JPWO2015012239A1 - Manufacturing method and manufacturing apparatus of organic electroluminescence element - Google Patents

Abstract

Provided are an organic EL element manufacturing method and a manufacturing apparatus capable of uniformly bonding a flexible sealing substrate having an adhesive layer formed in advance to an organic EL structure while suppressing bubbles and wrinkles. A sealing member (3) having a sealing substrate (15) and an adhesive layer (14) containing a thermosetting adhesive is bonded to the organic EL structure (2) formed on the substrate (16). In this method, the organic EL structure (2) is sealed to manufacture the organic EL element (1), and the substrate (16) and the sealing member (3) are opposed to each other, and the organic EL structure (2) A first step (S105) in which the adhesive layer (14) of the sealing member (3) and the adhesive layer (14) are in close contact with each other under the first adhesive condition, and the organic EL structure. A second step (S106) in which (2) and the sealing member (3) are adhered to each other under a condition in which the adhesive layer (14) has a second adhesiveness higher than the first adhesiveness; And a third step (S107) for curing the layer (14) in this order.

Description

  The present invention relates to a method for manufacturing an organic electroluminescent element and a manufacturing apparatus, and more particularly to a method for sealing an organic electroluminescent element.

  In recent years, organic electroluminescence (hereinafter also referred to as organic EL) elements as self-luminous elements have attracted attention. In an organic EL element, a light emitting layer of an organic compound (hereinafter also referred to as an organic light emitting layer or simply a light emitting layer) is sandwiched between two electrodes, a first electrode (anode) and a second electrode (cathode), on a substrate such as glass. The organic light emitting layer emits light by arranging the organic EL structure having the structure and supplying a current between the anode and the cathode.

  With the expansion of applications of organic EL elements, organic EL elements using flexible substrates such as resin films have also appeared, and by using such flexible substrates as organic EL element substrates, It has become possible to produce organic EL elements by a roll-to-roll method. The roll-to-roll manufacturing method here refers to a substrate wound in a roll shape, an organic EL structure is formed on the substrate, and the substrate on which the organic EL structure is formed is wound around a roll again. The manufacturing method of a form is pointed out. The roll-to-roll manufacturing method has the advantage that production efficiency can be improved because continuous production is possible.

  The organic light emitting layer constituting the organic EL element is easily affected by moisture and oxygen, and if left in the air, the quality is deteriorated by moisture and oxygen. Therefore, in the manufacturing process of the organic EL element, an external environment called sealing is used. A step of forming a protective layer on the organic EL structure for reducing the influence is added. As a sealing technique of the organic EL structure, for example, a sheet-like sealing that blocks moisture and oxygen based on a flexible material mainly made of a plastic film so as to keep the flexibility of the organic EL structure. A technique is known in which a stop substrate is bonded to an organic EL structure using an adhesive having sealing performance to perform sealing (see, for example, Patent Document 1).

Japanese Patent Laying-Open No. 2005-4063

  A flexible organic EL element can be produced by bonding a sheet-shaped sealing substrate to an organic EL structure. However, in order to obtain the required sealing performance, it is required that the sealing substrate be uniformly bonded to the organic EL structure without bubbles or wrinkles.

  In the apparatus described in Patent Document 1, after a liquid resin material is discharged from a nozzle onto a substrate on which an organic EL structure is formed, a sealing substrate (film) is overlaid, and a holding device presses the sealing substrate. Move while. As a result, the bead of the liquid resin material can be crushed and air can be pushed out to form an adhesive layer without leaving air bubbles, which can be bonded (see paragraph 0033).

  However, the apparatus described in Patent Document 1 requires an operation of discharging a liquid resin material onto a substrate on which the organic EL structure is formed when sealing the organic EL structure. For this reason, the handling of the resin material (adhesive) at the time of sealing is not easy, and there is a risk of reducing the production efficiency.

  On the other hand, for example, an improvement in production efficiency can be expected by bonding a sealing substrate on which an adhesive layer has been formed in advance to an organic EL structure. However, in this case, there is a problem that bubbles and wrinkles are likely to occur at the time of bonding as compared with the case where a liquid resin material (adhesive) is used.

  Therefore, the present invention provides a method for producing an organic EL element capable of uniformly bonding a flexible sealing substrate having an adhesive layer formed in advance to an organic EL structure while suppressing bubbles and wrinkles, and It is an object to provide a manufacturing apparatus.

  The object of the present invention is achieved by the following constitution.

  1. The organic electroluminescence structure is sealed by bonding a sealing member to the organic electroluminescence structure having at least the first electrode, the organic functional layer including the light emitting layer, and the second electrode formed on the substrate. A method of manufacturing an organic electroluminescence device by stopping the sealing member, wherein the sealing member includes a flexible sealing substrate and a thermosetting adhesive previously formed on one surface of the sealing substrate. An adhesive layer containing the substrate, the surface side of the substrate on which the organic electroluminescent structure is formed and the adhesive layer side of the sealing member are opposed to each other, and the organic electroluminescent structure and the sealing member are A first step of overlapping and adhering both under the condition that the adhesive layer has first tackiness, the organic electroluminescence structure and the sealing member, The adhesive layer includes a second step in which both of them are brought into close contact under a condition where the adhesive layer has a second adhesiveness higher than the first adhesive property, and a third step in which the adhesive layer is cured in this order. A method for producing an organic electroluminescent element.

  2. 2. The method for producing an organic electroluminescent element according to 1 above, wherein the first adhesiveness has a characteristic of an adhesive strength of 2 N / 25 mm or less.

  3. 3. The method for producing an organic electroluminescent element according to 1 or 2, wherein the second adhesiveness has a characteristic of an adhesive strength of 5 N / 25 mm or more.

  4). In the first step, the organic electroluminescence structure and the sealing member are brought into close contact with each other at a first temperature, and in the second step, the organic electroluminescence at a second temperature higher than the first temperature. The method for producing an organic electroluminescent element according to any one of 1 to 3, wherein the structure and the sealing member are brought into close contact with each other.

  5). 5. The method for producing an organic electroluminescent element according to 4 above, wherein the first temperature is 0 ° C. or higher and 50 ° C. or lower.

  6). Said 2nd temperature is 80 degreeC or more and 130 degrees C or less, The manufacturing method of the said organic electroluminescent element of 4 or 5 characterized by the above-mentioned.

  7). Said 1st process and said 2nd process are performed with a different apparatus, The manufacturing method of the organic electroluminescent element as described in any one of said 1-6 characterized by the above-mentioned.

  8). The organic electroluminescence structure is sealed by bonding a sealing member to the organic electroluminescence structure having at least the first electrode, the organic functional layer including the light emitting layer, and the second electrode formed on the substrate. An apparatus for producing an organic electroluminescence device by stopping the sealing member, wherein the sealing member includes a flexible sealing substrate and a thermosetting adhesive previously formed on one surface of the sealing substrate. A surface of the substrate on which the organic electroluminescence structure is formed and an adhesive layer side of the sealing member, and the organic electroluminescence structure and the sealing member. A first treatment part that adheres both under the condition that the adhesive layer has first adhesiveness, the organic electroluminescence structure, and the sealing member And a second processing unit that causes the adhesive layer to adhere to each other under a condition that the second adhesiveness is higher than the first adhesiveness, and a third processing unit that cures the adhesive layer. An apparatus for manufacturing an organic electroluminescence element characterized by the above.

  9. The organic electroluminescence structure is sealed by bonding a sealing member to the organic electroluminescence structure having at least the first electrode, the organic functional layer including the light emitting layer, and the second electrode formed on the substrate. An apparatus for producing an organic electroluminescence device by stopping the sealing member, wherein the sealing member includes a flexible sealing substrate and a thermosetting adhesive previously formed on one surface of the sealing substrate. A surface of the substrate on which the organic electroluminescence structure is formed and an adhesive layer side of the sealing member, and the organic electroluminescence structure and the sealing member. And the adhesive layer adheres both under the condition that the adhesive layer has the first adhesiveness, and then the adhesive layer has the second adhesiveness higher than the first adhesiveness. Apparatus for producing an organic electroluminescent device characterized by having an adhesion processing section for close contact with each other, and a curing treatment unit for curing the adhesive layer.

  According to the present invention, a method for producing an organic EL element capable of uniformly bonding a flexible sealing substrate in which an adhesive layer is formed in advance to an organic EL structure while suppressing bubbles and wrinkles, and A manufacturing apparatus can be provided.

It is a schematic sectional drawing which shows an example of a structure of an organic EL element. It is a process line figure showing an example of the 1st process, the 2nd process, and the 3rd process concerning a 1st embodiment of a manufacturing method of an organic EL device concerning the present invention. It is the flowchart concerning 1st Embodiment and 2nd Embodiment of the manufacturing method of the organic EL element which concerns on this invention. (A) is a process line figure showing an example of the 1st process, the 2nd process, and the 3rd process concerning a 2nd embodiment of a manufacturing method of an organic EL device concerning the present invention. (B) is the partial process line figure which shows the 1st process of 2nd Embodiment, and the modification of a 2nd process. It is a process line figure showing the 1st process, the 2nd process, and the 3rd process concerning a 3rd embodiment of a manufacturing method of an organic EL device concerning the present invention. It is a flowchart which concerns on 3rd Embodiment of the manufacturing method of the organic EL element concerning this invention.

  Embodiments of the present invention will be described with reference to FIGS. 1 to 6, but the present invention is not limited to the following.

  The present invention provides the organic electroluminescence by bonding a sealing member to an organic electroluminescence structure having at least a first electrode, an organic functional layer including a light emitting layer, and a second electrode formed on a substrate. A method of manufacturing an organic electroluminescence element by sealing a structure, wherein the sealing member has a flexible sealing substrate and a thermosetting formed in advance on one surface of the sealing substrate An adhesive layer containing an adhesive, and a surface side of the substrate on which the organic electroluminescence structure is formed and an adhesive layer side of the sealing member are opposed to each other, and the organic electroluminescence structure and the sealing A first step of superimposing a stop member and bringing the adhesive layer into contact with each other under a condition where the adhesive layer has a first adhesive property; the organic electroluminescence structure; and the sealing A second step of adhering the materials under the condition that the adhesive layer has a second tackiness higher than the first tackiness, and a third step of curing the adhesive layer in this order. It is a manufacturing method of the organic electroluminescent element characterized by including.

