說其具有平面 方向爲大致矩形的輪廓。蒸鍍遮罩20，具有：形成有孔 25的有孔區域22 ;及沒有孔25形成，其區域位於包圍著 有孔區域2 2的無孔區域2 3。如第1圖所示，各有孔區域 22，其平面方向爲大致四角形的形狀，再加上，正確地說 其具有平面方向爲大致矩形的輪廓。 本實施形態中，複數的有孔區域22是沿著和蒸鍍遮 0 罩20 —邊平行的一方向隔著指定間隔形成配置的同時， 沿著和上述一方向正交的另一方向隔著指定間隔形成配置 。本實施形態中，形成爲一個有孔區域2 2對應一個有機 EL顯不裝置。即，根據第1圖所示的蒸鍍遮罩裝置ι〇( 蒸鑛遮罩20)時，可執行具多面蒸鑛。 此外，如第1圖及第3圖所示，設置在各多孔區域22 的複數孔2 5 ’於該有孔區域22是沿著一方向隔著等間隔 排列配置。另外’各孔2 5是形成和正交於上述一方向的 另一方向平行，從有孔區域22的一端成細長延伸至另一 -13- 200927962 端。此外’如第4圖所示，沿著金屬製薄片3 4的薄片面 形成剖面的各孔25的剖面積是從片狀所形成的蒸鍍遮罩 20的一方的面20a朝另—方的面2〇b逐斯變小。於此，第 3圖是蒸鍍遮罩20從一方的面2〇a側看的局部平面圖，第 4圖是沿著第3圖IV-iv剖線的面圖。 然而’如第5圖所示’當蒸鍍遮罩裝置1〇收容在蒸 鍍裝置40時’其蒸鍍遮罩20的一方的面20a是和保持著 φ 蒸鍍材料48的熔爐44成對面，蒸鍍遮罩20的另一方的 面20b是和玻璃基板42成對面。即，如第5圖所示，蒸 鍍材料4 8是通過剖面積逐漸變小的孔2 5附著在玻璃基板 42。如第5圖所示’有時蒸鑛材料48從熔爐44往玻璃基 板42的移動並非直線移動，而是對玻璃基板42的板面成 斜向移動。此時，孔2 5的剖面形狀若形成爲如第5圖虛 線所示具有輪廓的形狀時，斜向移動的蒸鍍材料4 8就會 附著在蒸鍍遮罩20而不會到達玻璃基板42。 φ 即，若要提昇蒸鍍材料的利用效率（成膜效率：附著 在玻璃基板42的比率）節省高價的蒸鍍材料，則於蒸鍍 遮罩20薄片面正交的剖面（第5圖的剖面）中，一方的 面20a側的孔25的端部及另一方的面20b側的孔25的端 部連接形成的直線L與另一方的面20b所形成的角度0最 好是形成較小爲佳。但是，針對玻璃基板42的垂線成大 角度朝玻璃基板42移動的蒸鍍材料的比率是較少。接著 ，當上述的直線L對另一方的面20b形成的角度0爲60 °以下時，就可獲得蒸鍍材料利用效率充份的値。 -14- 200927962 另，當角度β逐漸變小時，如第5圖二點虛線所示， 彼此相鄰的孔25的壁面彼此會接觸。如此一來，若是考 慮到蒸鍍遮罩2 0的強度時，則相鄰的孔2 5的壁面彼此不 接觸會比較好，若針對一方的面20a使相鄰的孔25之間 形成有5 // m以上的平坦面時則更佳。 即，直線L對另一方的面20b形成的角度0，最好是 成爲能夠針對一方的面2 0 a使相鄰的孔2 5之間形成有5 // Q m以上平坦面的角度以上，且爲 60°以下。 如以上所述，本實施形態中，各孔2 5是於各有孔區 域22成等間隔配置。其一例，當蒸鍍遮罩20 (蒸鍍遮罩 裝置1 0 )是使用在製作行動電話或數位相機等的顯示器（ 2〜3英吋左右）時，孔2 5的排列節距P (參照第4圖） ’就能夠爲 84/zm( 300ppi)以上且 254/zm(100ppi)以 下程度。另，若欲執行彩色顯示時，也可將蒸鍍遮罩20 ( 蒸鍍遮罩裝置丨〇 )和玻璃基板42沿著孔25的排列方向（ © 上述的~方向）進行少量相對移動，依順序蒸鍍紅色用有 機發光材料、綠色用有機發光材料及藍色用有機發光材料 。此外’當蒸鍍遮罩20(蒸鍍遮罩裝置10)是使用在製 作行動電話的顯示器時’各孔25其沿著排列方向（上述 的一方向）的寬度（窄縫寬）W，可形成爲28 以上且 84以m以下程度。 另〜方面，蒸鍍遮罩裝置10的框架15是安裝在矩形 狀蒸鑛遮罩2〇的周緣部。框架15是將蒸鍍遮罩2〇保持 成張貼狀態避免蒸鍍遮罩2〇撓曲變形。蒸鍍遮罩20和框 -15- 200927962 架1 5 ’例如是利用點焊焊接成彼此固定著。 蒸鍍遮罩裝置10是保持在成爲高溫環境氣體的蒸鍍 裝置40內部。因此，爲了防止蒸鍍框架的轉曲或熱應力 的產生，蒸鍍遮罩20及框架15，最好是由熱膨脹係數低 的同一材料製成爲佳。該材料，例如可使用3 6 % N i鋼材。 其次’主要是使用第6圖至第9圖對上述蒸鑛遮罩20 及蒸鍍遮罩裝置10的製造方法進行說明。其中第6圖是 0 蒸鍍遮罩之製造方法說明圖。 如第6圖所示，本實施形態的蒸鍍遮罩之製造方法， 包括：可供應具有樹脂製薄片32和層疊在樹脂製薄片32 上之金屬製薄片34的層疊體30之層疊體供應步驟；使用 光刻法技術對層疊體3 0的金屬製薄片3 4進行蝕刻，使金 屬製薄片3 4形成有多數孔25的層疊體蝕刻步驟；及蝕刻 步驟後，從層疊體30去除樹脂製薄片32的樹脂製薄片去 除步驟。 φ 如第6圖所示，本實施形態中，準備有將層疊體3 0 捲繞在供應芯筒31的層疊體卷體29。接著’旋轉該供應 芯筒31對卷體29進行開卷，如第6圖所示藉此供應帶狀 延伸的層疊體30。於此，層疊體30是以金屬製薄片34位 於下方位置的同時樹脂製薄片32位於上方位置形成供應 〇 另，層疊體30的金屬製薄片34，如以下說明是成爲 形成有孔25的蒸鍍遮罩20。因此，如以上所述’金屬製 薄片3 4，例如是由3 6 % N i鋼材形成。不過’並不限於此 -16- 200927962 ，金屬製薄片34也可使用由不鏽鋼、銅、鐵、鋁形成的 薄片。 另一方面，樹脂製薄片32，例如是可使用具有50 y m 〜15〇em程度厚度的聚對苯二甲酸乙二醇酯或聚丙烯形 成的薄片。本實施形態中，是使用經UV光照射就會降低 其對金屬製薄片34之黏合力的樹脂製薄片32。具體而言 ，樹脂製薄片32，可形成爲具有：由聚對苯二甲酸乙二醇 q 酯形成的基材薄片32a ;及層疊在基材薄片32a上的同時 和金屬製薄片32成對面的UV剝離層32b(參照第7圖及 第8圖）。 於此，所謂UV剝離層32b是指當初具有黏合力，可 黏合著基材薄片32a和金屬製薄片34，當照射UV光時所 照射的部份其黏合力會降低的層。例如：當照射UV光時 ，所照射的部份會凝固以致其對金屬製薄片34的接合力 降低。該UV剝離層32b，例如是可由丙烯酸系UV再剝 D 離型黏合劑形成。 所供應的層疊體3 0是由蝕刻裝置（蝕刻手段）5 0施 以蝕刻處理。具體而言，首先，在層疊體30的金屬製薄 片3 4的面上（第7圖紙面下側的面上）塗抹感光性抗蝕 劑材料，使金屬製薄片3 4上形成有抗蝕膜3 6。其次，準 備可使光不透過除去抗蝕膜36之區域的玻璃乾板37,將 玻璃乾板3 7配置在抗蝕膜3 6上。 然後，如第7圖所示，越過玻璃乾板3 7對抗蝕膜3 6 進行曝光，再加上又對抗蝕膜3 6進行顯像。經由以上所 -17- 200927962 述，就可使抗蝕圖案36a形成在層疊體30的金屬製薄片 34上。 另，也可事先將玻璃乾板37當中應去除的抗_膜36 對面的區域形成爲黑色，使用可視光做爲曝光的光。於該 狀況時，藉由黑色部份吸收可視光使光不入射在抗蝕膜36 的應去除區域，因此抗蝕膜36不會固定在金屬製薄片34 上。另一方面，光會入射在抗蝕膜36的不應去除區域， 0 使該區域的抗蝕膜36固定在金屬製薄片34上。不固定的 抗蝕膜3 6，例如是利用熱水清洗去除。 接著，如第8圖所示，對形成在金屬製薄片34上的 抗蝕圖案3 6a進行遮罩，用蝕刻液（例如氯化鐵溶液）3 8 對層疊體3 6進行蝕刻。本實施形態中，蝕刻液3 8，是從 配置在所搬運過來的層疊體3 0下方的蝕刻裝置5 0的噴嘴 51越過抗蝕圖案3 6a朝金屬製薄片34 —方的面34a噴射 。此時，如第8圖的虛線所示，飽刻液就會開始浸餘金屬 φ 製薄片34當中未覆蓋有抗蝕圖案3 6a的區域。然後，浸 蝕，不僅朝金屬製薄片34的厚度方向進行，還會沿著金 屬製薄片3 4的薄片面持續進行。如此一來，蝕刻液的浸 蝕就會從金屬製薄片34 —方的面34a前進至另一方的面 3 4b，形成貫通金屬製薄片34的孔25。 然後，除去層疊體30上的抗蝕圖案36a，再加上又對 層疊體30進行清洗。如此一來，在樹脂製薄片32上，就 可獲得由形成有多數孔25的金屬製薄片34形成的蒸鍍遮 罩用片狀構件1 8。 -18- 34 200927962 此外’若沒有設置樹脂製薄片3 2時，如以上所述 在金屬製薄片34經貫通形成有孔25之後，金屬製薄片 另一方的面3 4 b側會滯留有餓刻液’以致會獲得形狀及 寸都不穩定具有瑕脏的孔25。但是’根據本實施形態時 即使形成有貫通金屬製薄片34的孔25，該孔25其上方 是由樹脂製薄片32覆蓋著。因此’能夠確實避免習知 法所產生的瑕疵。其結果，使浸蝕只從金屬製薄片34 0 方的面3 4 a側前進’形成在金屬製薄片3 4的孔2 5的剖 積’是從一·方的面34a、20a朝另一方的面34b、20b逐 變小。此外’還可精度佳形成具有所期望開孔面積（平 方向的孔25面積）的孔25。 然後’經上述蝕刻的層疊體3 0，是以夾持該層疊 30的狀態進行旋轉的一對搬運輥57、57搬運至去除裝 (去除手段）54內。另，該搬運輥57、57的旋轉會對 疊體30作用應力（拉力）使上述供應芯筒31旋轉，形 0 從卷體29供應層疊體30。 另外，本實施形態中，金屬製薄片34是由樹脂製 片32支撐及補強著。因此，在層疊體30搬運時，作用 孔2 5和孔2 5之間的應力能夠格外抑制金屬製薄片3 4 孔2 5和孔2 5之間被切斷，或抑制孔2 5和孔2 5之間延 成線狀的部份纏繞等問題。其結果，能夠避免蝕刻步驟 形成在金屬製薄片34的微細孔25的形狀於後續步驟受 的問題。 另，如上述當沿著排列方向的正交方向形成細長延 尺 9 側 方 面 漸 面 體 置 層 成 薄 在 的 伸 中 損 伸 -19- 200927962 的孔25時，以孔25延伸方向（上述另一方向）和層疊體 30供應方向（層疊體搬運方向）大致平行爲佳。於該狀況 時，能夠有效防止金屬製薄片3 4的孔2 5和孔2 5之間被 切斷’或抑制孔2 5和孔2 5之間延伸成線狀的部份纏繞。 如第9圖所示，本實施形態的去除裝置54，具有設置 在搬運輥5 7下游側的UV光照射手段5 5。UV光照射手段 5 5 ’具有沿著層疊體3 0的移動路徑設置，從樹脂製薄片 32側覆蓋層疊體30的遮蔽罩55a;及配置在遮蔽罩55a 內的UV光源55b。接著’搬運過來的層疊體30是從樹脂 製薄片32側受到UV光照射，由透過樹脂製薄片32的基 材薄片32a的UV光使基材薄片32a和蒸鍍遮罩20 (金屬 製薄片34 )黏合的UV剝離層32b的黏合力大幅降低。其 結果’使成爲層疊體3〇的樹脂製薄片32和金屬製薄片34 (蒸鍍遮罩20)能夠分離，如第9圖所示，樹脂製薄片 32是從金屬製薄片34剝離捲取在捲取芯筒58。 另，樹脂製薄片32從金屬製薄片34拉開剝離的方向 ，是以平行於形成在金屬製薄片34的孔25的延伸方向（ 上述另一方向）爲佳。沿著該方向將樹脂製薄片32從金 屬製薄片34分離時，能夠有效防止金屬製薄片34的孔25 和孔2 5之間被切斷，或抑制孔2 5和孔2 5之間延伸成線 狀的部份纏繞。 如此一來，就可獲得形成有多數孔25的金屬製薄片 34，利用切斷裝置（切斷手段）59將金屬製薄片34切斷 成指疋長度，就可獲得薄片狀的蒸鍍遮罩20。接著，對各 -20- 200927962 蒸鍍遮罩20安裝框架15就可獲得蒸鍍裝置10。另，框架 15可以是安裝在蒸鍍遮罩20 —方的面20a，也可以是安 裝在蒸鍍遮罩20另一方的面20b。 根據以上所述的本實施形態時，可不斷處理層疊在樹 脂製薄片32上的金屬製薄片34。因此，對金屬製薄片34 只要從一方的面3 4a側進行蝕刻就能夠形成貫通金屬製薄 片34的孔25。於該狀況時，孔25是貫通金屬製薄片34 @ ’但位於金屬製薄片34另一方的面34b側的孔25的端部 是由樹脂製薄片32覆蓋著。即，孔25並沒有貫通層疊體 3 0，因此能夠避免上述的習知問題點，如此一來，就可獲 得從一方的面20a朝另一方的面20b形成有剖面積逐漸變 小之孔2 5的蒸鍍遮罩2 0。此外，還能夠精度佳製成以高 精細圖案形成開孔的蒸鍍遮罩20。根據該蒸鍍遮罩20時 ，能夠精度佳執行高精細圖案蒸鍍。 因此’經由上述作業所獲得的蒸鍍遮罩20，非常適用 φ 在有機EL顯示裝置製造時例如將有機發光材料以所期望 的圖案佈置在玻璃基板42上所使用的蒸鍍遮罩（蒸鍍用 的金屬製遮罩）。 此外，根據本實施形態時，能夠明顯降低形成孔25 之後的搬運時作用在層疊體30當中的金屬製薄片34的應 力（拉力），能夠明顯降低金屬製薄片34的孔25和孔25 之間的切斷作用應力產生，及明顯降低金屬製薄片34的 孔2 5和孔2 5之間延伸成線狀部份的纏繞作用應力的產生 。因此’能夠防止已精度良好形成在蒸鑛遮罩20上的孔 -21 - 200927962 於後續步驟受損。 再加上，根據本實施形態時，於層疊體3 0供應 中，對捲繞有層疊體3〇的卷體29進行開卷供應帶狀 的層疊體30。該卷體29是可廉價購入’再加上使用 方面非常理想。 另，關於上述的實施形態，在本發明主旨範圍內 進行各種變更。以下，針對變形例的一例進行說明。 上述的實施形態中，揭示著以UV光照射在樹脂 片32使樹脂製薄片32從層疊體30去除的例子，但 製薄片3 2的去除方法並不限於此。例如也可將層疊f 送入加熱爐（去除手段），燃燒層疊體30的樹脂製 32使樹脂製薄片32從層疊體30去除。燃燒去除樹脂 片3 2時，因是使用簡易裝置的簡易方法，所以能夠 影響形成在金屬製薄片34(蒸鍍遮罩20)的孔25之 下使樹脂製薄片32從金屬製薄片34分離。另，燃燒 樹脂製薄片3 2時，不需使用經UV光照射就會降低 合於金屬製薄片34之黏合力的樹脂製薄片32。 此外，上述的實施形態中，揭示著準備有樹脂製 32和金屬製薄片34事先層疊形成的層疊體30進行供 例子，但並不限於此。例如也可在供應帶狀延伸的金 薄片34之同時供應帶狀延伸的樹脂製薄片32，將供 金屬製薄片34和樹脂製薄片32進行黏合製作層疊體 對依順序製成的層疊體3 0施以上述的處理。或者， 在供應帶狀延伸的金屬製薄片34之同時將薄片狀的 步驟 延伸 處理 是可 製薄 樹脂 I 30 薄片 製薄 在不 狀況 去除 其黏 薄片 應的 屬製 應的 30， 也可 樹脂 -22- 200927962 製薄片32不斷層疊在所供應的金屬製薄片34上，對金 製薄片34當中層疊有薄片狀樹脂製薄片32的部份（層 體3 0 )依順序施以上述的處理。或者是，也可在供應帶 延伸的樹脂製薄片32之同時將薄片狀金屬製薄片34不 層疊在所供應的樹脂製薄片32上，對層疊在樹脂製薄 32上的薄片狀金屬製薄片34層疊部份（層疊體30)依 序施以上述的處理。 再加上’上述實施形態中，揭示著將孔2 5形成在 屬製薄片34，又加上在樹脂製薄片32從金屬製薄片34 離後，利用切斷裝置59將金屬製薄片34切斷成指定長 的例子，但並不限於此。例如：金屬製薄片3 4的切斷 驟，也可在金屬製薄片34形成孔25之前進行，再加上 也可在金屬製薄片34形成孔25之後且在樹脂製薄片 從金屬製薄片34分離之前進行。在樹脂製薄片32從金 製薄片34分離之前就將金屬製薄片34切斷成指定長度 ，也可使樹脂製薄片32成爲不切斷程度地對層疊體30 行半切斷只切斷金屬製薄片34，或者是，也可將包括金 製薄片34的層疊體30全體切斷成指定長度。再加上， 可於利用蝕刻形成孔25的步驟中，將金屬製薄片34以 刻進行邊緣切割成指定長度。即，也可在利用鈾刻形成 25時，利用蝕刻使金屬製薄片34分離成指定長度。於 狀況時，可節省需另外將金屬製薄片34切斷成指定長 的作業工時，能夠以高生產效率便宜製造蒸鍍遮罩2〇。 又加上’上述的實施形態中，揭示著蒸鍍遮罩20 屬 疊 狀 斷 片 順 金 分 度 步 > 32 屬 時 進 屬 也 蝕 孔 該 度 切 -23- 200927962 斷成指定長度的例子，但並不限於此 多數孔25的金屬製薄片34以不切斷 用片狀構件1 8使用處理。