WO2020076021A1

WO2020076021A1 - Mask support template and manufacturing method therefor, and frame-integrated mask manufacturing method

Info

Publication number: WO2020076021A1
Application number: PCT/KR2019/013086
Authority: WO
Inventors: 이병일; 장택용; 이영호; 김봉진
Original assignee: 주식회사 오럼머티리얼
Priority date: 2018-10-11
Filing date: 2019-10-07
Publication date: 2020-04-16
Also published as: CN112740437A; TWI810381B; TW202020578A

Abstract

The present invention relates to a mask support template and a manufacturing method therefor, and a frame-integrated mask manufacturing method. A method for manufacturing a mask support template, according to the present invention, manufactures a template (50) supporting a mask (100) for forming OLED pixels so as to match same to a frame (200), and comprises the steps of: (a) preparing a mask metal film (110') generated by rolling; (b) attaching the mask metal film (110') to the template (50) having a temporary adhesive part (55) formed on one surface thereof; (c) reducing (110' -> 110) the thickness of the mask metal film (110') attached to the template (50); and (d) manufacturing the mask (100) by forming a mask pattern (P) on the mask metal film (110).

Description

Mask support template and method for manufacturing same, and method for manufacturing frame-integrated mask

The present invention relates to a mask support template, a method for manufacturing the same, and a method for manufacturing a frame-integrated mask. More specifically, it is possible to stably support and move without deformation of the mask, it is possible to stably frame and attach the mask, and a mask support template capable of clarifying the alignment between each mask and its manufacture It relates to a method and a method of manufacturing a frame-integrated mask.

As a technique for forming a pixel in an OLED manufacturing process, a FMM (Fine Metal Mask) method is used, in which a thin metal mask is closely adhered to a substrate to deposit an organic material at a desired location.

In the conventional OLED manufacturing process, the mask is manufactured in a stick form, a plate form, etc., and then the mask is welded and fixed to the OLED pixel deposition frame. In one mask, a plurality of cells corresponding to one display may be provided. In addition, several masks can be fixed to the OLED pixel deposition frame for large-area OLED manufacturing. In the process of fixing to the frame, each mask is tensioned to be flat. Adjusting the tensile force so that the entire part of the mask is flat is a very difficult task. In particular, in order to align the mask patterns having a size of only a few to several tens of µm while all cells are flattened, a high-level operation to check the alignment state in real time while finely adjusting the tensile force applied to each side of the mask is required. do.

Nevertheless, in the process of fixing several masks to one frame, there was a problem in that alignment between the masks and between the mask cells did not work well. In addition, because the thickness of the mask film is too thin and large area in the process of welding and fixing the mask to the frame, the mask cell may be damaged or warped by a load, or wrinkles or burrs generated in the welding part in the welding process. There were problems such as misalignment.

In the case of ultra-high-definition OLED, the current QHD image quality is 500 ~ 600 pixel per inch (PPI), and the pixel size reaches about 30 ~ 50㎛, and 4K UHD, 8K UHD high image quality is higher than ~ 860 PPI, ~ 1600 PPI, etc. It has the resolution of. As described above, the alignment error between each cell should be reduced to a few μm in consideration of the pixel size of the ultra-high quality OLED, and an error out of this may lead to product failure, so the yield may be very low. Therefore, there is a need to develop a technique that prevents deformation such as a mask being crushed or distorted, a technique for making alignment clear, and a technique for fixing a mask to a frame.

Accordingly, the present invention has been devised to solve various problems of the prior art as described above, and an object of the present invention is to provide a mask supporting template capable of stably attaching a mask and a frame and a method for manufacturing the same.

In addition, an object of the present invention is to provide a mask support template capable of stably supporting and moving a mask without deformation and a method for manufacturing the same.

In addition, an object of the present invention is to provide a mask support template capable of forming a fine mask pattern on a mask and a method for manufacturing the same.

In addition, an object of the present invention is to provide a mask support template and a method of manufacturing the same, which can improve the adhesion between the mask and the frame when the mask is attached to the frame.

In addition, an object of the present invention is to provide a mask support template that can be repeatedly used after attaching the mask to the frame and a method for manufacturing the same.

In addition, an object of the present invention is to provide a method of manufacturing a frame-integrated mask in which the mask and the frame can form an integrated structure.

In addition, an object of the present invention is to provide a method of manufacturing a frame-integrated mask capable of preventing deformation such as a mask being struck or twisted and making alignment clear.

In addition, it is an object of the present invention to provide a method for manufacturing a frame-integrated mask in which the production time is significantly reduced and the yield is significantly increased.

The above object of the present invention is a method for manufacturing a template supporting a frame for forming an OLED pixel and corresponding to a frame, comprising: (a) preparing a mask metal film produced by rolling; (b) adhering a mask metal film on a template on which a temporary adhesive portion is formed on one surface; (c) reducing the thickness of the mask metal film adhered to the template; And (d) forming a mask pattern on the mask metal film, thereby producing a mask.

In addition, the above object of the present invention is a method of manufacturing a template supporting a frame for forming an OLED pixel and corresponding to a frame, comprising: (a) preparing a mask metal film; (b) reducing at least a portion of the thickness from the first surface of the mask metal film and the second surface opposite to the first surface; (c) bonding the mask metal film on the template on which the temporary adhesive portion is formed; And (d) forming a mask pattern on the mask metal film, thereby producing a mask.

In step (a), a mask metal film is prepared and at least a portion of the thickness is reduced from the first surface of the mask metal film, in step (b), the first surface of the mask metal film is adhered onto the template, and in step (c), At least a portion of the thickness can be reduced from the second surface facing the first surface of the mask metal film.

The temporary adhesive portion may be an adhesive or adhesive sheet that can be separated by applying heat, or an adhesive or adhesive sheet that can be separated by UV irradiation.

The reduction of the thickness of the mask metal film may be performed by any one of CMP (Chemical Mechanical Polishing), chemical wet etching, and dry etching.

When the CMP method is used to reduce the thickness of the mask metal film, surface roughness on one surface of the mask metal film may be reduced.

When chemical wet etching or dry etching is used to reduce the thickness of the mask metal film, polishing may be further performed in a subsequent step to reduce surface roughness on one surface of the mask metal film.

It is possible to reduce the thickness of the mask metal film to be 5 µm to 20 µm.

The step (d) includes: (d1) forming a patterned insulating portion on the mask metal film; (d2) forming a mask pattern by etching a portion of the mask metal film exposed between the insulating parts; And (d3) removing the insulating portion.

When the first surface is 0% and the second surface is 100% based on the thickness of the mask metal film, the mask may be one that uses at least a portion of a portion corresponding to a thickness of 10% to 90% of the mask metal film.

And, the above object of the present invention is a template for supporting a mask for forming an OLED pixel and corresponding to a frame, the template; A temporary adhesive formed on the template; And it is adhered to the template via a temporary adhesive portion, and includes a mask formed with a mask pattern, the thickness of the mask is achieved by a mask support template, 5㎛ to 20㎛.

The mask may include a central portion formed by reducing at least a portion of the thickness from the upper and lower surfaces of the mask metal sheet produced by the rolling process.

When the upper surface is 0% and the lower surface is 100% based on the thickness of the mask metal film, the mask may be to use at least a portion of a portion corresponding to a thickness of 10% to 90% of the mask metal film.

It may be an adhesive or adhesive sheet that can be separated by applying heat, or an adhesive or adhesive sheet that can be separated by UV irradiation.

A laser through hole may be formed in a portion of the rim portion of the template corresponding to the weld portion of the mask.

The template may include any one of a wafer, glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), and borosilicate glass.

