KR101356258B1 - 주석 도금의 내열 박리성이 우수한 Ｃｕ-Ｎｉ-Ｓｉ계 합금 주석 도금조 - Google Patents

주석 도금의 내열 박리성이 우수한 Ｃｕ-Ｎｉ-Ｓｉ계 합금 주석 도금조 Download PDF

Info

Publication number
KR101356258B1
KR101356258B1 KR1020127001034A KR20127001034A KR101356258B1 KR 101356258 B1 KR101356258 B1 KR 101356258B1 KR 1020127001034 A KR1020127001034 A KR 1020127001034A KR 20127001034 A KR20127001034 A KR 20127001034A KR 101356258 B1 KR101356258 B1 KR 101356258B1
Authority
KR
South Korea
Prior art keywords
plating
concentration
copper alloy
interface
layer
Prior art date
Application number
KR1020127001034A
Other languages
English (en)
Korean (ko)
Other versions
KR20120023185A (ko
Inventor
마사유키 나가노
Original Assignee
제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 filed Critical 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤
Publication of KR20120023185A publication Critical patent/KR20120023185A/ko
Application granted granted Critical
Publication of KR101356258B1 publication Critical patent/KR101356258B1/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020127001034A 2009-09-30 2009-09-30 주석 도금의 내열 박리성이 우수한 Ｃｕ-Ｎｉ-Ｓｉ계 합금 주석 도금조 KR101356258B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/067100 WO2011039875A1 (ja) 2009-09-30 2009-09-30 すずめっきの耐熱剥離性に優れるＣｕ－Ｎｉ－Ｓｉ系合金すずめっき条

Publications (2)

Publication Number Publication Date
KR20120023185A KR20120023185A (ko) 2012-03-12
KR101356258B1 true KR101356258B1 (ko) 2014-01-28

Family

ID=43825729

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127001034A KR101356258B1 (ko) 2009-09-30 2009-09-30 주석 도금의 내열 박리성이 우수한 Ｃｕ-Ｎｉ-Ｓｉ계 합금 주석 도금조

Country Status (4)

Country Link
JP (1) JPWO2011039875A1 (zh)
KR (1) KR101356258B1 (zh)
CN (1) CN102482794B (zh)
WO (1) WO2011039875A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5986822B2 (ja) * 2012-06-21 2016-09-06 三菱伸銅株式会社 Ｃｕ−Ｎｉ−Ｓｉ系銅合金Ｓｎめっき板及びその製造方法
JP6854114B2 (ja) * 2016-01-04 2021-04-07 Ｊｘ金属株式会社 表面処理銅箔
KR101900793B1 (ko) * 2017-06-08 2018-09-20 주식회사 풍산 전기·전자, 자동차 부품용 동합금의 주석 도금 방법 및 이로부터 제조된 동합금의 주석 도금재
KR20210144680A (ko) * 2019-03-28 2021-11-30 후루카와 덴키 고교 가부시키가이샤 구리 합금 조재 및 그 제조 방법, 그것을 사용한 저항기용 저항 재료 및 저항기
CN110669959A (zh) * 2019-10-25 2020-01-10 宁夏中色新材料有限公司 一种弹性青铜合金及其制备方法
JP2021147673A (ja) * 2020-03-19 2021-09-27 三菱マテリアル株式会社 Ｃｕ−Ｎｉ−Ｓｉ系銅合金板、めっき皮膜付Ｃｕ−Ｎｉ−Ｓｉ系銅合金板及びこれらの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100774225B1 (ko) 2005-03-29 2007-11-07 닛코 킨조쿠 가부시키가이샤 Ｃｕ-Ｎｉ-Ｓｉ-Ｚｎ 계 합금 주석 도금조
KR100774226B1 (ko) 2005-03-29 2007-11-07 닛코 킨조쿠 가부시키가이샤 주석 도금의 내열 박리성이 우수한Ｃｕ-Ｎｉ-Ｓｉ-Ｚｎ-Ｓｎ 계 합금조 및 그 주석 도금조

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3906472B2 (ja) * 1996-02-05 2007-04-18 三菱伸銅株式会社 Ｎｉメッキ密着性に優れた銅合金
JP2007039789A (ja) * 2005-03-29 2007-02-15 Nikko Kinzoku Kk すずめっきの耐熱剥離性に優れるＣｕ−Ｎｉ−Ｓｉ−Ｚｎ−Ｓｎ系合金条およびそのすずめっき条
JP2006307336A (ja) * 2005-03-29 2006-11-09 Nikko Kinzoku Kk Ｃｕ−Ｎｉ−Ｓｉ−Ｚｎ系合金Ｓｎめっき条
JP4489738B2 (ja) * 2005-08-31 2010-06-23 日鉱金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ−Ｚｎ系合金すずめっき条

