TW202020578A - Template for supporting mask and producing method thereof and producing method of mask integrated frame - Google Patents

Abstract

The present invention relates to a mask support template and a manufacturing method therefor, and a frame-integrated mask manufacturing method. A method for manufacturing a mask support template, according to the present invention, manufactures a template supporting a mask for forming OLED pixels so as to match same to a frame, and comprises the steps of: (a) preparing a mask metal film generated by rolling; (b) attaching the mask metal film to the template having a temporary adhesive part formed on one surface thereof; (c) reducing the thickness of the mask metal film attached to the template; and (d) manufacturing the mask by forming a mask pattern on the mask metal film.

Description

Shield support template and manufacturing method thereof and frame integrated shield manufacturing method

The invention relates to a mask support template and a manufacturing method thereof and a frame integrated mask manufacturing method. In more detail, the present invention relates to a mask that can be stably supported and moved without deformation of the mask, that the mask is stably attached to the frame, and that the alignment between the masks is accurately aligned Cover support template and its manufacturing method and frame integrated shield manufacturing method.

As a technology for forming pixels in the OLED manufacturing process, a FMM (Fine Metal Mask) method is mainly used, which closely adheres a metal mask (shadow mask) in the form of a thin film to a substrate and deposits organic matter at a desired position.

In the existing OLED manufacturing process, after the mask is manufactured into a strip shape, a plate shape, etc., the mask is welded and fixed to the OLED pixel deposition frame and used. Multiple units corresponding to one display may be provided on one mask. In addition, in order to manufacture a large-area OLED, a plurality of masks may be fixed to the OLED pixel deposition frame, and in the process of fixing to the frame, each mask is stretched to make it flat. It is very difficult to adjust the stretching force to flatten the entire part of the mask. In particular, in order to flatten all the cells and align the mask pattern with a size of only a few μm to several tens of μm, it is necessary to fine-tune the tensile force applied to each side of the mask and to check the alignment state in real time. Claim.

Nevertheless, in the process of fixing multiple masks to one frame, there is still a problem of poor alignment between the masks and between the mask units. In addition, in the process of welding and fixing the mask to the frame, the thickness of the mask film is too thin and the area is large, so there is a problem that the mask sags or twists due to load, and wrinkles and burrs that occur in the welded part during the welding process (Burr), etc. problems such as misalignment of the mask unit.

In ultra-high-definition OLED, the existing QHD (Quarter High Definition) image quality is 500-600PPI (pixel per inch), the pixel size reaches about 30-50μm, and 4K UHD (Ultra High Definition), 8K UHD HD has a comparison The higher resolution is ~860PPI, ~1600PPI, etc. In this way, considering the pixel size of the ultra-high-definition OLED, the alignment error between the units needs to be reduced to a degree of several μm. Exceeding this error will result in defective products, so the yield may be extremely low. Therefore, it is necessary to develop a technique capable of preventing deformation such as sagging or twisting of the mask and accurately aligning it, and a technique of fixing the mask to the frame and the like.

Problems to be solved by invention Therefore, the present invention is proposed to solve the above-mentioned problems in the prior art, and an object of the present invention is to provide a mask support template and a method for manufacturing the same that enables the mask and the frame to be stably attached.

In addition, an object of the present invention is to provide a mask support template capable of stably supporting and moving the mask without deformation and a method of manufacturing the same.

In addition, an object of the present invention is to provide a mask support template capable of forming a fine mask pattern on a mask and a manufacturing method thereof.

In addition, an object of the present invention is to provide a mask support template that can improve the adhesion between the mask and the frame when the mask is attached to the frame, and a method of manufacturing the same.

In addition, an object of the present invention is to provide a mask support template that can be used repeatedly after attaching a mask to a frame and a method for manufacturing the same.

In addition, an object of the present invention is to provide a method for manufacturing a frame-integrated mask in which the mask and the frame can form an integrated structure.

In addition, an object of the present invention is to provide a method for manufacturing a frame-integrated mask that can prevent deformation of the mask such as sagging or twisting and can be accurately aligned.

In addition, an object of the present invention is to provide a method for manufacturing a frame-integrated mask that significantly reduces manufacturing time and significantly improves productivity. Ways to solve the problem

The above object of the present invention is achieved by a manufacturing method of a mask support template, which is used to support a mask for forming an OLED pixel and make the mask correspond to the frame. The method includes the following steps: (a) preparing a mask Mask metal film; (b) bonding the mask metal film to the template on which a temporary bonding portion is formed; (c) reducing the thickness of the mask metal film bonded on the template; and (d) forming on the mask metal film Mask patterns to make masks.

In addition, the above object of the present invention is achieved by a method of manufacturing a mask support template for supporting a mask for OLED pixel formation and making the mask correspond to the frame. The method includes the following steps: preparing the mask Metal film; (b) Reduce at least a part of the thickness from the first surface of the mask metal film and the second surface opposite to the first surface; (c) Bond the mask metal film to a template on which a temporary bonding portion is formed; And (d) forming a mask pattern on the mask metal film to manufacture a mask.

In step (a), prepare the mask metal film, and reduce the thickness of at least a part of the first surface of the mask metal film, in step (b), bond the first surface of the mask metal film to the template, in (c ) Step, at least a part of the thickness may be reduced from the second surface opposite to the first surface of the mask metal film.

The temporary bonding part may be a heat-separable adhesive or a bonding sheet, a UV-separating adhesive or a bonding sheet.

The thickness reduction of the mask metal film can be performed by any of CMP (Chemical Mechanical Polishing), chemical wet etching (chemical wet etching), and dry etching (dry etching).

When using the CMP method to reduce the thickness of the mask metal film, the surface roughness on one side of the mask metal film can be reduced.

When using chemical wet etching or dry etching to reduce the thickness of the mask metal film, it may be further polished in subsequent steps to reduce the surface roughness of one side of the mask metal film.

The thickness of the mask metal film can be reduced to 5 μm to 20 μm.

Step (d) may include the following steps: (d1) forming a patterned insulating portion on the mask metal film; (d2) etching the portion of the mask metal film exposed between the insulating portions to form a mask pattern; and ( d3) Remove the insulation.

Based on the thickness of the mask metal film, when the first surface is 0% and the second surface is 100%, the mask can use at least a portion of the portion corresponding to 10% to 90% of the thickness of the mask metal film.

In addition, the above object of the present invention is achieved by a mask support template for supporting a mask for OLED pixel formation and making the mask correspond to the frame. The mask support template includes: a template; a temporary bonding portion, It is formed on the template; and a mask, which is bonded to the template by interposing a temporary adhesive part, and a mask pattern is formed, and the thickness of the mask is 5 μm to 20 μm.

The mask may include a central portion formed by reducing at least a part of the thickness from the upper surface and the lower surface of the mask metal film manufactured by the rolling process.

Based on the thickness of the mask metal film, when the upper surface is 0% and the lower surface is 100%, the mask uses at least part of the portion corresponding to 10% to 90% of the thickness of the mask metal film.

The temporary bonding part may be a heat-separable adhesive or a bonding sheet, a UV-separating adhesive or a bonding sheet.

A laser penetrating hole may be formed in the edge portion of the template corresponding to the welding portion of the mask.

The template may include any one of wafer, glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), and borosilicate glass .

In addition, the above object of the present invention is achieved by a method for manufacturing a frame-integrated mask, which is formed by integrating at least one mask with a frame for supporting the mask, wherein the method includes the following steps: (A) On the frame having at least one mask unit area, load the template manufactured by the manufacturing method described in claim 1 or 2, and make the mask correspond to the mask unit area of the frame and (b) mask Attach to the frame. Effect of invention

According to the present invention configured as described above, the attachment of the mask to the frame can be performed stably.