And, the above object of the present invention is a method of manufacturing a frame-integrated mask in which at least one mask and a frame supporting a mask are integrally formed, (a) the method of manufacturing on a frame having at least one mask cell region Loading the template prepared by the step corresponding to the mask cell region of the mask frame; And (b) attaching the mask to the frame.

According to the present invention configured as described above, there is an effect capable of stably performing the attachment of the mask and the frame.

In addition, according to the present invention, there is an effect capable of stably supporting and moving the mask without deformation.

In addition, according to the present invention, there is an effect that can form a fine mask pattern on the mask.

Further, according to the present invention, when the mask is attached to the frame, there is an effect that can improve the adhesion between the mask and the frame.

In addition, according to the present invention, there is an effect that can be repeatedly used after attaching the mask to the frame.

In addition, according to the present invention, there is an effect that the mask and the frame can achieve an integral structure.

In addition, according to the present invention, it is possible to prevent deformation such as a mask being struck or distorted and to make alignment clear.

In addition, according to the present invention, there is an effect that can significantly reduce the manufacturing time, and significantly increase the yield.

1 is a schematic view showing a conventional OLED pixel deposition mask.

2 is a schematic diagram showing a process of attaching a conventional mask to a frame.

3 is a schematic diagram showing that an alignment error occurs between cells in the process of stretching a conventional mask.

4 is a front view and a side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention.

5 is a front view and a side cross-sectional view showing a frame according to an embodiment of the present invention.

6 is a schematic diagram showing a manufacturing process of a frame according to an embodiment of the present invention.

7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention.

8 is a schematic view showing a mask for forming a conventional high-resolution OLED.

9 is a schematic diagram showing a mask according to an embodiment of the present invention.

10 to 11 are schematic diagrams showing a process of manufacturing a mask support template by adhering a mask metal film on a template according to an embodiment of the present invention and forming a mask.

12 is a schematic view showing a mask metal film according to another embodiment of the present invention.

13 is a schematic view showing a manufacturing process of a mask metal film according to another embodiment of the present invention.

14 is a schematic diagram showing a process of loading a mask support template on a frame according to an embodiment of the present invention.

15 is a schematic diagram showing a state in which a template is loaded on a frame according to an embodiment of the present invention to associate a mask with a cell region of the frame.

16 is a schematic view showing a process of separating a mask and a template after attaching a mask to a frame according to an embodiment of the present invention.

17 is a schematic diagram showing a state in which a mask according to an embodiment of the present invention is attached to a frame.

18 is a schematic diagram showing an OLED pixel deposition apparatus using an integrated frame mask according to an embodiment of the present invention.

40, 45: support substrate

41, 46: adhesive

50: template

50a, 50b: center, border of template

51: laser through hole

55: temporary adhesive

70: lower support

100: mask

101, 102: one side of the mask, the other side

110, 110 ', 110 ": mask film, mask metal film

111 ": first side of the mask metal film

112 ": second side of the mask metal film

115 ": central part of the mask metal film

117 ": upper part of the mask metal film

119 ": lower part of the mask metal film

200: frame

210: border frame

220: mask cell sheet portion

221: border sheet portion

223: first grid sheet portion

225: second grid sheet portion

1000: OLED pixel deposition device

C: cell, mask cell

CM: chemical treatment

CR: mask cell area

DM: Dummy, mask dummy

ET: heat applied

L: laser

R: Hollow area of the border frame

P: mask pattern

PS, PS1, PS2: flattening process

US: ultrasonic approval

UV: UV applied

W: Welding

WB: welding bead

For a detailed description of the present invention, which will be described later, reference is made to the accompanying drawings that illustrate, by way of example, specific embodiments in which the present invention may be practiced. These examples are described in detail enough to enable those skilled in the art to practice the present invention. It should be understood that the various embodiments of the present invention are different, but need not be mutually exclusive. For example, certain shapes, structures, and properties described herein may be implemented in other embodiments without departing from the spirit and scope of the invention in relation to one embodiment. In addition, it should be understood that the location or placement of individual components within each disclosed embodiment can be changed without departing from the spirit and scope of the invention. Therefore, the following detailed description is not intended to be taken in a limiting sense, and the scope of the present invention, if appropriately described, is limited only by the appended claims, along with all ranges equivalent to those claimed. In the drawings, similar reference numerals refer to the same or similar functions across various aspects, and length, area, thickness, and the like may be exaggerated for convenience.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to enable those skilled in the art to easily implement the present invention.

1 is a schematic diagram showing a conventional OLED pixel deposition mask 10.

Referring to FIG. 1, the conventional mask 10 may be manufactured in a stick-type or plate-type. The mask 10 shown in (a) of FIG. 1 is a stick-shaped mask and can be used by welding and fixing both sides of the stick to an OLED pixel deposition frame. The mask 100 illustrated in FIG. 1B is a plate-type mask and may be used in a large area pixel formation process.

The body 10 of the mask 10 (or the mask film 11) is provided with a plurality of display cells C. One cell C corresponds to one display such as a smartphone. The pixel pattern P is formed in the cell C to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B appear. For example, the pixel pattern P is formed in the cell C to have a resolution of 70 X 140. That is, a number of pixel patterns P form a cluster to form one cell C, and a plurality of cells C may be formed on the mask 10.

2 is a schematic view showing a process of attaching the conventional mask 10 to the frame 20. 3 is a schematic diagram showing that alignment errors between cells occur in the process of tensioning (F1 to F2) of the conventional mask 10. The stick mask 10 having six cells C: C1 to C6 shown in FIG. 1A will be described as an example.

Referring to (a) of FIG. 2, first, the stick mask 10 must be flattened. The stick mask 10 is stretched as it is pulled by applying tensile force F1 to F2 in the long axis direction of the stick mask 10. In this state, the stick mask 10 is loaded on the frame 20 in the form of a square frame. The cells C1 to C6 of the stick mask 10 are positioned in an empty area inside the frame of the frame 20. The frame 20 may be sized such that cells C1 to C6 of one stick mask 10 are positioned in an empty area inside the frame, and cells C1 to C6 of the plurality of stick masks 10 are framed. It may be large enough to be located in the interior empty area.

Referring to (b) of FIG. 2, after aligning while finely adjusting the tensile forces F1 to F2 applied to each side of the stick mask 10, a part of the side of the stick mask 10 is welded (W) to Accordingly, the stick mask 10 and the frame 20 are interconnected. Fig. 2 (c) shows a cross-section of a stick mask 10 and a frame connected to each other.

Referring to Figure 3, despite the fine adjustment of the tensile force (F1 ~ F2) applied to each side of the stick mask 10, there is a problem that the alignment between the mask cells (C1 ~ C3) does not work well. For example, the distances D1 to D1 "and D2 to D2" between the patterns P of the cells C1 to C3 are different from each other, or the patterns P are skewed. The stick mask 10 is a large area including a plurality of (for example, six) cells C1 to C6 and has a very thin thickness of several tens of μm, so it is easily struck or distorted by a load. In addition, it is very difficult to check in real time the alignment between the cells (C1 to C6) while adjusting the tensile force (F1 to F2) so that all the cells (C1 to C6) are flat.

Therefore, the fine error of the tensile force (F1 ~ F2) may cause an error in the degree of stretching or unfolding each cell (C1 ~ C3) of the stick mask 10, accordingly, the distance (D1) between the mask pattern (P) ~ D1 ", D2 ~ D2") causes a problem that is different. Of course, it is difficult to perfectly align the error to 0, but in order to prevent the mask pattern P having a size of several to several tens of µm from adversely affecting the pixel process of the ultra-high-definition OLED, the alignment error does not exceed 3 µm. It is desirable not to. The alignment error between adjacent cells is referred to as pixel position accuracy (PPA).

