JP2006263685A - Mask forming method, material for mask, and pattern film forming system using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mask forming method which enables the formation of a thin film on a base with a pattern of high precision and definition with high productivity at low costs, a material for a mask, and a pattern film forming system using it. <P>SOLUTION: A release material part to be released corresponding a shape of a mask is only released by an release operation means from the material for the mask. The exposed surface of a predetermined part of a second adhesive layer 16 is brought into contact with the surface of the base 22 in a mask adherend part. In a mask transfer part, a sheet 14 for a mask corresponding to the shape of the mask is attached by the second adhesive layer 16 to be transferred. Further, on the surface of the base 22 attached with the sheet 14 for the mask by the second adhesive layer 16 in a thin film forming part, a thin film 98 is formed by a vacuum film deposition method. The sheet 14 for the mask is removed by a mask removal part, thereby forming the thin film 98 of a predetermined pattern on the base 22. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a mask forming method for forming a patterned mask film on a support such as a substrate, a mask material used for forming the mask film, and a pattern film forming system using the mask material. About.

  Generally, a transparent electrode or an opaque electrode used for an electronic display such as a liquid crystal display, a light emitting body (pixel) for an electronic display of EL (Electro Luminescence), a TFT (Thin Film Transistor) element used as a switching element for a liquid crystal display or the like. A patterned magnetic medium or the like having a recording layer divided for each bit is formed by a vacuum film forming method.

  In the vacuum film forming method for forming a patterned vacuum thin film on this substrate, after forming a continuous vacuum thin film on the substrate surface, a resist layer drawn according to the pattern to be formed is formed using photolithography. There is a method of patterning a vacuum thin film by removing an unnecessary thin film by dry or wet etching.

  In such a method using photolithography, the accuracy and precision of the pattern are excellent. However, such as substrate cleaning, resist coating, resist pre-baking, resist exposure, resist post-baking, development processing, etching, etc. Since a large number of processes are required, a large capital investment is required, and the yield is low. Furthermore, since it has a large number of processes and the yield is low, the manufacturing cost is high and the productivity is also low.

  In addition, the vacuum film formation method for forming a patterned vacuum thin film on a substrate uses a metal mask having an opening corresponding to the pattern to be formed, and passes through the metal mask by performing vacuum film formation through this mask. A method of forming a patterned vacuum thin film by depositing only the deposited material on the substrate is also used.

  In the vacuum film formation method using a conventional mask, the electrode material evaporated from the evaporation source at the portion where the flexible strip-shaped deposition mask is brought into contact with the flexible strip-shaped substrate while being continuously conveyed. Has been proposed (see, for example, Patent Document 1).

  In such a method of forming a patterned vacuum thin film with the mask in contact with the substrate, the film forming material is deposited on the mask as the film is formed. When forming high-precision and high-definition patterns, the deposition of this film-forming material makes the mask unusable in a short period of time, so it takes time to replace or regenerate the mask in a short period of time. And productivity falls and manufacturing cost improves.

Furthermore, when the vacuum thin film is formed with the mask spaced from the substrate to prevent the substrate from being damaged when the mask is brought into contact with the substrate, the evaporated particles of the thin film material are deposited wider than the width of the mask. As a result, the boundary of the pattern formed on the substrate may be blurred.
JP 58-40704 A

  In view of the above points, the present invention provides a mask forming method, a mask material, and a pattern film formation using the mask forming method, which can form a thin film on a support with a high-precision and high-definition pattern at high productivity and low cost. The purpose is to provide a new system.

  According to a first aspect of the present invention, there is provided a mask forming method, wherein a mask sheet formed in a thin film shape having an adhesive layer formed on one plane is punched into a predetermined pattern, and a substrate material A support body in which a mask sheet body perforated in a predetermined pattern is adhered to the surface of the support body to be used by the adhesive force of the adhesive layer, and a mask sheet body in a predetermined pattern shape is adhered Forming a thin film on the surface side of the substrate by a vacuum film forming method, and removing the mask sheet body portion having a predetermined pattern shape from the surface of the support on which the thin film is formed, And a mask removing step of completing a substrate on which a thin film having a predetermined pattern is formed.

  According to the above-described method, a mask having a predetermined pattern can be made by adhering a mask sheet formed in a predetermined pattern to the surface of the support as a material of the substrate by the adhesive force of the adhesive layer. Compared to making a mask by photolithography, the mask can be made easily and inexpensively with fewer steps. Furthermore, since the mask sheet on which the thin film removed by the mask removal process is formed is discarded, the work process is simplified compared to the case where the thin film deposited thereon is removed and reused. We can provide inexpensive products.

  The mask material according to claim 2 of the present invention is laminated on the temporary support formed in the form of a flexible sheet, the first adhesive layer laminated on the surface of the temporary support, and the first adhesive layer. A flexible sheet-like mask sheet, a second adhesive layer laminated on the mask sheet, and a release material laminated on the second adhesive layer. It is characterized by that.

  By configuring as described above, a half-cut is made from the separating material side of the mask material to a predetermined depth at which the cut is made in the temporary support along a predetermined shape corresponding to the shape of the mask, and then the surface By peeling only the separating material part to be peeled off so that a predetermined part of the second adhesive layer is exposed, by sticking the exposed second adhesive layer to the support and then separating the mask material, A mask having a predetermined pattern can be easily made. If this mask material is used, it is possible to perform the operation easily and quickly as compared with the case where only the mask sheet provided with the adhesive layer on one surface is taken out and positioned and pasted on the support. Further, the mask sheet, the second adhesive layer, and the remaining release material portion that are not used for the mask are integrally left on the temporary support of the mask material via the first adhesive layer. Therefore, it is possible to easily dispose of unnecessary mask material.

  The invention described in claim 3 is characterized in that, in the mask material according to claim 2, the adhesive force of the second adhesive layer is made stronger than the adhesive force of the first adhesive layer.