In addition, according to the present invention, the mask can be stably supported and moved without being deformed.

Furthermore, according to the present invention, a fine mask pattern can be formed on the mask.

Furthermore, according to the present invention, when the mask is attached to the frame, the adhesion between the mask and the frame can be improved.

Furthermore, according to the present invention, the mask can be used repeatedly after being attached to the frame.

Furthermore, according to the present invention, the cover and the frame can form an integrated structure.

In addition, according to the present invention, deformation such as sagging or twisting of the mask can be prevented, and alignment can be accurately performed.

In addition, according to the present invention, the manufacturing time can be significantly shortened, and the yield can be significantly increased.

The detailed description of the present invention described later will refer to the accompanying drawings, which show specific embodiments capable of implementing the present invention as examples. These embodiments are described in sufficient detail to enable those skilled in the art to implement the present invention. It should be understood that although the various embodiments of the present invention are different from each other, they are not mutually exclusive. For example, the specific shapes, structures, and characteristics described herein are related to one embodiment, and can be implemented as other embodiments without departing from the spirit and scope of the present invention. In addition, it should be understood that the position or arrangement of the individual constituent elements in each disclosed embodiment can be changed without departing from the spirit and scope of the present invention. Therefore, the following detailed description should not be regarded as limiting, and as long as it is properly described, the scope of the present invention is limited only by the scope of the attached patent application and all ranges equivalent thereto. Similar symbols in the drawings represent the same or similar functions in many ways. For convenience, the length, area, thickness, and shape can be exaggerated.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention.

FIG. 1 is a schematic diagram showing a conventional mask 10 for OLED pixel deposition.

Referring to FIG. 1, the existing mask 10 may be manufactured in stick-type or plate-type. The mask 10 shown in (a) of FIG. 1 serves as a strip mask, and both sides of the strip can be welded and fixed to the OLED pixel deposition frame and used. The mask 100 shown in (b) of FIG. 1 can be used as a plate-type (Plate-Type) mask in a large-area pixel formation process.

The body (body or mask film 11) of the mask 10 is provided with a plurality of display units C. One unit C corresponds to one display such as a smartphone. A pixel pattern P is formed in the cell C so as to correspond to each pixel of the display. When the unit C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B are displayed. As an example, the pixel pattern P is formed in the cell C so as to have a resolution of 70×140. That is, a large number of pixel patterns P form a set to constitute one unit C, and a plurality of units C may be formed on the mask 10.

FIG. 2 is a schematic diagram showing a conventional process of attaching the mask 10 to the frame 20. FIG. 3 is a schematic diagram showing that an alignment error between cells occurs during the conventional stretching of the F1 to F2 mask 10. The strip mask 10 including six units C (C1 to C6) shown in (a) of FIG. 1 will be described as an example.

Referring to (a) of FIG. 2, first, the strip mask 10 should be spread out flat. Tensile forces F1 to F2 are applied along the long axis direction of the strip mask 10, and the strip mask 10 is unfolded as it is stretched. In this state, the strip mask 10 is mounted on the frame 20 in a frame shape. The cells C1 to C6 of the strip mask 10 will be located in the blank area inside the frame of the frame 20. The size of the frame 20 may be sufficient to make the units C1 to C6 of one strip mask 10 located in the blank area inside the frame, or it may be enough to make the units C1 to C6 of multiple strip masks 10 located in the blank area inside the frame.

Referring to (b) of FIG. 2, finely adjust the tensile forces F1 to F2 applied to each side of the strip mask 10, and after the alignment, as the part of the side surface of the strip mask 10 is welded, the strip mask 10 and the frame 20 are connected to each other. (C) of FIG. 2 shows a side section of the strip mask 10 and the frame connected to each other.

Referring to FIG. 3, although fine adjustment of the stretching forces F1 ˜F2 applied to the sides of the strip mask 10, the problem is that the mask units C1 ˜ C3 are not well aligned with each other. For example, the distances D1 to D1" and D2 to D2" between the patterns P of the cells C1 to C3 are different from each other, or the pattern P is skewed. Since the strip mask 10 has a large area including a plurality (6 cells as an example) of cells C1 to C6 and has a very thin thickness of several tens of μm, it is easy to sag or twist due to load. In addition, it is very difficult to adjust the tensile forces F1 to F2 so that all the cells C1 to C6 are flat, and confirming the alignment state between the cells C1 to C6 with a microscope.

Therefore, a slight error in the stretching forces F1 to F2 may cause an error in the degree of stretching or unfolding of the units C1 to C3 of the strip mask 10, thereby causing the distances D1 to D1", D2 between the mask patterns P ~D2" is different. Although it is very difficult to perfectly align so that the error is 0, in order to avoid the mask pattern P having a size of several μm to several tens of μm from adversely affecting the pixel process of the ultra-high-definition OLED, the alignment error is preferably not more than 3 μm. The alignment error between such adjacent units is called pixel position accuracy (PPA).

In addition, approximately 6-20 strip masks 10 are respectively connected to one frame 20, and the alignment between the plurality of strip masks 10 and the plurality of cells C-C6 of the strip mask 10 are simultaneously aligned Precise state is a very difficult task, and can only increase the process time based on alignment, which becomes an important reason for reducing productivity.

On the other hand, after the strip mask 10 is connected and fixed to the frame 20, the tensile forces F1 to F2 applied to the strip mask 10 can act on the frame 20 in the reverse direction. That is, after the strip mask 10 stretched and stretched due to the tensile forces F1 to F2 is connected to the frame 20, it is possible to apply tension to the frame 20. Normally, this tension is not large, and it does not have a great influence on the frame 20. However, when the size of the frame 20 is miniaturized and the rigidity becomes low, such tension may slightly deform the frame 20. In this way, a problem may occur that the alignment state between the plurality of cells C to C6 is broken.

In view of this, the present invention proposes a frame 200 and a frame-integrated mask capable of forming the mask 100 and the frame 200 into an integrated structure. The cover 100 integrated with the frame 200 not only prevents deformation such as sagging or twisting, but also can be accurately aligned with the frame 200. When the mask 100 is connected to the frame 200, no tensile force is applied to the mask 100, so after the mask 100 is connected to the frame 200, no tension is applied to the mask 200 that causes deformation. Also, the manufacturing time for integrally connecting the mask 100 to the frame 200 can be significantly shortened, and the productivity can be significantly improved.

4 is a front view (FIG. 4(a)) and a side cross-sectional view (FIG. 4(b)) showing a frame-integrated mask according to an embodiment of the present invention, and FIG. 5 is a diagram showing the present invention. A front view ((a) of FIG. 5) and a side sectional view (b of FIG. 5) of the frame according to an embodiment.

4 and 5, the frame-integrated mask may include a plurality of masks 100 and a frame 200. In other words, the form in which the plurality of masks 100 are attached to the frame 200 respectively. In the following, for convenience of explanation, a quadrangular mask 100 is taken as an example for description, but before the mask 100 is attached to the frame 200, it may be a strip mask shape having a protrusion for clamping on both sides, the mask After 100 is attached to the frame 200, the protrusion can be removed.

A plurality of mask patterns P are formed on each mask 100, and one unit C may be formed in one mask 100. One mask unit C may correspond to one display of a smartphone or the like.

The mask 100 may use a metal sheet generated by a rolling process. The mask 100 may be an invar with a thermal expansion coefficient of about 1.0×10 ⁻⁶ /°C or a super invar material with about 1.0×10 ⁻⁷ /°C. Since the thermal expansion coefficient of the mask 100 of this material is very low, the pattern shape of the mask is less likely to be deformed by thermal energy, and it can be used as a FMM (Fine Metal Mask) or shadow mask in the manufacture of high-resolution OLEDs. Shadow Mask). In addition, considering that a technology for implementing a pixel deposition process within a range with a small temperature change value is being developed recently, the mask 100 may also be nickel (Ni), nickel-cobalt (Ni-Co), etc. with a slightly larger thermal expansion coefficient. material.