In addition, while connecting the plurality of stick masks 10 of approximately 6 to 20 to one of the frame 20, between the plurality of stick masks 10 and the plurality of cells C of the stick mask 10 It is also very difficult to clarify the alignment between ~ C6), and it is a significant reason to reduce productivity because the process time due to the alignment is forced to increase.

On the other hand, after the stick mask 10 is connected and fixed to the frame 20, the tensile forces F1 to F2 applied to the stick mask 10 may act on the frame 20 in reverse. That is, after the stick mask 10, which has been stretched tightly by the tensile forces F1 to F2, is connected to the frame 20, tension may be applied to the frame 20. Usually this tension is not large, so it may not have a significant effect on the frame 20, but if the size of the frame 20 is small and the rigidity is low, this tension can deform the frame 20 finely. This may cause a problem that the alignment state is wrong between the plurality of cells C to C6.

Accordingly, the present invention proposes a frame 200 and a frame-integrated mask that enable the mask 100 to form an integral structure with the frame 200. The mask 100 integrally formed in the frame 200 is prevented from being deformed, such as being struck or twisted, and can be clearly aligned with the frame 200. When the mask 100 is connected to the frame 200, any tension is not applied to the mask 100, so that the tension of the frame 200 is not deformed after the mask 100 is connected to the frame 200. . In addition, the manufacturing time for integrally connecting the mask 100 to the frame 200 is significantly reduced, and the yield can be significantly increased.

Figure 4 is a front view showing a frame-integrated mask according to an embodiment of the present invention [Fig. 4 (a)] and side cross-sectional view [Fig. 4 (b)], Figure 5 according to an embodiment of the present invention It is a front view (FIG. 5 (a)) and a side cross-sectional view (FIG. 5 (b)) showing the frame.

4 and 5, the frame-integrated mask may include a plurality of masks 100 and one frame 200. In other words, a plurality of masks 100 are attached to the frame 200 one by one. Hereinafter, for convenience of explanation, the mask 100 having a square shape will be described as an example, but the masks 100 may be in the form of a stick mask having protrusions clamped on both sides before being attached to the frame 200, and the frame 200 ), The protrusion can be removed.

A plurality of mask patterns P may be formed in each mask 100, and one cell C may be formed in one mask 100. One mask cell C may correspond to one display such as a smartphone.

The mask 100 may use a metal sheet produced by a rolling process. The mask 100 may be made of an invar having a coefficient of thermal expansion of about 1.0 X 10 ^-6 / ° C, and a super invar having a temperature of about 1.0 X 10 ^-7 / ° C. Since the mask 100 of this material has a very low coefficient of thermal expansion, it is less likely that the pattern shape of the mask is deformed by thermal energy, and thus can be used as a fine metal mask (FMM) or shadow mask in manufacturing a high-resolution OLED. In addition, considering that technologies for performing a pixel deposition process in a range in which the temperature change value is not large recently, the mask 100 has nickel (Ni), nickel-cobalt (Ni-Co) having a slightly higher thermal expansion coefficient than this. ).

The metal sheet produced by the rolling process may have a thickness of tens to hundreds of μm in the manufacturing process. In order to form the mask pattern P, which will be described later, in a relatively thick metal sheet, it needs to be made thinner. A process of thinning the metal sheet to a thickness of about 50 μm or less by using a method such as CMP may be further performed on the metal sheet. The thickness of the mask is preferably formed to about 2㎛ to 50㎛, more preferably, the thickness can be formed to about 5㎛ to 20㎛. However, it is not necessarily limited thereto.

In the case of using the metal sheet produced by the rolling process, there is a problem in that it is thicker in thickness than the plated film formed by electroforming, but since the coefficient of thermal expansion (CTE) is low, there is no need to perform a separate heat treatment process and corrosion resistance. This has a strong advantage.

Meanwhile, a metal sheet produced by electroforming may be used without necessarily using a metal sheet produced by a rolling process. At this time, the thermal expansion coefficient of the electro-plated sheet may be lowered by further performing a heat treatment process. The substrate used as a cathode electrode of electroplating may be a conductive material. Particularly, since a uniform electric field is not applied to the negative electrode body due to metal oxide in the case of metal, inclusions in the case of polycrystals, and grain boundaries, a part of the plated metal sheet may be formed non-uniformly, so that a single crystal material base plate (or negative electrode body) is used. Can be used. In particular, it may be a single crystal silicon material, and metals such as Ti, Cu, Ag, GaN, SiC, GaAs, GaP, AlN, InN, InP, Ge, semiconductors, carbon such as graphite, graphene, etc. based _{_{_{material, CH 3 NH 3 PbCl 3,}}} CH 3 NH 3 PbBr 3, CH 3 NH 3 PbI 3, page containing SrTiO _3, such as perovskite (perovskite) single crystal seconds for single-crystal ceramic, aircraft parts for superconductors such as architecture Heat-resistant alloys and the like may be used. Doping may be performed partially or entirely to have conductivity. In the case of a single crystal material, since there are no defects, a uniform metal sheet due to the formation of a uniform electric field on all surfaces during electroplating is produced, and the frame-integrated

masks

100 and 200 manufactured through this increase the image quality level of the OLED pixels. It can be improved further.

The frame 200 is formed to attach a plurality of masks 100. The frame 200 may include various edges formed in a first direction (for example, a horizontal direction) and a second direction (for example, a vertical direction) including the outermost border. These various corners may partition the area to which the mask 100 is to be attached on the frame 200.

The frame 200 may include a frame frame 210 having a substantially square shape or a square frame shape. The inside of the frame portion 210 may be hollow. That is, the border frame unit 210 may include a hollow region R. The frame 200 may be made of a metal material such as invar, super invar, aluminum, titanium, etc., and is composed of invar, super invar, nickel, nickel-cobalt, etc. having the same thermal expansion coefficient as the mask in consideration of thermal deformation. Preferably, these materials can be applied to both the frame portion 210 of the frame 200, the mask cell sheet portion 220.

In addition to this, the frame 200 may include a plurality of mask cell regions CR, and may include a mask cell sheet portion 220 connected to the edge frame portion 210. The mask cell sheet portion 220 may be formed by rolling like the mask 100 or may be formed using other film forming processes such as electroforming. In addition, the mask cell sheet unit 220 may be connected to the edge frame unit 210 after forming a plurality of mask cell regions CR through laser scribing, etching, or the like on a flat sheet. Alternatively, the mask cell sheet unit 220 may form a plurality of mask cell regions CR through laser scribing, etching, or the like after connecting a planar sheet to the edge frame unit 210. In the present specification, a description will be mainly given of the formation of a plurality of mask cell regions CR in the mask cell sheet portion 220 and then connection to the frame portion 210.

The mask cell sheet unit 220 may include at least one of the edge sheet unit 221 and the first and second

grid sheet units

223 and 225. The border sheet portions 221 and the first and second

grid sheet portions

223 and 225 refer to portions divided in the same sheet, and they are integrally formed with each other.

The edge sheet portion 221 may be substantially connected to the edge frame portion 210. Therefore, the edge sheet portion 221 may have an approximately square shape and a square frame shape corresponding to the edge frame portion 210.

In addition, the first grid sheet portion 223 may be formed to extend in the first direction (horizontal direction). The first grid sheet portion 223 is formed in a straight shape so that both ends may be connected to the edge sheet portion 221. When the mask cell sheet portion 220 includes a plurality of first grid sheet portions 223, it is preferable that each of the first grid sheet portions 223 has equal intervals.

In addition, in addition to this, the second grid sheet portion 225 may be formed to extend in the second direction (vertical direction). The second grid sheet portion 225 may be formed in a straight line shape, and both ends may be connected to the edge sheet portion 221. The first grid sheet portion 223 and the second grid sheet portion 225 may cross each other vertically. When the mask cell sheet portion 220 includes a plurality of second grid sheet portions 225, it is preferable that each second grid sheet portion 225 has an equal interval.