  By configuring as described above, in addition to the operation and effect of the invention according to claim 2, only the separating material portion to be peeled corresponding to the mask shape in the mask material is peeled and exposed. (2) After the surface of the predetermined part of the adhesive layer is in contact with and adhered to the surface of the support on which the thin film is to be formed, when the mask material is peeled off from the support on which the thin film is to be formed, The adhesive force between the support to be formed and the predetermined portion of the second adhesive layer exceeds the adhesive force between the temporary support and the first adhesive layer, and the second adhesive on the surface of the support to be formed with a thin film. The operation of attaching the mask film with the layer can be easily and reliably performed.

  According to a fourth aspect of the present invention, in the mask material according to the second or third aspect, the mask sheet is made of a flexible sheet material made of polyethylene terephthalate.

  By configuring as described above, in addition to the operation and effect of the invention described in claim 2 or 3, mask material can be manufactured at low cost.

  The pattern film forming system according to claim 5 of the present invention includes a temporary support formed in a flexible sheet shape, a first adhesive layer laminated on the surface of the temporary support, and a laminate on the first adhesive layer. A flexible sheet-like mask sheet body, a second adhesive layer laminated on the mask sheet body, and a release material laminated on the second adhesive layer. The mask material is configured to make a half cut along a predetermined shape corresponding to the shape of the mask from the surface on the side of the separating material in the mask material to a predetermined depth at which a part of the temporary support is cut. The mask sheet half-cut portion, the peeling operation means for peeling only the separating material portion to be peeled corresponding to the mask shape from the half-cut mask material, and the peeling material to be peeled off in the mask material The material part is peeled off The mask corresponding to the mask shape by the mask attaching portion for attaching the surface of the second adhesive layer exposed by being brought into contact with the surface of the support, and the operation of separating the mask material from the surface of the support A mask forming section comprising: a mask transfer section for transferring and transferring the sheet body by the second adhesive layer; and a surface of the support in which the mask sheet body is bonded by the second adhesive layer in the mask forming section. A thin film forming portion for forming a thin film by a vacuum film forming method, and a mask removing portion for removing a mask sheet from the support on which the thin film is formed, and forming a thin film having a predetermined pattern on the support. And a thin film formation processing step section.

  A sixth aspect of the present invention is the pattern film forming system according to the fifth aspect, characterized in that the thin film formation processing unit is accommodated in a vacuum state in a vacuum chamber.

  By configuring as described above, the surface of the predetermined portion of the second adhesive layer exposed by peeling only the separating material portion to be peeled corresponding to the mask shape by the peeling operation means from the half-cut mask material Is adhered to the surface of the support at the mask adhering portion, and the mask sheet corresponding to the mask shape is adhered and transferred by the second adhesive layer at the mask transfer portion, and further the thin film A thin film is formed on the surface of the support with the mask sheet adhered by the second adhesive layer at the forming part, and then the mask sheet is removed by the mask removing part to support the thin film with a predetermined pattern. Since it can be easily and efficiently formed on the body, an inexpensive product can be provided.

  A seventh aspect of the present invention is the pattern film forming system according to the fifth aspect, wherein the support on which the mask sheet formed at the mask forming portion is adhered by the second adhesive layer is provided as an air-vacuum transport device. Through the vacuum chamber, the substrate is loaded into a thin film formation processing step housed in a vacuum state in the vacuum chamber, and the support on which the thin film having a predetermined pattern is formed in the thin film formation processing step -It is configured to be carried out to the atmosphere through a vacuum transfer device.

  According to an eighth aspect of the present invention, in the patterned film forming system according to the fifth aspect, the mask forming unit and the thin film forming process step unit are both disposed in the vacuum chamber.

  By comprising as mentioned above, in addition to the effect | action of the invention of Claim 5, the support body which stuck the sheet | seat body for masks formed in the mask formation part by the 2nd adhesion layer directly For example, the support end cutting part, the take-up roll, the support original fabric bonding part, etc. are omitted, simplifying the configuration, enabling continuous processing, and improving the processing efficiency. Can be improved.

  According to the mask forming method, the mask material, and the pattern film forming system using the mask forming method of the present invention, it is possible to form a thin film on a support with high precision and high definition at high productivity and at low cost. It has the effect of making it possible.

DESCRIPTION OF EMBODIMENTS Embodiments relating to a mask forming method, a mask material, and a pattern film forming system using the same according to the present invention will be described with reference to FIGS.
[Mask formation method]
In the mask forming method used in the pattern film forming system according to the present embodiment, a mask sheet having an adhesive layer formed on at least one plane is prepared.

  In the next mold making process, the mask sheet with the adhesive layer is formed in a predetermined pattern.

  In the next sticking step, a mask sheet body formed in a predetermined pattern is stuck to the surface of the support serving as the material of the substrate by the adhesive force of the adhesive layer.

  In the next vacuum film-forming step, a thin film is formed by a vacuum film-forming method on the surface side of the support as a substrate material to which the mask sheet having the predetermined pattern shape is attached.

In the next mask removing step, the mask sheet body portion having a predetermined pattern shape is removed from the surface of the support on which the thin film is generated, thereby completing the substrate on which the thin film having the predetermined pattern is formed on the surface of the support.
[Mask materials]
The mask material used in the pattern film forming system according to this embodiment is temporarily supported as shown in FIG. 8A (in FIG. 8, the thickness of the member is exaggerated). The first adhesive layer 12 is laminated on the surface of the body 10, the mask film 14 which is a mask sheet formed of a material such as PET is laminated thereon, and the second adhesive layer 16 is laminated thereon, It is formed in a strip shape of a five-layer structure in which a separating material 18 is laminated thereon.

  The temporary support 10 is made of a flexible sheet material such as plastic or paper, and has a thickness (wall thickness) of 20 μm to 200 μm, more preferably 50 μm to 150 μm.

  The mask film 14 as the mask sheet is made of a flexible sheet material such as plastic such as polyethylene terephthalate (PET), and has a thickness of 10 μm to 100 μm, more preferably 20 μm to 100 μm. To form.