The metal sheet manufactured by the rolling process may have a thickness of tens to hundreds of μm in the manufacturing process. In order to enable the mask pattern P described later to be finely formed, the thickness of the metal sheet having such a thickness needs to be thinner. The process of making the thickness thinner than about 50 μm by CMP or the like can be further performed on the metal sheet. The thickness of the mask is preferably about 2 μm to 50 μm, and more preferably about 5 μm to 20 μm. However, it is not limited to this.

In the case of using a metal sheet manufactured by the rolling process, although there is a thickness that is thicker than the thickness of the plating film formed by electroforming, the thermal expansion coefficient CTE is low, so no additional heat treatment process is required and it is corrosion-resistant Strong advantages.

In addition, the metal sheet produced by the rolling process is not necessarily used, and the metal sheet produced by electroforming can also be used. At this time, a heat treatment process may be further performed to reduce the thermal expansion coefficient of the electroformed sheet. The base material used as an electroformed cathode electrode may be a conductive material. In particular, due to metal oxides, polycrystalline inclusions, and grain boundaries, it is not possible to apply a uniform electric field to the cathode, so that a part of the plated metal sheet is formed unevenly, so a single crystal material master can be used ( Or cathode). In particular, it can be a single crystal silicon material, and metals such as Ti, Cu, Ag; GaN, SiC, GaAs, GaP, AlN, InN, InP, Ge and other semiconductors; graphite (graphite), graphene (graphene) like carbon material; comprising CH ₃ NH ₃ PbCl superconductor _{3, CH 3 NH 3 PbBr 3} , CH 3 NH 3 PbI 3, SrTiO ₃ perovskite of (Transition of perovskite) single crystal ceramic structure; a single aircraft parts Crystal super heat resistant alloy, etc. In order to have conductivity, doping may be performed in part or in whole. The single crystal material has no defects, and a uniform electric field is formed on the surface during electroforming. Therefore, a uniform metal sheet is generated. The frame-integrated masks 100 and 200 manufactured thereby can further improve the image quality of OLED pixels.

The frame 200 is formed in a form capable of attaching a plurality of masks 100. Including the most peripheral edge, the frame 200 may include a plurality of corners formed along the first direction (eg, lateral direction) and the second direction (eg, vertical direction). Such multiple corners may define a region on the frame 200 for attaching the mask 100.

The frame 200 may include an edge frame portion 210 having a substantially rectangular shape or a square shape. The inside of the edge frame part 210 may have a hollow shape. That is, the edge frame part 210 may include the hollow region R. The frame 200 may be formed of metal materials such as constant steel, super constant steel, aluminum, titanium, etc. In consideration of thermal deformation, it is preferably made of constant steel, super constant steel, nickel, nickel-cobalt with the same thermal expansion coefficient as the mask These materials can be applied to the edge frame portion 210 and the mask unit sheet portion 220 as constituent elements of the frame 200.

In addition, the frame 200 is provided with a plurality of mask unit regions CR, and may include the mask unit sheet portion 220 connected to the edge frame portion 210. The mask unit sheet portion 220 is the same as the mask 100 and can be formed by rolling, or by other film forming processes such as electroforming. In addition, the mask unit sheet portion 220 may be connected to the edge frame portion 210 after forming a plurality of mask unit regions CR on a planar sheet by laser scribing, etching, or the like. Alternatively, the mask unit sheet portion 220 may form a plurality of mask unit regions CR by laser scribing, etching, or the like after connecting a planar sheet to the edge frame portion 210. In this specification, the case where first a plurality of mask unit regions CR is formed in the mask unit sheet portion 220 and then connected to the edge frame portion 210 will be described.

The mask unit sheet portion 220 may include at least one of the edge sheet portion 221 and the first grid sheet portion 223 and the second grid sheet portion 225. The edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225 refer to portions divided on the same sheet, and they are formed integrally with each other.

The edge sheet portion 221 may be substantially connected to the edge frame portion 210. Therefore, the edge sheet portion 221 may have a substantially square shape or a square shape corresponding to the edge frame portion 210.

In addition, the first grid sheet portion 223 may be formed to extend along the first direction (lateral direction). The first grid sheet portion 223 is formed in a straight line shape, and both ends thereof may be connected to the edge sheet portion 221. When the mask unit sheet portion 220 includes a plurality of first grid sheet portions 223, each first grid sheet portion 223 preferably has the same pitch.

In addition, further, the second grid sheet portion 225 may be formed to extend along the second direction (vertical direction), the second grid sheet portion 225 is formed in a linear form, and both ends thereof may be connected to the edge sheet portion 221 . The first grid sheet portion 223 and the second grid sheet portion 225 may cross each other perpendicularly. When the mask unit sheet portion 220 includes a plurality of second grid sheet portions 225, each second grid sheet portion 225 preferably has the same pitch.

On the other hand, the pitch between the first grid sheet portion 223 and the pitch between the second grid sheet portion 225 may be the same or different depending on the size of the mask unit C.

Although the first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, the shape of the cross section perpendicular to the longitudinal direction may be such as a rectangular shape, a trapezoidal quadrangular shape, a triangular shape, etc. , A part of the corner can form a circle. The cross-sectional shape can be adjusted during laser scribing, etching, etc.

The thickness of the edge frame part 210 may be greater than the thickness of the mask unit sheet part 220. Since the edge frame part 210 is responsible for the overall rigidity of the frame 200, it may be formed with a thickness of several mm to several cm.

As far as the mask unit sheet portion 220 is concerned, the process of manufacturing a thick sheet is actually difficult. If it is too thick, the organic matter source 600 (see FIG. 18) may block the path through the mask 100 in the OLED pixel deposition process . Conversely, if it is too thin, it may be difficult to ensure sufficient rigidity to support the mask 100. Thus, the mask unit sheet portion 220 is preferably thinner than the thickness of the edge frame portion 210, but thicker than the mask 100. The thickness of the mask unit sheet portion 220 may be about 0.1 mm to 1 mm. In addition, the width of the first grid sheet portion 223 and the second grid sheet portion 225 may be approximately 1 to 5 mm.

In the planar sheet, in addition to the area occupied by the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225, a plurality of mask unit regions CR (CR11 to CR56) may be provided . From another perspective, the mask unit region CR may refer to the hollow region R of the edge frame portion 210 except for the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225 A blank area outside the occupied area.

As the cell C of the mask 100 corresponds to the mask cell region CR, it can be substantially used as a channel for depositing pixels of the OLED through the mask pattern P. As described above, one mask unit C corresponds to one display of a smartphone or the like. A mask pattern P for constituting one cell C may be formed in one mask 100. Alternatively, one mask 100 includes a plurality of cells C and each cell C may correspond to each cell region CR of the frame 200, but in order to accurately align the mask 100, it is necessary to avoid a large-area mask 100, preferably one unit C's small area mask 100. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell region CR of the mask 200. At this time, in order to accurately align, a mask 100 corresponding to 2-3 cells C may be considered.

The mask 200 includes a plurality of mask unit regions CR, and each mask 100 can be attached so that each mask unit C corresponds to each mask unit region CR. Each mask 100 may include a mask unit C in which a plurality of mask patterns P are formed, and a virtual part around the mask unit C (equivalent to a portion of the mask film 110 other than the unit C). The dummy part may include only the mask film 110, or may include the mask film 110 formed with a prescribed dummy pattern in a form similar to the mask pattern P. The mask unit C corresponds to the mask unit region CR of the frame 200, and part or all of the virtual part may be attached to the frame 200 (mask unit sheet part 220). Thus, the cover 100 and the frame 200 can form an integrated structure.