Meanwhile, an interval between the first grid sheet parts 223 and an interval between the second grid sheet parts 225 may be the same or different depending on the size of the mask cell C.

The first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, but the shape of the cross section perpendicular to the longitudinal direction may be a rectangle, a rectangular shape such as a trapezoid, a triangular shape, or the like. Sides and corners may be partially rounded. The cross-sectional shape can be adjusted in processes such as laser scribing and etching.

The thickness of the frame portion 210 may be thicker than the thickness of the mask cell sheet portion 220. The border frame portion 210 may be formed to a thickness of several mm to several cm because it is responsible for the overall rigidity of the frame 200.

In the case of the mask cell sheet portion 220, the process of manufacturing a substantially thick sheet is difficult, and if it is too thick, the organic material source 600 (see FIG. 18) passes through the mask 100 in the OLED pixel deposition process. This can cause clogging problems. Conversely, if the thickness is too thin, it may be difficult to secure rigidity sufficient to support the mask 100. Accordingly, the mask cell sheet portion 220 is thinner than the thickness of the frame portion 210, but is preferably thicker than the mask 100. The thickness of the mask cell sheet portion 220 may be formed about 0.1 mm to 1 mm. In addition, the widths of the first and second

grid sheet portions

223 and 225 may be formed to about 1 to 5 mm.

A plurality of mask cell regions CR: CR11 to CR56 may be provided except for regions occupied by the border sheet portions 221 and the first and second

grid sheet portions

223 and 225 in the planar sheet. In another aspect, the mask cell region CR is an area occupied by the border sheet portions 221 and the first and second

grid sheet portions

223 and 225 in the hollow region R of the border frame portion 210. Except for, it may mean an empty area.

As the cell C of the mask 100 corresponds to the mask cell region CR, it can be used as a passage through which the pixels of the OLED are substantially deposited through the mask pattern P. As described above, one mask cell C corresponds to one display such as a smartphone. Mask patterns P constituting one cell C may be formed in one mask 100. Alternatively, one mask 100 may include a plurality of cells C, and each cell C may correspond to each cell area CR of the frame 200, but the clear alignment of the mask 100 may be performed. For this, it is necessary to avoid the large area mask 100, and the small area mask 100 having one cell C is preferable. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell region CR of the frame 200. In this case, for clear alignment, it may be considered to correspond to the mask 100 having a small number of cells C of 2-3.

The frame 200 includes a plurality of mask cell regions CR, and each of the masks 100 may be attached such that one mask cell C corresponds to the mask cell region CR. Each mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy around the mask cell C (corresponding to a portion of the mask film 110 excluding the cell C). have. The dummy may include only the mask film 110 or may include the mask film 110 on which a predetermined dummy pattern having a shape similar to the mask pattern P is formed. The mask cell C corresponds to the mask cell region CR of the frame 200, and a part or all of the dummy may be attached to the frame 200 (mask cell sheet portion 220). Accordingly, the mask 100 and the frame 200 can achieve an integral structure.

On the other hand, according to another embodiment, the frame is not manufactured by attaching the mask cell sheet portion 220 to the border frame portion 210, the border frame portion 210 in the hollow region (R) portion of the border frame portion 210 ) And a frame in which a grid frame (corresponding to the grid sheet portions 223 and 225) integrally formed directly may be used. This type of frame also includes at least one mask cell region CR, and it is possible to manufacture a frame-integrated mask by matching the mask 100 to the mask cell region CR.

Hereinafter, a process of manufacturing the frame-integrated mask will be described.

First, the frame 200 described above with reference to FIGS. 4 and 5 may be provided. 6 is a schematic diagram showing a manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to (a) of FIG. 6, a border frame unit 210 is provided. The border frame part 210 may have a rectangular frame shape including the hollow region R.

Next, referring to FIG. 6B, a mask cell sheet portion 220 is manufactured. The mask cell sheet portion 220 may be manufactured by manufacturing a planar sheet using a rolling or other film forming process, and then removing the mask cell region CR through laser scribing, etching, or the like. . In this specification, description will be given taking an example in which 6 X 5 mask cell regions CR: CR11 to CR56 are formed. Five first grid sheet portions 223 and four second grid sheet portions 225 may be present.

Next, the mask cell sheet portion 220 may correspond to the border frame portion 210. In the process of matching, by stretching (F1 to F4) all sides of the mask cell sheet portion 220, the mask cell sheet portion 220 is flattened and the border sheet portion 221 is attached to the border frame portion 210. You can respond. One side can hold and hold the mask cell sheet portion 220 with several points (eg, 1 to 3 points in FIG. 6 (b), for example). On the other hand, the mask cell sheet portion 220 may be tensioned (F1, F2) along some side directions rather than all sides.

Next, when the mask cell sheet portion 220 corresponds to the edge frame portion 210, the edge sheet portion 221 of the mask cell sheet portion 220 may be welded (W) and attached. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 can be firmly attached to the frame portion 220. Welding (W) should be performed as close as possible to the edge of the edge frame portion 210 to reduce the excitation space between the edge frame portion 210 and the mask cell sheet portion 220 as much as possible to increase adhesion. The welding (W) portion may be generated in the form of a line or a spot, and has the same material as the mask cell sheet portion 220 and integrally forms the border frame portion 210 and the mask cell sheet portion 220. It can be a medium to connect to.

7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention. In the embodiment of FIG. 6, the mask cell sheet portion 220 having the mask cell region CR is first manufactured and attached to the border frame portion 210. However, in the embodiment of FIG. 7, the flat sheet of the border frame portion ( After attaching to 210), a portion of the mask cell region CR is formed.

First, as illustrated in (a) of FIG. 6, a border frame portion 210 including a hollow region R is provided.

Next, referring to (a) of FIG. 7, a flat sheet (the flat mask cell sheet part 220 ′) may correspond to the border frame part 210. The mask cell sheet portion 220 ′ is in a planar state in which the mask cell region CR is not yet formed. In the process of matching, all sides of the mask cell sheet portion 220 'are tensioned (F1 to F4), so that the mask cell sheet portion 220' can be flattened to correspond to the border frame portion 210. One side can hold and hold the mask cell sheet portion 220 'with several points (for example, 1 to 3 points in FIG. 7 (a)). On the other hand, the mask cell sheet portion 220 'may be tensioned (F1, F2) along some side directions rather than all sides.

Next, when the mask cell sheet portion 220 'corresponds to the frame portion 210, the edge portion of the mask cell sheet portion 220' may be welded (W) and attached. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 ′ can be firmly attached to the frame portion 220. The welding (W) should be performed as close as possible to the edge of the edge frame portion 210 to minimize the excitation space between the edge frame portion 210 and the mask cell sheet portion 220 'and increase adhesion. The welding (W) portion may be generated in the form of a line or a spot, and has the same material as the mask cell sheet portion 220 ', and the frame portion 210 and the mask cell sheet portion 220'. It can be a medium to integrally connect.

Next, referring to FIG. 7B, a mask cell region CR is formed on a planar sheet (planar mask cell sheet portion 220 '). The mask cell region CR may be formed by removing the sheet of the mask cell region CR portion through laser scribing, etching, or the like. In this specification, description will be given taking an example in which 6 X 5 mask cell regions CR: CR11 to CR56 are formed. When the mask cell region CR is formed, the edge frame portion 210 and the welded (W) portion become the edge sheet portion 221, and the five first grid sheet portions 223 and the four second grids The mask cell sheet portion 220 having the sheet portion 225 may be configured.

