KR20200040471A - Producing method of mask and producing method of mask integrated frame - Google Patents

Abstract

The present invention relates to a method for manufacturing a mask and a method for manufacturing a mask integrated with a frame. According to the present invention, the method of manufacturing the mask comprises the steps of: (a) providing a plated film (110) having a first insulating portion (23) formed on one surface thereof; (b) contacting the other surface facing the one surface of the first insulating portion (23) in contact with the plated film (110) to the upper surface of a template (50); (c) forming a patterned second insulating portion (25) on the other surface of the plated film (110); and (d) etching (WE) the plated film (110) through the space (26) between the patterns of the second insulating portion (25).

Description

Method for manufacturing a mask and method for manufacturing a frame-integrated mask {PRODUCING METHOD OF MASK AND PRODUCING METHOD OF MASK INTEGRATED FRAME}

The present invention relates to a method of manufacturing a mask and a method of manufacturing a frame-integrated mask. More specifically, the mask pattern can be formed only through one surface direction, and can be stably supported and moved without deformation of the mask, and when the mask is integrated with the frame, the alignment between each mask can be clarified. It relates to a method for manufacturing a mask and a method for manufacturing a frame-integrated mask.

Recently, studies on electroforming methods have been conducted in the manufacture of thin plates. The electroplating method is a method in which an anode and a cathode body are immersed in an electrolyte, and a metal thin plate is electrodeposited on the surface of the cathode body by applying a power source, and thus a mass production is expected.

On the other hand, as a technique for forming a pixel in the OLED manufacturing process, the FMM (Fine Metal Mask) method, which deposits an organic substance in a desired position by attaching a thin metal mask to a substrate, is mainly used.

In the conventional OLED manufacturing process, the mask is manufactured in a stick form, a plate form, etc., and then the mask is welded and fixed to the OLED pixel deposition frame. In one mask, a plurality of cells corresponding to one display may be provided. In addition, several masks can be fixed to the OLED pixel deposition frame for large-area OLED manufacturing. In the process of fixing to the frame, each mask is tensioned to be flat. Adjusting the tensile force so that the entire part of the mask is flat is a very difficult task. In particular, in order to align the mask patterns having a size of only a few to several tens of µm while all cells are flattened, a high-level operation to check the alignment state in real time while finely adjusting the tensile force applied to each side of the mask is required. do.

Nevertheless, in the process of fixing several masks to one frame, there was a problem in that alignment between the masks and between the mask cells did not work well. In addition, because the thickness of the mask film is too thin and large area in the process of welding and fixing the mask to the frame, the mask cell may be damaged or warped by a load, or wrinkles or burrs generated in the welding part in the welding process. There were problems such as misalignment.

In the case of ultra-high-definition OLED, the current QHD image quality is 500 ~ 600 pixel per inch (PPI), and the pixel size reaches about 30 ~ 50㎛, and 4K UHD, 8K UHD high image quality is higher than ~ 860 PPI, ~ 1600 PPI, etc. It has the resolution of. As described above, the alignment error between each cell should be reduced to a few μm in consideration of the pixel size of the ultra-high quality OLED, and an error out of this may lead to product failure, so the yield may be very low. Therefore, there is a need to develop a technique that prevents deformation such as a mask being crushed or distorted, a technique for making alignment clear, and a technique for fixing a mask to a frame.

Accordingly, the present invention has been made to solve the problems of the prior art as described above, and its object is to provide a method of manufacturing a mask capable of forming a clear pattern by forming a mask pattern only through one surface direction.

In addition, an object of the present invention is to provide a method for manufacturing a frame-integrated mask capable of stably supporting and moving a mask without deformation.

In addition, an object of the present invention is to provide a method of manufacturing a frame-integrated mask in which the mask and the frame can form an integrated structure.

In addition, an object of the present invention is to provide a method of manufacturing a frame-integrated mask capable of preventing deformation such as a mask being struck or twisted and making alignment clear.

In addition, it is an object of the present invention to provide a method for manufacturing a frame-integrated mask in which the production time is significantly reduced and the yield is significantly increased.

The above object of the present invention, (a) providing a plated film formed on one surface of the first insulating portion; (b) contacting the upper surface of the template with the other surface facing the one surface of the first insulating portion contacting the plating film; (c) forming a patterned second insulating portion on the other surface of the plated film; And (d) etching the plated film through the space between the patterns of the second insulating portion.

And, the above object of the present invention, (a) forming a plating film on the upper surface and at least the side surface of the conductive substrate; (b) forming a patterned first insulating portion on one surface of the plated film, and removing at least a portion of the rim of the plated film through a space between the patterns of the first insulating portion; (C) separating the conductive substrate and the plating film; (d) contacting the other surface opposite to one surface of the first insulating portion in contact with the plated film to the upper surface of the template; (e) forming a patterned second insulating portion on the other surface of the plated film; And (f) etching the plated film through the space between the patterns of the second insulating portion.

The conductive substrate may be a wafer.

Between steps (a) and (b), a process of heat-treating the plated film may be further performed.

A temporary adhesive portion is formed on the upper surface of the template, and the temporary adhesive portion and the first insulating portion may contact each other.

The temporary adhesive may be liquid wax.

The liquid wax can fix the plating film and the template at a temperature lower than 85 ° C.

In the step of contacting the upper surface of the template with the other surface opposite to one surface of the first insulating portion contacting the plated film, the liquid wax is heated to 85 ° C. or higher and the first insulating portion is brought into contact with the template, and the plated film and the template between the rollers The adhesion can be performed by passing through.

The template can be a transparent material.

The template may include any one of glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), and borosilicate glass.

And, the above object of the present invention is a method of manufacturing a frame-integrated mask in which at least one mask and a frame supporting a mask are integrally formed, comprising: (a) providing a plated film having a first insulating portion formed on one surface; (b) contacting the upper surface of the template with the other surface facing the one surface of the first insulating portion contacting the plating film; (c) forming a patterned second insulating portion on the other surface of the plated film; (d) etching the plated film through the space between the patterns of the second insulating portion; (e) providing a frame having at least one mask cell region; (f) loading a template on the frame to correspond the mask to the mask cell area of the frame; And (g) irradiating a laser to the welding portion of the mask to adhere the mask to the frame, which is achieved by a method of manufacturing a frame-integrated mask.

Step (e) includes: (e1) providing a border frame portion including a hollow region; (e2) connecting the planar mask cell sheet portion to the border frame portion; And (e3) forming a frame by forming a plurality of mask cell regions in the mask cell sheet portion.

Step (e) includes: (e1) providing a border frame portion including a hollow region; And (e2) manufacturing a frame by connecting a mask cell sheet portion having a plurality of mask cell regions to an edge frame portion.

The temporary adhesive may be liquid wax.

The liquid wax can fix the plating film and the template at a temperature lower than 85 ° C.

In step (b), after heating the liquid wax to 85 ° C. or higher and contacting the first insulating portion with the template, adhesion may be performed by passing the plated film and the template between rollers.

The template can be a transparent material.

The template may include any one of glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), and borosilicate glass.

A laser through hole may be formed in a portion of the template corresponding to the weld portion of the mask.

A welding bead is formed in a portion of the welded portion where the laser is irradiated, and the welding bead can be mediated so that the mask and the frame are integrally connected.

After the step (g), a step of separating the mask and the template may be further performed by performing at least one of heat application, chemical treatment, and ultrasonic application to the temporary adhesive portion.

The mask cell sheet portion includes a border sheet portion; And at least one first grid sheet portion extending in the first direction and having both ends connected to the edge sheet portion.