  The release material 18 is made of a flexible sheet material such as plastic or paper, and has a thickness of 10 μm to 100 μm, more preferably 20 μm to 100 μm.

  The first pressure-sensitive adhesive layer 12 and the second pressure-sensitive adhesive layer 16 can each be composed of a pressure-sensitive adhesive used in a general pressure-sensitive adhesive tape or the like, and the thickness of the pressure-sensitive adhesive layer is 1 μm to 50 μm, more preferably 2 μm. To 10 μm.

  As will be described later, the second adhesive layer 16 is formed by forming a thin film from the mask film 14 on the support 22 with the second adhesive layer 16 adhered thereto, and then forming a mask film. It is desirable to use a material having a peeling function as the material of the second adhesive layer 16 so that 14 can be easily peeled from the portion of the second adhesive layer 16.

  As a material having a peeling function constituting the second adhesive layer 16, a UV curable peeling layer for making it peelable by irradiating light, a thermosetting peeling layer for making it peelable by applying heat, or A water-soluble release layer that can be peeled off by applying water can be used. It is more preferable to provide a UV curable release layer that peels off with light or a thermosetting release layer that peels off with heat.

  In the mask material 20, the adhesive force of the second adhesive layer 16 disposed between the mask film 14 and the separating material 18 is the first adhesive disposed between the temporary support 10 and the mask film 14. It is configured to be stronger than the adhesive strength of the layer 12 by a predetermined amount.

  For this reason, the adhesive strength may be increased by forming the second adhesive layer 16 to be thicker than the first adhesive layer 12.

  By configuring in this way, only the separating material portion 18A to be peeled corresponding to the mask shape in the mask material 20 is peeled off, and the surface of the predetermined portion of the exposed second adhesive layer 16 is coated with a thin film. When the mask material 20 is peeled off from the support 22 on which the thin film is to be formed after being brought into contact with and adhered to the surface of the support 22 to be formed, the support 22 on which the thin film is to be formed The adhesive force between the second adhesive layer 16 and the predetermined portion exceeds the adhesive force between the temporary support 10 and the first adhesive layer 12, and the second adhesive layer 16 is formed on the surface of the support 22 where a thin film is to be formed. Therefore, the operation of attaching the mask film 14 can be performed easily and reliably.

  Further, a silicon film or the like is formed on the separation surface of the separation material 18 so as to weaken the adhesive force of the second adhesive layer 16 to the separation material 18, and the separation material to be peeled off on the surface of the mask material 20. When the material portion 18A is peeled off from the second adhesive layer 16, the mask film 14 remains on the temporary support 10 due to the adhesive force of the first adhesive layer 12, and is prevented from peeling off together.

  The thus configured mask material 20 extends the mask film 14 in the thickness direction so as to leave at least a part in the thickness direction of the temporary support 10 from the surface side on which the separating material 18 is disposed. Then, a cutting process for cutting a predetermined pattern is performed so as to cut completely.

  At this time, when a so-called island-like portion is left in the mask material 20, it is cut into a closed loop shape (here, the cutting line may include a contour line of the mask material 20 to be a closed loop). Process.

  Next, the separating material portion 18A to be peeled off from the separating material 18 of the masking material 20 corresponding to the portion of the support 22 where the thin film is to be formed corresponding to the mask is formed, and shown in FIG. Thus, only the remaining release material portion 18 </ b> B is left on the second adhesive layer 16.

  Next, the surface of the support 22 (the surface to be masked) on which the thin film is to be formed is pressed onto the second adhesive layer 16 in which only the remaining separating material portion 18B is left in the mask material 20, and FIG. As shown in FIG. 8C, only the separation material portion 18A (the portion without the remaining separation material portion 18B) to be peeled off of the second adhesive layer 16 is attached.

  Next, when the mask material 20 is peeled off from the support 22 on which the thin film is to be formed, only the separation material portion 18A from which the second adhesive layer 16 is peeled is formed on the surface of the support 22 on which the thin film is to be formed. Sticks and the masked state is realized.

Further, the mask material 20 peeled off from the support 22 on which the thin film is to be formed includes the remaining separation material portion 18B that has not been used for the mask, the second adhesive layer 16 and the mask corresponding thereto. The film 14, the first adhesive layer 12, and the temporary support 10 remain. The remaining used mask material 20 portion is discarded. The mask material 20 is made of an inexpensive material such as polyethylene terephthalate (PET). Therefore, even if the used mask material 20 is disposed of, the mask material 20 is less than other mask means such as photolithography. Mask processing can be done at low cost.
[Pattern film forming system]
Next, a pattern film forming system using the above-described mask forming method and mask material will be described.

  This pattern film forming system can be configured by dividing it into a mask forming part and a thin film forming process part.

  In this pattern film forming system, the mask forming unit is configured to work in an atmospheric pressure, and the thin film forming process step unit is housed in a vacuum chamber so that the work is performed in a vacuum. Can be configured.

  Further, in this pattern film forming system, the mask forming unit is configured to operate in an atmospheric pressure, and the thin film formation processing step unit is configured to perform the operation in a vacuum by storing equipment in a vacuum chamber. At the same time, the substrate 22 is loaded into the vacuum chamber while holding the vacuum state from the mask forming unit to the thin film forming process step unit, and the substrate 22 that has been vacuum-deposited is carried out of the vacuum chamber while maintaining the vacuum state. It can comprise in the 2nd aspect provided with the vacuum holding | maintenance conveyance means to do.

  In addition, this pattern film forming system can be configured as a third mode in which the mask forming unit and the thin film forming process step unit are both housed in a vacuum chamber and work is performed in a vacuum.

  Next, the mask formation part comprised in the 1st aspect in this pattern film formation system is demonstrated with reference to FIG.