  According to such a configuration, the organic EL structure and the sealing member which is the sealing substrate on which the adhesive layer including the thermosetting adhesive is formed are bonded via the adhesive layer including the thermosetting adhesive. Adhering in a state where the adhesiveness of the layer is low makes it difficult for air bubbles to be included between the organic EL structure and the adhesive layer, and the adhesive layer is less likely to become wrinkles. That is, it becomes possible to adhere the organic EL structure and the sealing substrate while eliminating bubbles and wrinkles.

  Further, after the adhesive layer is adhered in a state where the adhesive layer is low, the organic EL structure and the sealing substrate adhered to the organic EL structure are further adhered in a state where the adhesive layer is high in adhesive state. The uniformity of the adhesive force of the adhesive layer with the sealing substrate is improved.

  Next, with a focus on a method for closely attaching a sealing member, which is a flexible sealing substrate having an adhesive layer formed in advance, in the method for manufacturing an organic EL element according to the present invention to the organic EL structure, the drawings. This will be described in detail with appropriate reference.

<< Configuration of Organic EL Element >>
An example of the organic EL element 1 is shown in FIG. In addition, in each drawing after this including FIG. 1, each figure is represented typically. As shown in FIG. 1, the organic EL element 1 manufactured according to the present invention includes an organic EL structure 2 provided on a substrate 16 and a sealing member 3 bonded to the organic EL structure 2. The organic EL structure 2 includes at least a first electrode 11, a second electrode 13, and an organic functional layer 12 including a light emitting layer, and includes a first electrode 11 provided on a substrate 16, a second electrode 11, and a second electrode 11. The organic functional layer 12 is sandwiched between the electrodes 13. The first electrode 11 and the second electrode 13 are a pair of an anode and a cathode. The sealing member 3 includes a flexible sealing substrate 15 and an adhesive layer 14 including a thermosetting adhesive formed in advance on one surface of the sealing substrate 15. The sealing substrate 15 has a support substrate and a barrier layer (both not shown).

<Board>
The substrate 16 is a member that serves as a support for the organic EL element 1. The substrate 16 is not limited to quartz, glass, plastic, or the like. In the case of a long strip, a flexible synthetic resin film is often used. When light is extracted from the substrate 16 side, the substrate is preferably transparent.

  When the substrate 16 is made of a synthetic resin film, the substrate 16 can be formed of a film applied to a known organic EL element. For example, it can be formed of polyester such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN), polyethylene, or the like.

<First electrode (anode)>
In the organic EL element 1, the first electrode 11 (anode) side is usually the observation side. As the first electrode 11 (anode), an electrode material made of a metal, an alloy, an electrically conductive compound, or a mixture thereof having a large work function (4 eV or more) and a transmittance of 40% or more is preferably used.

  For the first electrode (anode), a known substance can be used. For example, the substance described in Paragraph 0046 of JP2012-22783A, Paragraph 0077 of International Publication WO2011-132631 is used. Is possible.

<Second electrode (cathode)>
The second electrode 13 is connected to a power source and functions as, for example, a cathode. For such a second electrode 13 (cathode), a known substance can be used. For example, paragraphs 0034 of JP 2012-22783 A and paragraphs 0127 to 0130 of JP 2012-128954 A can be used. It is possible to use the substances described.

<Organic functional layer>
The organic functional layer 12 is a light emitting layer (not shown) that emits light by recombination of holes injected from the first electrode 11 (anode) and electrons injected from the second electrode 13 (cathode). Contains. In addition to the light emitting layer, the organic functional layer 12 includes an electron transport layer, a hole transport layer, a hole injection layer (anode buffer layer), an electron injection layer (cathode buffer layer), a hole blocking layer, an electron blocking layer, and the like ( Any of them can be appropriately laminated.

[Light emitting layer]
The light emitting layer is a layer that emits light by recombination of holes injected from the first electrode 11 (anode) and electrons injected from the second electrode 13 (cathode). The portion that emits light may be within the layer of the light emitting layer or at the interface between the light emitting layer and the adjacent layer. The light emitting layer may be a single layer or may be a multilayer using a plurality of light emitting layers. In the case of a multilayer structure, a non-light emitting intermediate layer may be provided between the light emitting layers. Further, among the layer configurations, the organic functional layer 12 including the light emitting layer can be used as one light emitting unit, and a plurality of light emitting units can be stacked. The plurality of stacked light emitting units may have a non-light emitting intermediate layer between the light emitting units, and the intermediate layer may further include a charge generation layer.

  For the light emitting layer constituting the organic functional layer 12, a known substance can be used. For example, paragraphs 0022 to JP-A 2013-58673, paragraphs 0093 to 0096 of JP-A 2012-186212, It can be formed of a material that satisfies the conditions described in paragraph 0053 of JP 2012-22783, paragraph 0180 of JP 2009-37751 A, paragraph 0022 of JP 2013-89608 A.

[Hole transport layer (hole injection layer, electron blocking layer)]
(Hole transport layer)
The hole transport layer has a role of moving holes to an effective recombination region and a role of blocking electrons locally as an energy barrier to strengthen light emission. The hole transport layer is made of a hole transport material having a function of transporting holes, and in a broad sense, a hole injection layer and an electron blocking layer are also included in the hole transport layer. The hole transport layer can be provided as a single layer or a plurality of layers. These are described in detail in Chapter 2 “Electrode Materials” (pages 123 to 166) of Volume 2 of “Organic EL Devices and the Forefront of Industrialization” (NTS Corporation, issued on November 30, 1998). Have been described.

  As the hole transport layer constituting the organic functional layer 12, a known substance can be used. For example, paragraphs 0148 to 0150 in JP 2013-84962 A, paragraph 0110 in JP 2013-128954 A, and so on. To 0117, paragraphs 0083 to 0089 of JP 2013-89608 A, and paragraph 0048 of JP 2012-22783 A can be used.

(Hole injection layer)
As the hole injection layer (anode buffer layer) constituting the organic functional layer 12, a known substance can be used. For example, paragraphs 0097 and 0099 of JP2013-128954A and JP2012-186212A. It is possible to use substances that satisfy the conditions described in paragraph 0088 of the publication.

[Electron transport layer (electron injection layer, hole blocking layer)]
(Electron transport layer)
The electron transport layer plays a role of moving holes to an effective recombination region and a role of blocking holes as an energy barrier and locally retaining light to enhance light emission. The electron transport layer is made of a material having a function of transporting electrons (electron transport material), and includes an electron injection layer and a hole blocking layer in a broad sense. The electron transport layer can be provided as a single layer or a plurality of layers. These are described in detail in “Organic EL elements and their industrialization front line” (issued by NTT, Inc. on November 30, 1998).

  For the electron transport layer constituting the organic functional layer 12, a known substance can be used. For example, paragraphs 0155 to 0156 of JP 2013-84962 A, paragraphs 0118 to 0 of JP 2012-128954 A, and so on. It is possible to use the substances described in 0123.

(Electron injection layer)
For the electron injection layer (cathode buffer layer) constituting the organic functional layer 12, a known substance can be used, for example, a substance described in paragraph 0100 of JP 2012-128954 A is used. Is possible.

(Hole blocking layer)
As the hole blocking layer constituting the organic functional layer 12, a known substance can be used. For example, the substances described in paragraphs 0143 to 0145 of JP2013-84962A can be used. is there. The hole blocking layer can be implemented using the one described in the electron transport layer. The hole blocking layer is preferably provided adjacent to the light emitting layer. The film thickness of the hole blocking layer is preferably 3 to 100 nm, more preferably 5 to 30 nm.

[Sealing substrate]
The sealing substrate 15 of the organic EL element 1 has a barrier layer (not shown) on the side in contact with the organic EL structure 2. Furthermore, a protective layer (not shown) may be provided on the barrier layer. The support substrate is preferably a flexible resin substrate, and examples thereof include a resin film and a transparent resin film.
The support substrate may be a single body or a laminate, and can be appropriately selected as necessary.
The barrier layer may be a single body or a laminate, and can be appropriately selected as necessary.

(Support substrate)
The thickness of the support substrate is preferably 10 μm to 500 μm in consideration of handling at the time of manufacture, tensile strength, stress cracking resistance of the barrier layer, and the like.

The water vapor permeability of the support substrate is preferably 0.01 g / m ² · day or less in consideration of gas barrier properties and the like required for commercialization as an organic EL element. The water vapor permeability indicates a value measured mainly by the MOCON method by a method based on the JIS K7129B method (1992).

The oxygen permeability of the support substrate is preferably 0.01 ml / m ² · day · atm or less. The oxygen permeability is a value measured mainly by the MOCON method by a method based on the JIS K7126B method (1987).

The rigidity (Young's modulus) of the support substrate is preferably 1 × 10 ⁻³ GPa to 80 GPa in consideration of handleability during manufacturing, tensile strength, stress cracking resistance of the barrier layer, and the like.

The support substrate constituting the sealing substrate 15 used in the present invention is not particularly limited as long as it has flexibility and satisfies the above numerical values. This support substrate includes, for example, unstretched polypropylene (CPP), polyvinyl alcohol, which is a polymer film described in “New trends in functional packaging material development” (Toray Research Center, Inc.). (PVA), cellophane, expanded vinylon (OV), ethylene-vinyl alcohol copolymer (EVOH), ethylene-propylene copolymer, ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer, vinylidene chloride (PVDC) ) Etc. can be used.
In addition, this support substrate includes oriented polypropylene (OPP), oriented nylon (ONy), polyethylene terephthalate (PET), polystyrene (PS), polymethyl methacrylate (PMMA), ethylene tetrafluoroethyl copolymer (ETFE), polycarbonate. (PC), polyimide, polyether styrene (PES) and the like can also be used.