The mask cell sheet portion may further include at least one second grid sheet portion formed to extend in a second direction perpendicular to the first direction to intersect the first grid sheet portion, and both ends of which are connected to the edge sheet portion.

The mask and the frame may be made of any one of invar, super invar, nickel, and nickel-cobalt.

And, the above object of the present invention, (a) providing a rolled film formed on one surface of the first insulating portion; (b) contacting the other surface opposite to one surface of the first insulating portion contacting the rolled film to the upper surface of the template; (c) forming a patterned second insulating portion on the other surface of the rolled film; And (d) etching the pressed film through the space between the patterns of the second insulating portion.

And, the above object of the present invention is a method of manufacturing a frame-integrated mask in which at least one mask and a frame supporting a mask are integrally formed, comprising: (a) providing a rolled film having a first insulating portion formed on one surface; (b) contacting the other surface opposite to one surface of the first insulating portion contacting the rolled film to the upper surface of the template; (c) forming a patterned second insulating portion on the other surface of the rolled film; (d) etching the rolled film through the space between the patterns of the second insulating portion; (e) providing a frame having at least one mask cell region; (f) loading a template on the frame to correspond the mask to the mask cell area of the frame; And (g) irradiating a laser to the welding portion of the mask to adhere the mask to the frame, which is achieved by a method of manufacturing a frame-integrated mask.

According to the present invention configured as described above, there is an effect capable of forming a clear pattern by forming the mask pattern only through one surface direction.

In addition, according to the present invention, the mask can be stably supported and moved without deformation.

In addition, according to the present invention, there is an effect that the mask and the frame can achieve an integral structure.

In addition, according to the present invention, it is possible to prevent deformation such as a mask being struck or distorted and to make alignment clear.

In addition, according to the present invention, there is an effect that can significantly reduce the manufacturing time, and significantly increase the yield.

1 is a schematic view showing a conventional OLED pixel deposition mask.
2 is a schematic view showing a process of bonding a conventional mask to a frame.
3 is a schematic diagram showing that an alignment error occurs between cells in the process of stretching a conventional mask.
4 is a front view and a side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention.
5 is a front view and a side cross-sectional view showing a frame according to an embodiment of the present invention.
6 is a schematic diagram showing a manufacturing process of a frame according to an embodiment of the present invention.
7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention.
8 to 10 are schematic diagrams showing a manufacturing process of a mask according to an embodiment of the present invention.
11 is a schematic diagram showing a template for supporting a mask according to an embodiment of the present invention.
12 is a schematic diagram showing a state in which a template is loaded on a frame according to an embodiment of the present invention to associate a mask with a cell region of the frame.
13 is a schematic view showing a process of separating a mask and a template after adhering a mask according to an embodiment of the present invention to a frame.
14 is a schematic view showing a state in which a mask according to an embodiment of the present invention is attached to a frame.
15 is a schematic diagram showing an OLED pixel deposition apparatus using an integrated frame mask according to an embodiment of the present invention.

For a detailed description of the present invention, which will be described later, reference is made to the accompanying drawings that illustrate, by way of example, specific embodiments in which the present invention may be practiced. These examples are described in detail enough to enable those skilled in the art to practice the present invention. It should be understood that the various embodiments of the present invention are different, but need not be mutually exclusive. For example, certain shapes, structures, and properties described herein may be implemented in other embodiments without departing from the spirit and scope of the invention in relation to one embodiment. In addition, it should be understood that the location or placement of individual components within each disclosed embodiment can be changed without departing from the spirit and scope of the invention. Therefore, the following detailed description is not intended to be taken in a limiting sense, and the scope of the present invention, if appropriately described, is limited only by the appended claims, along with all ranges equivalent to those claimed. In the drawings, similar reference numerals refer to the same or similar functions across various aspects, and length, area, thickness, and the like may be exaggerated for convenience.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to enable those skilled in the art to easily implement the present invention.

1 is a schematic diagram showing a conventional OLED pixel deposition mask 10.

Referring to FIG. 1, the conventional mask 10 may be manufactured in a stick-type or plate-type. The mask 10 shown in (a) of FIG. 1 is a stick-shaped mask and can be used by welding and fixing both sides of the stick to an OLED pixel deposition frame. The mask 100 illustrated in FIG. 1B is a plate-type mask and may be used in a large area pixel formation process.

The body 10 of the mask 10 (or the mask film 11) is provided with a plurality of display cells C. One cell C corresponds to one display such as a smartphone. The pixel pattern P is formed in the cell C to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B appear. For example, the pixel pattern P is formed in the cell C to have a resolution of 70 X 140. That is, a number of pixel patterns P form a cluster to form one cell C, and a plurality of cells C may be formed on the mask 10.

2 is a schematic view showing a process of bonding the conventional mask 10 to the frame 20. 3 is a schematic diagram showing that alignment errors between cells occur in the process of tensioning (F1 to F2) of the conventional mask 10. The stick mask 10 having six cells C: C1 to C6 shown in FIG. 1A will be described as an example.

Referring to (a) of FIG. 2, first, the stick mask 10 must be flattened. The stick mask 10 is stretched as it is pulled by applying tensile force F1 to F2 in the long axis direction of the stick mask 10. In this state, the stick mask 10 is loaded on the frame 20 in the form of a square frame. The cells C1 to C6 of the stick mask 10 are positioned in an empty area inside the frame of the frame 20. The frame 20 may be sized such that cells C1 to C6 of one stick mask 10 are positioned in an empty area inside the frame, and cells C1 to C6 of the plurality of stick masks 10 are framed. It may be large enough to be located in the interior empty area.

Referring to (b) of FIG. 2, after aligning while finely adjusting the tensile forces F1 to F2 applied to each side of the stick mask 10, a part of the side of the stick mask 10 is welded (W) to Accordingly, the stick mask 10 and the frame 20 are interconnected. Fig. 2 (c) shows a cross-section of a stick mask 10 and a frame connected to each other.

Referring to Figure 3, despite the fine adjustment of the tensile force (F1 ~ F2) applied to each side of the stick mask 10, there is a problem that the alignment between the mask cells (C1 ~ C3) does not work well. For example, the distances D1 to D1 "and D2 to D2" between the patterns P of the cells C1 to C3 are different from each other, or the patterns P are skewed. The stick mask 10 is a large area including a plurality of (for example, six) cells C1 to C6 and has a very thin thickness of several tens of μm, so it is easily struck or distorted by a load. In addition, it is very difficult to check in real time the alignment between the cells (C1 to C6) while adjusting the tensile force (F1 to F2) so that all the cells (C1 to C6) are flat.

Therefore, the fine error of the tensile force (F1 ~ F2) may cause an error in the degree of stretching or unfolding each cell (C1 ~ C3) of the stick mask 10, accordingly, the distance (D1) between the mask pattern (P) ~ D1 ", D2 ~ D2") causes a problem that is different. Of course, it is difficult to perfectly align the error to 0, but in order to prevent the mask pattern P having a size of several to several tens of µm from adversely affecting the pixel process of the ultra-high-definition OLED, the alignment error does not exceed 3 µm. It is desirable not to. The alignment error between adjacent cells is referred to as pixel position accuracy (PPA).

In addition, while connecting the plurality of stick masks 10 of approximately 6 to 20 to one of the frame 20, between the plurality of stick masks 10 and the plurality of cells C of the stick mask 10 It is also very difficult to clarify the alignment between ~ C6), and it is a significant reason to reduce productivity because the process time due to the alignment is forced to increase.