  The mask forming unit pulls out the support 22 formed of unprocessed plastic such as PET or other material from the supply roll 24, and sends out the support 22 with the mask formed thereon, and attaches the mask to the support 22. The unprocessed mask material 20 and the unprocessed mask material 20 are pulled out from the supply roll 26, and a mask portion having a predetermined shape is cut out and pasted to be transferred to the support 22, and the remaining used mask material 20 is removed. It has the processing of the mask material 20 to be recovered and a transfer process section for transfer.

  In the transporting process unit for attaching the mask to the support 22, the support 22 pulled out from the supply roll 24 is sent to the support original fabric bonding part 28. In this conveyance process part, in order to eliminate the loss of the switching time for switching the empty supply roll 24 to the supply roll 24 with which the new support body 22 is wound, two supply rolls 24 are prepared and used.

  In this support original fabric joining portion 28, the rear end of the original fabric of the support 22 and the leading edge of the original fabric of the support 22 to be newly conveyed are joined with a tape using a suction table, and are continuous. Send to tension setting unit 30.

  The tension setting unit 30 applies a certain tension to the support 22 using the dancer roller 30 </ b> A so as to prevent the support 22 being conveyed from becoming slack, and sends it to the support pre-processing unit 32.

  In this support body pretreatment part 32, the surface of the support body 22 is cleaned as a pretreatment of the base surface with respect to the surface to which the mask of the support body 22 is stuck.

  In the cleaning process of the surface of the support 22, an adhesive roll contact type cleaning means using an adhesive roll made of urethane rubber, butyl rubber, silicon rubber or a combination thereof, or other commonly used cleaning is used. Means can be used.

  Further, in the pretreatment of the base surface with respect to the surface to which the mask of the support 22 is attached, corona treatment, atmospheric pressure plasma treatment, or vacuum plasma treatment may be performed. The plasma treatment performed as a pretreatment of the base surface with respect to the surface to which the mask of the support 22 is attached is an atmosphere containing any of argon gas, xenon gas, oxygen gas, nitrogen gas, carbon dioxide gas, or a mixed gas. DC plasma, AC plasma, rf plasma, microwave plasma, or pulsed plasma can be used. Note that the plasma processing in vacuum corresponds to the configuration of the third mode in which the mask forming unit and the thin film forming processing step unit are both housed in a vacuum chamber and work is performed in a vacuum.

  The support 22 pretreated by the support pretreatment unit 32 is carried into the mask attaching unit 34. The mask sticking section 34 is configured so that two laminate rolls (rubber rolls) are brought into contact with each other at a predetermined appropriate pressure, and a roller surface is required by a heater (not shown) provided on at least one laminate roll. It can be heated to a temperature of

  This mask sticking portion 34 is a portion of the separating material remaining on the surface of the support 22 as shown in FIG. 8B described above in the processing step of the mask material 20 to be described later and the transfer process portion for transfer. The processed mask material 20 is overlaid with only 18B left on the second adhesive layer 16, and is crimped by rolling so as to be sandwiched between two laminate rolls. The mask material 20 is heated by the second pressure-sensitive adhesive layer 16 exposed by peeling off the release material portion 18A to be peeled, and the first pressure-sensitive adhesive force is used to adhere the mask film 14 to the support 22. In a state in which the layer 12 is controlled to have a predetermined amount larger than the adhesive strength of the mask film 14 adhered to the temporary support 10, the mask film 14 formed in a predetermined mask shape is formed on the surface of the support 22. In To photographed.

  That is, the mask film 14 formed in a predetermined mask shape moves from the mask material 20 side onto the support 22 by the pressurization and heating action of the mask adhering portion 34, and is a release material that is peeled off. It will be in the state stuck by the 2nd adhesion layer 16 corresponding to part 18A.

  At this time, the portion of the mask film 14 where the separating material portion 18B remains on the surface of the mask material 20 is in contact with the surface of the support 22 because the remaining separating material portion 18B contacts the surface of the support 22. Since the adhesive action of the layer 16 does not work, it remains in the mask material 20.

  In this way, in the mask attaching part 34, the mask material 20 and the support 22 that are pressed and heated in a bonded state are transferred to a mask transfer part 36 that is configured to cause a pair of peeling rolls to roll in contact with each other. After being carried in and separated into the support 22 to which the mask film 14 is adhered by the second adhesive layer 16 and the used mask material 20, it is carried into the tension setting unit 38 and the tension setting unit 60, respectively. Is done.

  The tension setting unit 38 and the tension setting unit 60 use the dancer roller 38A or 60A to prevent the slack from appearing on the support 22 being transported or the used mask material 20, respectively. A predetermined tension is applied to each of the used mask materials 20.

  In this mask forming part, the support 22 and the mask material 20 that are respectively transported on the transport path between the mask attaching part 34 and the mask transfer part 36 are respectively upstream in the transport direction and downstream in the transport direction. When the appropriate tension is applied by the tension setting unit 30 and the tension setting unit 38 arranged in the above, or the tension setting unit 46 and the tension setting unit 60 described later, the support 22 and the mask material 20 may be wrinkled. The mask film 14 can be attached to the support 22 via the second adhesive layer 16 in an appropriate state without any mutual displacement.

  In addition, in this mask formation part, when performing the half cut operation | movement with respect to the mask material 20 in the mask film half cut part 48 continuously (when conveying continuously) so that it may mention later, the mask sticking part 34 is set. Operate continuously. In addition, when the half-cut operation for the mask material 20 is intermittently performed by the mask film half-cut portion 48 (when intermittently transported), the mask attaching portion 34 is also operated intermittently in synchronization with this. .

  The support 22 that has passed through the tension setting section 38 passes through the support end cutting section 40 and is wound on the roll 42 of the mask-formed support winding section.

  The support body end cutting section 40 cuts the mask formed support body 22 at a predetermined timing such as when the mask formed support body 22 is fully wound on the roll 42 and winds it on a new roll 42. Is configured as a cutter device for starting the operation.

  Next, processing of the mask material 20 in the mask forming part of the pattern film forming system and a transfer process part for transfer will be described with reference to FIG.