On the other hand, according to another embodiment, the frame is not manufactured by attaching the mask unit sheet portion 220 to the edge frame portion 210, but may be formed directly in the hollow region R portion of the edge frame portion 210 with the edge frame The part 210 becomes a frame of an integrated grid frame (corresponding to the grid sheet parts 223, 225). The frame of this form also includes at least one mask unit region CR, and the mask 100 can be made to correspond to the mask unit region CR to manufacture a frame-integrated mask.

Hereinafter, the manufacturing process of the frame-integrated mask will be described.

First, the frame 200 described in FIGS. 4 and 5 may be provided. FIG. 6 is a schematic diagram showing the manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to (a) of FIG. 6, an edge frame portion 210 is provided. The edge frame part 210 may have a square shape including a hollow region R.

Next, referring to (b) of FIG. 6, the mask unit sheet portion 220 is manufactured. After rolling or another film forming process, after manufacturing the planar sheet, the mask unit region CR portion is removed by laser scribing, etching, etc., so that the mask unit sheet portion 220 can be manufactured. In this specification, a 6×5 mask cell region CR (CR11 to CR56) will be described as an example. There may be five first grid sheet sections 223 and four second grid sheet sections 225.

Then, the mask unit sheet portion 220 may correspond to the edge frame portion 210. In the corresponding process, the edge sheet portion 221 and the edge frame portion 210 may be made in a state where all sides of the mask unit sheet portion 220 are stretched to flatten the mask unit sheet portion 220 in F1 to F4 correspond. The mask unit sheet portion 220 may be sandwiched and stretched at a plurality of points (1 to 3 points in the example of (b) in FIG. 6) at one side. On the other hand, the unit sheet portion 220 may be covered by stretching F1 and F2 along a part of the side direction instead of all sides.

Then, when the mask unit sheet portion 220 corresponds to the edge frame portion 210, the edge sheet portion 221 of the mask unit sheet portion 220 may be attached by welding W. Preferably, all sides are welded so that the mask unit sheet portion 220 is firmly attached to the edge frame portion 210. Welding W should be performed as close as possible to the corner side of the frame portion 210 in order to minimize the warping space between the edge frame portion 210 and the mask unit sheet portion 220 and improve the adhesion. The welded W part may be formed in a line or spot shape, have the same material as the mask unit sheet portion 220, and may become an integral unit that connects the edge frame portion 210 and the mask unit sheet portion 220 medium.

7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention. The embodiment of FIG. 6 first manufactures the mask unit sheet portion 220 having the mask unit area CR and then attaches it to the edge frame portion 210, while the embodiment of FIG. 7 attaches the planar sheet to the edge frame portion 210 and then The mask unit area CR portion is formed.

First, as in (a) of FIG. 6, the edge frame portion 210 including the hollow region R is provided.

Then, referring to (a) of FIG. 7, a planar sheet (planar mask unit sheet portion 220 ′) may correspond to the edge frame portion 210. The mask unit sheet portion 220' is a planar state where the mask unit region CR has not yet been formed. In the corresponding process, all the side portions of the mask unit sheet portion 220' of F1 to F4 may be stretched to correspond to the edge frame section 210 in a state where the mask unit sheet portion 220' is flatly extended. On one side, the unit sheet portion 220' can be sandwiched and stretched at a plurality of points (1 to 3 points as an example in (a) of FIG. 7 ). On the other hand, the unit sheet portion 220' may be stretched by extending F1 and F2 along a part of the side direction instead of all sides.

Then, when the mask unit sheet portion 220' corresponds to the edge frame portion 210, the edge portion of the mask unit sheet portion 220' can be attached by welding W. Preferably, all sides are welded so that the mask unit sheet portion 220' is firmly attached to the edge frame portion 220. Welding W should be performed as close as possible to the corner side of the edge frame portion 210 to minimize the warping space between the edge frame portion 210 and the mask unit sheet portion 220', and to improve adhesion. The welded W part may be formed in a line or spot shape, and has the same material as the mask unit sheet portion 220', and may be formed by connecting the edge frame portion 210 and the mask unit sheet portion 220' together Medium.

Then, referring to (b) of FIG. 7, a mask unit region CR is formed on a planar sheet (planar mask unit sheet portion 220'). The sheet of the mask unit region CR is removed by laser scribing, etching, etc., so that the mask unit region CR can be formed. In this specification, a 6×5 mask cell region CR (CR11 to CR56) will be described as an example. When the mask unit region CR is formed, the mask unit sheet portion 220 may be constituted, wherein the portion welded W to the edge frame portion 210 becomes the edge sheet portion 221, and includes five first grid sheet portions 223 and Four second grid sheet sections 225.

8 is a schematic diagram showing a conventional mask for forming a high-resolution OLED.

In order to realize a high-resolution OLED, the size of the pattern gradually becomes smaller, and thus the thickness of the mask metal film used needs to be thinner. As shown in (a) of FIG. 8, if high-resolution OLED pixels 6 are to be realized, the pixel pitch and pixel size (PD->PD') are reduced on the mask 10'. Moreover, in order to prevent uneven deposition of the OLED pixels 6 due to the shadow effect, it is necessary to form the pattern 14 of the mask 10' obliquely. However, with a thickness T1 of about 30 to 50 μm, in the process of obliquely forming the pattern 14 on the thicker mask 10 ′, it is difficult to perform patterning 13 that matches the fine pixel pitch PD′ and the pixel size, so it will be processed The reason for the poor yield in the process. In other words, in order to form the pattern 14 obliquely while having a fine pixel pitch PD', it is necessary to use a mask 10' with a thin thickness.

In particular, in order to achieve high resolution at the UHD level, as shown in (b) of FIG. 8, only a thin mask 10' with a thickness T2 of about 20 μm or less can be patterned finely. Furthermore, in order to achieve ultra-high resolution of UHD or higher, it may be considered to use a thin mask 10' having a thickness T2 of about 10 m.

9 is a schematic diagram showing a mask 100 according to an embodiment of the present invention.

The mask 100 may include a mask unit C formed with a plurality of mask patterns P and a dummy portion DM around the mask unit C. As described above, the mask 100 may be manufactured using a metal sheet generated based on the rolling process, and one unit C may be formed on the mask 100. The dummy portion DM corresponds to a portion of the mask film 110 [mask metal film 110] other than the cell C, and may include only the mask film 110 or may include a mask formed with a predetermined dummy portion pattern similar in shape to the mask pattern P盖膜110。 The cover film 110. The dummy portion DM corresponds to the edge of the mask 100, so a part or all of the dummy portion DM can be attached to the frame 200 [mask unit sheet portion 220].

The width of the mask pattern P may be less than 40 μm, and the thickness of the mask 100 may be about 5-20 μm. Since the frame 200 includes a plurality of mask unit regions CR (CR11 to CR56), it may also have a plurality of masks 100 having mask units corresponding to the respective mask unit regions CR (CR11 to CR56). C (C11~56).

Since the one surface 101 of the mask 100 is a surface that comes into contact with and adheres to the frame 200, it is preferably flat. The one side 101 can be mirror-finished while being flattened by a flattening process described later. The other side 102 of the mask 100 may be opposite to the side of the template 50 described later.

10 to 11 are schematic diagrams showing a process of bonding the mask metal film 110 to the template 50 and forming the mask 100 to manufacture a mask support template according to an embodiment of the present invention.

Referring to (a) of FIG. 10, a template 50 (template) may be provided. The template 50 is a medium that moves with the mask 100 attached and supported on one side of the template 50. One side of the template 50 is preferably flat to support and move the flat mask 100. The center portion 50a corresponds to the mask unit C that masks the metal film 110, and the edge portion 50b may correspond to the dummy portion DM of the mask metal film 110. The template 50 may have a large flat plate size larger than the mask metal film 110 so that the mask metal film 110 is supported as a whole.