此例如第 多數孔25的金屬製薄片34形成的蒸 ，也能以不切斷的狀態捲取在捲取芯 用片狀構件18的卷體I8a使用處理 鍍遮罩用片狀構件1 8也是本案的保議 再加上，上述的實施形態中，揭 的蒸鍍遮罩20安裝在框架15的例子 如：也可將樹脂製薄片3 2去除之後 前的金屬製薄片34安裝在框架15。] 後且樹脂製薄片32去除之前的金屬| 15 ° 【圖式簡單說明】 φ 第1圖爲表示本發明的蒸鏟遮罩 實施形態圖。 第2圖爲使用第1圖所示蒸鍍i 蒸鍍方法的說明圖。 第3圖爲表示第1圖所示蒸鍍遮 第4圖爲沿著第3圖的IV-IV線 第5圖爲蒸鍍遮罩作用的說明圖 第6圖爲本發明的蒸鍍遮罩之S 置之製造方法的一實施形態說明圖。 。例如也可將形成有 的狀態做爲蒸鍍遮罩 10圖所示，由形成有 鍍遮罩用片狀構件1 8 筒1 9，作爲蒸鍍遮罩 (出貨等）。另，蒸 I對象。 示著切斷成指定長度 ，但並不限於此。例 且切斷成指定長度之 或者，形成有孔25之 吳薄片34安裝在框架 :及蒸鍍遮罩裝置的一 ;罩及蒸鑛遮罩裝置之 罩的局部平面圖。 的剖面圖。 〇 ;造方法及蒸鍍遮罩裝 -24- 200927962 第7圖爲層疊體（金屬製薄片）抗蝕刻性圖案形成方 法說明圖。 第8圖爲層疊體（金屬製薄片）触刻方法說明圖。 第9圖爲層疊體去除樹脂製薄片時的樹脂製薄片去除 方法說明圖。 第10圖爲第6圖的對應圖，其是蒸鍍遮罩用片狀構 件製造方法說明圖。 φ 第11圖爲第5圖的對應圖，其是使用從兩側鈾刻之 金屬板所形成的蒸鍍遮罩進行蒸鍍時的蒸鍍方法說明圖。 第1 2圖爲第8圖的對應圖，其是從下方側的面蝕刻 金屬板製造出蒸鍍遮罩的蒸鑛遮罩製造方法說明圖。 【主要元件符號說明】 1 _·蒸鍍遮罩 2 :金屬板 ❹ 2a :孔 3 :突出部 4 :基板 5 :蒸鍍膜 6 :金屬板 6a :前端細的孔 7 :抗蝕膜 8 :蝕刻液 10 :蒸鍍遮罩裝置 -25- 200927962200927962 IX. [Technical Field] The present invention relates to a mask for performing desired pattern vapor deposition, in particular, a vapor deposition mask capable of performing extremely high-definition pattern evaporation with high precision. The present invention relates to a vapor deposition mask device including a vapor deposition mask for performing a desired pattern vapor deposition. In particular, there is a vapor deposition mask device having a vapor deposition mask capable of performing extremely high-definition patterns with high precision. ^ Plus, The present invention relates to a method of manufacturing a vapor deposition mask for performing a desired pattern evaporation. In particular, it is a method of manufacturing a vapor deposition mask that can perform extremely high-definition pattern vapor deposition with high precision. Plus, The present invention relates to a method of manufacturing a vapor deposition mask device including a vapor deposition mask for performing a desired pattern vapor deposition. In particular, there is a method of manufacturing a vapor deposition mask device having a vapor deposition mask capable of performing extremely high-definition pattern vapor deposition with high precision. Further, the present invention relates to a method of manufacturing a sheet member used for performing a vapor deposition mask for a desired pattern vapor deposition. In particular, it relates to a method for producing a sheet member for a steam mask which is capable of performing fine-grained fine pattern steaming. [Prior Art] It is known to use a mask for vapor deposition having holes arranged in a desired pattern, A method of forming a film in a desired pattern. then, Recently, for example, an operation of depositing an organic material on a substrate during production of an organic EL display device, etc., is strongly desired to be performed by extremely high-definition patterning by vapor deposition -4-200927962. In addition, The above-mentioned mask for vapor deposition, Generally, the metal plate is etched using a photolithography technique to form a hole. Thereby, a mask for vapor deposition is produced (for example, JP2004-3 93 1 9A). In addition, When etching is used to form a hole in a metal plate, There is a method of etching from the faces on both sides of the metal plate, And a method of etching only from the side of one side of the metal plate. 〇 【Contents】 However, When using an evaporation mask formed by etching, Sometimes there is a problem that the extremely high-definition pattern evaporation cannot be performed with high precision. The inventor of the case investigated the cause of the problem and investigated the results. The following items were confirmed: 铀 The uranium engraving using the photolithography technique is etched from a region of the metal plate which is not covered with a resist. then, The etching is not only carried out in the direction of the thickness of the metal sheet, It also proceeds in the direction along the surface of the sheet metal. therefore, A thin hole at the front end is gradually formed on the metal plate by 〇 etching. Based on, When etching from the faces on both sides of the metal plate 2, As shown in Figure 11, A portion other than the end portion in the thickness direction of the metal plate 2 is formed with a projection 3 having the smallest sectional area (opening area) in the hole 2a. then, After vapor deposition is performed using the vapor deposition mask 1 in this state, The film thickness of the vapor deposited film 5 which is formed in the region of the substrate 4 corresponding to the back side of the protruding portion 3 is unstable. As a result, the edge of the steaming shovel pattern is blurred (the outline of the vapor deposition pattern is not conspicuous). Further, it is difficult to control the position or the cross-sectional shape of the protruding portion formed in the hole. For these reasons, It is known that the metal plate etching from the faces on both sides is not performed. -5-200927962 The precision of the method is extremely high. on the other hand, When the metal plate is etched only from the upper side surface, a hole in the front end formed by etching, An etching solution having a low etching ability after being used by etching may remain. then, When the hole of the metal plate is gradually formed to the lower side surface, The etching liquid remaining in the hole so far will flow out from the lower surface. It then flows into the pores formed by the fresh etching solution with high uranium leaching ability. at this time, The cross-sectional area (opening area) forms a smaller area in the lower side of the hole, and the hydraulic pressure 0 becomes higher. The area on the lower side of the hole is violently etched by the fresh etching solution. the result, The same condition as etching from both sides of the metal plate, A protrusion is formed in the hole. In addition, When etching is performed only from the lower surface side of the metal plate 6 via the resist film 7, as shown in Fig. 2, When the fine hole 6a formed at the front end through the etching penetrates the metal plate 6, Around the hole on the upper side, Occasionally, 8 remains. the result, The residual etchant will also etch the metal plate from the upper side. Causes the same conditions as when etching from both sides of the metal plate, 突出 There will still be protrusions in the holes. Based on the above situation, Even if the etching is performed only from the side of the metal plate, the vapor deposition pattern is blurred (the outline of the vapor deposition pattern is not conspicuous). In addition, 'originally, When etching from the side of one side of the metal plate, The pressure generated when the etchant begins to flow after the hole is passed through sometimes causes the hole profile to be irregular. So, in this situation, It is inherently difficult to form a hole of a desired shape with high precision. For the vapor deposition mask for performing the above high-definition pattern production, The above phenomenon is more obvious. Based on the above, It can be seen that even if etching is performed only from the side of the metal plate, it is impossible to perform extremely high precision -6 - 200927962 fine pattern evaporation. then, The present invention has been made in view of the above problems, and an object of the invention is to provide a vapor deposition mask capable of performing extremely high-definition pattern production. In addition, The present invention has an object of providing a vapor deposition mask device having a vapor deposition mask capable of performing extremely high-definition pattern production. Plus, SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a manufacturing method for producing an evaporation mask capable of performing extremely high-definition patterning. 