KR101357906B1 - 집적회로 제조시 방향성을 표시하는 방법 및 장치 - Google Patents

집적회로 제조시 방향성을 표시하는 방법 및 장치 Download PDF

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Publication number
KR101357906B1
KR101357906B1 KR1020087020330A KR20087020330A KR101357906B1 KR 101357906 B1 KR101357906 B1 KR 101357906B1 KR 1020087020330 A KR1020087020330 A KR 1020087020330A KR 20087020330 A KR20087020330 A KR 20087020330A KR 101357906 B1 KR101357906 B1 KR 101357906B1
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South Korea
Prior art keywords
implant
indicator
region
integrated circuit
source
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Expired - Fee Related
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KR1020087020330A
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English (en)
Korean (ko)
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KR20080107379A (ko
Inventor
에드워드 오. 트래비스
메훌 디. 쉬로프
도날드 이. 스멜트저
트라씨 엘. 스미스
Original Assignee
프리스케일 세미컨덕터, 인크.
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Publication of KR20080107379A publication Critical patent/KR20080107379A/ko
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Publication of KR101357906B1 publication Critical patent/KR101357906B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
KR1020087020330A 2006-02-23 2007-01-09 집적회로 제조시 방향성을 표시하는 방법 및 장치 Expired - Fee Related KR101357906B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/360,925 2006-02-23
US11/360,925 US7635920B2 (en) 2006-02-23 2006-02-23 Method and apparatus for indicating directionality in integrated circuit manufacturing
PCT/US2007/060257 WO2007100929A2 (en) 2006-02-23 2007-01-09 Method and apparatus for indicating directionality in integrated circuit manufacturing

Publications (2)

Publication Number Publication Date
KR20080107379A KR20080107379A (ko) 2008-12-10
KR101357906B1 true KR101357906B1 (ko) 2014-02-06

Family

ID=38427329

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087020330A Expired - Fee Related KR101357906B1 (ko) 2006-02-23 2007-01-09 집적회로 제조시 방향성을 표시하는 방법 및 장치

Country Status (6)

Country Link
US (2) US7635920B2 (enExample)
JP (1) JP2009527926A (enExample)
KR (1) KR101357906B1 (enExample)
CN (1) CN101438405B (enExample)
TW (1) TWI433207B (enExample)
WO (1) WO2007100929A2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI368963B (en) * 2008-07-18 2012-07-21 Inotera Memories Inc An analysis method of wafer's ion implant
US7829939B1 (en) * 2009-04-20 2010-11-09 International Business Machines Corporation MOSFET including epitaxial halo region
JP5561823B2 (ja) * 2010-02-05 2014-07-30 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
CN102509726A (zh) * 2011-11-14 2012-06-20 上海宏力半导体制造有限公司 具有加密结构的ip模块及其制造方法
TWI466296B (zh) * 2012-07-31 2014-12-21 瑞昱半導體股份有限公司 半導體元件及其形成方法
US20150087131A1 (en) * 2013-09-20 2015-03-26 Infineon Technologies Ag Method for processing a chip
US10002800B2 (en) * 2016-05-13 2018-06-19 International Business Machines Corporation Prevention of charging damage in full-depletion devices
CN109950133B (zh) * 2019-03-14 2021-07-27 北京大学深圳研究生院 一种便于识别的碳化硅外延片圆片制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06350042A (ja) * 1993-06-08 1994-12-22 Sony Corp トランジスタの製造方法
US6190980B1 (en) 1998-09-10 2001-02-20 Advanced Micro Devices Method of tilted implant for pocket, halo and source/drain extension in ULSI dense structures
JP2003502862A (ja) * 1999-06-21 2003-01-21 インフィニオン テクノロジーズ ノース アメリカ コーポレイション ハローインプラントを形成するための改善された方法を用いてデバイス性能を向上させる方法
US6911660B2 (en) 2002-10-02 2005-06-28 Varian Semiconductor Equipment Associates, Inc. Method of measuring ion beam angles

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60195923A (ja) * 1984-03-17 1985-10-04 Sumitomo Electric Ind Ltd メサ方向を表示した半導体ウエハおよびチツプ並びにその製法
JPS62113462A (ja) * 1985-11-12 1987-05-25 Nec Corp 半導体装置
US4973217A (en) * 1987-02-09 1990-11-27 Svg Lithography Systems, Inc. Wafer handling system
US5686345A (en) * 1996-01-30 1997-11-11 International Business Machines Corporation Trench mask for forming deep trenches in a semiconductor substrate, and method of using same
US5742041A (en) * 1996-05-29 1998-04-21 Intermec Corporation Method and apparatus for locating and decoding machine-readable symbols, including data matrix symbols
KR100289810B1 (ko) * 1999-05-10 2001-05-15 김영환 반도체 소자 제조를 위한 할로 이온 주입 방법
US6842538B2 (en) * 2001-03-23 2005-01-11 Shih-Jong J. Lee Automatic detection of alignment or registration marks
US6742708B2 (en) 2001-06-07 2004-06-01 Hewlett-Packard Development Company, L.P. Fiducial mark patterns for graphical bar codes
US6745708B2 (en) * 2001-12-19 2004-06-08 Conocophillips Company Method and apparatus for improving the efficiency of a combustion device
JP2004103612A (ja) * 2002-09-04 2004-04-02 Toshiba Corp 半導体装置とその製造方法
US6833307B1 (en) * 2002-10-30 2004-12-21 Advanced Micro Devices, Inc. Method for manufacturing a semiconductor component having an early halo implant
US7138318B2 (en) * 2003-05-28 2006-11-21 Advanced Micro Devices, Inc. Method of fabricating body-tied SOI transistor having halo implant region underlying hammerhead portion of gate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06350042A (ja) * 1993-06-08 1994-12-22 Sony Corp トランジスタの製造方法
US6190980B1 (en) 1998-09-10 2001-02-20 Advanced Micro Devices Method of tilted implant for pocket, halo and source/drain extension in ULSI dense structures
JP2003502862A (ja) * 1999-06-21 2003-01-21 インフィニオン テクノロジーズ ノース アメリカ コーポレイション ハローインプラントを形成するための改善された方法を用いてデバイス性能を向上させる方法
US6911660B2 (en) 2002-10-02 2005-06-28 Varian Semiconductor Equipment Associates, Inc. Method of measuring ion beam angles

Also Published As

Publication number Publication date
KR20080107379A (ko) 2008-12-10
US20070194392A1 (en) 2007-08-23
TWI433207B (zh) 2014-04-01
TW200746238A (en) 2007-12-16
US7635920B2 (en) 2009-12-22
US7858487B2 (en) 2010-12-28
US20100112779A1 (en) 2010-05-06
CN101438405B (zh) 2013-10-30
CN101438405A (zh) 2009-05-20
JP2009527926A (ja) 2009-07-30
WO2007100929A2 (en) 2007-09-07
WO2007100929A3 (en) 2008-12-04

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