On the other hand, after the stick mask 10 is connected and fixed to the frame 20, the tensile forces F1 to F2 applied to the stick mask 10 may act on the frame 20 in reverse. That is, after the stick mask 10, which has been stretched tightly by the tensile forces F1 to F2, is connected to the frame 20, tension may be applied to the frame 20. Usually this tension is not large, so it may not have a significant effect on the frame 20, but if the size of the frame 20 is small and the rigidity is low, this tension can deform the frame 20 finely. This may cause a problem that the alignment state is wrong between the plurality of cells C to C6.

Accordingly, the present invention proposes a frame 200 and a frame-integrated mask that enable the mask 100 to form an integral structure with the frame 200. The mask 100 integrally formed in the frame 200 is prevented from being deformed, such as being struck or twisted, and can be clearly aligned with the frame 200. When the mask 100 is connected to the frame 200, any tension is not applied to the mask 100, so that the tension of the frame 200 is not deformed after the mask 100 is connected to the frame 200. . In addition, the manufacturing time for integrally connecting the mask 100 to the frame 200 is significantly reduced, and the yield can be significantly increased.

Figure 4 is a front view showing a frame-integrated mask according to an embodiment of the present invention [Fig. 4 (a)] and side cross-sectional view [Fig. 4 (b)], Figure 5 according to an embodiment of the present invention It is a front view (FIG. 5 (a)) and a side cross-sectional view (FIG. 5 (b)) showing the frame.

4 and 5, the frame-integrated mask may include a plurality of masks 100 and one frame 200. In other words, the plurality of masks 100 are bonded to the frame 200 one by one. Hereinafter, for convenience of explanation, the mask 100 having a square shape will be described as an example, but the masks 100 may be in the form of a stick mask having protrusions clamped on both sides before being adhered to the frame 200, and the frame 200 ), The protrusions can be removed.

A plurality of mask patterns P may be formed in each mask 100, and one cell C may be formed in one mask 100. One mask cell C may correspond to one display such as a smartphone. The mask 100 may be formed by electroforming to form a thin thickness. The mask 100 may be made of an invar having a coefficient of thermal expansion of about 1.0 X 10 ^-6 / ° C, and a super invar of about 1.0 X 10 ^-7 / ° C. Since the mask 100 of this material has a very low coefficient of thermal expansion, it is less likely that the pattern shape of the mask is deformed by thermal energy, and thus can be used as a fine metal mask (FMM) or shadow mask in manufacturing a high-resolution OLED. In addition, considering that technologies for performing a pixel deposition process in a range in which the temperature change value is not large recently, the mask 100 has nickel (Ni), nickel-cobalt (Ni-Co) having a slightly higher thermal expansion coefficient than this. ). The thickness of the mask may be formed about 2㎛ to 50㎛.

The frame 200 is formed to allow the plurality of masks 100 to adhere. The frame 200 may include various edges formed in a first direction (for example, a horizontal direction) and a second direction (for example, a vertical direction) including the outermost border. These various corners may partition the region to which the mask 100 is to be adhered on the frame 200.

The frame 200 may include a frame frame 210 having a substantially square shape or a square frame shape. The inside of the frame portion 210 may be hollow. That is, the border frame unit 210 may include a hollow region R. The frame 200 may be made of a metal material such as invar, super invar, aluminum, titanium, etc., and is composed of invar, super invar, nickel, nickel-cobalt, etc. having the same thermal expansion coefficient as the mask in consideration of thermal deformation. Preferably, these materials can be applied to both the frame portion 210 of the frame 200, the mask cell sheet portion 220.

In addition to this, the frame 200 may include a plurality of mask cell regions CR, and may include a mask cell sheet portion 220 connected to the edge frame portion 210. The mask cell sheet portion 220 may be formed by electroplating as in the mask 100 or may be formed using other film forming processes. In addition, the mask cell sheet unit 220 may be connected to the edge frame unit 210 after forming a plurality of mask cell regions CR through laser scribing, etching, or the like on a flat sheet. Alternatively, the mask cell sheet unit 220 may form a plurality of mask cell regions CR through laser scribing, etching, or the like after connecting a planar sheet to the edge frame unit 210. In the present specification, a description will be mainly given of the formation of a plurality of mask cell regions CR in the mask cell sheet portion 220 and then connection to the frame portion 210.

The mask cell sheet unit 220 may include at least one of the edge sheet unit 221 and the first and second grid sheet units 223 and 225. The border sheet portions 221 and the first and second grid sheet portions 223 and 225 refer to portions divided in the same sheet, and they are integrally formed with each other.

The edge sheet portion 221 may be substantially connected to the edge frame portion 210. Therefore, the edge sheet portion 221 may have an approximately square shape and a square frame shape corresponding to the edge frame portion 210.

In addition, the first grid sheet portion 223 may be formed to extend in the first direction (horizontal direction). The first grid sheet portion 223 is formed in a straight shape so that both ends may be connected to the edge sheet portion 221. When the mask cell sheet portion 220 includes a plurality of first grid sheet portions 223, it is preferable that each of the first grid sheet portions 223 has equal intervals.

In addition, in addition to this, the second grid sheet portion 225 may be formed to extend in the second direction (vertical direction). The second grid sheet portion 225 may be formed in a straight line shape, and both ends may be connected to the edge sheet portion 221. The first grid sheet portion 223 and the second grid sheet portion 225 may cross each other vertically. When the mask cell sheet portion 220 includes a plurality of second grid sheet portions 225, it is preferable that each second grid sheet portion 225 has an equal interval.

Meanwhile, an interval between the first grid sheet parts 223 and an interval between the second grid sheet parts 225 may be the same or different depending on the size of the mask cell C.

The first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, but the shape of the cross section perpendicular to the longitudinal direction may be a rectangular shape, a rectangular shape such as a parallelogram, a triangular shape, or the like. , The sides and corners may be rounded. The cross-sectional shape can be adjusted in processes such as laser scribing and etching.

The thickness of the frame portion 210 may be thicker than the thickness of the mask cell sheet portion 220. The border frame portion 210 may be formed to a thickness of several mm to several cm because it is responsible for the overall rigidity of the frame 200.

In the case of the mask cell sheet portion 220, the process of manufacturing a substantially thick sheet is difficult, and if it is too thick, the path through which the organic material source 600 (see FIG. 15) passes through the mask 100 in the OLED pixel deposition process is difficult. This can cause clogging problems. Conversely, if the thickness is too thin, it may be difficult to secure rigidity sufficient to support the mask 100. Accordingly, the mask cell sheet portion 220 is thinner than the thickness of the frame portion 210, but is preferably thicker than the mask 100. The thickness of the mask cell sheet portion 220 may be formed about 0.1 mm to 1 mm. In addition, the widths of the first and second grid sheet portions 223 and 225 may be formed to about 1 to 5 mm.

A plurality of mask cell regions CR: CR11 to CR56 may be provided except for regions occupied by the border sheet portions 221 and the first and second grid sheet portions 223 and 225 in the planar sheet. In another aspect, the mask cell region CR is an area occupied by the border sheet portions 221 and the first and second grid sheet portions 223 and 225 in the hollow region R of the border frame portion 210. Except for, it may mean an empty area.

As the cell C of the mask 100 corresponds to the mask cell region CR, it can be used as a passage through which the pixels of the OLED are substantially deposited through the mask pattern P. As described above, one mask cell C corresponds to one display such as a smartphone. Mask patterns P constituting one cell C may be formed in one mask 100. Alternatively, one mask 100 may include a plurality of cells C, and each cell C may correspond to each cell area CR of the frame 200, but the clear alignment of the mask 100 may be performed. For this, it is necessary to avoid the large area mask 100, and the small area mask 100 having one cell C is preferable. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell region CR of the frame 200. In this case, for clear alignment, it may be considered to correspond to the mask 100 having a small number of cells C of 2-3.