(Barrier layer)
Examples of the barrier layer include an inorganic vapor deposition film and a metal foil. As the inorganic deposited film, “Thin Film Handbook” (published by Japan Society for the Promotion of Science, published by Ohm Co., p879-p901), “Vacuum Technology Handbook” (published by Nikkan Kogyo Shimbun, p502-p509, p612, p810), “Vacuum Handbook Amendment Plate ”(published by ULVAC, Japan Vacuum Technology Co., Ltd., published by Ohm, p132 to p134). For example, metals such as In, Sn, Pb, Au, Cu, Ag, Al, Ti, Ni, MgO, SiO, SiO ₂ , Al ₂ O ₃ , GeO, NiO, CaO, BaO, Fe ₂ O ₃ , Y ₂ O ₃ , TiO ₂ , Cr ₂ O ₃ , single crystal Si, Si _x O _y (x = 1, y = 1.5 to 2.0), Ta ₂ O ₃ , TiC, SiC, ZrN, PSG, Si ₃ N ₄ , amorphous Si, W, or the like is used.

  As the material of the metal foil, for example, a metal material such as aluminum, copper, or nickel, or an alloy material such as stainless steel or an aluminum alloy can be used. Aluminum is preferable in terms of workability and cost. The film thickness is about 1 μm to 100 μm, preferably about 10 μm to 50 μm.

[Adhesive layer]
In the method for manufacturing the organic EL element 1 of the present invention, the adhesive layer 14 that bonds the substrate 16 on which the organic EL structure 2 is formed and the sealing substrate 15 contains a thermosetting adhesive. The thermosetting adhesive preferably has temperature-dependent adhesiveness (tackiness). Thereby, the adhesive layer 14 containing a thermosetting adhesive has low adhesiveness (adhesiveness) at room temperature, and the adhesiveness (adhesiveness) is increased by raising the temperature. Furthermore, it has a property of reactive hardening when the temperature is raised.

  As the thermosetting adhesive contained in the adhesive layer, there is an adhesive formed into a sheet shape having low tackiness at 0 ° C. or more and 50 ° C. or less and increasing tackiness within a range of 80 ° C. or more and 130 ° C. or less. preferable. As a sheet-like thermosetting adhesive, it exhibits non-flowability at 0 ° C. or more and 30 ° C. or less, and when heated, exhibits fluidity in a range of 90 ° C. or more and 120 ° C. or less, and is formed into a sheet shape. An agent is more preferable.

  At the time of use, as described later, it is preferable to use it by pasting on the sealing substrate 15 in advance. Examples of the adhesive to be used include an epoxy sheet-like thermosetting adhesive (1600 series manufactured by Three Bond Co., Ltd.).

  Alternatively, the adhesive layer 14 may be formed by applying a liquid thermosetting adhesive on the sealing substrate 15 and drying it.

  And you may form the contact bonding layer 14 by bonding these liquid thermosetting adhesives in the shape of a film, and then bonding to the sealing substrate 15. The laminating method can be made by using various generally known methods such as a wet laminating method, a dry laminating method, a hot melt laminating method, an extrusion laminating method, and a thermal laminating method.

(Adhesive)
The adhesiveness of the adhesive layer 14 in the present invention is obtained by measuring according to the adhesive tape / adhesive sheet test method defined in JIS Z 0237 (2009), assuming that the sealing member 3 is similar to an adhesive sheet. It is done. The unit is a peeling force (N) with respect to the width (mm) of the sealing member 3 (N / 25 mm).

  As the test apparatus, a tensile tester or the like specified in JIS B 7721 is used. As the test plate, instead of the specified SUS304 plate, a test plate in which the substrate 16 on which the organic EL structure 2 is formed is attached to the specified SUS304 plate is used. The contact condition between the test plate (organic EL structure 2) and the test piece (sealing member 3) is a temperature environment to be measured and conditions such as a pressure specified in JIS Z 0237 (2009). The close contact apparatus uses the close contact processing portion of the sealing device described later. The peeling angle is 90 ° as defined in JIS Z 0237 (2009) 10.4. The environmental temperature of the installation environment of the test apparatus is adjusted to the contact condition between the test plate (organic EL structure 2) and the test piece (sealing member 3).

  The low adhesive region of the adhesive layer 14 which is a condition for bringing the sealing member 3 into close contact with the organic EL structure 2 refers to a condition where the adhesive force measured by the above method is 2 N / 25 mm or less. For example, when the adhesive strength of the adhesive is temperature-dependent, a temperature range in which the adhesive strength measured by the above method is 2 N / 25 mm or less is preferable. Moreover, the adhesive force measured by the said method should just be a temperature range larger than 0 N / 25mm, and the temperature range where the adhesive force measured by the said method becomes 0.05 N / 25mm or more is preferable.

  If the adhesive strength of the adhesive layer 14 is 2 N / 25 mm or less, the adhesive layer 14 is in a low adhesive state, so that the sealing member 3 is easy to extend while maintaining a flat state, and the organic EL structure 2 and the adhesive layer It becomes difficult to contain air bubbles between 14 and the adhesive layer is difficult to become wrinkles. That is, the organic EL structure 2 and the sealing substrate 15 can be brought into close contact with each other while eliminating bubbles and wrinkles. Further, no peeling occurs during the conveyance in the apparatus.

Furthermore, even when the sealing area is a large area, the organic EL structure 2 and the sealing substrate 15 can be brought into close contact with each other while eliminating bubbles and wrinkles.
If the adhesive strength of the adhesive layer 14 is 1 N / 25 mm or less, it is more preferable because the adhesiveness becomes lower and bubbles and wrinkles can be easily removed.

  The adhesive strength of the adhesive layer 14 is more preferable as it is closer to 0 N / 25 mm because air bubbles and wrinkles can be easily removed. By setting the adhesive strength of the adhesive layer 14 to 0.05 N / 25 mm or more, the minimum required adhesive strength can be obtained when the organic EL structure 2 is transported in a state of being in close contact with the organic EL structure 2. In the case of transporting the organic EL structure 2 in a state where the sealing member 3 is in close contact, for example, the first step S105 and the second step S106 described later are performed in different devices or different regions of the same device. The case where it performs is mentioned.

  The highly adhesive region of the adhesive layer 14, which is a condition for bringing the sealing member 3 into close contact with the organic EL structure 2, refers to a condition where the adhesive force measured by the above method is 5 N / 25 mm or more. For example, when the adhesive strength of the adhesive is temperature-dependent, a temperature range in which the adhesive strength measured by the above method is 5 N / 25 mm or more is preferable. Moreover, the temperature range where the adhesive force measured by the method is 50 N / 25 mm or less is preferable.

If the adhesive strength of the adhesive layer 14 is 5 N / 25 mm or more, the adhesive layer 14 is highly adhesive, so the uniformity of the adhesive strength is improved.
If the adhesive strength of the adhesive layer 14 is 8 N / 25 mm or more, it is more preferable because the uniformity of the adhesive strength of the adhesive layer 14 is further improved and the sealing performance is improved.

  The upper limit of the adhesive strength of the adhesive layer 14 may be as high as it does not mean that it is too high. If the adhesive strength of the adhesive layer 14 is 50 N / 25 mm, the adhesive strength is too high when the organic EL structure 2 is conveyed in a state of being in close contact with the organic EL structure 2. By setting the adhesive strength of the adhesive to 50 N / 25 mm, the adhesive is not heated more than necessary to increase the adhesive strength, and the production efficiency is improved.

Further, when the adhesive layer 14 is in a fluid state, the flexibility of the adhesive layer 14 is increased, and the thickness uniformity of the adhesive layer 14 between the substrate 16 and the sealing substrate 15 is improved.
The organic EL structure 2 and the sealing member 3 are in close contact with each other without being displaced, and the adhesive performance of the adhesive layer 14 is high and the fluidity of the adhesive layer 14 further improves the sealing performance.

  The temperature range in which the adhesive strength of the adhesive layer 14 is 2 N / 25 mm or less is preferably 0 ° C. or higher and 50 ° C. or lower, although it depends on the type of adhesive contained in the adhesive layer 14. Within this temperature range, thermal deformation of the substrate 16 and the sealing member 3 is small. For this reason, in a state where the organic EL structure 2 and the sealing member 3 are in close contact with each other, positional deviation and dimensional deviation are also reduced, and sealing performance is improved. In particular, when the sealing area is a large area, the effect of reducing positional deviation and dimensional deviation due to small thermal deformation is significant. Therefore, when the sealing area is a large area, the sealing performance is further improved. 0 degreeC or more and 30 degrees C or less are more preferable.

  The temperature range in which the adhesive strength of the adhesive layer 14 is 5 N / 25 mm or more is preferably 80 ° C. or higher and 130 ° C. or lower, although it depends on the type of adhesive contained in the adhesive layer 14. 90 degreeC or more and 120 degrees C or less are more preferable.

(Sealing member)
The sealing member 3 is a sealing substrate 15 on which an adhesive layer 14 is formed in advance, and seals the organic EL structure 2 by being bonded to the organic EL structure 2.

  Here, the sealing member 3 is cut into a shape that covers the display area of the organic EL element 1. The size of the sealing member 3 is such that the light emitting region of the organic EL structure 2 formed on the substrate 16 and the first electrode 11 and the second electrode 13 excluding the portion where the extraction electrode portion is formed. A size including a part is preferable. Further, the sealing member 3 may be cut into a shape that covers the plurality of organic EL elements 1. In addition, as described later, a long sealing member 3 wound in a roll shape may be used.

<Sealing device>
As shown in FIG. 2, the sealing device of the manufacturing apparatus for the organic EL element 1 includes a first processing unit 31 and an adhesion processing unit having a second processing unit 33 and a curing processing unit that cures the adhesive layer 14. A third processing unit 35 is provided.

The adhesion processing unit is an apparatus that performs an adhesion process on the organic EL structure 2 formed on the substrate 16 and the sealing member 3.
The first processing unit 31 includes a pair of upper and lower contact rolls 32, a plurality of alignment mark detectors (not shown), and a temperature control device (not shown). The first processing unit 31 may include a vacuum exhaust unit or an inert gas supply unit (not shown).
Similar to the first processing unit 31, the second processing unit 33 includes a pair of upper and lower contact rolls 34, a temperature control device (not shown), and a plurality of alignment mark detectors (not shown). The second processing unit 33 may include a vacuum exhaust unit or an inert gas supply unit (not shown).

The third processing unit 35 includes a heating unit that cures the thermosetting adhesive included in the adhesive layer 14.
Examples of the heating means of the third processing unit 35 include radiant heat heating such as a surface heater, a heating roller, a heating belt, a heating oven, a halogen heater, and a far infrared heater.

