WO2008139585A1 - 初期亀裂形成機構 - Google Patents

初期亀裂形成機構 Download PDF

Info

Publication number
WO2008139585A1
WO2008139585A1 PCT/JP2007/059650 JP2007059650W WO2008139585A1 WO 2008139585 A1 WO2008139585 A1 WO 2008139585A1 JP 2007059650 W JP2007059650 W JP 2007059650W WO 2008139585 A1 WO2008139585 A1 WO 2008139585A1
Authority
WO
WIPO (PCT)
Prior art keywords
cutting blade
crack
substrate
horizontal axis
cause
Prior art date
Application number
PCT/JP2007/059650
Other languages
English (en)
French (fr)
Inventor
Tomoo Uchikata
Akihiro Kanazawa
Toshiyuki Jinda
Original Assignee
Toray Engineering Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Engineering Co., Ltd. filed Critical Toray Engineering Co., Ltd.
Priority to PCT/JP2007/059650 priority Critical patent/WO2008139585A1/ja
Publication of WO2008139585A1 publication Critical patent/WO2008139585A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools

Abstract

【課題】極微小な初期亀裂を正確な位置に再現性良く形成することができる初期亀裂形成機構を提供すること。 【解決手段】初期亀裂形成機構３０は、基板Ｋに対向する先端に切削刃１７を備え、基板に対してその割断予定線Ｊに沿う方向Ｙに相対移動可能とされ、且つこの相対移動の方向と直交する水平軸１５回りに回動可能に軸支された切削刃ユニット１と、初期亀裂形成位置Ｐ１に切削刃を保持した状態で切削刃ユニットが前記水平軸の回りに回動することを規制し、前記相対移動により切削刃が基板における割断予定線の始端に衝突したときの抵抗力によって上記保持を解除可能とする第１保持手段５と、上記衝突により第１保持手段による保持が解除された切削刃ユニットを、上記水平軸の回りに回動させると共に退避位置Ｐ２に切削刃が位置するように保持する第２保持手段４とを備える。
PCT/JP2007/059650 2007-05-10 2007-05-10 初期亀裂形成機構 WO2008139585A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/059650 WO2008139585A1 (ja) 2007-05-10 2007-05-10 初期亀裂形成機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/059650 WO2008139585A1 (ja) 2007-05-10 2007-05-10 初期亀裂形成機構

Publications (1)

Publication Number Publication Date
WO2008139585A1 true WO2008139585A1 (ja) 2008-11-20

Family

ID=40001816

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/059650 WO2008139585A1 (ja) 2007-05-10 2007-05-10 初期亀裂形成機構

Country Status (1)

Country Link
WO (1) WO2008139585A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011194723A (ja) * 2010-03-19 2011-10-06 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法および分断装置
WO2012152784A3 (de) * 2011-05-09 2013-01-10 Wolfcraft Gmbh Fliesenschneider
US10675274B2 (en) 2018-09-19 2020-06-09 Forma Therapeutics, Inc. Activating pyruvate kinase R
US10836771B2 (en) 2017-03-20 2020-11-17 Forma Therapeutics, Inc. Compositions for activating pyruvate kinase
US11001588B2 (en) 2018-09-19 2021-05-11 Forma Therapeutics, Inc. Activating pyruvate kinase R and mutants thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0313040B2 (ja) * 1987-10-21 1991-02-21 Nagasaki Prefecture
JPH07164400A (ja) * 1993-12-15 1995-06-27 Nec Corp ガラス基板の切断装置
JPH1110376A (ja) * 1997-06-25 1999-01-19 Souei Tsusho Kk 割断加工方法
JP2003514673A (ja) * 1999-11-20 2003-04-22 ショット シュペツィアールグラス ゲーエムベーハー 脆性材平板加工物の切断方法及び装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0313040B2 (ja) * 1987-10-21 1991-02-21 Nagasaki Prefecture
JPH07164400A (ja) * 1993-12-15 1995-06-27 Nec Corp ガラス基板の切断装置
JPH1110376A (ja) * 1997-06-25 1999-01-19 Souei Tsusho Kk 割断加工方法
JP2003514673A (ja) * 1999-11-20 2003-04-22 ショット シュペツィアールグラス ゲーエムベーハー 脆性材平板加工物の切断方法及び装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011194723A (ja) * 2010-03-19 2011-10-06 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法および分断装置
WO2012152784A3 (de) * 2011-05-09 2013-01-10 Wolfcraft Gmbh Fliesenschneider
US10836771B2 (en) 2017-03-20 2020-11-17 Forma Therapeutics, Inc. Compositions for activating pyruvate kinase
US11014927B2 (en) 2017-03-20 2021-05-25 Forma Therapeutics, Inc. Pyrrolopyrrole compositions as pyruvate kinase (PKR) activators
US11396513B2 (en) 2017-03-20 2022-07-26 Forma Therapeutics, Inc. Compositions for activating pyruvate kinase
US11649242B2 (en) 2017-03-20 2023-05-16 Forma Therapeutics, Inc. Pyrrolopyrrole compositions as pyruvate kinase (PKR) activators
US10675274B2 (en) 2018-09-19 2020-06-09 Forma Therapeutics, Inc. Activating pyruvate kinase R
US11001588B2 (en) 2018-09-19 2021-05-11 Forma Therapeutics, Inc. Activating pyruvate kinase R and mutants thereof
US11071725B2 (en) 2018-09-19 2021-07-27 Forma Therapeutics, Inc. Activating pyruvate kinase R
US11844787B2 (en) 2018-09-19 2023-12-19 Novo Nordisk Health Care Ag Activating pyruvate kinase R

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