The frame 200 includes a plurality of mask cell regions CR, and each of the masks 100 may be adhered so that one mask cell C corresponds to the mask cell region CR. Each mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy around the mask cell C (corresponding to a portion of the mask film 110 excluding the cell C). have. The dummy may include only the mask film 110 or may include the mask film 110 on which a predetermined dummy pattern having a shape similar to the mask pattern P is formed. The mask cell C corresponds to the mask cell area CR of the frame 200, and a part or all of the dummy may be adhered to the frame 200 (mask cell sheet portion 220). Accordingly, the mask 100 and the frame 200 can achieve an integral structure.

On the other hand, according to another embodiment, the frame is not manufactured by adhering the mask cell sheet portion 220 to the border frame portion 210, the border frame portion 210 in the hollow region (R) portion of the border frame portion 210 ) And a frame in which a grid frame (corresponding to the grid sheet portions 223 and 225) integrally formed directly may be used. This type of frame also includes at least one mask cell region CR, and it is possible to manufacture a frame-integrated mask by matching the mask 100 to the mask cell region CR.

Hereinafter, a process of manufacturing the frame-integrated mask will be described.

First, the frame 200 described above with reference to FIGS. 4 and 5 may be provided. 6 is a schematic diagram showing a manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to (a) of FIG. 6, a border frame unit 210 is provided. The border frame part 210 may have a rectangular frame shape including the hollow region R.

Next, referring to FIG. 6B, a mask cell sheet portion 220 is manufactured. The mask cell sheet portion 220 may be manufactured by manufacturing a planar sheet using electroforming or other film forming process, and then removing the mask cell region CR portion through laser scribing, etching, or the like. have. In this specification, description will be given taking an example in which 6 X 5 mask cell regions CR: CR11 to CR56 are formed. Five first grid sheet portions 223 and four second grid sheet portions 225 may be present.

Next, the mask cell sheet portion 220 may correspond to the border frame portion 210. In the process of matching, by stretching (F1 to F4) all sides of the mask cell sheet portion 220, the mask cell sheet portion 220 is flattened and the border sheet portion 221 is attached to the border frame portion 210. You can respond. One side can hold and hold the mask cell sheet portion 220 with several points (eg, 1 to 3 points in FIG. 6 (b), for example). On the other hand, the mask cell sheet portion 220 may be tensioned (F1, F2) along some side directions rather than all sides.

Next, when the mask cell sheet portion 220 corresponds to the edge frame portion 210, the edge sheet portion 221 of the mask cell sheet portion 220 may be welded (W) to be adhered. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 can be firmly adhered to the frame portion 220. Welding (W) should be performed as close as possible to the edge of the edge frame portion 210 to reduce the excitation space between the edge frame portion 210 and the mask cell sheet portion 220 as much as possible to increase adhesion. The welding (W) portion may be generated in the form of a line or a spot, and has the same material as the mask cell sheet portion 220 and integrally forms the border frame portion 210 and the mask cell sheet portion 220. It can be a medium to connect to.

7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention. In the embodiment of FIG. 6, the mask cell sheet portion 220 having the mask cell region CR is first manufactured and adhered to the border frame portion 210. However, in the embodiment of FIG. 7, the flat sheet of the border frame portion ( After adhesion to 210), a portion of the mask cell region CR is formed.

First, as illustrated in (a) of FIG. 6, a border frame portion 210 including a hollow region R is provided.

Next, referring to (a) of FIG. 7, a flat sheet (the flat mask cell sheet part 220 ′) may correspond to the border frame part 210. The mask cell sheet portion 220 ′ is in a planar state in which the mask cell region CR is not yet formed. In the process of matching, all sides of the mask cell sheet portion 220 'are tensioned (F1 to F4), so that the mask cell sheet portion 220' can be flattened to correspond to the border frame portion 210. One side can hold and hold the mask cell sheet portion 220 'with several points (for example, 1 to 3 points in FIG. 7 (a)). On the other hand, the mask cell sheet portion 220 'may be tensioned (F1, F2) along some side directions rather than all sides.

Next, if the mask cell sheet portion 220 'corresponds to the edge frame portion 210, the edge portion of the mask cell sheet portion 220' may be welded (W) to adhere. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 'can be firmly adhered to the edge frame portion 220. The welding (W) should be performed as close as possible to the edge of the edge frame portion 210 to minimize the excitation space between the edge frame portion 210 and the mask cell sheet portion 220 'and increase adhesion. The welding (W) portion may be generated in the form of a line or a spot, and has the same material as the mask cell sheet portion 220 ', and the frame portion 210 and the mask cell sheet portion 220'. It can be a medium to integrally connect.

Next, referring to FIG. 7B, a mask cell region CR is formed on a planar sheet (planar mask cell sheet portion 220 '). The mask cell region CR may be formed by removing the sheet of the mask cell region CR portion through laser scribing, etching, or the like. In this specification, description will be given taking an example in which 6 X 5 mask cell regions CR: CR11 to CR56 are formed. When the mask cell region CR is formed, the edge frame portion 210 and the welded (W) portion become the edge sheet portion 221, and the five first grid sheet portions 223 and the four second grids The mask cell sheet portion 220 having the sheet portion 225 may be configured.

8 to 10 are schematic diagrams showing a manufacturing process of a mask according to an embodiment of the present invention.

Referring to (a) of FIG. 8, a conductive substrate 21 is prepared. In order to perform electroforming, the base material 21 of the mother plate may be a conductive material. The base plate can be used as a cathode electrode in electroplating.

As a conductive material, in the case of metal, metal oxides may be generated on the surface, impurities may be introduced in a metal manufacturing process, and in the case of a polycrystalline silicon substrate, inclusions or grain boundaries may exist, and a conductive polymer In the case of a substrate, there is a high likelihood that impurities are contained, and strength. Acid resistance may be vulnerable. Elements that prevent the electric field from being uniformly formed on the surface of the mother plate (or cathode body), such as metal oxides, impurities, inclusions, and grain boundaries, are referred to as "defects". Due to the defect, a uniform electric field is not applied to the cathode body of the above-described material, so that a part of the plating film 110 may be formed non-uniformly.

In realizing ultra-high-definition pixels of UHD level or higher, non-uniformity of the plating film and the plating film pattern (mask pattern P) may adversely affect the formation of pixels. For example, the current QHD image quality is 500 to 600 PPI (pixel per inch), and the pixel size reaches about 30 to 50㎛, and for 4K UHD and 8K UHD high image quality, higher than ~ 860 PPI and ~ 1600 PPI It has the same resolution. A micro display applied directly to a VR device, or a micro display used to be inserted into a VR device, aims to achieve an ultra-high quality of about 2,000 PPI or higher, and the pixel size reaches about 5 to 10 μm. Since the pattern width of the FMM and shadow mask applied to it can be formed to a size of several to several tens of µm, preferably less than 30 µm, even a defect of several µm in size takes up a large portion of the pattern size of the mask. to be. In addition, in order to remove defects in the cathode body of the above-described material, an additional process for removing metal oxide, impurities, etc. may be performed, and in this process, other defects such as etching of the cathode body material may be caused. have.

Therefore, the present invention can use a mother board (or cathode body) of a single crystal material. In particular, it is preferably a single crystal silicon material. To have conductivity, a high concentration doping of 10 ¹⁹ / cm ³ or more may be performed on the single crystal silicon base plate. Doping may be performed on the entire base plate, or may be performed only on the surface portion of the base plate.

