KR101256442B1 - 기판 분단 장치 - Google Patents

기판 분단 장치 Download PDF

Info

Publication number
KR101256442B1
KR101256442B1 KR1020110018967A KR20110018967A KR101256442B1 KR 101256442 B1 KR101256442 B1 KR 101256442B1 KR 1020110018967 A KR1020110018967 A KR 1020110018967A KR 20110018967 A KR20110018967 A KR 20110018967A KR 101256442 B1 KR101256442 B1 KR 101256442B1
Authority
KR
South Korea
Prior art keywords
substrate
trigger
glass substrate
edge
board
Prior art date
Application number
KR1020110018967A
Other languages
English (en)
Korean (ko)
Other versions
KR20110105708A (ko
Inventor
타케시 이케다
코지 야마모토
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20110105708A publication Critical patent/KR20110105708A/ko
Application granted granted Critical
Publication of KR101256442B1 publication Critical patent/KR101256442B1/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
KR1020110018967A 2010-03-19 2011-03-03 기판 분단 장치 KR101256442B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010064262A JP5237318B2 (ja) 2010-03-19 2010-03-19 基板分断装置
JPJP-P-2010-064262 2010-03-19

Publications (2)

Publication Number Publication Date
KR20110105708A KR20110105708A (ko) 2011-09-27
KR101256442B1 true KR101256442B1 (ko) 2013-04-19

Family

ID=44776118

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110018967A KR101256442B1 (ko) 2010-03-19 2011-03-03 기판 분단 장치

Country Status (4)

Country Link
JP (1) JP5237318B2 (zh)
KR (1) KR101256442B1 (zh)
CN (1) CN102219369B (zh)
TW (1) TWI414389B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5888158B2 (ja) 2012-04-05 2016-03-16 日本電気硝子株式会社 ガラスフィルムの割断方法
CN103848563A (zh) * 2012-11-28 2014-06-11 均豪精密工业股份有限公司 脆性材料钻孔方法
KR102503846B1 (ko) * 2015-10-30 2023-02-27 삼성디스플레이 주식회사 레이저 절단 장치
KR20190000792A (ko) * 2017-06-23 2019-01-03 미쓰보시 다이야몬도 고교 가부시키가이샤 커터 휠 및 다층기판의 절단 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08231239A (ja) * 1994-12-27 1996-09-10 Asahi Glass Co Ltd ガラスリボンの割断方法およびそのための装置
JP2009078502A (ja) * 2007-09-27 2009-04-16 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断装置および割断方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09150286A (ja) * 1995-06-26 1997-06-10 Corning Inc 脆弱性材料切断方法および装置
JP2000281375A (ja) * 1999-03-31 2000-10-10 Nec Corp ガラス基板の割断方法及び割断装置
JP2001170786A (ja) * 1999-12-10 2001-06-26 Hitachi Cable Ltd 非金属材料基板の加工方法及びその装置
JP2002172479A (ja) * 2000-09-20 2002-06-18 Seiko Epson Corp レーザ割断方法、レーザ割断装置、液晶装置の製造方法並びに液晶装置の製造装置
WO2003008352A1 (en) * 2001-07-18 2003-01-30 Mitsuboshi Diamond Industrial Co., Ltd. Device and method for scribing fragile material substrate
JP3792639B2 (ja) * 2002-11-08 2006-07-05 株式会社日本エミック 切断装置
KR100497820B1 (ko) * 2003-01-06 2005-07-01 로체 시스템즈(주) 유리판절단장치
JP2007099587A (ja) * 2005-10-07 2007-04-19 Kyoto Seisakusho Co Ltd 脆性材料の割断加工方法
WO2008139585A1 (ja) * 2007-05-10 2008-11-20 Toray Engineering Co., Ltd. 初期亀裂形成機構
KR20090079342A (ko) * 2008-01-17 2009-07-22 케이 이엔지(주) 레이져빔을 이용한 유리기판 절단 방법
CN102026925B (zh) * 2008-04-14 2013-06-05 三星钻石工业股份有限公司 脆性材料基板的加工方法
CN101444875A (zh) * 2008-12-08 2009-06-03 浙江工业大学 一种脆性材料基板的切割方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08231239A (ja) * 1994-12-27 1996-09-10 Asahi Glass Co Ltd ガラスリボンの割断方法およびそのための装置
JP2009078502A (ja) * 2007-09-27 2009-04-16 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断装置および割断方法

Also Published As

Publication number Publication date
TWI414389B (zh) 2013-11-11
KR20110105708A (ko) 2011-09-27
JP2011194723A (ja) 2011-10-06
CN102219369B (zh) 2013-12-04
JP5237318B2 (ja) 2013-07-17
TW201132443A (en) 2011-10-01
CN102219369A (zh) 2011-10-19

Similar Documents

Publication Publication Date Title
US9010154B2 (en) Method of cleaving and separating a glass sheet
US10639741B2 (en) Ablation cutting of a workpiece by a pulsed laser beam
KR100849696B1 (ko) 취성재료의 스크라이브 방법 및 스크라이브 장치
US9076855B2 (en) Laser machining method
JP5249979B2 (ja) 脆性材料基板の加工方法およびこれに用いるレーザ加工装置
KR101223470B1 (ko) 취성 재료 기판의 가공 방법
EP2418041A1 (en) Laser machining device and laser machining method
KR20110109881A (ko) 취성 재료 기판의 분단 방법
JP5879106B2 (ja) 脆性材料基板のスクライブ方法
KR101165982B1 (ko) 취성 재료 기판의 가공 방법
TW201210732A (en) Laser processing method
KR101258403B1 (ko) 강화유리 기판 절단방법
KR101256442B1 (ko) 기판 분단 장치
US20150059411A1 (en) Method of separating a glass sheet from a carrier
JP6349970B2 (ja) 基板分断方法並びに基板分断装置
KR101312284B1 (ko) 레이저 가공 방법
KR20110106360A (ko) 취성 재료의 분할 장치 및 할단 방법
KR101396989B1 (ko) 유리 기판의 스크라이브 방법
JP2007301806A (ja) 脆性基板の分断方法及び素子の製造方法
JP5598801B2 (ja) レーザーダイシング方法、チップの製造方法およびレーザー加工装置
JP5560096B2 (ja) レーザ加工方法
JP2013087001A (ja) スクライブ装置
JP5444158B2 (ja) 脆性材料基板の割断方法
KR20140068834A (ko) 유리 기판의 스크라이브 방법
WO2015190282A1 (ja) 強化ガラス板の割断方法及び強化ガラス板の割断装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20160318

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20170317

Year of fee payment: 5

LAPS Lapse due to unpaid annual fee