  In the transport process section for processing and transferring the mask material 20, the mask drawn out from the supply roll 26 around which the long strip-shaped mask material 20 formed in the five-layer structure is wound as shown in FIG. 8 described above. The material 20 is sent to the mask material original fabric bonding portion 44. In the mask material original fabric joining portion 44, the rear end of the original material of the mask material 20 and the front end of the original material of the support 22 to be newly conveyed are joined with a tape using a suction table to be continuous. To the tension setting unit 46.

  In order to eliminate the loss of switching time for switching the empty supply roll 26 to the supply roll 26 around which the new mask material 20 is wound, in the processing step for transferring and transferring the mask material 20, Two supply rolls 26 are prepared and used.

  In the tension setting unit 46, a certain tension is applied to the mask material 20 using the dancer roller 46 </ b> A so that the mask material 20 being conveyed does not become slack, and is sent to the mask film half-cut unit 48. .

  The mask film half-cut portion 48 makes a half cut with a Thomson blade having a predetermined shape corresponding to the shape of the mask to a predetermined depth at which the temporary support 10 is cut from the separating material 18 side of the mask material 20. Configure as follows.

  The mask film half-cut portion 48 is configured, for example, as shown in FIGS. 5 to 7 and includes a suction table 100 and a Thomson blade base 110. The suction table 100 has a large number of suction holes (not shown) formed on the surface thereof, and can suck the mask material 20 onto the table surface and hold it in a predetermined position by sucking air from the suction holes. To do.

  In addition, the Thomson blade base 110 has, for example, a rectangular frame-shaped Thomson blade 112 formed as a blade having a predetermined height on the flat portion facing the suction table 100, and an inner side surrounded by the Thomson blade 112. A small rectangular frame-shaped Thomson blade 112A formed as a blade having a predetermined height for leaving an island-shaped mask portion is provided at a predetermined position.

  Further, in this Thomson blade base 110, the cutting edge position between the Thomson blade 112 and the Thomson blade 112A having a small rectangular frame shape is set at a corresponding position outside the Thomson blade 112 and out of the mask material 20. The stopper member 114 is installed.

  The stopper member 114 may be arranged in a single or a plurality, and may be configured in any manner as long as the interval between the Thomson blade base 110 and the suction table 100 can be set to a predetermined interval. It may be configured as a member that is independently operated so as to be installed on the front surface side of the plate or interposed between the Thomson blade base 110 and the suction table 100.

  In the mask film half-cut portion 48 configured as described above, when the half-cut process is intermittently performed on the mask material 20, the mask material 20 that has been transported on the transport path is half-cut. Stop at a predetermined position. Next, the suction table 100 is raised to a position where it is brought into contact with the bottom surface of the mask material 20 and stopped, and the mask material 20 is adsorbed by using a suction function that sucks air from the suction holes of the suction table 100.

  Next, the Thomson blade base 110 is lowered until it is restrained by the stopper member 114, and the mask material 20 is half-cut as shown in FIG. The half-cut masking material 20 is separated from the masking material 20 from the side of the masking material 18 by the Thomson blade 112 (or Thomson blade 112A having a small rectangular frame shape), and the second adhesive layer 16 and Half cutting is performed so that the first adhesive layer 12 and a part of the surface side in the thickness direction of the temporary support 10 are cut so that the mask film 14 is completely cut. That is, the half-cut mask material 20 continues in a state where the back side part of the temporary support 10 in the thickness direction is always left.

  Next, the Thomson blade base 110 is raised, the suction operation of the suction table 100 is stopped, the suction table 100 is lowered, the mask material 20 is moved to a new half-cut portion, and then the above-mentioned half-cutting again. Repeat the cutting operation and repeat the half-cut operation intermittently.

  When the above-described half-cut operation is continuously performed, the above-described half-cut is performed while conveying the suction table 100 and the Thomson blade base 110 in synchronization with the conveyance speed of the mask material 20 from the initial position. After the half-cut operation is completed, the half-cut operation can be continuously performed by returning the suction table 100 and the Thomson blade base 110 to the initial positions and repeating the above-described half-cut operation again. it can.

  The mask material 20 half-cut in this way is carried into the mask film mask part peeling part. The mask film mask part peeling part includes a suction drum 58 that is in rolling contact with the bottom surface of the mask material 20 while being vacuum-sucked, and a peeling operation means 50.

  This peeling operation means 50 is a mask material in which the part of the adhesive tape 53 from when it is pulled out from the adhesive tape supply roller 52 to when it is taken up by the take-up roller 56 is adsorbed on the suction drum 58 by the peeling roller 54. The operation of pressing and separating the surface of 20 is configured to be operable.

  In order to prevent only the separation material portion 18A to be peeled off from the release material 18 from being attached to the adhesive tape 53 and to prevent the remaining release material portion 18B from being attached to the adhesive tape 53, this adhesive tape. 53 may be configured such that the adhesive material is disposed only in a predetermined portion corresponding to only the separating material portion 18A to be peeled off, if necessary.

  In the peeling operation means 50 configured as described above, for example, with respect to the surface of the mask material 20 adsorbed on the suction drum 58, the pressure-sensitive adhesive surface of the adhesive tape 53 is brought to the surface of the mask material 20 by the peeling roller 54. After the pressure-bonding and adhering operation, the separation roller 54 is moved away from the suction drum 58, thereby creating an opportunity for the separation material portion 18A of the mask material 20 to be peeled off. As shown in FIG. 8B, only the remaining separating material portion 18B is left on the second adhesive layer 16 as shown in FIG. 8 (B). The processed mask material 20 is made in the state of being left.

  Further, the separating material portion 18A adhered on the adhesive tape 53 is wound around the take-up roller 56 together with the used adhesive tape 53 and disposed.

  Further, the mask material 20 processed by the peeling operation means 50 in a state in which only the remaining separating material portion 18B is left on the second adhesive layer 16 as shown in FIG. As described above, the part of the second adhesive layer 16 and the mask film 14 corresponding to the peeled material part 18A which has been peeled off is transferred onto the support 22 as described above, and the mask transfer part 36 is transferred. Thus, after the used mask material 20 is separated from the support 22 to which the mask film 14 is attached, it is carried into the tension setting section 60.