0 plus, SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a method for producing a vapor deposition mask device which is capable of performing a vapor deposition mask capable of performing extremely high-definition pattern production. In addition, SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a method for producing a sheet member which is used in a vapor deposition mask capable of performing an extremely high precision pattern. A method of manufacturing a vapor deposition mask of the present invention, Its characteristic is that have: A laminate supply step of supplying a laminate of a resin sheet and a metal sheet laminated on the resin sheet; φ etching the supplied laminate, a laminate etching step of forming a metal foil with a plurality of holes; And after the etching step, A resin sheet removing step of removing the resin sheet from the laminate. In the method of manufacturing a vapor deposition mask of the present invention, It can also be constructed in the above-mentioned layer etching step, A plurality of holes arranged in a direction are formed as a plurality of holes each extending in the other direction orthogonal to the one direction. The resin sheet removing step of the method for producing a vapor deposition mask as described above, The metal flakes and the resin flakes may be gradually separated in the other direction. Further, as in the above manufacturing method of the vapor deposition mask, It is also possible to use 200927962 to supply the above laminated body in the other direction. In addition, In the above-described laminate etching step of the method for producing a vapor deposited mask of the present invention, Alternatively, a plurality of perforated regions in which a plurality of holes are arranged in a predetermined pattern may be formed in a metal foil. Thereby, a multi-faceted vapor deposition mask can be produced. Plus, In the above-described laminate supply step of the method for producing a vapor deposition mask of the present invention, It is also possible to configure the laminated body to be supplied with a resin sheet which is irradiated with U V light to reduce the adhesion to the metal sheet. In the above resin sheet removing step, Irradiating the above resin sheet with UV light, The above metal flakes and the resin flakes are separated. Plus, In the above-described laminate supply step of the method for producing a vapor deposition mask of the present invention, The roll body in which the above-mentioned laminated body is wound may be unwound to supply a laminated body extending in a strip shape. The vapor deposition mask of the present invention, It is an evaporation mask manufactured by any of the above manufacturing methods, Its characteristic is that The cross-sectional area of the hole formed in the vapor deposition mask gradually decreases from the surface of the vapor mask to the other surface. In the vapor deposition mask of the present invention, An angle formed by connecting a straight line formed by connecting the end portion on the one surface side of the hole and the end portion on the other surface side to the cross section orthogonal to the vapor deposition mask sheet surface is an angle formed by the straight line formed on the other surface Below 60 °. The vapor deposition mask device of the present invention, Its characteristic is that A vapor deposition mask manufactured by any of the above manufacturing methods; And a frame to be fixed to the vapor deposition mask. The cross-sectional area of the hole formed in the vapor deposition mask gradually decreases from the surface of the vapor deposition mask to the other surface. -8- 200927962 In the vapor deposition mask device of the present invention, For a profile orthogonal to the face of the dip mask, The angle formed by the straight line formed by connecting the end portion on the one surface side of the hole and the end portion on the other surface side of the hole to the other surface may be 60 or less. A method of manufacturing a vapor deposition mask device of the present invention, A method of manufacturing a vapor deposition mask device having a vapor deposition mask and a frame fixed to the vapor deposition mask. Its characteristic is that have: A laminate supply step of a laminate of a metal foil having a resin sheet and a layer Q laminated on the above resin sheet; Etching the supplied laminate, Forming a metal sheet into a laminate etching step having a plurality of holes; After the etching step, a resin sheet removing step of removing the resin sheet from the laminate; And after the etching step, The above frame is attached to the frame mounting step of the above-described metal foil. A method of manufacturing a vapor deposition mask device of the present invention, It may be configured such that after the above resin sheet is removed, The above-described frame is mounted on the frame mounting step of the above-described metal foil. or, Manufacture method of the vapor deposition mask of the present invention, It may also be configured after the above frame mounting step, The above resin sheet removing step is carried out. In the above-described laminate etching step of the method for producing a vapor deposition mask device of the present invention, It is also possible to form a plurality of holes arranged in one direction so as to form a plurality of holes each extending in the other direction orthogonal to the one direction. In the above-described resin sheet removing step of the method for producing a vapor deposition mask, Alternatively, the metal flakes and the resin flakes may be gradually separated in the other direction. In addition, In the manufacturing method of the vapor deposition mask described above, It is also possible to configure the laminate to be supplied in the other direction. -9- 200927962 In addition, In the above-described layer etching step of the method of manufacturing the vapor deposition mask device of the