On the other hand, as a single crystal material, metals such as Ti, Cu, Ag, GaN, SiC, GaAs, GaP, AlN, InN, InP, Ge and other semiconductors, graphite (graphite), graphene (graphene), etc. _{, CH 3 NH 3 PbCl 3,} CH 3 NH 3 PbBr 3, CH 3 NH 3 PbI 3, SrTiO 3 , etc. page containing the perovskite (perovskite) superconductor single crystalline ceramic, aircraft single crystal second heat-resistant alloy for components for such structures Etc. can be used. In the case of metal and carbon-based materials, they are basically conductive materials. In the case of a semiconductor material, doping with a high concentration of 1019 or more may be performed to have conductivity. For other materials, conductivity may be formed by performing doping or by forming oxygen vacancy. Doping may be performed on the entire base plate, or may be performed only on the surface portion of the base plate.

In the case of a single crystal material, since there are no defects, there is an advantage in that a uniform plating film 110 can be generated due to the formation of a uniform electric field on all surfaces during electroforming. The frame-integrated masks 100 and 200 manufactured through a uniform plating film can further improve the quality level of the OLED pixels. In addition, since there is no need to perform an additional process for removing and eliminating defects, there is an advantage in that the process cost is reduced and productivity is improved.

Hereinafter, it is assumed and described that a single crystal silicon wafer is used as the conductive substrate 21.

Referring back to Figure 8 (a), next, using a conductive substrate 21 as a base plate (cathode body (Cathode Body)), the anode body (not shown) to be spaced apart on the conductive substrate 21 A plating film 110 'may be formed by electroplating. The plating film 110 ′ may be formed on the exposed upper surface and at least the side surface of the conductive substrate 21 facing the positive electrode body and having an electric field. In addition to the side surface of the conductive substrate 21, a plating film 110 'may be formed even on a part of the lower surface of the conductive substrate 21.

Meanwhile, referring back to FIG. 8 (a), a heat treatment (H) may be performed immediately after forming the plating film 110 'on the conductive substrate 21. The present invention is to reduce the thermal expansion coefficient of the mask 100 and at the same time to prevent deformation by the heat of the mask 100 and the mask pattern (P), the plating film from the conductive substrate 21 (or mother plate, cathode body) ( 110 ') is characterized by performing a heat treatment (H) before separation. The heat treatment may be performed at a temperature of 300 ° C to 800 ° C.

Generally, the thermal expansion coefficient of the invar thin plate produced by electroforming is higher than that of the inba thin plate produced by rolling. Thus, the thermal expansion coefficient can be lowered by performing heat treatment on the thin film of Invar, and peeling, deformation, etc. may occur on the thin film of Invar during this heat treatment. This is a phenomenon that occurs because only the Inba thin plate is heat treated or the Inba thin plate temporarily adhered only to the upper surface of the conductive substrate 21 is heat treated. However, since the present invention forms the plated film 110 not only on the upper surface but also on the side of the conductive substrate 21, or on a portion of the lower surface, even when heat treatment (H) is performed, peeling, deformation, etc., do not occur. Does not. In other words, since the heat treatment is performed in a state where the conductive substrate 21 and the plating film 110 ′ are closely adhered, there is an advantage of preventing peeling, deformation, etc. due to heat treatment, and stably performing heat treatment.

Next, referring to (b) of FIG. 8, the first insulating portion 23 may be formed on the plating layer 110 ′. The first insulating portion 23 may be formed to have a space between patterns on the edge portion of the plated film 110 ′. The first insulating portion 23 is preferably a photoresist material. Subsequently, only a portion of the plating layer 110 ′ exposed through the space between the patterns of the first insulating portion 23 may be etched to remove (D). Meanwhile, the edge portion of the plated film 110 may be removed (D) by laser cutting.

Next, referring to (c) of FIG. 8, the plated film 110 may be separated from the conductive substrate 21. The first insulating portion 23 may remain on the plating layer 110.

On the other hand, without necessarily using the plating film 110 formed by electroforming, it is also possible to use the film 110 produced by rolling (rolling). In this case, the rolled film 110 may be thicker than the plated film 110 formed by electroforming. Therefore, in order to finely form the mask pattern P to be described later, a process of thinning the thickness of the rolled film 110 to about 20 μm or less using a method such as CMP may be further performed. Thereafter, as shown in FIG. 8 (c), the first insulating portion 23 may be formed on the rolled film 110 made thin. At this time, the plating film 110 of the process of FIG. 9 or less can be replaced with a rolled film 110.

In the case of using the rolled film 110, there is a problem in that it is thicker in thickness than the plated film 110 formed of electroplating, but since the coefficient of thermal expansion (CTE) is low, it is necessary to perform a separate heat treatment (H) process. There is no strong corrosion resistance.

Next, referring to (d) of FIG. 9, a template 50 may be provided. The template 50 is a medium through which the mask 100 is attached on one surface and can be moved in a supported state. Alternatively, the template 50 may be used as a substrate for performing a process of forming a mask pattern P on the plating film 110. The template 50 is preferably in the form of a flat plate so that the plated film 110 can be attached flat. The size of the template 50 may be a flat plate shape larger than the plated film 110 so that the plated film 110 may be flatly attached as a whole.

The template 50 is preferably a transparent material so that it is easy to observe vision and the like in the process of aligning and adhering the mask 100 to the frame 200. In addition, the laser may penetrate through a transparent material. As a transparent material, materials such as glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), and borosilicate glass can be used. For example, the template 50 may be a BOROFLOAT ^® 33 material having excellent heat resistance, chemical durability, mechanical strength, transparency, etc. among borosilicate glass. Also, BOROFLOAT ^® 33 has the advantage of ease of the control of the thermal expansion coefficient of from about 3.3 Invar plating film 110 and the thermal expansion coefficient of the coating film 110 is less difference.

On the other hand, in the template 50, one surface in contact with the plating film 110 may be a mirror surface so that an air gap does not occur between the interface with the plating film 110 (or the mask 100). . In consideration of this, the surface roughness (Ra) of one surface of the template 50 may be 100 nm or less. To implement the template 50 having a surface roughness (Ra) of 100 nm or less, the template 50 may use a wafer. The wafer has a surface roughness (Ra) of about 10 nm, and there are many commercial products and many surface treatment processes, so it can be used as a template 50. Since the surface roughness (Ra) of the template (50) is nm-scale, there is no or little air gap, and it is easy to generate the weld beads (WB) by laser welding, thereby affecting the alignment error of the mask pattern (P). May not give.

A temporary adhesive portion 55 may be formed on one surface of the template 50. The temporary adhesive portion 55 may be such that the plated film 110 (or the mask 100) is temporarily adhered to one surface of the template 50 to be supported on the template 50. For example, until the mask 100 is adhered to the frame 200, the mask 100 (or, the plating film 110) is temporarily adhered to one surface of the template 50 to be supported on the template 50. You can.

The temporary adhesive portion 55 may use liquid wax. The liquid wax may be the same as the wax used in the polishing step of a semiconductor wafer or the like, and the type is not particularly limited. Liquid wax is a resin component for controlling adhesion, impact resistance, etc., mainly related to holding power, and may include materials and solvents such as acrylic, vinyl acetate, nylon, and various polymers. As an example, the temporary adhesive portion 55 may be SKYLIQUID ABR-4016 including acrylonitrile butadiene rubber (ABR) as a resin component and n-propyl alcohol as a solvent component. The liquid wax may form a temporary adhesive portion 55 using spin coating.

The temporary adhesive portion 55, which is a liquid wax, has a low viscosity at a temperature higher than 85 ° C. to 100 ° C., a viscosity at a temperature lower than 85 ° C., and can be partially hardened like a solid, so that the plating film 110 and template 50 are Can be fixed.