  In the tension setting unit 60, a dancer roller 60A is used to apply a certain tension to the mask material 20 so that the mask material 20 being conveyed does not sag, and then passes through the support end cutting unit 62. And it is wound up by the winding roll 64 of a used mask material winding-up part.

  The support end cutting part 62 cuts the used mask material 20 at a predetermined timing such as when the used mask material 20 is fully wound on the take-up roll 64, and a new take-up roll. 64 is configured as a cutter device for starting winding.

  Next, the thin film formation processing process part comprised in the 1st aspect in this pattern film formation system is demonstrated with reference to FIG. The thin film formation processing unit is configured to be housed in a vacuum state in a vacuum chamber (not shown).

  The thin film formation processing step section shown in FIG. 2 includes a support body 22 with a mask film 14 attached by a second adhesive layer 16 as a mask drawn out from a roll 42, and a support original fabric bonding section 66. Send to. In the support original fabric joining portion 66, the rear end of the support 22 and the front end of the support 22 to be newly conveyed are joined with a tape using a suction table, and then sent to the tension setting portion 68. .

  In the tension setting unit 68, a constant tension is applied to the support 22 using the dancer roller 68 </ b> A so that the support 22 being conveyed does not become slack and is sent to the thin film forming unit 70.

  The thin film forming unit 70 forms a pattern thin film by forming a thin film material on the entire surface of the support 22 as a substrate on which the mask film 14 is adhered, by vacuum film formation, from above the mask film 14. Configure as a device.

  An apparatus for forming a patterned thin film by this vacuum film-forming method is an evaporation method, a sputtering method, an ion plating method, a plasma CVD method, an ion beam sputtering method, a laser ablation method, a hollow cathode arc plasma method, a cathodic arc plasma method, A pattern thin film is formed using any means of the MBE method or a combination thereof.

  A thin film formed by this vacuum film forming method can be formed using an organic material, an inorganic material, or a metal material. Further, for example, the thin film can be configured as a transparent conductive film.

  When configured as a transparent conductive film, the transparent conductive film is composed of antimony-doped tin oxide (ATO), fluorine-doped tin oxide (FTO), semiconducting metal compound (tin oxide, zinc oxide, and Al, Mg). , Ga-added material, indium oxide, indium tin oxide (ITO), indium zinc oxide (IZO), metal (gold, silver, chromium, nickel), a mixture or laminate of these metals and conductive metal oxides Inorganic conductive materials (copper iodide, copper sulfide), organic conductive materials (polyaniline, polythiophene, polypyrrole), and laminates of organic conductive materials and ITO can be used.

  Furthermore, the thin film formed by this vacuum film-forming method can be composed of an organic EL material.

  Next, the support 22 on which the pattern thin film is formed by the thin film forming unit 70 is sent to the mask removing unit 72. The mask removing section 72 is supported by rolling the peeling roll so that the thin film is formed on the entire surface of the support 22 on which the mask film 14 is adhered so that the peeling roll is brought into close contact with the predetermined pressure. The mask film 14 is peeled from the body 22.

  That is, in this thin film forming portion 70, as shown in FIG. 4A, a thin film 98 is formed on the entire surface of the substrate 22 on which the mask film 14 is adhered with the second adhesive layer 16 by a vacuum film forming method. Form.

  Next, in the mask removing unit 72, as shown in FIG. 4B, the mask film 14 and the second adhesive layer 16 are peeled off from the support 22 so that the surface of the support 22 is formed as shown in FIG. A thin film 98 having a predetermined pattern as shown in FIG.

  In addition, this mask removal part 72 is comprised similarly to the suction drum 58 and the peeling operation means 50 which were demonstrated in the film mask part peeling part for masks shown in FIG. The peeling roller 54 is driven against the surface of the support 22 adsorbed on the drum, and the pressure-sensitive adhesive surface of the pressure-sensitive adhesive tape is pressed and adhered to the mask film 14 portion via the thin film 98, and then the peeling roller is moved. An operation for separating the mask film 14 from the suction drum is created to cause the mask film 14 to peel off, and the mask film 14 portion is peeled off from the support 22 as the peeling roller moves away. And as shown in (C), only the remaining thin film 98 is left on the support 22 to obtain the support 22 on which the pattern thin film is formed. It may be configured.

  Moreover, in this mask removal part 72, the 2nd adhesion layer 16 in the material 20 for masks is a material which has a peeling function, and adds UV hardening release layer or heat for making it peelable by irradiating light. When it is composed of a thermosetting release layer to make it peelable or a water-soluble release layer to make it peelable by applying water, it can be easily peeled off from the UV curing release layer by irradiating light or It can be easily peeled off from the thermosetting release layer by applying heat, or can be easily peeled off from the water-soluble release layer by applying water.

  As shown in FIG. 2, in the mask removing unit 72, the support 22 on which the patterned thin film is formed, the used mask film 14 and the second adhesive layer 16 are separated from each other, and then the tension setting unit 74 and the tension are separated. Carry into the setting unit 80.

  The tension setting unit 74 and the tension setting unit 80 are separated from the support 22 on which the patterned thin film is formed, the used mask film 14, and the second adhesive layer 16, which are separated by the mask removing unit 72. In order that each of the predetermined tensions (tensions) can be applied and can be properly peeled off, the dancer rollers 74A or 80A are used to apply a constant tension to the support 22 or the used mask film 14 portion. Configure to grant.

  The support 22 on which the patterned thin film drawn from the tension setting unit 80 is formed is cleaned by a cleaning device (not shown) on the surface of the support (substrate) 22 on which the thin film is formed by a vacuum film forming method, if necessary. After the treatment, the patterned thin film-formed support terminal cutting section 82 is passed through and taken up on the winding roll 84 of the patterned thin film-formed support winding section.