present invention, It is also possible to form a perforated area in which a plurality of holes are arranged in a predetermined pattern, and a plurality of holes are formed in the metal sheet. This produces a multi-faceted vapor deposition mask configuration. Plus, In the above-described laminated body supplying step of the method for producing a vapor deposition mask device of the present invention, It is also possible to configure the laminated body to be supplied with a resin ◎ sheet which is reduced in adhesion to the above-mentioned metal sheet by irradiation with UV light. Irradiating the adhesive layer with UV light in the resin sheet removing step, The above metal flakes and the resin flakes can be separated. Plus, In the above-described laminated body supply step of the method for producing a vapor deposition mask of the present invention, the stacked body in which the above-mentioned laminated body is wound may be unwound and supplied in a strip shape. A method of producing a sheet member for vapor deposition mask of the present invention, It is a method for producing a sheet member for a steam mask for producing a sheet member which is used in a vapor mask having a plurality of holes, and is characterized by: A laminate supply step of supplying a laminate having a Φ resin sheet and a metal sheet laminated on the above resin sheet; Etching the supplied laminate, a laminate uranium engraving step in which a metal foil is formed with a plurality of pores; And after the etching step, A resin sheet removing step of removing the resin sheet from the laminate. The above-described laminated uranium engraving step of the method for producing a sheet member for a vapor mask according to the present invention, Alternatively, a plurality of holes arranged in one direction may be formed as a plurality of holes extending in the other direction orthogonal to the one direction. The above-mentioned resin 10-200927962 sheet removing step of the method for producing a sheet member for vapor deposition mask, The metal flakes and the resin flakes may be gradually separated in the other direction. In addition, As described above, a method of manufacturing a sheet member for vapor deposition mask, also may; The laminate is supplied in the other direction. In addition, The above-described laminate etching step of the method for producing a sheet member for vapor deposition mask of the present invention, Alternatively, the perforated region in which the plurality of holes are arranged in a predetermined pattern may be formed in a plurality of metal sheets. Thereby, a sheet-like member which can have a vapor deposition mask having a plurality of H faces is manufactured. Plus, In the above-described laminated body supply step of the method for producing a sheet member for vapor deposition mask of the present invention, It is also possible to configure the laminated body to be supplied with a resin sheet which is reduced in adhesion to the above-mentioned metal sheet by irradiation with UV light. In the above resin sheet removing step, Applying UV light to the adhesive layer, The above metal flakes and the resin flakes can be separated. Plus, In the above-described laminated body supply step of the method for producing a sheet member for vapor deposition mask of the present invention, The roll body around which the laminated body is wound may be unwound and supplied in a strip shape. According to the invention, The vapor-deposited mask obtained has a shape in which the cross-sectional area gradually decreases from one surface to the other, and the other surface is formed with high precision. therefore, When using the vapor deposition mask, Extremely high precision pattern evaporation can be performed with high precision. [Embodiment] [Best Embodiment of the Invention] Hereinafter, the vapor deposition mask of the present invention will be described with reference to Figs. 1 to 10, -11 - 200927962 Evaporative masking device, a method of manufacturing a vapor deposition mask, a method of manufacturing a vapor deposition mask device, An embodiment of a method for producing a sheet member for vapor deposition mask will be described. herein, Fig. 1 to Fig. 1 are diagrams showing an embodiment of the present invention. another, The following embodiments, A vapor deposition mask (a metal mask for vapor deposition) used for arranging an organic light-emitting material to form a desired pattern on a glass substrate during production of an organic EL display device, Evaporating mask device, a method of manufacturing a vapor deposition mask, a method of manufacturing a vapor deposition mask device, And the sheet member for the Q vapor deposition mask will be described as an example. but, The present invention is not limited to the above applications. It is also applicable to vapor deposition masks (metal masks for vapor deposition) used in various applications. Evaporative masking device, Manufacturing method of vapor deposition mask, a method of manufacturing a vapor deposition mask device, And a sheet member for vapor deposition mask 〇 First, First, an example of a vapor deposition mask and a vapor deposition mask which are manufactured by the method for producing a vapor deposition mask of the present invention and the method for producing a vapor deposition mask will be described with reference to Figs. 1 to 5 . herein, 1 is a perspective view showing an example of a vapor deposition mask and a vapor deposition mask device, Fig. 2 is an explanatory view showing the use of the vapor deposition mask and the vapor deposition mask device. As shown in Figures 1 to 4, The vapor deposition mask device 10 of the present embodiment, have: a vapor deposition mask 20 formed by a rectangular metal sheet; And mounted on the frame 15 of the 20th edge portion of the vapor deposition mask. The vapor deposition mask 20 is formed of a metal sheet member in which a plurality of holes 25 (see Fig. 4) are formed. The vapor deposition mask device 10, As shown in Figure 2, The vapor deposition mask 20 is supported in the vapor deposition device 40 in a pair with the glass substrate 42. In the vapor deposition device 40, It is located below the glass substrate 4 2 via the vapor deposition mask device 1 A furnace 44 for accommodating -12-200927962 vapor deposition material (an example of which is an organic light-emitting material) 48 and a heater 46 for heating the furnace 44 are disposed. The vapor deposition material 48 in the furnace 44 is formed by vaporization of the heater 46 to be vaporized or sublimated to the surface of the glass substrate 42. As above, The vapor deposition mask 20 is formed with a plurality of holes 25, The vapor deposition material 48 is adhered to the glass substrate 42 through the hole 25. the result, The vapor deposition material 48 