In order to realize a high-resolution OLED, the size of the pattern is decreasing, and the thickness of the mask metal film used for this needs to be reduced. As shown in FIG. 8 (a), in order to implement a high-resolution OLED pixel 6, the pixel spacing and pixel size in the mask 10 'must be reduced (PD-> PD'). In addition, in order to prevent the OLED pixel 6 from being unevenly deposited by the shadow effect, it is necessary to form the pattern of the mask 10 ′ inclined 14. However, in the process of forming the pattern inclined (14) on the thick mask 10 'having a thickness T1 of about 30 to 50 µm, patterning 13 that matches the fine pixel spacing PD' and the pixel size Since it is difficult to do this, it may cause the yield to deteriorate in the processing step. In other words, in order to form the pattern 14 with a fine pixel spacing PD ', a thin mask 10' must be used.

In particular, for high resolution of UHD level, as shown in FIG. 8 (b), it is possible to perform fine patterning by using a thin mask 10 'having a thickness T2 of about 20 µm or less. In addition, for ultra-high resolution of UHD or higher, the use of a thin mask 10 'having a thickness T2 of about 10 mu m may be considered.

9 is a schematic diagram showing a mask 100 according to an embodiment of the present invention.

The mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy DM around the mask cell C. It has been described above that the mask 100 may be manufactured from the metal sheet produced by the rolling process, and that one cell C may be formed in the mask 100. The dummy DM corresponds to a portion of the mask film 110 (the mask metal film 110) excluding the cell C, and includes only the mask film 110 or a predetermined dummy having a shape similar to the mask pattern P The patterned mask layer 110 may be included. The dummy DM may be attached to the frame 200 (the mask cell sheet unit 220) in part or all of the dummy DM in correspondence to the edge of the mask 100.

The width of the mask pattern P may be smaller than 40 μm, and the thickness of the mask 100 may be about 5-20 μm. Since the frame 200 includes a plurality of mask cell regions (CR: CR11 to CR56), a mask 100 having mask cells (C: C11 to C56) corresponding to each of the mask cell regions (CR: CR11 to CR56) ) Can also be provided in plural.

Since the one surface 101 of the mask 100 is a surface to be attached in contact with the frame 200, it is preferable that it is flat. In a planarization process, which will be described later, one surface 101 may be flattened and mirrored. The other surface 102 of the mask 100 may face one surface of the template 50 to be described later.

10 to 11 are schematic diagrams showing a process of manufacturing a mask support template by adhering the mask metal film 110 on the template 50 and forming the mask 100 on the template 50 according to an embodiment of the present invention.

Referring to (a) of FIG. 10, a template 50 may be provided. The template 50 is a medium through which the mask 100 is attached on one surface and can be moved in a supported state. One surface of the template 50 is preferably flat so as to support and move the flat mask 100. The central portion 50a may correspond to the mask cell C of the mask metal film 110, and the edge portion 50b may correspond to the dummy DM of the mask metal film 110. The size of the template 50 may be a flat plate having an area larger than that of the mask metal film 110 so that the mask metal film 110 is entirely supported.

The template 50 is preferably a transparent material to facilitate observation of vision and the like in the process of aligning and attaching the mask 100 to the frame 200. In addition, the laser may penetrate through a transparent material. As a transparent material, materials such as glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), and borosilicate glass can be used. For example, the template 50 may be a BOROFLOAT ^® 33 material having excellent heat resistance, chemical durability, mechanical strength, transparency, etc. among borosilicate glass. Also, BOROFLOAT ^® 33 has the advantage of ease of the control of the thermal expansion coefficient is less by about 3.3 Invar mask, the metal film 110 and the thermal expansion coefficient difference between the metal mask film 110.

On the other hand, in the template 50, one surface in contact with the mask metal film 110 is a mirror surface so that an air gap does not occur between the interface with the mask metal film 110 (or the mask 100). You can. In consideration of this, the surface roughness (Ra) of one surface of the template 50 may be 100 nm or less. To implement the template 50 having a surface roughness (Ra) of 100 nm or less, the template 50 may use a wafer. The wafer has a surface roughness (Ra) of about 10 nm, and there are many commercial products and many surface treatment processes, so it can be used as a template 50. Since the surface roughness (Ra) of the template (50) is nm-scale, there is no or little air gap, and it is easy to generate the weld beads (WB) by laser welding, thereby affecting the alignment error of the mask pattern (P). May not give.

The template 50 has a laser through hole 51 in the template 50 so that the laser L irradiated from the top of the template 50 can reach the welding part (area to be welded) of the mask 100. Can be formed. The laser through hole 51 may be formed in the template 50 to correspond to the position and number of welds. Since a plurality of welding portions are disposed at predetermined intervals at the edge or dummy DM portion of the mask 100, a plurality of laser through holes 51 may also be formed at predetermined intervals to correspond thereto. As an example, since a plurality of welding parts are disposed at predetermined intervals on both sides (left / right) dummy DM portions of the mask 100, the laser through holes 51 also have templates 50 on both sides (left / right). A plurality may be formed along a predetermined interval.

The laser through-hole 51 does not necessarily correspond to the position and number of welds. For example, it is also possible to perform welding by irradiating the laser L only on a part of the laser through holes 51. In addition, some of the laser through holes 51 that do not correspond to the welding portion may be used in place of the alignment marks when aligning the mask 100 and the template 50. If the material of the template 50 is transparent to the laser (L) light, the laser through hole 51 may not be formed.

A temporary adhesive portion 55 may be formed on one surface of the template 50. Temporary adhesive portion 55, the mask 100 is attached to the frame 200, the mask 100 (or, the mask metal film 110 ') is temporarily attached to one surface of the template 50, the template 50 It can be supported on the image.

The temporary adhesive portion 55 may use an adhesive or adhesive sheet that can be separated by applying heat, or an adhesive or adhesive sheet that can be separated by UV irradiation.

As an example, the temporary adhesive 55 may use liquid wax. The liquid wax may be the same as the wax used in the polishing step of a semiconductor wafer or the like, and the type is not particularly limited. Liquid wax is a resin component for controlling adhesion, impact resistance, etc., mainly related to holding power, and may include materials and solvents such as acrylic, vinyl acetate, nylon, and various polymers. As an example, the temporary adhesive portion 55 may be SKYLIQUID ABR-4016 including acrylonitrile butadiene rubber (ABR) as a resin component and n-propyl alcohol as a solvent component. The liquid wax may be formed on the temporary adhesive portion 55 using spin coating.

The temporary adhesive portion 55, which is a liquid wax, has a low viscosity at a temperature higher than 85 ° C to 100 ° C, and a high viscosity at a temperature lower than 85 ° C, and can be partially hardened like a solid, thereby mask metal film 110 'and template ) Can be fixed.

Next, referring to (b) of FIG. 10, a mask metal film 110 ′ may be adhered to the template 50. After the liquid wax is heated to 85 ° C. or higher and the mask metal film 110 ′ is brought into contact with the template 50, adhesion can be performed by passing the mask metal film 110 ′ and the template 50 between rollers. .

According to one embodiment, the template 50 is vaporized for about 120 ° C. for 60 seconds to vaporize the solvent of the temporary adhesive portion 55, and immediately, a mask metal film lamination process may be performed. . The lamination can be performed by loading the mask metal film 110 on the template 50 having the temporary adhesive portion 55 formed on one surface, and passing it between the upper roll at about 100 ° C and the lower roll at about 0 ° C. have. As a result, the mask metal film 110 ′ may be contacted on the template 50 through the temporary adhesive portion 55.

As another example, the temporary adhesive 55 may use a thermal release tape. In the form of a thermal release tape, a core film such as a PET film is disposed in the center, a thermal release adhesive is disposed on both sides of the core film, and a release film / release film is disposed on the outside of the adhesive layer. Can be Here, the adhesive layers disposed on both sides of the core film may have different temperatures from each other.