  This pattern thin film formed support terminal cutting section 82 is a support on which the pattern thin film is formed at a predetermined timing such as when the support 22 on which the pattern thin film is formed is fully wound on the winding roll 84. 22 is configured as a cutter device for allowing the new winding roll 84 to start winding.

  Further, the mask film 14 and the second adhesive layer 16 to which the thin film is attached, drawn out from the tension setting section 74, are passed through the used mask film end cutting section 76, and used as a used mask film take-up section. It is wound up on a winding roll 78.

  The used mask film end cutting section 76 cuts the mask film 14 to which the thin film is adhered at a predetermined timing such as when the mask film 14 to which the thin film is adhered is fully wound on the take-up roll 78. Then, it is configured as a cutter device for allowing the new winding roll 78 to start winding.

  Next, in the pattern film forming system, the mask forming unit is configured to operate in atmospheric pressure, and the thin film formation processing step unit is configured to operate in vacuum, and a second vacuum holding and conveying unit is provided. The configuration of the aspect will be described with reference to FIG.

  In the configuration of the second aspect of the pattern film forming system, the support with the mask film 14 attached by the second adhesive layer 16 as a mask on the downstream side in the transport direction of the tension setting unit 38 in the mask forming unit. 22 is carried through the atmosphere-vacuum transfer device 86 into a vacuum chamber 96 configured as a sealable container containing a thin film formation processing step. In the configuration of the second mode shown in FIG. 3, the support terminal cutting unit 40 and the roll 42 used in the mask forming unit in the configuration of the first mode shown in FIG. 1 are omitted.

  The air-vacuum transfer device 86 is installed integrally with the entrance and exit for passing the support 22 of the vacuum chamber 96 in a secret manner so as to form a passage. An airtight holding roller group is arranged in three stages along the conveyance direction inside the passage.

  Each of the airtight holding roller groups is composed of anti-wall airtight holding rollers 88A, 88B, 88C disposed at both ends and intermediate intermediate airtight holding rollers 90A, 90B, 90C.

  Each of the airtight holding rollers 88A, 88B, 88C faces the inner wall of the casing of the atmosphere-vacuum transfer device 86 with a means having a low frictional resistance and capable of holding the airtightness. It is configured so that it can be rotated while maintaining airtightness.

  For example, each of the airtight holding rollers 88A, 88B, and 88C is configured such that the outer peripheral surface thereof is in sliding contact with the inner wall of the passage of the casing of the air-vacuum transfer device 86 while maintaining airtightness.

  Further, each of the intermediate medium hermetic holding rollers 90A, 90B, and 90C is sandwiched between a pair of opposite wall hermetic holding rollers 88A, 88B, and 88C, and is in rolling contact with the two at the same time. Attach to keep airtight.

  In the air-vacuum transfer device 86, a wall-to-wall airtight holding roller 88A and an intermediate medium airtight holding roller 90A that are a first-stage airtight holding roller group, and a wall-to-wall airtight holding that is a second-stage airtight holding roller group. A vacuum suction inlet 92 is provided so as to communicate with the inside of the first hermetic chamber defined by the inner wall of the passage between the casing 88B and the intermediate medium hermetic holding roller 90B. The air is sucked by a vacuum pump (not shown) through the air inlet 92, and the inside of the first hermetic chamber is set to a predetermined low pressure.

  Further, in the air-vacuum transfer device 86, the anti-wall airtight holding roller 88B and the intermediate medium airtight holding roller 90B which are the second-stage airtight holding roller group, and the counter-wall which is the third-stage airtight holding roller group. A vacuum suction inlet 94 is provided to communicate with the inside of the second hermetic chamber defined by the inner wall of the passage of the casing between the hermetic holding roller 88C and the intermediate intermediate hermetic holding roller 90C. Suction is performed by a vacuum pump (not shown) through the vacuum intake port 94, and the inside of the first hermetic chamber is set to a predetermined lower air pressure that is lower than the inside of the first hermetic chamber.

  Further, the inside of the vacuum chamber 96 that is hermetically held by the third stage hermetic holding roller group is configured to be depressurized to a pressure suitable for the vacuum film forming process by means such as suction by a vacuum pump (not shown) as necessary. .

  As shown in FIG. 3, the atmosphere-vacuum transfer device 86 configured as described above is configured so that the support 22 with the mask film 14 attached by the second adhesive layer 16 as a mask is moved to the right as viewed in FIG. In the first stage, between the one anti-wall airtight holding roller 88A and the intermediate medium airtight holding roller 90A, and in the second stage, one anti-wall airtight holding roller 88B and the intermediate intermediate airtight holding roller 90B. In the third stage, the air-tight holding roller 88C and the intermediate medium hermetic holding roller 90C are passed through the third stage and guided into the vacuum chamber 96.

  Further, as shown in FIG. 3, the support 22 on which the pattern thin film is formed in the thin film formation processing step in the vacuum chamber 96 hits the left side as viewed in the figure, and is for maintaining the other airtight wall at the third stage. Between the roller 88C and the intermediate medium airtight holding roller 90C, between the other anti-wall airtight holding roller 88B and the intermediate intermediate airtight holding roller 90B in the second stage, and for the other anti-wall airtight holding at the first stage. The roller 88A and the intermediate medium hermetic holding roller 90A are passed through and guided to the outside of the vacuum chamber 96.

  In the thin film formation processing step disposed inside the vacuum chamber 96, the support 22 with the mask film 14 attached directly by the second adhesive layer 16 as a mask is continuously supplied from the mask forming portion. Therefore, the supplied support 22 with the mask film 14 is immediately carried into the tension setting section 68, and the support 22 on which the pattern thin film carried out from the tension setting section 80 is formed is placed in the atmosphere. -It is configured to be wound around the winding roll 84 of the patterned thin film formed support winding section through the patterned thin film formed support terminal cutting section 82 installed outside the vacuum chamber 96 through the vacuum transfer device 86.