can be formed on the surface of the glass substrate 42 in a desired pattern corresponding to the position of the hole 25 of the vapor deposition mask 20. φ as shown in Figure 1, In this embodiment, Evaporating the mask 20, The plane direction is a substantially quadrangular shape. Plus, It is correctly said that it has a substantially rectangular outline in the plane direction. Evaporating the mask 20, have: Forming a perforated region 22 having a hole 25; And no holes 25 are formed, Its area is located in a non-porous area 23 surrounded by a perforated area 22. As shown in Figure 1, Each perforated area 22, The plane direction is a substantially quadrangular shape. Plus, It is correctly said that it has a substantially rectangular outline in the plane direction. In this embodiment, The plurality of perforated regions 22 are arranged along a direction parallel to the side of the vapor deposition mask 20 at a predetermined interval. The arrangement is formed at a predetermined interval along the other direction orthogonal to the above-described one direction. In this embodiment, Formed as a perforated area 2 2 corresponds to an organic EL display device. which is, According to the vapor deposition mask device ι〇 (steam mask 20) shown in Fig. 1, Executable with multi-faceted steaming. In addition, As shown in Figures 1 and 3, The plurality of holes 2 5 ' provided in each of the porous regions 22 are arranged at equal intervals in one direction along the one direction. Further, each of the holes 25 is formed in parallel with the other direction orthogonal to the above one direction, Extending from one end of the apertured region 22 to the other -13-200927962 end. In addition, as shown in Figure 4, The cross-sectional area of each of the holes 25 which are formed along the sheet surface of the metal foil 34 is reduced from one surface 20a of the vapor deposition mask 20 formed in a sheet shape to the other surface 2〇b. herein, Fig. 3 is a partial plan view of the vapor deposition mask 20 as seen from the side of one face 2〇a, Fig. 4 is a plan view taken along line IV-iv of Fig. 3. However, as shown in Fig. 5, when the vapor deposition mask device 1 is housed in the vapor deposition device 40, one surface 20a of the vapor deposition mask 20 is opposite to the furnace 44 holding the φ vapor deposition material 48. , The other surface 20b of the vapor deposition mask 20 is opposed to the glass substrate 42. which is, As shown in Figure 5, The vapor deposition material 48 is adhered to the glass substrate 42 through the holes 25 which are gradually reduced in sectional area. As shown in Fig. 5, sometimes the movement of the steamed material 48 from the furnace 44 to the glass substrate 42 does not move linearly. Instead, the plate surface of the glass substrate 42 is moved obliquely. at this time, When the cross-sectional shape of the hole 25 is formed into a contoured shape as shown by the broken line in Fig. 5, The vapor-deposited material 48 which is moved obliquely adheres to the vapor deposition mask 20 without reaching the glass substrate 42. Φ ie, To improve the utilization efficiency of the evaporation material (film formation efficiency: The ratio of adhesion to the glass substrate 42) saves expensive vapor-deposited materials, In the cross section (the cross section of Fig. 5) in which the vapor deposition mask 20 is orthogonal to the sheet surface, It is preferable that the angle L formed by the straight line L formed by connecting the end portion of the hole 25 on the one surface 20a side and the end portion of the hole 25 on the other surface 20b side to the other surface 20b is preferably small. but, The ratio of the vapor deposition material that moves toward the glass substrate 42 at a large angle with respect to the perpendicular line of the glass substrate 42 is small. Then, When the angle L formed by the straight line L described above to the other surface 20b is 60° or less, In order to obtain sufficient utilization efficiency of the vapor deposition material. -14- 200927962 Also, When the angle β gradually becomes smaller, As shown by the dotted line in Figure 5, The walls of the holes 25 adjacent to each other come into contact with each other. As a result, If considering the strength of the vapor deposition mask 20, It is better that the walls of the adjacent holes 25 are not in contact with each other. It is more preferable to form a flat surface of 5 // m or more between adjacent holes 25 for one surface 20a. which is, The angle 0 formed by the straight line L to the other surface 20b, Preferably, it is possible to form an angle of 5 // Q m or more between the adjacent holes 2 5 with respect to one surface 20 a, And it is 60° or less. As mentioned above, In this embodiment, Each of the holes 25 is disposed at equal intervals in each of the perforated regions 22. An example of this, When the vapor deposition mask 20 (the vapor deposition mask device 10) is used in a display (about 2 to 3 inches) such as a mobile phone or a digital camera, The arrangement pitch P (see Fig. 4) of the holes 25 can be 84/zm (300 ppi) or more and 254/zm (100 ppi) or less. another, If you want to perform a color display, The vapor deposition mask 20 (vapor deposition mask 丨〇) and the glass substrate 42 may be moved in a small amount relative to each other along the direction in which the holes 25 are arranged ( © the above-mentioned direction). Evaporating red with organic luminescent materials in sequence, Green organic light-emitting materials and blue organic light-emitting materials. Further, when the vapor deposition mask 20 (the vapor deposition mask device 10) is used in the display for manufacturing a mobile phone, the width (slit width) W of each of the holes 25 in the arrangement direction (one direction described above), It can be formed to be 28 or more and 84 or less in m. Another ~ aspect, The frame 15 of the vapor deposition mask device 10 is attached to the peripheral portion of the rectangular vapor mask 2〇. The frame 15 holds the vapor deposition mask 2〇 in a posted state to avoid deflection of the vapor deposition mask 2〇. The vapor deposition mask 20 and the frame -15-200927962 frame 1 5 ' are fixed to each other by, for example, spot welding. The vapor deposition mask device 10 is held inside the vapor deposition device 40 which is a high-temperature ambient gas. therefore, In order to prevent the occurrence of buckling or thermal stress in the evaporation frame, Evaporating the mask 20 and the frame 15, It is preferably made of the same material having a low coefficient of thermal expansion. The material, For example, 3 6 % N i steel can be used. Next, the manufacturing method of the above-described steam mask 20 and vapor deposition mask 10 will be mainly described using Figs. 6 to 9 . Fig. 6 is an