The template 50 is preferably made of a transparent material, so that the process of aligning and attaching the mask 100 and the frame 200 is convenient for viewing vision and the like. Furthermore, if it is a transparent material, the laser can also penetrate. As a transparent material, materials such as glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), and borosilicate glass can be used. As an example, for the template 50, BOROFLOAT ^® 33 material having excellent heat resistance, chemical durability, mechanical strength, transparency, etc. in borosilicate glass can be used. Moreover, the thermal expansion coefficient of BOROFLOAT ^® 33 is about 3.3, which is small in difference from the thermal expansion coefficient of the Hengfan steel mask metal film 110, thereby having the advantage of facilitating control of the mask metal film 110.

In addition, the side of the template 50 that is in contact with the mask metal film 110 may be a mirror surface so that no air gap is generated between the interface with the mask metal film 110 [or the mask 100]. Based on this, the surface roughness Ra of one side of the template 50 may be 100 nm or less. In order to realize the template 50 having a surface roughness Ra of 100 nm or less, a wafer may be used for the template 50. The surface roughness Ra of the wafer is about 10 nm, and there are many products on the market. The surface treatment process is already known, so it can be used as the template 50. The surface roughness Ra of the template 50 is on the order of nm, so there is no gap AG or almost no gap AG, and it is easy to generate a welding bead WB based on laser welding, so there is no influence on the alignment error of the mask pattern P.

The template 50 may be formed with a laser penetrating hole 51 so that the laser L irradiated from the upper portion of the template 50 reaches the welding portion (the area where welding is performed) of the mask 100. The laser penetrating holes 51 can be formed on the template 50 according to the positions and the number of welded portions. A plurality of welded portions may be arranged on the edge of the mask 100 or a portion of the dummy portion DM at a predetermined interval. Therefore, a plurality of laser through holes 51 may be formed at a predetermined interval corresponding thereto. As an example, the welded portions are arranged at predetermined intervals on the virtual portions DM on both sides (left/right) of the mask 100, so the laser through holes 51 may also be defined on both sides (left/right) of the template 50 Multiple intervals are formed.

The laser through holes 51 do not necessarily correspond to the position and number of welded parts. For example, only a part of the laser through hole 51 may be irradiated with laser L to perform welding. In addition, some of the laser through holes 51 that do not correspond to the welded portion may be used instead of the alignment marks when the mask 100 and the template 50 are aligned. If the material of the template 50 is transparent to the laser L light, the laser through hole 51 may not be formed.

A temporary bonding portion 55 may be formed on one surface of the template 50. The temporary bonding portion 55 is used to temporarily bond the mask 100 [or the mask metal film 110'] to one side of the template 50 to support the template 50 before attaching the mask 100 to the frame 200.

The temporary adhesive part 55 may use an adhesive or an adhesive sheet that can be separated by heating, and an adhesive or an adhesive sheet that can be separated by UV irradiation.

As an example, liquid wax can be used for the temporary bonding portion 55. As the liquid wax, the same wax as that used in the semiconductor wafer polishing step and the like can be used, and the type is not particularly limited. The liquid wax mainly contains acrylic acid, vinyl acetate, nylon, various polymers, and other substances and solvents as resin components for controlling adhesion, impact resistance, etc. related to the holding force. As an example, the temporary bonding portion 55 may use acrylonitrile butadiene rubber (ABR) as the resin component and SKYLIQUID ABR-4016 containing n-propanol as the solvent component. The liquid wax can be formed on the temporary bonding portion 55 using spin coating.

The temporary bonding portion 55 as a liquid wax has a lower viscosity at a temperature higher than 85°C to 100°C, and a higher viscosity at a temperature lower than 85°C, a part of it becomes hard like a solid, and can make the mask The cover metal film 110' is fixed and adhered to the template 50.

Then, referring to (b) of FIG. 10, the mask metal film 110' may be adhered to the template 50. After heating the liquid wax above 85°C and bringing the mask metal film 110' into contact with the template 50, the mask metal film 110' and the template 50 are passed between rollers and bonded.

According to an embodiment, the template 50 is baked at a temperature of about 120° C. for 60 seconds to vaporize the solvent of the temporary bonding portion 55 and directly perform the lamination process of the mask metal film. Lamination can be performed by loading the mask metal film 110' on the template 50 with the temporary bonding portion 55 formed on one side and passing it between an upper roll of about 100°C and a lower roll of about 0°C. As a result, the mask metal film 110' can be brought into contact by interposing the temporary bonding portion 55 on the template 50.

As yet another example, the temporary bonding portion 55 may use thermal release tape. The thermal separation tape is a base film with a PET film or the like arranged in the middle, a thermally separable adhesive layer (thermal release adhesive) is arranged on both sides of the base film, and a separation film/release film can be arranged on the outer surface of the adhesive layer. Among them, the separation temperatures of the adhesive layers arranged on both sides of the base film may be different from each other.

According to an embodiment, in a state where the separation film/release film is removed, the lower surface of the thermal separation tape [the lower second adhesive layer of the base film] is adhered to the template 50, and the upper surface of the thermal separation tape [the upper part of the base film The first adhesive layer] can be adhered to the mask metal film 110'. The separation temperature of the first adhesive layer and the second adhesive layer are different from each other. Therefore, in FIG. 16 described later, when the template 50 is separated from the mask 100, as the first adhesive layer is heated, the mask 100 can be removed from the template 50 and the temporary bonding part 55 are separated.

Next, referring further to FIG. 10(b), one side of the mask metal film 110' can be flattened PS. Here, the flattening PS means mirroring one side (upper surface) of the mask metal film 110' and removing a part of the upper part of the mask metal film 110' to make the thickness thin. As shown in (b) of FIG. 8, in order to achieve high resolution at the UHD level, only a thin mask metal film 110 with a thickness of about 20 μm or less can be used for fine patterning, and in order to achieve UHD For the above ultra-high resolution, it may be considered to use a thin mask metal film 110 having a thickness of about 10 μm. However, the mask metal film 110' generated by the rolling process has a thickness of about 25 to 500 m, so it is necessary to make the thickness thinner. In addition, even if a mask metal film 110' produced by an electroforming process that is thinner than the thickness of the rolling process is used, the crystal structure/fine structure is etched differently according to the composition of the surface layer of the plated mask metal film 110' The characteristics will be different, so it is necessary to control the surface characteristics and thickness by flattening the PS.

Specifically, the back surface 101 opposite to the surface 102 of the mask metal film 110' bonded on the template 50 may be flattened PS to reduce the thickness of the mask metal film 110'. The flattening PS can be performed by a CMP (Chemical Mechanical Polishing) method, and any known CMP method can be used without particular limitation. Moreover, the thickness of the mask metal film 110' can be reduced by chemical wet etching or dry etching methods.

In the process of performing the planarization PS, as a row, during the CMP process, the surface roughness Ra of the upper surface of the mask metal film 110' can be controlled. Preferably, the mirror surface can be further reduced in surface roughness. Or, as another example, after the PS is planarized by a chemical wet etching or dry etching process, a polishing process such as a separate CMP process may be additionally performed to reduce the surface roughness Ra.

Other than that, as long as it is a flattening process capable of making the thickness of the mask metal film 110' thin, it can be used without particular limitation. Thereby, as shown in FIG. 10(c), as the thickness of the mask metal film 110' decreases (110'->110), the thickness of the mask metal film 110 becomes about 5 to 20 m.

Then, referring to (d) of FIG. 11, a patterned insulating portion 25 may be formed on the mask metal film 110. The insulating portion 25 can be formed of a photoresist material using a printing method or the like.