The alignment mark detector detects alignment marks attached to the substrate 16 and the carrier substrate 21. The alignment control between the organic EL structure 2 and the sealing member 3 can be performed based on the information detected by the alignment mark detector.
The sealing member 3 is disposed on the carrier substrate 21.

The first processing unit 31 rotates while contacting and pressing the contact rolls 32 with a constant pressure so that the organic EL structure 2 and the sealing member 3 passing between the pair of upper and lower contact rolls 32 can be uniformly and continuously pressed. It has a structure to do. The surface pressure (surface pressure) at this time is preferably 0.05 MPa or more and 0.5 MPa or less. More preferably, it is 0.1 MPa or more and 0.4 MPa or less. The preferable range of the conveyance speed at this time is 0.1 to 30 m / min.
The 1st process part 31 can adhere | attach the organic EL structure 2 and the sealing member 3 which pass between a pair of upper and lower contact | adherence rolls 32 on the conditions used as the low-adhesion area | region prescribed | regulated in this invention. Yes.

The second processing unit 33 rotates while contacting and pressing the contact rolls 34 with a constant pressure so that the organic EL structure 2 and the sealing member 3 passing between the pair of upper and lower contact rolls 34 can be uniformly and continuously pressed. It has a structure to do. The surface pressure at this time is preferably 0.05 MPa or more and 0.5 MPa or less. More preferably, it is 0.1 MPa or more and 0.4 MPa or less. The preferable range of the conveyance speed at this time is 0.1 to 30 m / min.
The second processing unit 33 can further adhere the organic EL structure 2 and the sealing member 3 passing between the pair of upper and lower contact rolls 34 under the condition of becoming a highly adhesive region defined in the present invention. It has become.

  The pair of upper and lower contact rolls 32 and 34 can move toward and away from each other, and the surface pressure can be adjusted. The pair of upper and lower contact rolls 32, 34 can be adjusted to a surface pressure in which wrinkles and bubbles are sufficiently extended during contact and do not affect (damage) the organic EL element 1.

The first processing unit 31 and the second processing unit 33 include the temperature adjusting device, thereby adjusting the adhesiveness of the adhesive layer 14 when the organic EL structure 2 and the sealing member 3 are in close contact with each other. It is possible to do. That is, the adjustment can be performed so that the adhesiveness is low and high. The temperature adjusting device is preferably provided in a pair of upper and lower contact rolls 32 and 34, and is preferably provided at least in the contact roll on the sealing member 3 side.
When the organic EL structure 2 and the sealing member 3 are brought into close contact with each other by the vacuum evacuation means or the inert gas supply means, it is possible to use a vacuum or an inert gas atmosphere. .

  The first processing unit 31 and the second processing unit 33 may all be provided in one device, or may be provided in a separate device for each processing unit.

<< Method for sealing organic electroluminescence element >>
<First Embodiment>
FIG. 3 is a flowchart of the method for manufacturing the organic EL element 1 according to the present invention.
As shown in FIG. 3, the method for manufacturing the organic EL element 1 according to the present invention includes a first step S105, a second step S106, a third step S107, and the like.

In the roll-to-roll manufacturing process, the substrate 16 is fed out from the feeding roll 53, and the organic EL structure 2 is formed in the light emitting layer forming process S114 and the like. On the other hand, the sealing member 3 is formed in the adhesive layer forming step S102, and the sealing member 3 is arranged on the peelable adhesive layer on the carrier substrate 21 in the arranging step S104.
In the first step S105, the sealing member 3 is brought into close contact with the organic EL structure 2 while keeping out the bubbles so as not to cause wrinkles, and in the second step S106, the adhesive force of the adhesive layer 14 is made uniform. Then, the adhesive layer 14 is cured in the third step S107, and the organic EL element 1 is wound up in a roll shape.

[First step]
In the first step S105 (see FIG. 3), the sealing member 3 is closely adhered to the organic EL structure 2 on the substrate 16 while suppressing wrinkles so that there are no bubbles and wrinkles in the low-adhesive region of the adhesive layer 14. It is a process to make. Since the adhesive layer 14 has low adhesiveness, it is possible to detect the alignment mark and the like, adjust the contact position, expel bubbles, and bring the organic EL structure 2 and the sealing member 3 into close contact with each other while extending the folds. It becomes.

  For example, as shown in FIG. 2, the substrate 16 on which the organic EL structure 2 conveyed at the same speed and the carrier substrate 21 on which the sealing member 3 is disposed are moved up and down via a support roll 52. The sealing member 3 can be adhered to the organic EL structure 2 on the substrate 16 by being sandwiched by the first processing unit 31 having the adhesion roll 32. At this time, bubbles are driven out from one end where the organic EL structure 2 and the sealing member 3 are overlapped by the contact roll 32 toward the other end, and are gradually brought into close contact with each other so as not to generate wrinkles.

  The organic EL structure 2 is fed out by the feeding roll 53 from the state of being formed on the substrate 16 and wound up in a roll shape. The sealing member 3 is a carrier substrate 21 on which a peelable adhesive layer is formed, and is disposed at a position corresponding to the organic EL structure 2 on the substrate 16 on the peelable adhesive layer. The carrier substrate 21 is sent out from the feeding roll 51.

  In the first step S <b> 105, when the sealing member 3 is brought into close contact with the organic EL structure 2, it is performed in the low tack region of the adhesive layer 14. Conditions under which the adhesive strength of the adhesive layer 14 is 2 N / 25 mm or less are preferable. Although depending on the adhesive contained in the adhesive layer 14, the temperature is preferably 0 ° C. or higher and 50 ° C. or lower. The surface pressure at this time is preferably 0.05 MPa or more and 0.5 MPa or less. The conveyance speed at this time is preferably 3 m / min.

[Second step]
The second step S <b> 106 (see FIG. 3) is a step of closely attaching the sealing member 3 to the organic EL structure 2 on the substrate 16 in the highly adhesive region of the adhesive layer 14. Since the adhesion of the adhesive layer 14 is in close contact with the organic EL structure 2 in a state higher than that in the first step, the variation in the adhesive force of the adhesive layer 14 between the substrate 16 and the sealing substrate 15 is reduced. Improves uniformity. When the fluidity of the adhesive layer 14 is higher than that in the first step, the adhesive layer 14 can easily adjust the thickness of the adhesive layer 14 between the substrate 16 and the sealing substrate due to the fluidity of the adhesive layer 14. The uniformity of the thickness is improved.
The second step S106 is performed by the second processing unit 33, for example.

  As shown in FIG. 2, for example, the substrate 16 having the organic EL structure 2 to which the sealing member 3 is adhered in the first step is sandwiched by the second processing unit 33 having the adhesion rolls 34 on the substrate 16. The sealing member 3 can be further adhered to the organic EL structure 2. At this time, the organic EL structure 2 and the sealing member 3 are brought into close contact with each other from one end to the other end by the contact roll 34. After the organic EL structure 2 and the sealing member 3 are brought into close contact with each other, the carrier substrate 21 is peeled off and taken up by the take-up roll 54.

  In the second step S <b> 106, when the sealing member 3 is brought into close contact with the organic EL structure 2, it is performed in the highly adhesive region of the adhesive layer 14. Conditions under which the adhesive strength of the adhesive layer 14 is 5 N / 25 mm or more are preferable. Although depending on the adhesive contained in the adhesive layer 14, the temperature is preferably 80 ° C. or higher and 130 ° C. or lower. The surface pressure at this time is 0.05 MPa or more and 0.5 MPa or less. The conveyance speed at this time is preferably 3 m / min.

(Contact position determination method)
Determination of the contact position in the first step S105 and the second step S106 can be performed based on alignment marks (not shown) provided on the substrate 16 and the carrier substrate 21.

The first step S105 and the second step S106 may be performed not only in a vacuum but also in an inert gas atmosphere.
The adhesion of the sealing member 3 to the organic EL structure 2 on the substrate 16 is performed under a reduced pressure environment of 200 Pa or more and 1 × 10 ⁻⁴ Pa or less, or an oxygen concentration of 10 ppm or less in order to thoroughly exclude oxygen, moisture, and bubbles. It is preferably carried out in an inert gas environment having a moisture concentration of 10 ppm or less.

  In FIG. 2, the substrate 16 on which the organic EL structure 2 is formed and the carrier substrate 21 on which the sealing member 3 is disposed, which are wound in a roll shape, are illustrated for convenience. However, it is naturally possible to continuously adhere to other processes such as formation of the organic EL structure 2 without using the substrate 16 formed in advance and wound in a roll shape. is there. In obtaining the effects of the present invention, it is more preferable to continuously perform the steps from the preparation of the substrate 16 and the formation of the organic EL structure 2 to the sealing of the organic EL element 1.

  The first step S105 and the second step S106 may be performed by different processing units separated as illustrated, or may be performed by the same processing unit. By performing the first step S105 and the second step S106 in different processing units, it is possible to continuously perform the flow operation without resetting the temperature, pressure, etc. according to each step. . When the first process S105 and the second process S106 are performed by the same processing unit, the apparatus is downsized.

[Third step]
In the third step S107, the adhesive layer 14 of the sealing member 3 bonded to the organic EL structure 2 on the substrate 16 is cured. Since the material constituting the adhesive layer 14 is a sheet-like thermosetting adhesive, it is heated to a desired temperature using the heating means of the third processing unit 35 which is a curing processing unit of the sealing device. It can be cured. Then, the organic EL element 1 in which the sealing member 3 is bonded to the organic EL structure 2 is wound around the winding roll 55.

  Although heating temperature is based also on the kind of material which comprises the contact bonding layer, 60 to 120 degreeC is preferable and 80 to 120 degreeC is more preferable.

  Hereinafter, the other process of the manufacturing method of the organic EL element 1 which concerns on this invention is demonstrated. First, the substrate preparation step S111 to the second electrode formation step S116 will be described.

[Board preparation process]
In the substrate preparation step S111, for example, the substrate 16 wound in a roll shape is fed out to the cleaning unit, immersed in an ultrasonic cleaning tank and subjected to ultrasonic cleaning, and then rinsed with pure water in the rinse tank, Rinse with a shower head and dry in the drying section.