Next, referring to (e) of FIG. 9, the plating layer 110 having the first insulating portion 23 on one surface of the template 50 may be loaded. The plating layer 110 may be turned over so that the first insulating portion 23 faces the template 50. Then, the first insulating portion 23 and the temporary adhesive portion 55 on the template 50 may contact.

Subsequently, the plating film 110 may be adhered to the template 50. After the liquid wax is heated to 85 ° C. or higher and the plating film 110 is brought into contact with the template 50, adhesion may be performed by passing the plating film 110 and the template 50 between rollers.

According to one embodiment, the template 50 is vaporized for about 120 ° C. for 60 seconds to vaporize the solvent of the temporary adhesive portion 55, and immediately, a plating film lamination process may be performed. Lamination may be performed by loading the plating film 110 on the template 50 having the temporary adhesive portion 55 formed on one surface, and passing it between the upper roll at about 100 ° C and the lower roll at about 0 ° C. .

Next, referring to (f) of FIG. 9, the patterned second insulating portion 25 on the other surface opposite to one surface on which the first insulating portion 23 is formed, on the plated film 110 Can form. The second insulating portion 25 may be formed of a photoresist material using a printing method or the like. The plating layer 110 may be exposed as the space 26 between the patterns of the patterned second insulating portion 25.

Next, referring to (g) of FIG. 10, etching of the plating film 110 may be performed. Methods such as dry etching and wet etching may be used without limitation, and as a result of etching, a portion of the plated film 110 exposed as an empty space 26 between the insulating parts 25 may be etched. In the present invention, it is assumed and described to perform wet etching (WE). The etched portion of the plating layer 110 constitutes a mask pattern P, and the mask 100 on which a plurality of mask patterns P are formed may be manufactured.

On the other hand, when performing the etching, it may be advantageous for the etching solution to enter (WE) only on one side (for example, the top surface) of the plating film 110 to perform etching (WE) based only on one direction. When etching is performed on both sides at the same time, the thickness of the plating layer 110 may be non-uniform, and it may be difficult to realize the shape of the desired mask pattern P. Therefore, it is very important to prevent etching (WE ') on the other surface (eg, the lower surface) of the plating film 110.

In the present invention, the first insulating portion 23 remains on the other surface of the plating film 110. In addition, a temporary adhesive portion 55 is interposed between the plating film 110 and the template 50. Accordingly, the etching solution is prevented (WE ') from entering the other surface (back surface) of the plating film 110, and an etching (WE) process of forming the mask pattern P on only one surface (upper surface) of the plating film 110 There is an advantage to proceed.

Next, referring to (h) of FIG. 10, in order to debond the mask 100 and the template 50, heat is applied to the temporary adhesive part 55 (ET), chemical treatment (CM), and ultrasonic is applied. At least one of (US) may be performed. For example, when heat (ET) of a temperature higher than 85 ° C to 100 ° C is applied (ET), the viscosity of the temporary adhesive portion 55 is lowered, and the adhesive force between the mask 100 and the template 50 is weakened, and thus the mask 100 ) And the template 50 may be separated. As another example, the mask 100 and the template 50 may be separated by dissolving and removing the temporary adhesive portion 55 by immersing (CM) the temporary adhesive portion 55 in chemical substances such as IPA, acetone, and ethanol. have. As another example, when ultrasonic waves are applied (US), the adhesive force between the mask 100 and the template 50 is weakened, and the mask 100 and the template 50 may be separated.

10 (i) shows a state in which the mask 100 and the template 50 are separated. Here, the first and second insulating portions 23 and 25 remaining on both surfaces of the mask 100 may be removed. And, if the washing process or the like is further performed, manufacturing of the mask 100 may be completed as shown in FIG. 10 (j).

11 is a schematic diagram showing a template 50 for supporting the mask 100 according to an embodiment of the present invention. 11 is to move the mask 100 to the frame 200 in a state supported by the template 50, and may correspond to a state performed up to step (g) of FIG. 10. In other words, the separation of the mask 100 and the template 50 is not performed.

The laser passing hole 51 may be formed in the template 50 so that the laser L irradiated from the upper portion of the template 50 reaches the welding portion (the region to be welded) of the mask 100. The laser through hole 51 may be formed in the template 50 to correspond to the position and number of welds. Since a plurality of welding portions are disposed at predetermined intervals in the rim or dummy (see FIG. 12) portion of the mask 100, a plurality of laser passing holes 51 may also be formed at predetermined intervals to correspond thereto. As an example, since a plurality of welds are arranged along a predetermined distance on both sides (left / right) dummy portions of the mask 100, the laser through holes 51 also have predetermined intervals on both sides (left / right) of the template 50. Accordingly, a plurality may be formed.

The laser through-hole 51 does not necessarily correspond to the position and number of welds. For example, it is also possible to perform welding by irradiating the laser L only on a part of the laser through holes 51. In addition, some of the laser through holes 51 that do not correspond to the welding portion may be used in place of the alignment marks when aligning the mask 100 and the template 50. If the material of the template 50 is transparent to the laser (L) light, the laser through hole 51 may not be formed.

In addition, since the other surface (upper surface) of the mask 100 is in contact with the frame 200 after the mask 100 is moved to the frame 200, the second insulating portion remaining on the upper portion of the mask 100 ( 25) is preferably removed.

The width of the mask pattern P may be smaller than 40 μm, and the thickness of the mask 100 may be about 2 to 50 μm. Since the frame 200 includes a plurality of mask cell regions (CR: CR11 to CR56), a mask 100 having mask cells (C: C11 to C56) corresponding to each of the mask cell regions (CR: CR11 to CR56) ) Can also be provided in plural. In addition, a plurality of templates 50 supporting each of the plurality of masks 100 may be provided.

The template 50 may be transported by a vacuum chuck (not shown). The surface of the template 50 to which the mask 100 is adhered can be adsorbed and transferred by a vacuum chuck. The vacuum chuck may be connected to a moving means (not shown) that moves in the x, y, z, and θ axes. Further, the vacuum chuck may be connected to a flip means (not shown) capable of adsorbing and flipping the template 50. In the process of transferring the template 50 onto the frame 200 after the vacuum chuck adsorbs the template 50 and flips it, since the mask 100 is attached to the template 50 via the entrance-adhesive portion 55. , The adhesive state and alignment state of the mask 100 are not affected.

12 is a schematic diagram showing a state in which a template is loaded on a frame according to an embodiment of the present invention to associate a mask with a cell region of the frame. In FIG. 12, it is illustrated that one mask 100 corresponds to / adhesively adheres to the cell region CR, but the mask 100 is framed 200 by simultaneously correlating the plurality of masks 100 to all the cell regions CR. ) May be performed.

Next, referring to FIG. 12, the mask 100 may correspond to one mask cell area CR of the frame 200. By loading the template 50 on the frame 200 (or the mask cell sheet unit 220), the mask 100 may correspond to the mask cell area CR. While controlling the position of the template 50 / vacuum chuck (not shown), it can be seen whether the mask 100 corresponds to the mask cell region CR through a microscope. Since the template 50 compresses the mask 100, the mask 100 and the frame 200 can be in close contact.

Meanwhile, the lower support 70 may be further disposed under the frame 200. The lower support 70 may have a size sufficient to fit within the hollow region R of the frame edge portion 210 and may be flat. In addition, a predetermined support groove (not shown) corresponding to the shape of the mask cell sheet portion 220 may be formed on the upper surface of the lower support 70. In this case, the edge sheet portions 221 and the first and second grid sheet portions 223 and 225 are fitted into the support grooves, so that the mask cell sheet portion 220 can be more secured.