Next, the mask metal film 110 may be etched. Methods such as dry etching and wet etching may be used, and there is no particular limitation on it. After etching, the portion of the mask metal film 110 exposed on the empty space 26 between the insulating portions 25 will be etched. The etched portion of the mask metal film 110 constitutes the mask pattern P, whereby the mask 100 formed with a plurality of mask patterns P can be manufactured.

Then, referring to (e) of FIG. 11, by removing the insulating portion 25, the manufacture of the template 50 supporting the mask 100 can be completed.

FIG. 12 is a schematic diagram showing a mask metal film 110" according to another embodiment of the present invention.

In order to fabricate the mask 100 shown in FIG. 9, a process of forming the mask pattern P on the mask metal film 110" needs to be performed. The mask pattern P can be formed by etching or the like. However, in order to realize UHD or more For a high-resolution OLED, the width of the mask pattern P should be less than 40 μm. Therefore, the shape and direction of the grains in the mask metal film 110” need to be considered when etching. Since the etching rate differs according to the directionality of the crystal grains, if the uneven crystal grains are etched, the mask pattern P with a desired width may not be generated even with an error of several μm Will be successful in achieving resolution or not.

In general, for a metal film formed by rolling, the surface, that is, the morphology and direction of crystal grains on the upper surface and the lower surface are different from the central portion of the metal film. Referring to FIG. 12, a portion 117" [upper portion 117"] separated by a predetermined thickness from an upper surface 111" of the mask metal film 110" is separated from a portion 119" [lower portion 119"] separated by a predetermined thickness from a lower surface 112" There is a difference in the grain characteristics of the portion corresponding to the central portion 115" other than the upper layer portion 117" and the lower layer portion 119". The upper layer portion 117" and the lower layer portion 119" are elongated in the rolling direction by rolling, and have an irregular shape. The crystal grains on the central portion 115" are substantially non-directional and have a spherical shape.

Therefore, another embodiment of the present invention is characterized in that, in order to prevent etching errors caused by different morphologies of the crystal grains, a mask 115 is used to manufacture the mask except for the upper portion 117" and the lower portion 119" of the mask metal film 110" Hood 100. A flattening PS1, PS2 process or thickness reduction process is performed on the upper part 117" and the lower part 119", whereby the mask metal film 110 including the central part 115" can be manufactured. Since only the regular and uniform central part 115" of the crystal grain is etched Since the mask pattern P is formed, there is an advantage that the width of the mask pattern P can be finely controlled.

FIG. 13 is a schematic diagram of the manufacturing process of the mask metal film 110 according to another embodiment of the present invention.

Referring to FIG. 13( a ), the lower surface 112 ″[second surface] of the mask metal film 110 ″ manufactured by the rolling process can be adhered to the support substrate 40 using the adhesive portion 41. The bonding part 41 has the same material as the temporary bonding part 55 or has a predetermined bonding force, and any material that can be subsequently separated can be used.

After the mask metal film 110" is adhered to the support substrate 40, the upper surface 111" [first surface] can be planarized PS1. In this case, flattening PS1 and PS2 means that one side of the mask metal film 110' is mirror-finished and a part of the mask metal film 110' is removed to reduce the thickness. The flattening of PS1 and PS2 can be performed by methods such as chemical wet etching or dry etching.

Based on the thickness of the mask metal film 110", when the upper surface is 0% and the lower surface is 100%, the central portion 115" can use at least a part of the thickness portion of 10% to 90%. If the planarization PS1 and PS2 are performed in almost the same thickness range, the thickness reduction from the upper surface 111" through the planarization PS1 process can be performed in the range of about 5% to 45% of the thickness of the entire mask metal film 110". However, it is not necessarily limited to this. If the thickness of the mask metal film 110" is used as a reference, at least a part of the thickness portion of 10% to 90% is used for the central portion 115", the thickness reduction in each of the flattening PS1 and PS2 processes The degree can be changed.

After performing the planarization PS1 process, the upper layer portion 117" may be removed from the mask metal film 110".

Then, referring to FIG. 13( b ), another supporting substrate 45 is prepared, and the upper surface 111 ″ [first surface] of the mask metal film 110 ′ can be bonded to the supporting substrate 45 using the adhesive portion 46. The supporting substrate 45 and bonding The portion 46 may be the same as the support substrate 40 and the bonding portion 41.

Then, referring to (c) of FIG. 13, after the mask metal film 110' is adhered to the support substrate 40, the support substrate 40 may be separated. Next, the second surface 112" may be planarized PS2. After the planarized PS2 process is performed, the lower layer portion 119" is removed from the mask metal film 110".

In (b) and (c) of FIG. 13, the support substrate 45 may correspond to the template 50 described above, and the bonding portion 45 may correspond to the temporary bonding portion 55 described above. In this case, as in step (b) of FIG. 10, step (b) of FIG. 13 can be replaced by the step of bonding the mask metal film 110" to the template 50 on which the temporary bonding portion 55 is formed. The flattened PS2 of step (c) can be replaced by the flattened PS of step (b) of FIG. 10.

Then, referring to FIG. 13( d ), when the planarization PS2 is completed, the manufacture of the mask metal film 110 can be completed. The mask metal film 110 includes a central portion 115", and the thickness of the mask metal film 110 is about 5 μm to 20 μm.

In addition, although it is assumed in FIG. 12 and FIG. 13 that the mask metal film 110 is manufactured by a rolling process, even if it is a mask metal film manufactured by other processes such as electroforming, the characteristics of the crystal grains on the surface portion and the center portion There are differences, so the flattening PS1 and PS2 processes shown in FIG. 13 can be applied.

14 is a schematic diagram showing a process of loading a mask support template on a frame according to an embodiment of the present invention.

Referring to FIG. 14, the template 50 can be transferred by the vacuum chuck 90. The surface opposite to the surface of the template 50 to which the mask 100 is bonded is sucked by the vacuum chuck 90 and transferred. The vacuum chuck 90 may be connected to moving means (not shown) that moves to the x, y, z, and θ axes. In addition, the vacuum chuck 90 can attract the template 50 and be connected to flip means (not shown) capable of flipping. As shown in FIG. 14( b ), the vacuum chuck 90 does not affect the adhesion state and the alignment state of the mask 100 even when the template 50 is sucked and turned over and transferred to the frame 200.

15 is a schematic diagram showing a state in which a template is mounted on a frame so that a mask corresponds to a unit area of the frame according to an embodiment of the present invention. FIG. 15 shows an example in which one mask 100 is associated with/attached to the unit region CR, but it is also possible to perform a process of attaching a plurality of masks 100 to all unit regions CR at the same time to attach the mask 100 to the frame 200 . At this time, there may be a plurality of templates 50 for supporting the plurality of masks 100, respectively.

Then, referring to FIG. 15, the mask 100 may correspond to one mask cell region CR of the frame 200. Correspondence between the mask 100 and the mask unit area CR can be achieved by loading the template 50 on the frame 200 [or the mask unit sheet portion 220]. While controlling the position of the template 50/vacuum chuck 90, observe with a microscope whether the mask 100 corresponds to the mask unit area CR. Since the template 50 presses the mask 100, the mask 100 and the frame 200 can tightly abut.

On the other hand, the lower support 70 may also be arranged below the frame 200. The lower support 70 has a size that can enter the inside of the hollow region R of the frame edge portion 210 and has a flat shape. Furthermore, a predetermined support groove (not shown) corresponding to the shape of the mask unit sheet portion 220 may be formed on the upper surface of the lower support 70. At this time, the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225 are inserted into the support grooves, so that the mask unit sheet portion 220 is better fixed.