explanatory diagram of the manufacturing method of the 0 vapor deposition mask. As shown in Figure 6, a method of manufacturing a vapor deposition mask according to the embodiment, include: A laminate supply step of a laminate 30 having a resin sheet 32 and a metal sheet 34 laminated on the resin sheet 32; The metal foil 34 of the laminate 30 is etched using a photolithography technique. a laminate etching step of forming a metal sheet 34 into a plurality of holes 25; And after the etching step, The resin sheet removing step of removing the resin sheet 32 from the laminated body 30 is carried out. φ as shown in Figure 6, In this embodiment, A laminated body wrap 29 in which the laminated body 30 is wound around the supply core tube 31 is prepared. Then, the supply core 31 is rotated to unwind the roll 29, The laminated body 30 extending in a strip shape is supplied as shown in Fig. 6. herein, The laminated body 30 is formed such that the metal sheet 34 is positioned at the lower position while the resin sheet 32 is located at the upper position. The metal foil 34 of the laminated body 30, As will be described below, the vapor deposition mask 20 is formed with the holes 25. therefore, As described above, 'metal sheet 3 4, For example, it is formed of 3 6 % N i steel. However, it is not limited to this -16- 200927962, The metal foil 34 can also be made of stainless steel, copper, iron, A thin sheet of aluminum. on the other hand, Resin sheet 32, For example, a sheet formed of polyethylene terephthalate or polypropylene having a thickness of about 50 y m to 15 〇em can be used. In this embodiment, It is a resin sheet 32 which reduces the adhesion to the metal foil 34 by irradiation with UV light. in particular , Resin sheet 32, Can be formed to have: a substrate sheet 32a formed of polyethylene terephthalate q ester; And a UV peeling layer 32b which is laminated on the base sheet 32a and which is opposed to the metal sheet 32 (see Figs. 7 and 8). herein, The so-called UV release layer 32b means that it has adhesive force at the beginning. The base sheet 32a and the metal sheet 34 can be bonded, The portion of the portion that is irradiated when the UV light is irradiated is lowered. E.g: When irradiating UV light, The irradiated portion is solidified so that its bonding force to the metal foil 34 is lowered. The UV peeling layer 32b, For example, it can be formed by an acrylic UV re-peeling release adhesive. The supplied laminate 30 is subjected to an etching treatment by an etching device (etching means) 50. in particular, First of all, A photosensitive resist material is applied to the surface of the metal foil 34 of the laminate 30 (the surface on the lower side of the seventh drawing surface). A resist film 36 is formed on the metal foil 34. Secondly, It is prepared to prevent light from passing through the glass dry plate 37 where the resist film 36 is removed. The glass dry plate 37 is placed on the resist film 36. then, As shown in Figure 7, Exposing the resist film 3 6 over the glass dry plate 3 7 , Further, the resist film 36 is developed. Through the above -17- 200927962, The resist pattern 36a can be formed on the metal foil 34 of the laminated body 30. another, It is also possible to form the area opposite to the anti-film 36 which should be removed in the glass dry plate 37 in advance, in black. Use visible light as the light to expose. In this situation, The visible light is absorbed by the black portion so that the light is not incident on the area to be removed of the resist film 36. Therefore, the resist film 36 is not fixed to the metal foil 34. on the other hand, Light is incident on the non-removed area of the resist film 36, 0 The resist film 36 in this region is fixed to the metal foil 34. Unfixed resist film 3 6, For example, it is removed by hot water cleaning. then, As shown in Figure 8, Masking the resist pattern 36a formed on the metal foil 34, The laminate 36 is etched with an etching solution (for example, a ferric chloride solution) 38. In this embodiment, Etching solution 3 8, The nozzle 51 of the etching apparatus 50 disposed under the stacked body 30 that has been transported is ejected toward the surface 34a of the metal sheet 34 over the resist pattern 36a. at this time, As shown by the dotted line in Figure 8, The saturated liquid starts to immerse the remaining metal φ into the region of the sheet 34 which is not covered with the resist pattern 36a. then, Etching, Not only in the thickness direction of the metal foil 34, It also continues along the sheet surface of the metal sheet 34. As a result, The etching of the etching solution proceeds from the square surface 34a of the metal foil 34 to the other surface 34b. A hole 25 penetrating through the metal foil 34 is formed. then, The resist pattern 36a on the laminated body 30 is removed, Further, the laminated body 30 is cleaned. As a result, On the resin sheet 32, A sheet-like member 18 for vapor deposition mask formed of a metal foil 34 having a plurality of holes 25 formed therein can be obtained. -18- 34 200927962 In addition, if no resin sheet 3 2 is provided, After the metal foil 34 is formed through the hole 25 as described above, On the other side of the metal sheet, the surface of the surface 4 4 b is trapped with a stagnation liquid so that a hole 25 having a shape and an inch which is unstable and has a dirty shape is obtained. However, according to the present embodiment, even if the hole 25 penetrating the metal foil 34 is formed, The hole 25 is covered with a resin sheet 32 above it. Therefore, it is possible to avoid the embarrassment caused by the conventional law. the result, The etching is carried out only from the surface 3 4 a side of the metal sheet 34 0. The section formed by the hole 25 formed in the metal sheet 34 is 'from the one side 34a, 20a faces the other side 34b, 20b is getting smaller. Further, it is also possible to form the hole 25 having the desired opening area (the area of the hole 25 in the flat direction) with high precision. Then 'the laminated body 30 etched as described above, a pair of conveyance rollers 57 that rotate in a state in which the stack 30 is sandwiched, 57 is transported to the removal device (removal means) 54. another, The carrying roller 57, The rotation of 57 exerts a stress (pull force) on the stack 30 to rotate the supply core 31 described above. Form 0 The laminated body 30 is supplied from the wrap 29. In addition, In this embodiment, The metal foil 34 is supported and reinforced by the resin sheet 32. therefore, When the laminated body 30 is transported, The stress between the hole 2 5 and the hole 25 can specifically suppress the metal sheet 3 4 between the hole 2 5 and the hole 2 5 being cut, Or, it is possible to suppress the problem that the linear portion is