  After that, the transfer speed with the subsequent process is adjusted by the buffer unit, and is transferred to the plasma tank through the preliminary chamber a and the preliminary chamber b (both not shown). A gate valve for allowing the substrate 16 (film) to pass is provided between each preliminary chamber entrance, between the preliminary chambers, and between the preliminary chamber and the plasma tank. The gate valve is provided with an orifice (a valve is formed so that the gap can be adjusted) so that the surface of the substrate 16, particularly the surface on the organic EL element 1 formation side, can pass through without contact. As a result, the degree of decompression is adjusted by the differential evacuation, and the substrate 16 is carried into the plasma tank by the decompression preliminary chamber, another decompression preliminary chamber, and the differential exhaust.

  Each decompression preparatory chamber and the plasma chamber are differentially evacuated by a vacuum pump (not shown) provided, so that the vacuum chamber required by the plasma chamber is changed from the atmospheric pressure environment to the plasma chamber. Adjusted.

In the plasma tank, the substrate 16 is cleaned with oxygen plasma in a vacuum environment of 1 × 10 ⁻⁴ Pa, for example.

  After the cleaning is performed, the substrate 16 is then transferred to the first electrode formation step S112.

[First electrode forming step]
In the first electrode formation step S112, for example, the first electrode 11 (anode) having the extraction electrode portion is formed by a sputtering method using a pattern mask. In this method, for example, when a film of ITO is formed on the substrate 16 as a material of the first electrode 11 (anode) by a sputtering method, the film is formed using a mask having a necessary shape in advance.

[Hole transport layer forming step]
Next, in the hole transport layer forming step S113, for example, a hole transport layer that is an organic compound is laminated on the entire surface of the first electrode 11 (anode) except for a portion that becomes an electrode by a vacuum deposition method using a pattern mask. Is done.

  Then, as will be described later, the light emitting layer, the electron transport layer, the electron injection layer, and the second electrode 13 (cathode) are formed on the hole transport layer formed as described above, and the organic EL structure 2 is manufactured. .

(Light emitting layer forming step)
In the light emitting layer forming step S114, a light emitting layer is formed by vacuum deposition on the hole transport layer excluding the extraction electrode portion of the substrate 16 on which the hole transport layer is formed.

[Electron injection layer forming step]
In the electron injection layer forming step S115, an electron injection layer is formed on the light emitting layer already formed on the substrate 16 continuously supplied from the feeding portion by, for example, a vacuum evaporation method. The thickness of the electron injection layer is preferably in the range of 0.1 nm to 5 μm.

[Second electrode forming step]
In the second electrode formation step S116, for example, the second electrode 13 (cathode) having an extraction electrode on the substrate 16 continuously supplied from the electron injection layer formation step S115 is formed on the already formed electron injection layer. A mask pattern is formed. The sheet resistance as the second electrode 13 (cathode) is preferably several hundred Ω / □ or less, and the film thickness is usually selected in the range of 10 nm to 5 μm, preferably 50 to 200 nm. At this stage, the organic EL structure 2 having the configuration of the first electrode (anode) / hole transport layer / light emitting layer / electron injection layer / second electrode (cathode) is produced on the substrate 16.

  In the above description of the second electrode (cathode) forming step S116 and the electron injection layer (cathode buffer layer) forming step S115, the case of the vapor deposition apparatus is shown. However, the second electrode 13 (cathode) and the electron injection layer (cathode buffer layer) are shown. There is no particular limitation on the forming method. About these formation methods, for example, sputtering method, reactive sputtering method, molecular beam epitaxy method, cluster ion beam method, ion plating method, plasma polymerization method, atmospheric pressure plasma polymerization method, plasma CVD method, laser CVD method, A thermal CVD method, a coating method, or the like can be used.

  The substrate 16 having the organic EL structure 2 formed up to the second electrode sequentially passes through a preliminary chamber having a gate valve for adjusting the degree of decompression, and the decompression is gradually released by the differential exhaust, and the vacuum It is taken out from the environment to the atmospheric pressure environment. The extracted substrate 16 is transported to the next process.

  Next, the sealing substrate preparation step S101 to the placement step S104 shown in FIG. 3 will be described.

[Encapsulation substrate preparation process]
The sealing substrate preparation step S101 is a step of preparing the sealing substrate 15 that seals the organic EL structure 2. As in the substrate preparation step S111, it is preferable to clean and dry the flexible support substrate. In this step S101, the sealing substrate 15 is produced by providing a barrier layer on the support substrate surface by a dry laminating method, a vapor deposition method or the like.

[Adhesive layer forming step]
The adhesive layer forming step S102 is a step of forming the adhesive layer 14 in close contact with the organic EL structure 2 on the support substrate. For example, the method of bonding a sheet-like thermosetting adhesive by the dry laminating method is mentioned. In this method, a general laminator can be used, and generally a sheet-like thermosetting adhesive having a thickness of about 1.0 to 2.5 μm is used.

[Sealing member cutting process]
The sealing member cutting step S103 is a step of cutting the produced sealing member 3 into a predetermined shape. The sealing member 3 cut into a predetermined shape in the sealing member cutting step S103 is placed on the peelable adhesive layer on the carrier substrate 21 in the next placement step S104.

  Here, the sealing member 3 is cut into a shape that covers the display area of the organic EL element 1. The size of the sealing member 3 is such that the light emitting region of the organic EL structure 2 formed on the substrate 16 and the first electrode 11 and the second electrode 13 excluding the portion where the extraction electrode portion is formed. A size including a part is preferable.

  There is no restriction | limiting in particular in the method to cut the sealing member 3 to a predetermined magnitude | size, For example, a hollow blade system, a punch die system, etc. can be used. The hollow blade method is a blade that is punched with a blade from above, and has a blade edge angle of about 30 ° when punched. The punch die method uses a die having a pair of upper and lower blades, and the angle of the upper and lower blades is around 90 °. The punch die method is preferable because of the durability of the blade.

[Arrangement process]
The placement step S104 is a step of placing the sealing member 3 cut in the sealing member cutting step S103 at a position corresponding to the organic EL structure 2 on the substrate 16 on the peelable adhesive layer of the carrier substrate 21. .
The method for arranging the sealing member 3 on the carrier substrate 21 is performed by, for example, a robot having a suction pad. By disposing the sealing member 3 on the carrier substrate 21 in advance, a plurality of organic EL elements 1 can be brought into close contact with each other at once, and work efficiency can be improved.

  Then, the substrate 16 having the organic EL structure 2 formed from the substrate preparation step S111 to the second electrode formation step S116 to the second electrode and the steps from the sealing substrate preparation step S101 to the placement step S104 are manufactured. The sealing member 3 thus bonded is bonded in the steps after the first step S105.

  The first step S105, the second step S106, and the third step S107 are as described above.

  Through the above steps, the flexible sealing substrate 15 (sealing member 3) in which the adhesive layer 14 is formed in advance is uniformly bonded and sealed to the organic EL structure 2 while suppressing bubbles and wrinkles. The organic EL element 1 can be manufactured.

Second Embodiment
A second embodiment of the present invention will be described below. In addition, description is abbreviate | omitted about the element same as 1st Embodiment, and the same code | symbol is attached | subjected.

<Sealing device>
As shown in FIG. 4A, the adhesion processing unit is an apparatus that performs an adhesion treatment between the organic EL structure 2 formed on the substrate 16 and the sealing member 3.
The 1st process part 31 is provided with the contact | adherence roll 36, the support stand 37, the some alignment mark detector (illustration omitted), and the temperature control apparatus (illustration omitted). A vacuum exhaust means or an inert gas supply means may be provided (not shown).
Similar to the first processing unit 31, the second processing unit 33 includes a contact roll 38, a support base 39, a temperature adjustment device (not shown), and a plurality of alignment mark detectors (not shown). A vacuum exhaust means or an inert gas supply means may be provided (not shown).

  The first processing unit 31 rotates and moves while the contact roll 36 is in constant contact pressure with the contact roll 36 and the support base 37 so that the organic EL structure 2 and the sealing member 3 can be uniformly and continuously pressurized. It has a structure to do. In addition, the organic EL structure 2 and the sealing member 3 sandwiched between the contact roll 36, the support base 37, and the sealing member 3 can be brought into close contact with each other under the condition of a low-adhesive region defined in the present invention.

  The second processing unit 33 rotates and moves while the contact roll 38 is in constant contact pressure so that the organic EL structure 2 and the sealing member 3 can be uniformly and continuously pressurized by the contact roll 38 and the support 39. It has a structure to do. Further, the second processing unit 33 further brings the organic EL structure 2 and the sealing member 3 sandwiched between the contact roll 38, the support base 39, and the sealing member 3 under the condition of becoming a highly adhesive region defined in the present invention. It is possible.

  Further, the contact rolls 36 and 38 can move up and down, and the surface pressure can be adjusted. At the same time, the contact rolls 36 and 38 are movable in the transport direction of the organic EL structure 2 and the sealing member 3. The contact rolls 36 and 38 can be adjusted to a surface pressure in which wrinkles and bubbles are sufficiently extended during contact and do not affect (damage) the organic EL element 1.

By providing the temperature adjusting device, the sealing device can adjust the adhesiveness of the adhesive layer 14 when the organic EL structure 2 and the sealing member 3 are brought into close contact with each other. That is, the adjustment can be performed so that the area is low and the area is low. The temperature adjusting device is preferably provided in the contact rolls 36 and 38 and the support bases 37 and 39, and is preferably provided in at least the contact rolls 36 and 38.
When the organic EL structure 2 and the sealing member 3 are brought into close contact with each other by the vacuum evacuation means or the inert gas supply means, it is possible to use a vacuum or an inert gas atmosphere. .

  The first processing unit and the second processing unit may be integrated as shown in FIG. In the case of this configuration, the support base 37a corresponds to the support bases 37 and 39 shown in FIG. The contact rolls 36a and 38a correspond to the contact rolls 36 and 38 in FIG. 4A, respectively, and the contact rolls 36a and 38a can operate independently. It is also possible for the contact roll 38a to operate after the contact roll 36a operates from end to end of the support base 37a. The contact roll 36a and the contact roll 38a can be continuously operated while being adjacent to each other. The close-contact roll 36a and the close-contact roll 38a can also operate with an interval. The movement range of the contact rolls 36a and 38a and the support range of the support base 37a may be widened. Even when the first processing unit and the second processing unit are integrated, there is no difference in basic configuration, function, and the like.