The lower support 70 may press the opposite surface of the mask unit region CR that is in contact with the mask 100. That is, the lower support body 70 supports the mask unit sheet portion 220 in the upper direction, thereby preventing the mask unit sheet portion 220 from sagging downward when the mask 100 is attached. At the same time, the lower support 70 and the template 50 press the edge portion of the mask 100 and the frame 200 [or the mask unit sheet portion 220] in opposite directions, so that the alignment state of the mask 100 is not destroyed and Keep it aligned.

In this way, only by attaching the mask 100 to the template 50 and loading the template 50 on the frame 200, the process of matching the mask 100 to the mask unit region CR of the frame 200 can be completed. This process does not apply anything to the mask 100. Stretching force.

Next, the mask 100 is irradiated with laser light L, so that the mask 100 is attached to the frame 200 by laser welding. The welding part of the mask to be laser welded generates a welding bead WB. The welding bead WB may have the same material as the mask 100/frame 200 and be integrally connected with the mask 100/frame 200. At this time, since the welding part [or part of the dummy part DM] of the mask 100 irradiated with the laser L is formed thicker than the mask unit C, a sufficient amount of welding part is melted to form a welding bead WB, so that it is possible to make Welding is carried out stably.

16 is a schematic diagram illustrating a process of separating the mask 100 and the template 50 after attaching the mask 100 to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 16, after attaching the mask 100 to the frame 200, the mask 100 and the template 50 may be debonded. The separation between the mask 100 and the template 50 can be achieved by at least one of heating the ET, the chemical treatment CM, applying ultrasonic waves US, and applying UV to the temporary bonding portion 55. Since the mask 100 remains attached to the frame 200, only the template 50 can be lifted. As an example, if a thermal ET higher than 85° C. to 100° C. is applied, the viscosity of the temporary bonding portion 55 decreases, and the adhesion force between the mask 100 and the template 50 is weak, so the mask 100 and the template 50 can be separated. As another example, the temporary bonding part 55 is immersed in a chemical substance such as IPA, acetone, ethanol, etc., and the mask 100 and the template 50 are separated by dissolving and removing the temporary bonding part 55 and the like. As yet another example, if ultrasonic waves US or UV are applied, the adhesion between the mask 100 and the template 50 becomes weak, so the mask 100 and the template 50 can be separated.

FIG. 17 is a schematic diagram showing a state where the mask 100 is attached to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 17, one mask 100 may be attached to one unit area CR of the frame 200.

Since the mask unit sheet portion 220 of the frame 200 has a thin thickness, when a tensile force is applied to the mask 100, when the mask unit sheet portion 220 is attached to the mask unit 220, the remaining tensile force in the mask 100 acts The mask unit sheet portion 220 and the mask unit region CR may be deformed. Therefore, the mask 100 should be attached to the mask unit sheet portion 220 in a state where no stretching force is applied to the mask 100. The present invention can complete the process of matching the mask 100 to the mask unit area CR of the frame 200 by attaching the mask 100 to the template 50 and loading the template 50 on the frame 200. This process does not apply anything to the mask 100. Stretching force. Thus, it is possible to prevent the frame 200 (or the mask unit sheet portion 220) from being deformed due to the tensile force applied to the mask 100 acting as a tension on the frame 200 in reverse.

The existing mask 10 of FIG. 1 includes six cells C1 to C6, and thus has a long length, and the mask 100 of the present invention includes one cell C, and thus has a short length, so PPA (pixel position accuracy) is distorted The degree will become smaller. Assuming that the length of the mask 10 including a plurality of cells C1 to C6, is 1 m, and a PPA error of 10 μm occurs in the total length of 1 m, the mask 100 of the present invention can be reduced with the relative length (equivalent to a cell The number of C decreases) and the above error range is 1/n. For example, the mask 100 of the present invention has a length of 100 mm, and has a length reduced from 1 m of the existing mask 10 to 1/10. Therefore, a PPA error of 1 μm occurs in the total length of 100 mm, and the alignment error is significantly reduced.

On the other hand, the mask 100 includes a plurality of cells C, and even if each cell C corresponds to each cell region CR of the frame 200, the alignment error is still within a minimum range, the mask 100 may also be The mask unit area CR corresponds. Alternatively, the mask 100 having a plurality of cells C may correspond to one mask cell region CR. In this case, considering the process time and productivity based on the alignment, the mask 100 is preferably provided with as few cells C as possible.

As far as the present invention is concerned, it is only necessary to match one unit C of the mask 100 and confirm the alignment state, so compared with the existing method that matches multiple units C (C1 to C6) at the same time and needs to confirm all alignment states , Can significantly reduce manufacturing time.

That is, the manufacturing method of the frame-integrated mask of the present invention consists of six processes of associating six cells C11 to C16 included in the mask 100 with one cell region CR11 to CR16 and confirming each alignment state, and Compared with existing methods that simultaneously match 6 cells C1~C6 and need to confirm the alignment state of 6 cells C1~C6 at the same time, the time can be significantly shortened.

In addition, in the manufacturing method of the frame-integrated mask of the present invention, the product yield in the process of aligning 30 masks 100 with 30 unit regions CR (CR11 to CR56) respectively and 30 times can be It is significantly higher than the yield of the existing product in the process of five times in which five masks 10 (refer to (a) of FIG. 2) including six cells C1 to C6 are respectively aligned and aligned with the frame 20. The existing method of aligning the six cells C1 to C6 on the area corresponding to the six cells C at a time is obviously cumbersome and difficult, and the product yield is low.

In addition, in the step (b) of FIG. 10, as described above, when the mask metal film 110 is bonded to the template 50 by a lamination process, a temperature of about 100° C. is applied to the mask metal film 110. Based on this, the mask metal film 110 is adhered to the template 50 with a partial tensile force applied. After that, the mask 100 is attached to the frame 200. If the mask 100 is separated from the template 50, the mask 100 will shrink by a predetermined degree.

When each mask 100 is attached to the corresponding mask unit region CR, and the template 50 is separated from the mask 100, the plurality of masks 100 apply a contractive tension in the opposite direction, so the force is offset, Therefore, the mask unit sheet portion 220 is not deformed. For example, on the first grid sheet portion 223 between the mask 100 attached to the CR11 cell area and the mask 100 attached to the CR12 cell area, the first grid sheet portion 223 acts on the right side of the mask 100 attached to the CR11 cell area The tension and the tension acting in the left direction of the mask 100 attached to the CR12 unit area can cancel each other. As a result, the deformation of the frame 200 [or the mask unit sheet portion 220] based on the tension is minimized, so that the alignment error of the mask 100 [or the mask pattern P] can be minimized.

18 is a schematic diagram showing an OLED pixel deposition apparatus 1000 using frame-integrated masks 100 and 200 according to an embodiment of the present invention.

Referring to FIG. 18, the OLED pixel deposition apparatus 1000 includes: a magnetic plate 300 in which a magnet 310 is accommodated and cooling water pipes 350 are arranged; and a deposition source supply part 500 that supplies an organic matter source 600 from the lower part of the magnetic plate 300.

A target substrate 900 such as glass for depositing the organic matter source 600 may be interposed between the magnetic plate 300 and the deposition source supply part 500. The target substrate 900 may be provided with frame-integrated masks 100, 200 [or FMM] for depositing the organic matter source 600 in different pixels in a close or very close manner. The magnet 310 can generate a magnetic field and adhere to the target substrate 900 by the magnetic field.

The deposition source supplying unit 500 can feed the organic matter source 600 to and from the left and right paths, and the organic source 600 supplied by the deposition source supplying unit 500 can be deposited on one side of the target substrate 900 by the pattern P formed in the frame-integrated masks 100 and 200. The organic matter source 600 deposited after the pattern P of the frame-integrated masks 100 and 200 can be used as the pixel 700 of the OLED.