entangled between the hole 25 and the hole 25. the result, It is possible to avoid the problem that the etching step is formed in the shape of the fine pores 25 of the metal foil 34 in the subsequent steps. another, As described above, when the elongated side of the elongated rule 9 is formed along the orthogonal direction of the arrangement direction, the thin layer is formed into a thin hole 25 of the extension and extension -19-200927962. It is preferable that the direction in which the holes 25 extend (the other direction described above) and the direction in which the stacked body 30 is supplied (the direction in which the stacked body is conveyed) are substantially parallel. In this situation, It is possible to effectively prevent the hole between the hole 2 5 and the hole 2 5 of the metal foil 34 from being cut off or to suppress the portion extending between the hole 25 and the hole 2 5 in a linear shape. As shown in Figure 9, The removing device 54 of the present embodiment, There is a UV light irradiation means 5 5 provided on the downstream side of the conveyance roller 57. The UV light irradiation means 5 5 ' has a movement path along the stacked body 30, Covering the mask 55a of the laminated body 30 from the side of the resin sheet 32; And a UV light source 55b disposed in the shield 55a. Then, the laminated body 30 that has been transported is irradiated with UV light from the resin sheet 32 side. The adhesion of the UV peeling layer 32b to which the base sheet 32a and the vapor deposition mask 20 (metal sheet 34) are bonded is largely lowered by the UV light transmitted through the base sheet 32a of the resin sheet 32. As a result, the resin sheet 32 to be laminated 3〇 and the metal sheet 34 (vapor deposition mask 20) can be separated. As shown in Figure 9, The resin sheet 32 is peeled off from the metal sheet 34 and wound up on the take-up core barrel 58. another, The resin sheet 32 is pulled away from the metal sheet 34, It is preferable to be parallel to the extending direction of the hole 25 formed in the metal foil 34 (the other direction described above). When the resin sheet 32 is separated from the metal sheet 34 in this direction, It is possible to effectively prevent the hole 25 of the metal foil 34 from being cut between the holes 25, Or, the portion between the hole 25 and the hole 25 which is extended in a line shape is entangled. As a result, A metal foil 34 having a plurality of holes 25 formed therein can be obtained. The metal foil 34 is cut into a length of a finger by a cutting device (cutting means) 59. A sheet-shaped vapor deposition mask 20 can be obtained. then, The vapor deposition device 10 can be obtained by mounting the frame 15 for each of the -20-200927962 vapor deposition masks 20. another, The frame 15 may be mounted on the face 20a of the vapor deposition mask 20, It may be mounted on the other surface 20b of the vapor deposition mask 20. According to the embodiment described above, The metal foil 34 laminated on the resin sheet 32 can be continuously processed. therefore, The metal foil 34 can be formed to penetrate the hole 25 of the metal foil 34 by etching from the side of the surface 34a. In this situation, The hole 25 is formed so as to penetrate the metal sheet 34 @ ' but the end of the hole 25 on the other side of the surface 34b of the metal sheet 34 is covered with the resin sheet 32. which is, The hole 25 does not penetrate the laminated body 30, Therefore, the above-mentioned conventional problems can be avoided. As a result, It is possible to obtain a vapor deposition mask 20 having a hole 25 whose sectional area is gradually reduced from the one surface 20a toward the other surface 20b. In addition, It is also possible to produce the vapor deposition mask 20 in which the openings are formed in a high-definition pattern with high precision. According to the vapor deposition mask 20, High-precision pattern evaporation can be performed with high precision. Therefore, the vapor deposition mask 20 obtained through the above operation, Highly applicable φ At the time of manufacture of an organic EL display device, for example, a vapor deposition mask (a metal mask for vapor deposition) used for arranging an organic light-emitting material on a glass substrate 42 in a desired pattern is used. In addition, According to this embodiment, The stress (pull force) of the metal foil 34 acting on the laminated body 30 after the formation of the hole 25 can be remarkably reduced, The cutting stress generation between the hole 25 of the metal foil 34 and the hole 25 can be significantly reduced, And the occurrence of the winding stress which extends between the hole 2 5 and the hole 2 5 of the metal foil 34 to form a linear portion. Therefore, it is possible to prevent the hole 21-200927962 which has been accurately formed on the vapor mask 20 from being damaged in the subsequent step. Plus, According to this embodiment, In the laminate 30 supply, The wound body 29 around which the laminated body 3 is wound is unwound and supplied in a strip-like laminated body 30. The wrap 29 is inexpensive to purchase' and is highly desirable in terms of use. another, Regarding the above embodiment, Various changes are made within the scope of the gist of the invention. the following, An example of a modification will be described. In the above embodiment, An example in which the resin sheet 32 is removed from the laminated body 30 by irradiation with UV light on the resin sheet 32 is disclosed. However, the method of removing the sheet 3 2 is not limited thereto. For example, the stack f can also be fed to a heating furnace (removal means). The resin sheet 32 of the fired laminated body 30 is removed from the laminated body 30. When the resin sheet 3 2 is burned and removed, Because it is an easy way to use a simple device, Therefore, it is possible to influence the resin sheet 32 to be separated from the metal sheet 34 by the holes 25 formed in the metal foil 34 (vapor deposition mask 20). another, When burning resin sheet 3 2, It is not necessary to use a resin sheet 32 which is reduced in adhesion to the metal sheet 34 by irradiation with UV light. In addition, In the above embodiment, A laminated body 30 prepared by laminating a resin 32 and a metal foil 34 in advance is disclosed as an example. But it is not limited to this. For example, a strip-shaped resin sheet 32 may be supplied while supplying the strip-shaped gold foil 34. The metal sheet 34 and the resin sheet 32 are bonded to each other to form a laminate. The laminate 30 thus produced is subjected to the above treatment. or, The step of extending the flaky step while supplying the strip-shaped metal foil 34 is a thin resin I 30 thin film thinning, which is not required to remove the adhesive sheet. Resin -22- 200927962 The