[First step]
In the first step S105 (see FIG. 3), the sealing member 3 is closely adhered to the organic EL structure 2 on the substrate 16 while suppressing wrinkles so that there are no bubbles and wrinkles in the low-adhesive region of the adhesive layer 14. It is a process to make. Since the adhesive layer 14 has low adhesiveness, it is possible to detect the alignment mark and the like, adjust the contact position, expel bubbles, and bring the organic EL structure 2 and the sealing member 3 into close contact with each other while extending the folds. It becomes.

  As shown in FIG. 4A, first, the substrate 16 on which the organic EL structure 2 is formed and the carrier substrate 21 on which the sealing member 3 is arranged are transported onto a support base 37. The substrate 16 and the carrier substrate 21 transported on the support base 37 are temporarily stopped at the first processing unit, and the contact position is adjusted. Next, the contact roll 36 descends onto the carrier substrate 21 and adheres with a predetermined surface pressure. And while the contact | adherence roll 36 closely_contact | adheres with predetermined | prescribed surface pressure, the organic EL structure 2 and the sealing member 3 of the organic EL structure 2 and the sealing member 3 from the one end which piled up the organic EL structure 2 and the sealing member 3 toward the other end Move in the transport direction. As a result, the bubbles are driven out and are gradually brought into close contact while suppressing soot so as not to cause soot.

  When the adhesion of the organic EL structure 2 and the sealing member 3 is completed, the adhesion roll 36 is raised, and the substrate 16 and the carrier substrate 21 can be transported. The substrate 16 and the carrier substrate 21 that have been brought into close contact with each other are transported to the second processing unit, and the contact roller 36 that has moved up moves to the initial position.

  In the first step S <b> 105, when the sealing member 3 is brought into close contact with the organic EL structure 2, it is performed in the low tack region of the adhesive layer 14. Conditions under which the adhesive strength of the adhesive layer 14 is 2 N / 25 mm or less are preferable. Although depending on the adhesive contained in the adhesive layer 14, the temperature is preferably 0 ° C. or higher and 50 ° C. or lower. The surface pressure at this time is preferably 0.05 MPa or more and 0.5 MPa or less. The conveyance speed at this time is preferably 3 m / min.

[Second step]
The second step S <b> 106 (see FIG. 3) is a step of closely attaching the sealing member 3 to the organic EL structure 2 on the substrate 16 in the highly adhesive region of the adhesive layer 14. Since the adhesion of the adhesive layer 14 is in close contact with the organic EL structure 2 in a state higher than that in the first step, the variation in the adhesive force of the adhesive layer 14 between the substrate 16 and the sealing substrate 15 is reduced. This improves the uniformity of the adhesive strength. When the fluidity of the adhesive layer 14 is higher than that in the first step, the adhesive layer 14 can easily adjust the thickness of the adhesive layer 14 between the substrate 16 and the sealing substrate due to the fluidity of the adhesive layer 14. The uniformity of the thickness is improved.

The second step S106 is performed by the second processing unit 33, for example.
The organic EL structure 2 and the sealing member 3 conveyed from the first processing unit onto the support 39 are processed under the same conditions as in the first embodiment by the same processing mechanism as in the first step S105. Done.

  The third step S107 is performed similarly to the first embodiment by the third processing unit 45 of the sealing device having the same configuration as the third processing unit 35 of the sealing device of the first embodiment.

  Note that the substrate 16 can be formed in the same manner even if it is changed from a long belt shape to a single wafer shape.

<Third Embodiment>
A third embodiment of the present invention will be described below. In addition, description is abbreviate | omitted about the element same as 1st Embodiment, and the same code | symbol is attached | subjected. In the present embodiment, the substrate 16 is preferably in the form of a single wafer in which one or a plurality of organic EL structures 2 can be formed. The sealing member 3 is a single wafer. In the third embodiment, the arrangement step S104 is not performed.

[Sealing device]
As shown in FIG. 5, the sealing device of the manufacturing apparatus of the organic EL element 1 includes a first processing unit 41 and an adhesion processing unit having a second processing unit 43 and a curing processing unit that cures the adhesive layer 14. A third processing unit 45 is provided. In addition, for example, the organic EL structure 2 (organic EL element 1) formed on the sheet-like substrate 16 by the conveying means 59 such as a conveyor is converted into the first processing unit 41, the second processing unit 43, and the third processing unit. The processing unit 45 can be moved.

The adhesion processing unit is an apparatus that performs an adhesion process on the organic EL structure 2 formed on the substrate 16 and the sealing member 3.
The first processing unit 41 includes a pressing member 42 for close contact in the vacuum chamber, a cylinder (not shown) that drives the support member 46, a support base 46 that supports the organic EL structure 2 and the sealing member 3 to be in close contact, A temperature control device (not shown) and a plurality of alignment mark detectors (not shown) are provided. The temperature adjusting device is preferably provided on the pressing member 42 and the support base 46, and is preferably provided on at least the pressing member 42. A vacuum exhaust means or an inert gas supply means may be provided (not shown).

  Similar to the first processing unit 41, the second processing unit 43 includes a pressing member 44 for pressing in the vacuum chamber, a cylinder (not shown) that drives the pressing member, the organic EL structure 2 to be in close contact with the sealing member 3 and the like. Are provided with a support base 47, a temperature control device (not shown), and a plurality of alignment mark detectors (not shown). The temperature adjusting device is preferably provided in the pressing member 44 and the support base 47, and is preferably provided in at least the pressing member 44. A vacuum exhaust means or an inert gas supply means may be provided (not shown).

  The third processing unit 45 includes a heating unit that cures the thermosetting adhesive included in the adhesive layer 14. Examples of the heating means of the third processing unit 45 include a surface heater, a heating roller, a heating belt, a heating oven, radiant heat heating such as a halogen heater and a far infrared heater, and the like.

  The pressing members 42 and 44 are members whose bottom surfaces are made of an elastic material such as silicon rubber or silicon sponge. The cylinder moves the pressing members 42 and 44 up and down, thereby pressing the organic EL structure 2 and the sealing member 3 to release the gas between them. The organic EL structure 2 and the sealing member 3 can be brought into close contact with the support bases 46 and 47.

The third processing unit 45 may be provided with a heater that is arranged to surround the organic EL structure 2 in substantially the same shape as the sealing member 3 (adhesive layer 14). The heater may also include a cylinder, and may have a function of heating by moving the heater up and down by the cylinder, bonding the heater to the back surface of the sealing member 3, and moving the heater.
Furthermore, it is preferable that the vacuum chamber (not shown) can be evacuated by a decompression device (not shown) after being sealed, and the vacuum chamber can be decompressed by shutting it out from the outside air.

  The supply unit 48 includes a storage unit for the sheet-like flexible sealing member 3 that is a sealing substrate on which the adhesive layer 14 is formed, and a sheet-like sheet that is a sealing substrate on which the adhesive layer 14 is formed. There is an arrangement robot that arranges the flexible sealing member 3 on the substrate 16 on which the organic EL structure 2 on the support base 49 is formed (all are not shown).

  The placement robot, for example, attaches an arm having an adsorption plate at the tip of the sheet-like sheet-like flexible sealing member 3 that is a sealing substrate on which the adhesive layer 14 is formed and holds the arm, and the vertical direction And a movable guide post. The arm can also be moved by aligning the sheet-like flexible sealing member 3 which is a sealing substrate on which the adhesive layer 14 on the support 49 is formed. The supply unit 48 is not particularly limited to the configuration described above.

  In place of the pressing member 42 for pressing in the vacuum chamber, the supporting base 46, and the pressing member 44 for pressing in the vacuum chamber, and the supporting base 47, the heating and pressing surfaces opposed to each other may be used. Good (not shown). By pressing the organic EL structure 2 and the sealing member 3 from above and below with this heating and pressing surface, the structure can be pressed uniformly.

  The first processing unit 41 and the second processing unit 43 may all be provided in one device, or may be provided in a separate device for each processing unit. The first processing unit 41 and the supply unit 48 may be an integrated device or may be separate devices.

[First step]
The first step S <b> 105 (see FIG. 6) is a step of closely attaching the sealing member 3 to the organic EL structure 2 on the substrate 16 in the low adhesive region of the adhesive layer 14. Since the adhesive layer 14 has low tackiness, the organic EL structure 2 and the sealing member 3 can be brought into close contact with each other while expelling bubbles and suppressing wrinkles while stretching the wrinkles.

  1st process S105 is performed by the supply part 48 and the 1st process part 41 of the sheet-like flexible sealing member 3 which are the sealing substrates in which the contact bonding layer 14 was formed, for example.

  Supply of the sealing member 3 is performed as follows. First, the single-sheet flexible sealing member 3 which is the sealing substrate 15 on which the adhesive layer 14 is formed is taken out from the storage unit by the placement robot of the supply unit 48. Next, the sheet-like flexible sealing member 3 on the support base 49 is overlaid on the organic EL structure 2 formed by patterning on the substrate 16.

  The close contact of the sealing member 3 in the first step S105 is performed as follows. First, the substrate 16 having the organic EL structure 2 to which the sealing member 3 is supplied by the supply unit 48 is supported by the support base 46 in the vacuum chamber of the first processing unit 41. Next, a vacuum chamber (not shown) is closed, shut off from the surroundings, and evacuated to an absolute pressure of 0 kPa to 50 kPa (gauge pressure of −99 kPa to −50 kPa).

Then, the pressing member 42 is lowered and gradually pressed against the sealing member 3 so as to prevent bubbles and wrinkles from being generated between the organic EL structure 2 and the sealing member 3 and is brought into close contact therewith. The conditions for bringing the sealing member 3 into close contact with the organic EL structure 2 are the same as those in the first step in the first embodiment.
Then, after returning the pressing member 42 to the original position, the decompression is released and the first step is completed.

  When the configuration in the vacuum chamber is a heating and pressing surface opposed to each other in the vertical direction, evacuation is started and the vertical heating and pressing surface reaches the organic EL structure 2 and the sealing member after reaching a predetermined degree of vacuum. 3 are pressed from above and below to be brought into close contact with each other.