The lower support 70 may compress the opposite surface of the mask cell region CR in contact with the mask 100. That is, the lower support 70 supports the mask cell sheet portion 220 in an upward direction to prevent the mask cell sheet portion 220 from sagging in the downward direction during the bonding process of the mask 100. At the same time, since the lower support 70 and the template 50 compress the frame and the frame 200 (or the mask cell sheet portion 220) of the mask 100 in opposite directions, the mask 100 The alignment state of can be maintained without being disturbed.

As described above, the mask 100 corresponds to the mask cell area CR of the frame 200 by simply attaching the mask 100 on the template 50 and loading the template 50 on the frame 200. Since the process is complete, no tension may be applied to the mask 100 in this process.

Subsequently, the laser 100 may be irradiated to the mask 100 to bond the mask 100 to the frame 200 by laser welding. A welding bead WB is generated in a welding portion of the laser-welded mask, and the welding bead WB may be integrally connected with the same material as the mask 100 / frame 200.

13 is a schematic diagram showing a process of separating the mask 100 and the template 50 after adhering the mask 100 to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 13, after the mask 100 is adhered to the frame 200, the mask 100 and the template 50 may be debonded. Separation of the mask 100 and the template 50 may be performed by at least one of heat application (ET), chemical treatment (CM), and ultrasonic application (US) to the temporary adhesive portion 55. Since the mask 100 remains attached to the frame 200, only the template 50 can be lifted. For example, when heat (ET) of a temperature higher than 85 ° C to 100 ° C is applied (ET), the viscosity of the temporary adhesive portion 55 is lowered, and the adhesive force between the mask 100 and the template 50 is weakened, and thus the mask 100 ) And the template 50 may be separated. As another example, the mask 100 and the template 50 may be separated by dissolving and removing the temporary adhesive portion 55 by immersing (CM) the temporary adhesive portion 55 in chemical substances such as IPA, acetone, and ethanol. have. As another example, when ultrasonic waves are applied (US), the adhesive force between the mask 100 and the template 50 is weakened, and the mask 100 and the template 50 may be separated.

14 is a schematic diagram showing a state in which the mask 100 according to an embodiment of the present invention is adhered to the frame 200.

Referring to FIG. 14, one mask 100 may be adhered to one cell area CR of the frame 200.

Since the mask cell sheet portion 220 of the frame 200 has a thin thickness, when the mask cell sheet portion 220 is adhered with tensile force applied to the mask 100, the tensile force remaining in the mask 100 is masked. The cell sheet portion 220 and the mask cell region CR may be actuated to deform them. Therefore, it is necessary to perform adhesion of the mask 100 to the mask cell sheet portion 220 without applying a tensile force to the mask 100. The present invention corresponds to the mask cell region CR of the frame 200 by attaching the mask 100 on the template 50 and loading the template 50 on the frame 200. Since the process is completed, it is not possible to apply any tensile force to the mask 100 in this process. Thus, it is possible to prevent the frame 200 (or the mask cell sheet portion 220) from being deformed by the tension applied to the mask 100 acting as a tension on the frame 200.

The conventional mask 10 of FIG. 1 includes 6 cells (C1 to C6), and thus has a long length, whereas the mask 100 of the present invention includes a cell (C) and thus has a short length. The degree to which the pixel position accuracy (PPA) is distorted may be reduced. For example, assuming that the length of the mask 10 including a plurality of cells C1 to C6, ... is 1 m, and a PPA error of 10 μm is generated in 1 m as a whole, the mask 100 of the present invention Can be 1 / n of the above error range according to the relative length reduction (corresponding to the reduction in the number of cells (C)). For example, if the length of the mask 100 of the present invention is 100 mm, since it has a length reduced from 1 m to 1/10 of the conventional mask 10, a PPA error of 1 μm is generated over the entire length of 100 mm. , Alignment error is significantly reduced.

On the other hand, if the mask 100 includes a plurality of cells C, and each cell C corresponds to each cell region CR of the frame 200, within the range in which the alignment error is minimized, The mask 100 may correspond to a plurality of mask cell areas CR of the frame 200. Alternatively, the mask 100 having a plurality of cells C may correspond to one mask cell area CR. Also in this case, considering the process time and productivity according to the alignment, it is preferable that the mask 100 has as few cells C as possible.

In the case of the present invention, since only one cell C of the mask 100 needs to be matched and the alignment state is checked, it is necessary to simultaneously correspond to a plurality of cells C: C1 to C6 and check all of the alignment state. Compared to the conventional method (see Fig. 2), the manufacturing time can be significantly reduced.

That is, in the frame-integrated mask manufacturing method of the present invention, each cell C11 to C16 included in the six masks 100 corresponds to one cell region CR11 to CR16, respectively, and the alignment state is checked. Through the process, time can be significantly shortened compared to a conventional method in which six cells C1 to C6 are simultaneously mapped and all six cells C1 to C6 are aligned at the same time.

In addition, in the method for manufacturing a frame-integrated mask of the present invention, the product yield in 30 processes of 30 masks 100 corresponding to and aligned with 30 cell regions (CR: CR11 to CR56) is 6 cells (C1). ~ C6), each of the five masks 10 (see FIG. 2 (a)), which correspond to and align the frame 20, may appear to be much higher than the conventional product yield in the five steps. Since the conventional method of arranging six cells C1 to C6 in a region corresponding to six cells C at a time is a much cumbersome and difficult operation, the product yield is low.

Meanwhile, as described above in step (e) of FIG. 9, when the plating film 110 is attached to the template 50 by a lamination process, a temperature of about 100 ° C. may be applied to the plating film 110. Accordingly, the plated film 110 may be adhered to the template 50 in a state where some tensile tension is applied. Thereafter, when the mask 100 is adhered to the frame 200 and the template 50 is separated from the mask 100, the mask 100 may shrink in a predetermined amount.

When the templates 50 and the masks 100 are separated after each of the masks 100 are adhered to the corresponding mask cell area CR, a tension is applied to the plurality of masks 100 contracting in opposite directions. Therefore, the force is canceled, so that the deformation does not occur in the mask cell sheet portion 220. For example, the first grid sheet portion 223 between the mask 100 attached to the CR11 cell area and the mask 100 attached to the CR12 cell area is directed to the right side of the mask 100 attached to the CR11 cell area. The acting tension and the tension acting in the left direction of the mask 100 attached to the CR12 cell region may be canceled. Thus, the deformation of the frame 200 (or the mask cell sheet part 220) due to tension is minimized, so that an alignment error of the mask 100 (or the mask pattern P) can be minimized.

15 is a schematic diagram illustrating an OLED pixel deposition apparatus 1000 using frame-integrated masks 100 and 200 according to an embodiment of the present invention.

Referring to FIG. 15, the OLED pixel deposition apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated, a coolant line 350 is disposed, and an organic material source 600 from the bottom of the magnet plate 300. It includes a deposition source supply unit 500 for supplying.

Between the magnet plate 300 and the source deposition unit 500, a target substrate 900 such as glass on which the organic source 600 is deposited may be interposed. The target substrate 900 may be disposed such that the frame-integrated masks 100 and 200 (or FMM) that allow the organic material source 600 to be deposited on a pixel-by-pixel basis are in close contact or very close. The magnet 310 generates a magnetic field and can be in close contact with the target substrate 900 by the magnetic field.

The deposition source supply unit 500 may supply the organic material source 600 while reciprocating the left and right paths, and the organic material sources 600 supplied from the deposition source supply unit 500 may include patterns P formed in the frame-integrated masks 100 and 200. ) To be deposited on one side of the target substrate 900. The deposited organic source 600 that has passed through the pattern P of the frame-integrated masks 100 and 200 may act as the pixel 700 of the OLED.