sheet 32 is continuously laminated on the supplied metal sheet 34, The portion (layer 30) in which the sheet-like resin sheet 32 is laminated among the gold sheets 34 is subjected to the above-described treatment in this order. or, It is also possible to laminate the sheet-like metal foil 34 on the supplied resin sheet 32 while supplying the resin-made sheet 32 extending. The above-described treatment is applied to the laminated portion (laminate 30) of the sheet-like metal foil 34 laminated on the resin sheet 32 in this order. In addition to the above embodiment, It is revealed that the hole 25 is formed in the genus sheet 34, Further, after the resin sheet 32 is separated from the metal sheet 34, The metal sheet 34 is cut into a designated length by the cutting device 59, But it is not limited to this. E.g: Cutting of the metal sheet 3 4, It can also be performed before the metal foil 34 forms the holes 25. Further, it may be performed after the metal foil 34 is formed with the holes 25 and before the resin sheets are separated from the metal sheets 34. The metal sheet 34 is cut to a specified length before the resin sheet 32 is separated from the gold sheet 34. Further, the resin sheet 32 can be half cut to the laminated body 30 without cutting, and only the metal sheet 34 can be cut. or, The entire laminate 30 including the gold foil 34 may be cut to a predetermined length. Plus, In the step of forming the hole 25 by etching, The metal foil 34 is edge cut to a specified length. which is, Can also be used when forming uranium engraving 25 The metal flakes 34 are separated into a specified length by etching. In the situation, It can save the need to separately cut the metal foil 34 into a designated long working time. The vapor deposition mask can be manufactured inexpensively with high production efficiency. In addition to the above embodiment, Revealing the evaporation mask 20 genus folded fragments cis gold graduation step > 32 belongs to the genus and also etches the hole. The degree is cut -23- 200927962 broken into the specified length example, However, the metal foil 34 of the plurality of holes 25 is not limited to the use of the sheet member 18 for cutting. For example, the steam formed by the metal flakes 34 of the first plurality of holes 25, It is also possible to take up the wound body I8a of the sheet-like member 18 in a state where it is not cut, and to use the sheet-like member for coating the mask 1 8 is also a guarantee of the present case. In the above embodiment, An example of the exposed vapor deposition mask 20 mounted on the frame 15 is as follows: It is also possible to attach the metal foil 34 before the resin sheet 3 2 is removed to the frame 15. The metal before removal of the resin sheet 32 is 15 ° [Simplified description of the drawings] φ Fig. 1 is a view showing an embodiment of the steamed shovel mask of the present invention. Fig. 2 is an explanatory view showing a vapor deposition i vapor deposition method shown in Fig. 1. Fig. 3 is a view showing the vapor deposition mask shown in Fig. 1 and Fig. 6 is a view showing the action of the vapor deposition mask along the line IV-IV of Fig. 3; Fig. 6 is an evaporation mask of the present invention. An embodiment of the manufacturing method of the S is illustrated. . For example, the formed state can also be used as a vapor deposition mask. From the sheet member 1 8 formed with a plating mask As a vapor deposition mask (shipping, etc.). another, Steam the I object. Shows cutting to the specified length, But it is not limited to this. And cut into a specified length or A lamella 34 formed with a hole 25 is mounted to the frame: And one of the vapor deposition mask devices; A partial plan view of the cover and the cover of the steam mask. Sectional view. Oh ; Manufacturing method and vapor deposition mask -24- 200927962 Fig. 7 is a view showing a method of forming an etching resist pattern of a laminate (metal sheet). Fig. 8 is an explanatory view showing a method of etching a laminate (metal sheet). Fig. 9 is an explanatory view showing a method of removing a resin sheet when the laminate is removed from the resin sheet. Figure 10 is a corresponding diagram of Figure 6, This is an explanatory view of a method for producing a sheet member for a vapor deposition mask. φ Figure 11 is the corresponding diagram of Figure 5, This is an explanatory diagram of a vapor deposition method when vapor deposition is performed using a vapor deposition mask formed of a metal plate engraved on both sides. Figure 12 is a corresponding diagram of Figure 8, This is an explanatory view of a method for producing a vaporized mask in which a vapor deposition mask is produced by etching a metal plate from the lower surface. [Main component symbol description] 1 _· evaporated mask 2 : Metal plate ❹ 2a : Hole 3: Projection 4 : Substrate 5 : Evaporation film 6 : Metal plate 6a : Thin hole at the front end 7 : Resist film 8 : Etching solution 10 : Evaporative masking device -25- 200927962
15: 18: 18a： 19 : 20 : 20a ·· 2 0b · 22 : 2 3 ·· 25 : 29 : 30 : 3 1 ： 32 : 32a ： 32b ： 34 : 3 4a: 34b ： 36 : 36a ： 37 : 38 : 40 : 框架 鍍鍍遮罩用片狀構件 卷體 捲取芯筒 蒸鍍遮罩 蒸鍍遮罩一方的面 蒸鍍遮罩另一方的面 有孔區域 無孔區域 孔 層疊體卷體 層疊體 供應芯筒 樹脂製薄片 基材薄片 UV剝離層 金屬製薄片 金屬製薄片一方的面 金屬製薄片另一方的面 抗蝕膜 抗蝕圖案 玻璃乾板 蝕刻液 蒸鍍裝置 -26 200927962 42 :玻璃基板 44 :熔爐 4 6 :加熱器 4 8 :蒸鍍材料 5 0 ··蝕刻裝置（蝕刻手段） 5 1 :噴嘴 54:去除裝置（去除手段） 55 : UV光照射手段 5 5 a :遮蔽罩 55b : UV光源 5 7 :搬運輥 5 8 :捲取芯筒 59:切斷裝置（切斷手段） W :各孔2 5其沿著排列方向的寬度（窄縫寬度） P :排列節距 L :於蒸鍍遮罩薄片面正交的剖面中，一方的面側的 孔的端部及另〜方的面側的孔的端部連接形成的直線 Θ :直線L對另一方的面形成的角度 -27-15:18:18a:19 :20 :20a ·· 2 0b · 22 : 2 3 ·· 25 : 29 : 30 : 3 1 : 32 : 32a : 32b : 34 : 3 4a: 34b : 36 : 36a : 37 : 38 : 40 : frame plating mask sheet member coil winding core tube vapor deposition mask vapor deposition mask one side vapor deposition mask the other side surface perforated area non-porous area hole laminated body roll stack Body supply core resin sheet base sheet UV peeling layer metal sheet metal sheet one side metal sheet sheet the other surface resist film resist pattern glass dry sheet etching liquid vapor deposition device -26 200927962 42 : glass substrate 44 : Furnace 4 6 : Heater 4 8 : vapor deposition material 5 0 · · etching device (etching means) 5 1 : nozzle 54 : removal device (removal means) 55 : UV light irradiation means 5 5 a : mask 55b : UV Light source 5 7 : conveying roller 5 8 : winding core cylinder 59 : cutting device (cutting means) W : width of each hole 2 5 along the arrangement direction (slit width) P : arrangement pitch L : steaming In the cross section orthogonal to the surface of the plating mask sheet, the end portion of the hole on one surface side and the end portion of the hole on the other side surface side are connected to each other. Linear Θ: the angle of the straight line L on the other surface formed -27-