[Second step]
The second step S <b> 106 (see FIG. 6) is a step of closely attaching the sealing member 3 to the organic EL structure 2 on the substrate 16 in the highly adhesive region of the adhesive layer 14. Since the adhesiveness of the adhesive layer 14 is in close contact with the organic EL structure 2 in a state higher than that in the first step, the variation in the adhesive force of the adhesive layer 14 between the substrate 16 and the sealing substrate is reduced. Uniformity is improved. When the fluidity of the adhesive layer 14 is higher than that in the first step, the adhesive layer 14 can easily adjust the thickness of the adhesive layer 14 between the substrate 16 and the sealing substrate due to the fluidity of the adhesive layer 14. The uniformity of the thickness is improved.
The second step S106 is performed by the second processing unit 43, for example.

  The close contact of the sealing member 3 is performed as follows, for example. The substrate 16 having the organic EL structure 2 to which the sealing member 3 is adhered in the first step is supported by the support 47 in the vacuum chamber (not shown) of the second processing unit 43. Next, the vacuum chamber is closed, shut off from the surroundings, and evacuated to an absolute pressure of 0 kPa to 50 kPa (gauge pressure of −99 kPa to −50 kPa).

Then, the pressing member 44 is lowered and gradually pressed against the sealing member 3 so as to prevent bubbles and wrinkles from being generated between the organic EL structure 2 and the sealing member 3 so as to be brought into close contact therewith. The conditions for bringing the sealing member 3 into close contact with the organic EL structure 2 are the same as those in the second step in the first embodiment.
Then, after returning the pressing member 44 to the original position, the decompression is released, and the second step is completed.

  When the configuration in the vacuum chamber is a heating and pressing surface opposed to each other in the vertical direction, evacuation is started and the vertical heating and pressing surface reaches the organic EL structure 2 and the sealing member after reaching a predetermined degree of vacuum. 3 are pressed from above and below to be brought into close contact with each other.

The first step S104 and the second step S105 may be performed not only in a vacuum but also in an inert gas atmosphere.
The adhesion of the sealing member 3 to the organic EL structure 2 on the substrate 16 is performed under a reduced pressure environment of 10 Pa to 1 × 10 ⁻⁵ Pa or an oxygen concentration of 10 ppm or less in order to thoroughly exclude oxygen, moisture, and bubbles. It is preferably carried out in an inert gas environment having a moisture concentration of 10 ppm or less.

  The third step S107 is performed in the same manner as in the first embodiment by, for example, a heating oven of the third processing unit 45.

  Note that the substrate 16 can be formed in the same manner even if it is changed from a single wafer shape to a long belt shape.

<Modification>
[Winding process]
In the first embodiment and the second embodiment, the winding process may be performed between the end of the second process S106 and the start of the third process S107. This winding process is a process of winding the organic EL element 1 formed on the flexible substrate 16 into a roll shape. By winding up the organic EL element 1 in a roll shape, it is easy to maintain production facilities, and it is easy to cope with any troubles. Moreover, since the sealing member 3 has been adhered to the organic EL structure 2, the organic EL element 1 is not affected by moisture, oxygen, or the like. The next process can also be processed with a roll, increasing productivity.

(Division of manufacturing process)
The division position of the manufacturing process is preferably after the second step S106 in which the organic EL structure 2 is protected by the sealing member 3. In addition, since the organic EL structure 2 before sealing is very sensitive to oxygen and moisture, it is preferable to seal as soon as possible.
On the other hand, when the third step S107 for curing the adhesive layer 14 of the sealing substrate 15 in the manufacture of the organic EL element 1 is also performed continuously after the second step S106, the production line is stagnant for some reason such as a failure in the previous step. In some cases, the heat curing time tends to be unstable. As a result, the heat curing time of the adhesive layer 14 of the sealing member 3 is insufficient, and the curing of the adhesive layer 14 tends to be insufficient, or the performance of the organic EL element 1 is degraded due to the excessive heat curing time. It is easy to imitate. Therefore, the process may be divided between the second process S106 and the third process S107.

[Adhesion method]
In the first embodiment and the second embodiment, the sealing member 3 is cut into a shape that covers the display area of each organic EL element 1 and disposed on the carrier substrate 21, and then the organic material on the substrate 16. It transfers to EL structure 2 and is bonded. However, the long sealing member 3 wound around the roll may be configured to be attached to the organic EL structure 2 on the substrate 16. In this case, the sealing member 3 is preliminarily processed with holes in the electrode extraction portion.

[Cutting process]
In the said 1st Embodiment and 2nd Embodiment, the organic EL element 1 in which the sealing member 3 is bonded by the organic EL structure 2 on the board | substrate 16 after the hardening process of 3rd process S107 is the winding roll 55. It is designed to be wound up by However, a cutting process may be performed after the curing process to produce a sheet-like (individual) organic EL element.

  In the embodiment, in the first step S105 and the second step S106, surface pressure is applied when the sealing member 3 is brought into close contact with the organic EL structure 2. However, by applying a contact pressure in the first step S105, the adhesive layer 14 is made highly adhesive even if the contact pressure is lower than the contact pressure in the first step S105 or not applied in the second step S106. By making the adhesive region, the sealing member 3 can be brought into close contact with the organic EL structure 2 on the substrate 16 by the adhesiveness (adhesive force) of the adhesive layer 14. When the adhesiveness of the adhesive layer 14 is temperature-dependent, the adhesive layer 14 becomes a highly adhesive region by setting the adhesive layer 14 in the temperature range.

  In the present invention, sealing is performed using a sealing member 3 having a flexible sealing substrate 15 and an adhesive layer 14 including a thermosetting adhesive on one surface of the sealing substrate 15. It is carried out. However, it is also possible to perform sealing under the above conditions by overlaying a sheet-like thermosetting adhesive on the organic EL structure 2 and overlaying the sealing substrate 15 thereon.

  Examples in which the effects of the present invention are confirmed will be described below. In addition, this invention is not limited to this Example.

<Example 1>
An organic EL structure in which a first electrode, a hole transport layer, a light emitting layer, an electron transport layer, and a second electrode are formed on a substrate in this order by the method described below, and a flexible sealing member The organic EL element sealed with was produced.

[Measurement of adhesiveness]
The adhesiveness of the adhesive layer of the sealing member was measured using a Konica Minolta Co., Ltd. in-house peel test apparatus that can carry out a measurement method based on JIS Z 0237 (2009). As a test plate, a substrate on which an organic EL structure described later was formed was attached to a SUS304 plate and used. As a test piece, a sealing member described later having a width of 25 mm was used. In the adhesion processing portion of the sealing device, the organic EL structure on the substrate attached to the SUS304 plate and the sealing member were adhered to each other under predetermined adhesion conditions (temperature, pressure, humidity, etc.). The measurement was performed immediately after the organic EL structure and the sealing member were brought into close contact with each other. The peeling angle was 90 °. The environmental temperature of the installation environment of the test apparatus was adjusted to the contact condition between the organic EL structure and the sealing member.

[Production of organic EL structure]
(Preparation of substrate)
As a substrate of the organic EL structure, a polyethylene terephthalate film (manufactured by Teijin DuPont Films, Ltd., hereinafter abbreviated as PET) having a length of 30 m, a width of 1000 mm, and a thickness of 100 μm is prepared. An inorganic gas barrier film made of SiOx is continuously formed on a flexible substrate on the entire surface on the electrode forming side using a commercially available general vacuum plasma discharge treatment apparatus so that the thickness becomes 500 nm. Formed. As a result, a gas barrier flexible substrate having an oxygen permeability of 0.001 mL / m ² / day or less and a water vapor permeability of 0.001 mL / m ² / day or less was produced.

Next, the organic EL structure was 250 mm × 250 mm in size, and was produced on the substrate by the following procedure so that the width was 3 rows evenly and the interval was 350 mm.
A first electrode (anode) and a hole transport layer were continuously formed.

(Formation of the first electrode)
From ITO (Indium Tin Oxide) having a device region of about 30 mm wide × 60 mm long and having a thickness of 120 nm on a gas barrier flexible substrate under a vacuum condition of 5 × 10 ⁻¹ Pa by sputtering. The first electrodes formed were continuously formed at regular intervals of 4 rows.

(Formation of hole transport layer)
N, N'-diphenyl-N, N'-m-tolyl-4,4'-diamino- as a hole transport layer forming material under vacuum conditions of 5 × 10 ⁻⁴ Pa by vapor deposition (vapor phase deposition) 1,1′-biphenyl was deposited on the first electrode to form a 30 nm thick hole transport layer.

  Then, a light emitting layer, an electron injection layer, and a second electrode were laminated on the formed hole transport layer according to the following conditions to produce an organic EL structure, which was wound into a roll.

(Formation of light emitting layer)
CBP as a host agent and Ir (ppy) ₃ as a dopant agent were laminated by a co-evaporation method so that the doping concentration was 6% and the thickness was 40 nm. In addition, although the material which has green light emission was used in the present Example, it is possible to produce a white organic EL element by laminating | stacking further using blue, red, and a dopant agent.

(Formation of electron injection layer)
Subsequently, LiF was deposited on the light emitting layer as a material for forming an electron injection layer under a vacuum condition of 5 × 10 ⁻⁴ Pa on the formed light emitting layer by a vapor deposition method (vapor phase deposition method). An electron injection layer (LiF layer) was formed.

(Formation of second electrode layer)
Subsequently, on the formed electron injection layer, a mask pattern is formed by using aluminum as a second electrode forming material under a vacuum condition of 5 × 10 ⁻⁴ Pa by a vapor deposition method (vapor phase deposition method) so as to have an extraction electrode. A second electrode layer having a thickness of 100 nm was formed by deposition on the electron injection layer.
Thus, an organic EL structure was produced.

[Preparation of sealing member]
(Sealing substrate)
Drying using a polyester adhesive, a polyethylene terephthalate film (made by Teijin DuPont Films, Inc.) having a width of 1000 mm and a thickness of 50 μm as a support substrate, and an aluminum foil of a conductive material having a thickness of 12.5 μm as a barrier layer. By bonding by a laminating method, a sheet-shaped sealing substrate having a two-layer structure was manufactured.

  The water vapor permeability of the produced sealing substrate was less than the measurement limit of the MOCON method based on JIS K 7129B method (1992).