In order to prevent uneven deposition of the pixels 700 by the shadow effect, the patterns of the frame-integrated masks 100 and 200 may be inclined (S) (or formed in a tapered shape (S)). . Since the organic material sources 600 passing through the pattern in the diagonal direction along the inclined surface may also contribute to the formation of the pixel 700, the pixel 700 may be uniformly deposited with a thickness as a whole.

Since the mask 100 is adhesively fixed to the frame 200 at a first temperature higher than the pixel deposition process temperature, even if it is raised to the process temperature for pixel deposition, the position of the mask pattern P is hardly affected. The PPA between 100 and its neighboring mask 100 may be maintained so as not to exceed 3 μm.

The present invention has been illustrated and described with reference to preferred embodiments, as described above, but is not limited to the above embodiments and is varied by those skilled in the art to which the present invention pertains without departing from the spirit of the present invention. Modifications and modifications are possible. Such modifications and variations are to be regarded as falling within the scope of the invention and appended claims.

21: conductive substrate
23: first insulation
25: second insulation
50: template
51: laser through hole
55: temporary adhesive
70: lower support
100: mask
110: plating film, mask film
200: frame
210: border frame
220: mask cell sheet portion
221: border sheet portion
223: first grid sheet portion
225: second grid sheet portion
1000: OLED pixel deposition device
C: cell, mask cell
CR: mask cell area
L: laser
R: Hollow area of the border frame
P: mask pattern
W: Welding
WB: welding bead
WE: Etch

Claims (26)

(A) providing a plated film formed on one surface of the first insulating portion;
(b) contacting the upper surface of the template with the other surface facing the one surface of the first insulating portion contacting the plating film;
(c) forming a patterned second insulating portion on the other surface of the plated film; And
(d) etching the plated film through the space between the patterns of the second insulating portion
The manufacturing method of a mask containing the. (a) forming a plating film on the top surface and at least the side surface of the conductive substrate;
(b) forming a patterned first insulating portion on one surface of the plated film, and removing at least a portion of the rim of the plated film through a space between the patterns of the first insulating portion;
(C) separating the conductive substrate and the plating film;
(d) contacting the other surface opposite to one surface of the first insulating portion in contact with the plated film to the upper surface of the template;
(e) forming a patterned second insulating portion on the other surface of the plated film; And
(f) etching the plated film through the space between the patterns of the second insulating portion
The manufacturing method of a mask containing the. According to claim 2,
The conductive substrate is a wafer, a method of manufacturing a mask. According to claim 2,
Between (a) step and (b) step, the method of manufacturing a mask, further performing a process of heat-treating the plating film. The method according to claim 1 or 2,
A method of manufacturing a mask, wherein a temporary adhesive portion is formed on the upper surface of the template, and the temporary adhesive portion and the first insulating portion contact each other. The method of claim 5,
The temporary adhesive is a liquid wax. The method of claim 6,
The method of manufacturing a mask, in which the liquid wax adheres the plating film and the template at a temperature lower than 85 ° C. The method of claim 7,
In the step of contacting the other surface of the first insulating portion in contact with the plating film to the upper surface of the template,
A method of manufacturing a mask, wherein the liquid wax is heated to 85 ° C. or higher and the first insulating portion is brought into contact with the template, and then the plating film and the template are passed between rollers to perform adhesion. According to claim 1,
The template is a transparent material, the manufacturing method of the mask. The method of claim 9,
The template includes a material of any one of glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), and borosilicate glass. A method of manufacturing a frame-integrated mask in which at least one mask and a frame supporting the mask are integrally formed,
(A) providing a plated film formed on one surface of the first insulating portion;
(b) contacting the upper surface of the template with the other surface facing the one surface of the first insulating portion contacting the plating film;
(c) forming a patterned second insulating portion on the other surface of the plated film;
(d) etching the plated film through the space between the patterns of the second insulating portion;
(e) providing a frame having at least one mask cell region;
(f) loading a template on the frame to correspond the mask to the mask cell area of the frame; And
(g) attaching the mask to the frame by irradiating a laser to the welding portion of the mask
A method of manufacturing a frame-integrated mask comprising a. The method of claim 11,
Step (e),
(e1) providing a border frame portion including a hollow region;
(e2) connecting the planar mask cell sheet portion to the border frame portion; And
(e3) forming a frame by forming a plurality of mask cell regions on the mask cell sheet portion
A method of manufacturing a frame-integrated mask comprising a. The method of claim 11,
Step (e),
(e1) providing a border frame portion including a hollow region; And
(e2) manufacturing a frame by connecting a mask cell sheet portion having a plurality of mask cell regions to an edge frame portion
A method of manufacturing a frame-integrated mask comprising a. The method of claim 11,
The temporary adhesive portion is a liquid wax (liquid wax), the method of manufacturing a frame-integrated mask. The method of claim 14,
The liquid wax is a method of manufacturing a frame-integrated mask in which a plating film and a template are fixedly adhered at a temperature lower than 85 ° C. The method of claim 15,
In the step (b), the liquid wax is heated to 85 ° C. or higher and the first insulating portion is brought into contact with the template, and then the plating film and the template are passed between the rollers to perform adhesion. The method of claim 11,
The template is a transparent material, the method of manufacturing a frame-integrated mask. The method of claim 17,
The template includes a material of any one of glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), and borosilicate glass. The method of claim 11,
A method of manufacturing a frame-integrated mask in which a laser through hole is formed in a portion of a template corresponding to a weld portion of the mask. The method of claim 11,
A method of manufacturing a frame-integrated mask, wherein a weld bead is formed on a portion of the welded portion where the laser is irradiated, and the weld bead mediates the mask and the frame to be integrally connected. The method of claim 11,
After step (g), performing at least one of heat application, chemical treatment, and ultrasonic application to the temporary adhesive portion to separate the mask and the template.
The method of manufacturing a frame-integrated mask further comprising a. The method of claim 12 or 13,
The mask cell sheet portion,
Border sheet portion; And
A method of manufacturing a frame-integrated mask comprising at least one first grid sheet portion extending in a first direction and having both ends connected to an edge sheet portion. The method of claim 22,
The mask cell sheet portion is formed to extend in a second direction perpendicular to the first direction, intersects the first grid sheet portion, and further includes at least one second grid sheet portion having both ends connected to the edge sheet portion. Method of manufacture. The method of claim 11,
The mask and frame are made of any one of invar, super invar, nickel, and nickel-cobalt. (A) providing a rolled film formed on one surface of the first insulating portion;
(b) contacting the other surface opposite to one surface of the first insulating portion contacting the rolled film to the upper surface of the template;
(c) forming a patterned second insulating portion on the other surface of the rolled film; And
(d) etching the pressed film through the space between the patterns of the second insulating portion
The manufacturing method of a mask containing the. A method of manufacturing a frame-integrated mask in which at least one mask and a frame supporting the mask are integrally formed,
(A) providing a rolled film formed on one surface of the first insulating portion;
(b) contacting the other surface opposite to one surface of the first insulating portion contacting the rolled film to the upper surface of the template;
(c) forming a patterned second insulating portion on the other surface of the rolled film;
(d) etching the rolled film through the space between the patterns of the second insulating portion;
(e) providing a frame having at least one mask cell region;
(f) loading a template on the frame to correspond the mask to the mask cell area of the frame; And
(g) attaching the mask to the frame by irradiating a laser to the welding portion of the mask
A method of manufacturing a frame-integrated mask comprising a.

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