According to one embodiment, in a state in which the release film / release film is removed, the lower surface of the thermal peeling tape (the lower second adhesive layer of the core film) is adhered to the template 50, and the upper surface of the thermal peeling tape (core film) The upper first adhesive layer of) may be adhered to the mask metal layer 110 ′. Since the first adhesive layer and the second adhesive layer have different peeling temperatures, when the template 50 is separated from the mask 100 in FIG. 16 to be described later, as the first adhesive layer applies heat to be peeled off. The mask 100 may be separated from the template 50 and the temporary adhesive portion 55.

Subsequently, referring to FIG. 10B, a surface of the mask metal layer 110 ′ may be planarized (PS). Here, the planarization (PS) means that the one surface (upper surface) of the mask metal film 110 'is mirrored, and at the same time, the upper portion of the mask metal film 110' is partially removed to reduce the thickness. As shown in FIG. 8 (b), fine patterning can be performed only by using a thin mask metal film 110 having a thickness of about 20 μm or less for UHD level high resolution, and 10 for ultra high resolution of UHD or higher. A thin mask metal film 110 having a thickness of about μm should be used. However, since the mask metal film 110 ′ generated by the rolling process has a thickness of about 25 to 500 μm, it is necessary to make the thickness thinner. In addition, even if the mask metal film 110 'produced by the electroplating process is thinner than the rolling process, the etching characteristics differ depending on the composition, crystal structure / fine structure of the surface layer of the plating mask metal film 110' Therefore, it is necessary to control surface properties and thickness through planarization (PS).

Specifically, the thickness of the mask metal film 110 ′ may be reduced by flattening (PS) the opposite surface 101 facing the surface 102 of the mask metal film 110 ′ adhered to the template 50. . Planarization (PS) may be performed by a chemical mechanical polishing (CMP) method, and a known CMP method may be used without limitation. In addition, the thickness of the mask metal layer 110 ′ may be reduced by chemical wet etching or dry etching.

In the process of performing the planarization (PS), for example, in the CMP process, the surface roughness R _a of the upper surface of the mask metal layer 110 ′ may be controlled. Preferably, mirroring may be performed in which the surface roughness is further reduced. Alternatively, as another example, after performing a planarization (PS) by performing a chemical wet etching or dry etching process, a surface roughness (R _a ) may be reduced by adding a polishing process such as a separate CMP process.

In addition to this, a process capable of flattening the thickness of the mask metal film 110 ′ can be used without limitation. Accordingly, as shown in FIG. 10 (c), as the thickness of the mask metal film 110 'is reduced (110'-> 110), the mask metal film 110 may have a thickness of about 5 μm to 20 μm. You can.

Next, referring to (d) of FIG. 11, a patterned insulation portion 25 may be formed on the mask metal film 110. The insulating portion 25 may be formed of a photoresist material using a printing method or the like.

Subsequently, the mask metal layer 110 may be etched. Methods such as dry etching and wet etching may be used without limitation, and as a result of etching, a portion of the mask metal layer 110 exposed as an empty space 26 between the insulating portions 25 may be etched. The etched portion of the mask metal layer 110 constitutes the mask pattern P, and the mask 100 on which a plurality of mask patterns P are formed may be manufactured.

Next, referring to (e) of FIG. 11, the insulation portion 25 may be removed to complete the manufacture of the template 50 supporting the mask 100.

12 is a schematic view showing a mask metal film 110 "according to another embodiment of the present invention.

In order to make the mask 100 described above in Fig. 9, a process of forming the mask pattern P on the mask metal layer 110 "is required. The mask pattern P may be formed by etching or the like. However, since the width of the mask pattern P must be smaller than 40 μm in order to realize a high-resolution OLED of UHD or higher, etching is performed in consideration of the shape and direction of grains in the mask metal layer 110 ″. Need something Since the etching rate differs depending on the direction of the grains, the mask pattern (P) of the desired width may not be generated when etching is performed on the non-uniform grains, and even a few μm error may result in high-resolution implementation. Can influence.

In general, in the case of a metal film produced by rolling, the surface, that is, the shape and direction of crystal grains on the upper and lower surfaces are different from the central portion of the metal film. Referring to FIG. 12, a portion 117 "(top layer 117") corresponding to a predetermined thickness from the upper surface 111 "of the mask metal film 110" and a predetermined thickness from the lower surface 112 " The portion corresponding to the portion 119 "(lower layer 119") and the central portion 115 "excluding the upper layer portion 117" and lower layer portion 119 "differs in the characteristics of the crystal grains. The upper layer portion 117 "and the lower layer portion 119" may have irregular shapes in which crystal grains are oriented long in the rolling direction by rolling. The central portion 115 "has a grain shape that is generally non-directional and may have a spherical shape.

Therefore, in another embodiment of the present invention, in order to prevent an etch error due to a difference in the shape of the crystal grains, the central portion 115 except for the upper portion 117 "and the lower portion 119" of the mask metal film 110 " Characterized in that the manufacturing of the mask 100 using "). A mask metal film 110 including a central portion 115 "may be manufactured by performing a planarization (PS1, PS2) process or a thickness reduction process for the upper portion 117" and the lower portion 119 ". Since the mask pattern P is formed by etching only the central portion 115 "that is not irregular and uniform, there is an advantage that the width of the mask pattern P can be finely controlled.

13 is a schematic diagram showing a manufacturing process of a mask metal film 110 according to another embodiment of the present invention.

Referring to (a) of FIG. 13, the lower surface 112 ″ (second surface) of the mask metal film 110 ″ manufactured by the rolling process is adhered to the support substrate 40 by using an adhesive portion 41. You can. The adhesive portion 41 has the same material as the temporary adhesive portion 55 or a predetermined adhesive force, and a material that can be separated later can be used without limitation.

After the mask metal film 110 "is adhered to the support substrate 40, the upper surface 111" (first surface) may be planarized (PS1). Here, the planarization (PS1, PS2) means that one surface of the mask metal film 110 "is mirrored, and at the same time, the mask metal film 110" is partially removed to reduce the thickness. The planarization (PS1, PS2) may be performed by methods such as CMP, chemical wet etching, and dry etching.

When the upper surface is 0% and the lower surface is 100% based on the thickness of the mask metal layer 110 ", the central portion 115" may use at least a portion of the thickness portion of 10% to 90%. If the planarization (PS1, PS2) is made in almost the same thickness range, the reduction in thickness reduced by the planarization (PS1) process from the upper surface 111 "is about 5% to 45% of the thickness of the entire mask metal film 110" %. However, the present invention is not necessarily limited thereto, and if the central portion 115 "uses at least a portion of the thickness portion of 10% to 90% based on the thickness of the mask metal layer 110", in each of the flattening processes PS1 and PS2, The thickness reduction degree can be changed.

After the planarization (PS1) process, the upper layer portion 117 "may be removed from the mask metal layer 110".

Next, referring to (b) of FIG. 13, another support substrate 45 is prepared and the upper surface 111 "(first surface) of the mask metal film 110 'is attached to the support substrate 45 ( 46). The support substrate 45 and the adhesive portion 45 may be the same as the support substrate 40 and the adhesive portion 41.

Next, referring to (c) of FIG. 13, after attaching the mask metal film 110 ′ to the support substrate 45, the support substrate 40 may be separated. Subsequently, the second surface 112 ″ may be planarized (PS2). After the planarization (PS2) process, the lower layer portion 119 ″ may be removed from the mask metal layer 110 ″.

In (b) and (c) of FIG. 13, the support substrate 45 may correspond to the above-described template 50, and the adhesive portion 45 may correspond to the temporary adhesive portion 55 described above. In this case, step (b) of FIG. 13 may be replaced with a step of adhering the mask metal film 110 ″ to the template 50 on which the temporary adhesive portion 55 is formed, as in step (b) of FIG. The planarization PS2 in step (c) may be replaced with the planarization PS in step (b) of FIG. 10.