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100774225B1 (ko) 2005-03-29 2007-11-07 닛코 킨조쿠 가부시키가이샤 Ｃｕ-Ｎｉ-Ｓｉ-Ｚｎ 계 합금 주석 도금조
KR100774226B1 (ko) 2005-03-29 2007-11-07 닛코 킨조쿠 가부시키가이샤 주석 도금의 내열 박리성이 우수한Ｃｕ-Ｎｉ-Ｓｉ-Ｚｎ-Ｓｎ 계 합금조 및 그 주석 도금조

Also Published As

Publication number Publication date
CN102482794B (zh) 2014-10-22
JPWO2011039875A1 (ja) 2013-02-21
WO2011039875A1 (ja) 2011-04-07
CN102482794A (zh) 2012-05-30
KR20120023185A (ko) 2012-03-12

Similar Documents

Publication Publication Date Title
KR101058764B1 (ko) Ｃｕ－Ｎｉ－Ｓｉ 합금 주석 도금 스트립
KR100774226B1 (ko) 주석 도금의 내열 박리성이 우수한Ｃｕ-Ｎｉ-Ｓｉ-Ｚｎ-Ｓｎ 계 합금조 및 그 주석 도금조
KR101081779B1 (ko) Ｓｎ 도금의 내열 박리성이 우수한 Ｃｕ－Ｚｎ 계 합금조 및 그 Ｓｎ 도금조
JP6055242B2 (ja) Ｃｕ−Ｍｇ−Ｐ系銅合金Ｓｎめっき板及びその製造方法
JP2007063624A (ja) 挿抜性及び耐熱性に優れる銅合金すずめっき条
KR101356258B1 (ko) 주석 도금의 내열 박리성이 우수한 Ｃｕ-Ｎｉ-Ｓｉ계 합금 주석 도금조
TWI840541B (zh) 銅合金板、附鍍敷被膜銅合金板及此等之製造方法
KR100689687B1 (ko) Ｃｕ-Ｎｉ-Ｓｉ-Ｍｇ 계 구리 합금 스트립
JP2006307336A (ja) Ｃｕ−Ｎｉ−Ｓｉ−Ｚｎ系合金Ｓｎめっき条
JP5393739B2 (ja) Ｃｕ−Ｎｉ−Ｓｉ合金すずめっき条
JP4489738B2 (ja) Ｃｕ−Ｎｉ−Ｓｉ−Ｚｎ系合金すずめっき条
JP2007039789A (ja) すずめっきの耐熱剥離性に優れるＣｕ−Ｎｉ−Ｓｉ−Ｚｎ−Ｓｎ系合金条およびそのすずめっき条
JP4820228B2 (ja) Ｓｎめっきの耐熱剥離性に優れるＣｕ−Ｚｎ−Ｓｎ系合金条及びそのＳｎめっき条
KR100774225B1 (ko) Ｃｕ-Ｎｉ-Ｓｉ-Ｚｎ 계 합금 주석 도금조
WO2015125350A1 (ja) コネクタ端子用銅合金材料、及びコネクタ端子用銅合金材料の製造方法
JP4247256B2 (ja) Ｃｕ−Ｚｎ−Ｓｎ系合金すずめっき条
JP2007291459A (ja) Ｃｕ−Ｓｎ−Ｐ系合金すずめっき条
JP4538424B2 (ja) Ｃｕ−Ｚｎ−Ｓｎ系合金すずめっき条
KR20060047620A (ko) Ｃｕ-Ｎｉ-Ｓｉ-Ｍｇ 계 구리합금스트립과 그것을 가공하여얻어지는 전자 기기용 부품
JP4642701B2 (ja) めっき密着性に優れるＣｕ−Ｎｉ−Ｓｉ系合金条
WO2009123139A1 (ja) すずめっきの耐熱剥離性に優れるＣｕ－Ｎｉ－Ｓｉ系合金すずめっき条
JP4804191B2 (ja) Ｃｕ−Ｚｎ系合金すずめっき条

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20170119

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20171219

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20181226

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20191217

Year of fee payment: 7