  Therefore, in the configuration of the second aspect in this pattern film forming system, the support end cutting part 40, the roll 42, and the support original fabric joining part 66 are omitted, compared with the structure of the first aspect. The processing efficiency can be improved by enabling continuous processing.

  Next, a description will be given of the configuration of the third aspect in which the mask forming unit and the thin film forming process step unit in the pattern film forming system are housed in a vacuum chamber and work is performed in a vacuum.

  The configuration of the third aspect is not shown, but the air-vacuum transfer device 86 portion in the configuration of the second aspect shown in FIG. 3 is omitted, and the mask forming unit and the thin film forming process step unit are all vacuumed. It is configured to be housed inside the chamber.

  In the configuration of the third aspect, compared with the configuration of the first aspect, the support terminal cutting portion 40, the roll 42, and the support original fabric joining portion 66 are omitted, the configuration is simplified, and continuous processing is performed. The processing efficiency can be improved as possible. Furthermore, the configuration of the third aspect is suitable for configuring the support pretreatment unit 32 to perform vacuum plasma processing.

  In addition, this invention is not limited to embodiment mentioned above, Of course, it can take other various structures in the range which does not deviate from the summary of this invention.

It is a schematic block diagram which shows the mask formation part comprised in the 1st aspect in the pattern film forming system which concerns on embodiment of this invention. It is a schematic block diagram which shows the thin film formation process process part comprised in the 1st aspect in the pattern film forming system which concerns on embodiment of this invention. It is a schematic block diagram which shows the structure of the 2nd aspect in the pattern film forming system which concerns on embodiment of this invention. (A), (B), and (C) show a predetermined pattern on the support by forming a thin film in the thin film formation processing step of the pattern film forming system according to the embodiment of the present invention and then removing the mask film. It is explanatory drawing which shows the process in which the thin film is formed. It is a schematic perspective view of the film half cut part for masks in the pattern film forming system which concerns on embodiment of this invention. It is a perspective view of the principal part which takes out and shows the Thomson blade base part in the pattern film forming system which concerns on embodiment of this invention. It is a principal part expanded sectional view which shows the state currently half-cut by the film half cut part for masks in the pattern film forming system which concerns on embodiment of this invention. (A), (B), (C), and (D) are perspective views of relevant parts illustrating respective processes of forming a mask using the mask material according to the embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Temporary support 12 Adhesive layer 14 Mask film 16 Adhesive layer 18 Separation material 18A Separation material part 18B Peeling separation material part 20 Remaining separation material part 20 Mask material 22 Mask formation support 34 Mask sticking part 36 Mask transfer part 48 Mask film half-cut part 50 Peeling operation means 54 Peeling roller 58 Suction drum 70 Thin film forming part 72 Mask removing part 86 Air-vacuum transfer device 96 Vacuum chamber 98 Thin film 100 Suction table 110 Thomson blade base 112 Thomson blade 112A Thomson blade 114 Stopper member

Claims (8)

Forming a mask sheet body formed in a thin film shape having an adhesive layer formed on one plane in a predetermined pattern;
Adhering the mask sheet body perforated in a predetermined pattern to the surface of the support as a substrate material by the adhesive force of the adhesive layer; and
Forming a thin film by a vacuum film formation method on the surface side of the support on which the mask sheet having a predetermined pattern shape is attached;
A mask removing step of removing a portion of the mask sheet having a predetermined pattern shape from the surface of the support on which the thin film is formed, and completing a substrate on which the thin film of the predetermined pattern is formed on the surface of the support; ,
A mask forming method characterized by comprising: A temporary support formed into a flexible sheet,
A first adhesive layer laminated on the surface of the temporary support;
A flexible sheet-like mask sheet laminated on the first adhesive layer;
A second adhesive layer laminated on the mask sheet;
A release material laminated on the second adhesive layer;
A mask material characterized by comprising a multilayer structure having The mask material according to claim 2, wherein the adhesive force of the second adhesive layer is stronger than the adhesive force of the first adhesive layer. The mask material according to claim 2 or 3, wherein the mask sheet is made of a flexible sheet material made of polyethylene terephthalate. A temporary support formed into a flexible sheet, a first adhesive layer laminated on the surface of the temporary support, and a flexible sheet-like mask sheet laminated on the first adhesive layer; A mask material configured in a multilayer structure having a second adhesive layer laminated on the mask sheet body and a release material laminated on the second adhesive layer corresponds to the shape of the mask. A mask sheet half-cut portion configured to make a half cut along the predetermined shape from the surface on the side of the separating material in the mask material to a predetermined depth at which a part of the temporary support is cut. ,
A peeling operation means for peeling only the separating material portion to be peeled corresponding to the mask shape from the half-cut mask material;
In the mask material, a mask adhering portion for adhering the surface of the second pressure-sensitive adhesive layer exposed by being exfoliated when the exfoliating material portion to be exfoliated is adhered to the surface of the support,
A mask transfer unit comprising: a mask transfer unit that transfers the mask sheet corresponding to a mask shape by the second adhesive layer by an operation of separating the mask material from the surface of the support; ,
In the mask forming part, a thin film forming part for forming a thin film by a vacuum film forming method on the surface of the support on which the mask sheet is adhered by the second adhesive layer;
A thin film forming process step unit comprising: a mask removing unit that removes the mask sheet from the support on which the thin film is formed and forms a thin film with a predetermined pattern on the support;
A pattern film forming system comprising: The pattern film forming system according to claim 5, wherein the thin film forming process section is configured to be housed in a vacuum state in a vacuum chamber. The support body, in which the mask sheet formed in the mask forming unit is adhered by the second adhesive layer, is transported while being kept in a vacuum state through an air-vacuum transport device. The thin film forming process step is stored in a state, and the support on which the thin film having a predetermined pattern is formed in the thin film forming process step is carried out to the atmosphere through the atmosphere-vacuum transfer device. The pattern film forming system according to claim 5. 6. The pattern film forming system according to claim 5, wherein both the mask forming unit and the thin film forming process step are disposed in a vacuum chamber.

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