Next, referring to (d) of FIG. 13, the planarization (PS2) is completed, and thus the manufacturing of the mask metal film 110 may be completed. The mask metal film 110 includes a central portion 115 ", and the thickness of the mask metal film 110 may be about 5 μm to 20 μm.

Meanwhile, in FIGS. 12 and 13, the mask metal film 110 is assumed to be manufactured by a rolling process, but even in the case of a mask metal film manufactured by other processes such as electroplating, the difference in characteristics between the crystal grains of the surface part and the center part Since there may be, the planarization (PS1, PS2) process as shown in FIG. 13 can be applied.

14, the template 50 may be transferred by a vacuum chuck (90). The vacuum chuck 90 may adsorb and transfer the opposite side of the template 50 surface to which the mask 100 is adhered. The vacuum chuck 90 may be connected to moving means (not shown) that is moved in the x, y, z, and θ axes. Further, the vacuum chuck 90 may be connected to a flip means (not shown) capable of adsorbing and flipping the template 50. As shown in (b) of FIG. 14, after the vacuum chuck 90 adsorbs and flips the template 50, in the process of transferring the template 50 onto the frame 200, the mask 100 There is no effect on the adhesion state and alignment state.

15 is a schematic diagram showing a state in which a template is loaded on a frame according to an embodiment of the present invention to associate a mask with a cell region of the frame. In FIG. 15, it is exemplified to attach / attach one mask 100 to the cell region CR, but the mask 100 is framed 200 by simultaneously correlating the plurality of masks 100 to all the cell regions CR. ). In this case, a plurality of templates 50 supporting each of the plurality of masks 100 may be provided.

Next, referring to FIG. 15, the mask 100 may correspond to one mask cell area CR of the frame 200. By loading the template 50 on the frame 200 (or the mask cell sheet unit 220), the mask 100 may correspond to the mask cell area CR. While controlling the position of the template 50 / vacuum chuck 90, it can be seen whether the mask 100 corresponds to the mask cell region CR through a microscope. Since the template 50 compresses the mask 100, the mask 100 and the frame 200 can be in close contact.

Meanwhile, the lower support 70 may be further disposed under the frame 200. The lower support 70 may have a size sufficient to fit within the hollow region R of the frame edge portion 210 and may be flat. In addition, a predetermined support groove (not shown) corresponding to the shape of the mask cell sheet portion 220 may be formed on the upper surface of the lower support 70. In this case, the edge sheet portions 221 and the first and second

grid sheet portions

223 and 225 are fitted into the support grooves, so that the mask cell sheet portion 220 can be more secured.

The lower support 70 may compress the opposite surface of the mask cell region CR in contact with the mask 100. That is, the lower support 70 supports the mask cell sheet portion 220 in the upper direction, thereby preventing the mask cell sheet portion 220 from sagging in the downward direction during the attachment process of the mask 100. At the same time, since the lower support 70 and the template 50 compress the frame and the frame 200 (or the mask cell sheet portion 220) of the mask 100 in opposite directions, the mask 100 The alignment state of can be maintained without being disturbed.

As described above, the mask 100 corresponds to the mask cell area CR of the frame 200 by simply attaching the mask 100 on the template 50 and loading the template 50 on the frame 200. Since the process is complete, no tension may be applied to the mask 100 in this process.

Subsequently, the mask 100 may be attached to the frame 200 by laser welding the laser 100 to the mask 100. A welding bead WB is generated in a welding portion of the laser-welded mask, and the welding bead WB may be integrally connected with the same material as the mask 100 / frame 200. At this time, since the welding portion (or part of the dummy DM) of the mask 100 to which the laser L is irradiated is formed thicker than the mask cell C, a sufficient amount of the welding portion is melted to form the welding bead WB. And welding can be stably performed.

16 is a schematic diagram illustrating a process of separating the mask 100 and the template 50 after attaching the mask 100 to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 16, after attaching the mask 100 to the frame 200, the mask 100 and the template 50 may be debonded. Separation of the mask 100 and the template 50 may be performed through at least one of heat application (ET), chemical treatment (CM), ultrasonic application (US), and UV application (UV) to the temporary adhesive portion 55. have. Since the mask 100 remains attached to the frame 200, only the template 50 can be lifted. For example, when heat (ET) of a temperature higher than 85 ° C to 100 ° C is applied (ET), the viscosity of the temporary adhesive portion 55 is lowered, and the adhesive force between the mask 100 and the template 50 is weakened, and thus the mask 100 ) And the template 50 may be separated. As another example, the mask 100 and the template 50 may be separated by dissolving and removing the temporary adhesive portion 55 by immersing (CM) the temporary adhesive portion 55 in chemical substances such as IPA, acetone, and ethanol. have. As another example, when ultrasonic waves are applied (US) or UV is applied (UV), the adhesive force between the mask 100 and the template 50 is weakened, so that the mask 100 and the template 50 may be separated.

17 is a schematic diagram showing a state in which the mask 100 according to an embodiment of the present invention is attached to the frame 200.

Referring to FIG. 17, one mask 100 may be attached on one cell area CR of the frame 200.

Since the mask cell sheet portion 220 of the frame 200 has a thin thickness, when attached to the mask cell sheet portion 220 with tensile force applied to the mask 100, the tensile force remaining in the mask 100 is masked. The cell sheet portion 220 and the mask cell region CR may be actuated to deform them. Therefore, the mask 100 should be attached to the mask cell sheet portion 220 without applying a tensile force to the mask 100. The present invention corresponds to the mask cell region CR of the frame 200 by attaching the mask 100 on the template 50 and loading the template 50 on the frame 200. Since the process is completed, it is not possible to apply any tensile force to the mask 100 in this process. Thus, it is possible to prevent the frame 200 (or the mask cell sheet portion 220) from being deformed by the tension applied to the mask 100 acting as a tension on the frame 200.

The conventional mask 10 of FIG. 1 includes 6 cells (C1 to C6), and thus has a long length, whereas the mask 100 of the present invention includes a cell (C) and thus has a short length. The degree to which the pixel position accuracy (PPA) is distorted may be reduced. For example, assuming that the length of the mask 10 including a plurality of cells C1 to C6, ... is 1 m, and a PPA error of 10 μm is generated in 1 m as a whole, the mask 100 of the present invention Can be 1 / n of the above error range according to the relative length reduction (corresponding to the reduction in the number of cells (C)). For example, if the length of the mask 100 of the present invention is 100 mm, since it has a length reduced from 1 m to 1/10 of the conventional mask 10, a PPA error of 1 μm is generated over the entire length of 100 mm. , Alignment error is significantly reduced.

On the other hand, if the mask 100 includes a plurality of cells C, and each cell C corresponds to each cell region CR of the frame 200, within the range in which the alignment error is minimized, The mask 100 may correspond to a plurality of mask cell areas CR of the frame 200. Alternatively, the mask 100 having a plurality of cells C may correspond to one mask cell area CR. Also in this case, considering the process time and productivity according to the alignment, it is preferable that the mask 100 has as few cells C as possible.

In the case of the present invention, since only one cell C of the mask 100 needs to be matched and the alignment state is checked, it is necessary to simultaneously correspond to a plurality of cells C: C1 to C6 and check all of the alignment state. Compared to the conventional method (see Fig. 2), the manufacturing time can be significantly reduced.

That is, in the frame-integrated mask manufacturing method of the present invention, each cell C11 to C16 included in the six masks 100 corresponds to one cell region CR11 to CR16, respectively, and the alignment state is checked. Through the process, time can be significantly shortened compared to a conventional method in which six cells C1 to C6 are simultaneously mapped and all six cells C1 to C6 are aligned at the same time.