(Formation of adhesive layer)
A sheet-shaped thermosetting adhesive (1600 series manufactured by ThreeBond Co., Ltd.) was bonded to the produced sealing member by a dry laminating method to form an adhesive layer having a thickness of 20 μm.

(Sealing member)
The produced sealing member was cut into a size of about 250 mm × about 250 mm covering the organic EL structure. A Thomson type machined to the above size was used for cutting. Hole processing of the electrode extraction part of the organic EL element was performed in advance on the manufactured sealing substrate. And it arrange | positioned in the predetermined position on the peelable contact bonding layer of a carrier substrate.

[Bonding of organic EL structure and sealing member]
The first processing unit and the second processing unit of the organic EL structure and the sealing member have a structure in which the organic EL structure and the sealing member are overlapped and adhered between a pair of adhesion rolls. Both the substrate on which the organic EL structure is formed and the carrier substrate to which the sealing member is in close contact are continuously conveyed at the same speed and sent to the first processing unit.

  The first processing unit has an upper contact roll and a lower contact roll. The contact rolls rotate while contacting and pressing at a constant pressure so that the substrate passing between the upper and lower contact rolls and the carrier substrate can be uniformly and continuously pressed. The surface of the contact roll was rubber-lined, the rubber hardness (JIS K 6253) was 70 degrees, and the outer diameter was φ100 mm.

  The first treatment unit was adjusted so that the temperature of the contact roll was 30 ° C. both above and below, and the pressure of the contact roll was adjusted to 0.3 MPa as the surface pressure applied to the organic EL structure. The conveyance speed of the first processing unit was 1 m / min. The surface pressure was measured using a Fuji film prescale (for ultra-low pressure) and a roll at normal temperature and humidity (23 ° C., relative humidity 50%). It was 1.5 (N / 25mm) when the adhesive force of the contact bonding layer of the sealing member was measured based on JISZ0237 (2009) on this condition.

  The substrate on which the organic EL structure with the sealing member discharged from the first processing unit is adhered is continuously transferred to the second processing unit.

The structure of the second processing unit is the same as the structure of the first laminating unit.
In the second treatment section, the temperature of the close-contact roll was adjusted to 100 ° C. on both the upper and lower sides, and the pressure of the close-contact roll was adjusted to 0.3 MPa as the surface pressure applied to the organic EL structure. The second processing section conveyance speed was 1 m / min. The surface pressure was measured in the same manner as the first laminate roll. It was 11 (N / 25mm) when the adhesive force of the contact bonding layer of the sealing member was measured based on JISZ0237 (2009) on this condition.

  The substrate on which the organic EL structure having the sealing member passed through the second processing unit was formed was passed through an oven serving as a heating unit of the third processing unit in order to cure the adhesive layer. The inside of the third processing part was adjusted so that the temperature of the sealing member was stabilized at 120 ° C. The time for passing through the oven was 10 minutes.

<Example 2>
An organic EL element was fabricated under the same conditions as in Example 1 with the width of the substrate of the organic EL structure being 350 mm.

<Example 3>
The width of the substrate of the organic EL structure is 350 mm, the adhesive force of the adhesive layer of the sealing member in the first processing part is 1.8 (N / 25 mm), and the adhesive force of the adhesive layer of the sealing member in the first processing part Was set to 5.5 (N / 25 mm), and an organic EL device was produced under the same conditions as in Example 1.

<Example 4>
The width of the substrate of the organic EL structure is 350 mm, the adhesive force of the adhesive layer of the sealing member in the first processing part is 3.0 (N / 25 mm), and the adhesive force of the adhesive layer of the sealing member in the first processing part Was set to 4.0 (N / 25 mm), and an organic EL device was produced under the same conditions as in Example 1.

<Comparative Example 1>
The organic EL structure and the sealing member are bonded together in the same manner as in Example 1 except that the first processing unit does not perform the first process and the second processing unit performs only the second process. To prepare an organic EL device.

<Comparative Example 2>
The organic EL structure and the sealing member are bonded together in the same manner as in Example 2 except that the first processing unit does not perform the first process and the second processing unit performs only the second process. To prepare an organic EL device.

<Evaluation of organic EL element>
The adhesion state of the sealing member and the presence or absence of wrinkles or bubbles were visually observed.
In Examples 1 and 2, bubbles and wrinkles were not seen in the bonded sealing member, and the sealing state was good. In Example 1, no shift in pitch between the organic EL structure and the sealing member was observed. In Example 2, even if the width was increased to at least 1000 mm (even if the area was increased), no bubbles were observed and no wrinkles were observed, confirming the effectiveness of the present invention.

  In Example 3, bubbles and wrinkles were not seen in the bonded sealing member, and the sealing state was good. In Example 3, the adhesive strength in the second processing part was weaker than in Example 2, but no bubbles were observed and no wrinkles were observed as in Example 2, confirming the effectiveness of the present invention. .

  In Example 4, although the adhesive force in the first processing unit was stronger than that in Example 2, no bubbles were observed in the bonded sealing member. Moreover, although the wrinkle was seen in the sealing member very slightly, the organic EL structure was sealed. This is a sealed state that can be used practically without any problem, and the effectiveness of the present invention was confirmed.

  In Comparative Example 1, bubbles and wrinkles were generally seen in the adhesive layer of the bonded sealing member. In Comparative Example 2, bubbles and wrinkles were partially seen in the adhesive layer of the bonded sealing member. In the conventional method, when the width is increased (when the area is increased), the generation amount of bubbles and wrinkles increases. Further, in Comparative Example 1, there was a shift in pitch between the organic EL structure and the sealing member.

  As mentioned above, although the manufacturing method of the organic electroluminescent element which concerns on this invention, and the manufacturing apparatus were shown and demonstrated in detail, the meaning of this invention is not limited to an above-described content, The right range is It should be interpreted based on the description of the claims. In addition, it cannot be overemphasized that the content of this invention can be changed or changed based on the above description.

1 Organic EL Element 2 Organic EL Structure 3 Sealing Member 11 First Electrode 12 Organic Functional Layer 13 Second Electrode 14 Adhesive Layer 15 Sealing Substrate 16 Substrate 21 Carrier Substrate 31 First Processing Unit 31a First Processing Unit 32 Adhesion Roll 33 Second treatment unit 34 Adhesion roll 35 Third treatment unit 36 Adhesion roll 36a Adhesion roll 37 Support table 37a Support table 38 Adhesion roll 38a Adhesion roll 39 Support table 41 First treatment unit 42 Press member 43 Second treatment unit 44 Press Member 45 Third processing section 46 Support base 47 Support base 48 Supply section 49 Support base 51 Feed roll 52 Support roll 53 Feed roll 54 Winding roll 55 Winding roll 59 Conveying means

Claims (9)

The organic electroluminescence structure is sealed by bonding a sealing member to the organic electroluminescence structure having at least the first electrode, the organic functional layer including the light emitting layer, and the second electrode formed on the substrate. A method for producing an organic electroluminescence device by stopping,
The sealing member has a flexible sealing substrate, and an adhesive layer including a thermosetting adhesive previously formed on one surface of the sealing substrate,
The surface of the substrate on which the organic electroluminescent structure is formed and the adhesive layer side of the sealing member are opposed to each other, the organic electroluminescent structure and the sealing member are overlapped, and the adhesive layer is A first step in which both are brought into close contact with each other under the condition having an adhesiveness of 1,
A second step of bringing the organic electroluminescence structure and the sealing member into close contact with each other under a condition in which the adhesive layer has a second adhesive property higher than the first adhesive property;
And a third step of curing the adhesive layer in this order. A method of manufacturing an organic electroluminescence element. The method for producing an organic electroluminescence element according to claim 1, wherein the first adhesiveness has a characteristic of an adhesive strength of 2 N / 25 mm or less. The method for producing an organic electroluminescence element according to claim 1, wherein the second adhesiveness has a characteristic of an adhesive strength of 5 N / 25 mm or more. In the first step, the organic electroluminescence structure and the sealing member are brought into close contact with each other at a first temperature, and in the second step, the organic electroluminescence at a second temperature higher than the first temperature. A structure and the said sealing member are closely_contact | adhered. The manufacturing method of the organic electroluminescent element as described in any one of Claims 1-3 characterized by the above-mentioned. The method for producing an organic electroluminescent element according to claim 4, wherein the first temperature is 0 ° C or higher and 50 ° C or lower. The method for producing an organic electroluminescent element according to claim 4 or 5, wherein the second temperature is 80 ° C or higher and 130 ° C or lower. The method for manufacturing an organic electroluminescence element according to claim 1, wherein the first step and the second step are performed by different apparatuses. The organic electroluminescence structure is sealed by bonding a sealing member to the organic electroluminescence structure having at least the first electrode, the organic functional layer including the light emitting layer, and the second electrode formed on the substrate. An apparatus for producing an organic electroluminescence device by stopping,
The sealing member has a flexible sealing substrate, and an adhesive layer including a thermosetting adhesive previously formed on one surface of the sealing substrate,
The surface side of the substrate on which the organic electroluminescence structure is formed and the adhesive layer side of the sealing member are opposed to each other, the organic electroluminescence structure and the sealing member are overlapped, and the adhesive layer is A first processing unit for bringing the two into close contact with each other under the first adhesive condition;
A second treatment unit for bringing the organic electroluminescence structure and the sealing member into close contact with each other under a condition in which the adhesive layer has a second adhesive property higher than the first adhesive property;
And a third processing unit for curing the adhesive layer. An apparatus for manufacturing an organic electroluminescence element, comprising: The organic electroluminescence structure is sealed by bonding a sealing member to the organic electroluminescence structure having at least the first electrode, the organic functional layer including the light emitting layer, and the second electrode formed on the substrate. An apparatus for producing an organic electroluminescence device by stopping,
The sealing member has a flexible sealing substrate, and an adhesive layer including a thermosetting adhesive previously formed on one surface of the sealing substrate,
The surface side of the substrate on which the organic electroluminescence structure is formed and the adhesive layer side of the sealing member are opposed to each other, the organic electroluminescence structure and the sealing member are overlapped, and the adhesive layer is An adhesion treatment unit for adhering both under a condition having a first adhesive property, and then adhering both under a condition in which the adhesive layer has a second adhesive property higher than the first adhesive property;
An organic electroluminescence device manufacturing apparatus, comprising: a curing processing unit that cures the adhesive layer.

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