In order to prevent uneven deposition of the pixels 700 due to the shadow effect, the pattern of the frame-integrated masks 100, 200 may be formed obliquely [or formed in a tapered S]. Along the inclined surface, the organic matter source 600 passing through the pattern in the diagonal direction can also contribute to the formation of the pixel 700, and therefore, the pixel 700 can be deposited with a uniform thickness as a whole.

As described above, the present invention lists preferred embodiments for illustration and description, but the present invention is not limited to the above-mentioned embodiments, and persons with ordinary knowledge in the technical field can make various modifications and changes within the scope not departing from the spirit of the present invention. change. Such modifications and changes fall within the scope of the present invention and the attached patent application.

10, 10’: mask 11: Mask film 13: Patterning 14: Form a pattern 20: Frame 25: Insulation 26: empty position 40, 45: support substrate 41, 46: Adhesive part 50: template 50a, 50b: the center and edge of the template 51: Laser penetrating hole 55: Temporary bonding section 70: lower support 90: Vacuum suction cup 100: mask 101, 102: one side and the other side of the mask 110, 110’, 110”: mask film, mask metal film 111”: mask the first side of the metal film 112”: mask the second side of the metal film 115”: mask the central part of the metal film 117”: Mask the upper layer of the metal film 119”: mask the lower part of the metal film 200: frame 210: edge frame part 220, 220’: sheet section of the mask unit 221: Edge sheet section 223: First grid sheet section 225: Second grid sheet section 300: magnetic board 310: magnet 350: cooling water pipe 500: deposition source supply department 600: Organic source 700: pixels 900: target substrate 1000: OLED pixel deposition device C: Unit, mask unit C1~C6, CR11~CR16: unit CM: Chemical treatment CR, CR11~CR56: mask unit area D1~D1”, D2~D2”: distance DM: Dummy Department, Mask Dummy Department ET: heat is applied F1~F2: tensile force L: Laser P: Mask pattern PD’: pixel pitch PS, PS1, PS2: flattening process R: Hollow area of the edge frame part T1, T2: thickness US: applying ultrasound UV: Apply UV W: welding WB: welding beads

FIG. 1 is a schematic diagram showing a conventional mask for OLED pixel deposition.

FIG. 2 is a schematic diagram showing a conventional process of attaching a mask to a frame.

FIG. 3 is a schematic diagram showing that an alignment error between cells occurs during a conventional stretching mask.

4 is a front view and a side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention.

5 is a front view and a side sectional view showing a frame according to an embodiment of the present invention.

6 is a schematic diagram showing a frame manufacturing process according to an embodiment of the present invention.

7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention.

8 is a schematic diagram showing a conventional mask for forming a high-resolution OLED.

9 is a schematic diagram showing a mask according to an embodiment of the present invention.

10 to 11 are schematic diagrams showing a process of manufacturing a mask support template by bonding a mask metal film on a template and forming a mask according to an embodiment of the present invention.

12 is a schematic diagram showing a mask metal film according to another embodiment of the present invention.

13 is a schematic diagram showing a manufacturing process of a mask metal film according to another embodiment of the present invention.

14 is a schematic diagram showing a process of loading a mask support template on a frame according to an embodiment of the present invention.

15 is a schematic diagram showing a state in which the mask corresponds to the unit area of the frame after the template is mounted on the frame according to an embodiment of the present invention.

16 is a schematic diagram showing a process of separating the mask from the template after attaching the mask to the frame according to an embodiment of the present invention.

17 is a schematic diagram showing a state where a mask is attached to a frame according to an embodiment of the present invention.

18 is a schematic view showing an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.

50: template

50a, 50b: the center and edge of the template

51: Laser penetrating hole

55: Temporary bonding section

110, 110’: mask film, mask metal film

PS: Flattening process

Claims (17)

A method for manufacturing a mask support template, the template is used to support a mask for forming an OLED pixel and make the mask correspond to a frame, wherein the method includes: (A) Prepare to mask the metal film; (B) The mask metal film is bonded to the template with a temporary bonding part formed on one side; Reduce the thickness of the mask metal film bonded on the template; and (D) A mask pattern is formed on the mask metal film to manufacture a mask. A method for manufacturing a mask support template, the template is used to support a mask for forming an OLED pixel and make the mask correspond to a frame, wherein the method includes: (A) Prepare to mask the metal film; (B) Reduce the thickness of at least a part of the first surface of the mask metal film and the second surface opposite to the first surface; (C) The mask metal film is bonded to the template with a temporary bonding part formed on one side; and (D) A mask pattern is formed on the mask metal film to manufacture a mask. The method for manufacturing a mask support template according to claim 1, wherein in step (a), a mask metal film is prepared, and at least a part of the thickness is reduced from the first surface of the mask metal film, In step (b), the first side of the mask metal film is adhered to the template, In step (c), at least a part of the thickness is reduced from the second surface opposite to the first surface of the mask metal film. The method for manufacturing a mask support template according to claim 1, wherein the temporary bonding part is based on heating a separable adhesive or adhesive sheet, and is based on UV irradiation to separate the adhesive or adhesive sheet. The method for manufacturing a mask support template according to claim 1, wherein the thickness of the mask metal film is reduced by any one of CMP (Chemical Mechanical Polishing), chemical wet etching (chemical wet etching), and dry etching (dry etching) carried out. The method for manufacturing a mask support template according to claim 5, wherein when the thickness of the mask metal film is reduced using the CMP method, the surface roughness on one side of the mask metal film is reduced. The method for manufacturing a mask support template according to claim 5, wherein when chemical wet etching or dry etching is used to reduce the thickness of the mask metal film, further polishing is performed in a subsequent step to reduce the surface of the mask metal film Surface roughness. The method for manufacturing a mask support template according to claim 1, wherein the thickness of the mask metal film is reduced to 5 μm to 20 μm. The method for manufacturing a mask support template according to claim 1, wherein step (d) includes the following steps: (D1) Form a patterned insulating portion on the mask metal film; (D2) etching the mask metal film portion exposed between the insulating portions to form a mask pattern; and (D3) Remove the insulation. The method for manufacturing a mask support template according to claim 2 or 4, wherein the mask is equivalent to the mask when the first side is 0% and the second side is 100% based on the thickness of the mask metal film At least a part of 10% to 90% of the thickness of the cover metal film. A mask support template for supporting a mask for forming OLED pixels and making the mask correspond to a frame, the mask support template includes: A template A temporary adhesive part formed on the template; and A mask, which is bonded to the template by interposing a temporary adhesive part, and a mask pattern is formed, The thickness of the mask is 5 μm to 20 μm. The mask support template according to claim 11, wherein the mask includes a central portion formed by reducing at least a part of the thickness from the upper surface and the lower surface of the mask metal film manufactured by the rolling process. The mask support template according to claim 11, wherein the thickness of the mask metal film is used as a reference, when the upper surface is 0% and the lower surface is 100%, the mask is equivalent to 10% of the thickness of the mask metal film To at least a part of 90%. The mask support template according to claim 11, wherein the temporary bonding part is based on heating a separable adhesive or adhesive sheet, and is based on UV irradiation to separate the adhesive or adhesive sheet. The mask support template according to claim 11, wherein a laser through hole is formed in an edge portion of the template corresponding to the welding portion of the mask. The mask support template according to claim 11, wherein the template includes wafer, glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), boron Any material in borosilicate glass. A method for manufacturing a frame-integrated mask, the frame-integrated mask is formed by at least one mask and a frame for supporting the mask as a whole, wherein the method includes the following steps: (A) On a frame having at least one mask unit area, load a template manufactured by the manufacturing method described in claim 1 or 2, and make the mask correspond to the mask unit area of the frame; and (B) Attach the mask to the frame.

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