In addition, in the method for manufacturing a frame-integrated mask of the present invention, the product yield in 30 processes of 30 masks 100 corresponding to and aligned with 30 cell regions (CR: CR11 to CR56) is 6 cells (C1). ~ C6), each of the five masks 10 (see FIG. 2 (a)), which correspond to and align the frame 20, may appear to be much higher than the conventional product yield in the five steps. Since the conventional method of arranging six cells C1 to C6 in a region corresponding to six cells C at a time is a much cumbersome and difficult operation, the product yield is low.

Meanwhile, as described above in step (b) of FIG. 10, when the mask metal film 110 is attached to the template 50 by a lamination process, a temperature of about 100 ° C. may be applied to the mask metal film 110. . Thereby, it may be adhered to the template 50 in a state where some tensile tension is applied to the mask metal film 110. Thereafter, when the mask 100 is attached to the frame 200 and the template 50 is separated from the mask 100, the mask 100 may contract a predetermined amount.

When the templates 50 and the masks 100 are separated after each of the masks 100 are all attached to the corresponding mask cell area CR, a tension is applied to the plurality of masks 100 contracting in opposite directions. Therefore, the force is canceled, so that the deformation does not occur in the mask cell sheet portion 220. For example, the first grid sheet portion 223 between the mask 100 attached to the CR11 cell area and the mask 100 attached to the CR12 cell area is directed to the right side of the mask 100 attached to the CR11 cell area. The acting tension and the tension acting in the left direction of the mask 100 attached to the CR12 cell region may be canceled. Thus, the deformation of the frame 200 (or the mask cell sheet part 220) due to tension is minimized, so that an alignment error of the mask 100 (or the mask pattern P) can be minimized.

18 is a schematic diagram illustrating an OLED pixel deposition apparatus 1000 using frame-integrated

masks

100 and 200 according to an embodiment of the present invention.

Referring to FIG. 18, the OLED pixel deposition apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated and a coolant line 350 is disposed, and an organic material source 600 from the bottom of the magnet plate 300. It includes a deposition source supply unit 500 for supplying.

Between the magnet plate 300 and the source deposition unit 500, a target substrate 900 such as glass on which the organic source 600 is deposited may be interposed. The target substrate 900 may be disposed such that the frame-integrated masks 100 and 200 (or FMM) that allow the organic material source 600 to be deposited on a pixel-by-pixel basis are in close contact or very close. The magnet 310 generates a magnetic field and can be in close contact with the target substrate 900 by the magnetic field.

The deposition source supply unit 500 may supply the organic material source 600 while reciprocating the left and right paths, and the organic material sources 600 supplied from the deposition source supply unit 500 may include patterns P formed in the frame-integrated masks 100 and 200. ) To be deposited on one side of the target substrate 900. The deposited organic source 600 that has passed through the pattern P of the frame-integrated

masks

100 and 200 may act as the pixel 700 of the OLED.

In order to prevent uneven deposition of the pixels 700 by the shadow effect, the patterns of the frame-integrated

masks

100 and 200 may be inclined (S) (or formed in a tapered shape (S)). . Since the organic material sources 600 passing through the pattern in the diagonal direction along the inclined surface may also contribute to the formation of the pixel 700, the pixel 700 may be uniformly deposited in thickness as a whole.

The present invention has been illustrated and described with reference to preferred embodiments, as described above, but is not limited to the above embodiments and is varied by those skilled in the art to which the present invention pertains without departing from the spirit of the present invention. Modifications and modifications are possible. Such modifications and variations are to be regarded as falling within the scope of the invention and appended claims.

Claims

A method of manufacturing a template that supports an OLED pixel forming mask and corresponds to a frame,

(a) preparing a mask metal film;

(b) adhering a mask metal film on a template on which a temporary adhesive portion is formed on one surface;

(c) reducing the thickness of the mask metal film adhered to the template; And

(d) preparing a mask by forming a mask pattern on the mask metal film

A method of manufacturing a mask support template comprising a.
A method of manufacturing a template that supports an OLED pixel forming mask and corresponds to a frame,

(a) preparing a mask metal film;

(b) reducing at least a portion of the thickness from the first surface of the mask metal film and the second surface opposite to the first surface;

(c) bonding the mask metal film on the template on which the temporary adhesive portion is formed; And

(d) preparing a mask by forming a mask pattern on the mask metal film

A method of manufacturing a mask support template comprising a.
According to claim 1,

In step (a), a mask metal film is prepared and at least a portion of the thickness is reduced from the first surface of the mask metal film,

In step (b), the first surface of the mask metal film is adhered to the template,

In step (c), a method of manufacturing a mask support template, wherein at least a portion of the thickness is reduced from a second surface opposite the first surface of the mask metal film.
According to claim 1,

The temporary adhesive portion is a method of manufacturing a mask support template, which is a detachable adhesive or adhesive sheet by heating, and an adhesive or adhesive sheet detachable by UV irradiation.
According to claim 1,

The reduction of the thickness of the mask metal film is performed by any one of CMP (Chemical Mechanical Polishing), chemical wet etching, and dry etching.
The method of claim 5,

When the CMP method is used to reduce the thickness of the mask metal film, the surface roughness on one surface of the mask metal film is reduced.
The method of claim 5,

When the chemical wet etching or dry etching method is used to reduce the thickness of the mask metal film, a polishing method is further performed in a subsequent step to reduce surface roughness on one surface of the mask metal film, thereby manufacturing a mask support template.
According to claim 1,

A method of manufacturing a mask support template, which reduces the thickness of the mask metal film to be 5 to 20 µm.
According to claim 1,

Step (d),

(d1) forming a patterned insulating portion on the mask metal film;

(d2) forming a mask pattern by etching a portion of the mask metal film exposed between the insulating parts; And

(d3) removing the insulation

A method of manufacturing a mask support template comprising a.
The method of claim 2 or 4,

When the first side is 0% and the second side is 100% based on the thickness of the mask metal film,

A method of manufacturing a mask support template, wherein the mask uses at least a portion of a portion corresponding to a thickness of 10% to 90% of the mask metal film.
As a template that supports the mask for forming OLED pixels and corresponds to the frame,

template;

A temporary adhesive formed on the template; And

A mask that is adhered to the template through a temporary adhesive part and a mask pattern is formed.

It includes,

The thickness of the mask is 5㎛ to 20㎛, the mask support template.
The method of claim 11,

The mask includes a central portion formed by reducing at least a portion of the thickness from the upper and lower surfaces of the mask metal film (sheet) produced by a rolling process.
The method of claim 11,

When the upper surface is 0% and the lower surface is 100% based on the thickness of the mask metal film,

The mask supporting template is to use at least a portion of a portion corresponding to a thickness of 10% to 90% of the mask metal film.
The method of claim 11,

The temporary adhesive portion is a mask support template, which is an adhesive or adhesive sheet that can be separated by heating, and an adhesive or adhesive sheet that can be separated by UV irradiation.
The method of claim 11,

A mask support template in which a laser through hole is formed in a portion of the rim portion of the template corresponding to the weld portion of the mask.
The method of claim 11,

The template is a wafer, glass, silica (silica), heat-resistant glass, quartz (quartz), alumina (Al 2 O 3 ), borosilicate glass (borosilicate glass) material of any one of, the mask support template.
A method of manufacturing a frame-integrated mask in which at least one mask and a frame supporting the mask are integrally formed,

(a) loading a template prepared by the manufacturing method of claim 1 or 2 on a frame having at least one mask cell region, thereby matching the mask to the mask cell region of the frame; And

(b) attaching the mask to the frame

A method of manufacturing a frame-integrated mask comprising a.