KR101251732B1 - 광 인쇄회로기판 및 그의 제조 방법 - Google Patents

광 인쇄회로기판 및 그의 제조 방법 Download PDF

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Publication number
KR101251732B1
KR101251732B1 KR1020100097472A KR20100097472A KR101251732B1 KR 101251732 B1 KR101251732 B1 KR 101251732B1 KR 1020100097472 A KR1020100097472 A KR 1020100097472A KR 20100097472 A KR20100097472 A KR 20100097472A KR 101251732 B1 KR101251732 B1 KR 101251732B1
Authority
KR
South Korea
Prior art keywords
insulating layer
optical waveguide
optical
light emitting
light receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020100097472A
Other languages
English (en)
Korean (ko)
Other versions
KR20120035757A (ko
Inventor
김재범
전기도
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020100097472A priority Critical patent/KR101251732B1/ko
Priority to US13/878,326 priority patent/US9459391B2/en
Priority to JP2013532726A priority patent/JP6050235B2/ja
Priority to PCT/KR2011/007378 priority patent/WO2012047024A2/en
Publication of KR20120035757A publication Critical patent/KR20120035757A/ko
Application granted granted Critical
Publication of KR101251732B1 publication Critical patent/KR101251732B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0005—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
    • G02B6/0008—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type the light being emitted at the end of the fibre
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73257—Bump and wire connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
KR1020100097472A 2010-10-06 2010-10-06 광 인쇄회로기판 및 그의 제조 방법 Expired - Fee Related KR101251732B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020100097472A KR101251732B1 (ko) 2010-10-06 2010-10-06 광 인쇄회로기판 및 그의 제조 방법
US13/878,326 US9459391B2 (en) 2010-10-06 2011-10-05 Optical printed circuit board and method for manufacturing the same
JP2013532726A JP6050235B2 (ja) 2010-10-06 2011-10-05 光印刷回路基板及びその製造方法
PCT/KR2011/007378 WO2012047024A2 (en) 2010-10-06 2011-10-05 Optical printed circuit board and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100097472A KR101251732B1 (ko) 2010-10-06 2010-10-06 광 인쇄회로기판 및 그의 제조 방법

Publications (2)

Publication Number Publication Date
KR20120035757A KR20120035757A (ko) 2012-04-16
KR101251732B1 true KR101251732B1 (ko) 2013-04-05

Family

ID=45928225

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100097472A Expired - Fee Related KR101251732B1 (ko) 2010-10-06 2010-10-06 광 인쇄회로기판 및 그의 제조 방법

Country Status (4)

Country Link
US (1) US9459391B2 (enExample)
JP (1) JP6050235B2 (enExample)
KR (1) KR101251732B1 (enExample)
WO (1) WO2012047024A2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9857544B2 (en) * 2015-10-09 2018-01-02 Te Connectivity Nederland B.V. Carrier having ablation-susceptible and ablation-insusceptible materials
KR102691019B1 (ko) * 2016-04-13 2024-07-31 택토텍 오와이 내장 면광원을 포함하는 조명 다층 구조체
US10877231B2 (en) * 2017-02-24 2020-12-29 Reflex Photonics Inc. Wirebonding for side-packaged optical engine
US11071199B2 (en) 2018-10-09 2021-07-20 City University Of Hong Kong Optical printed circuit board and its fabrication method
CN113467109A (zh) * 2020-03-31 2021-10-01 Tdk株式会社 光调制器
EP4152060B1 (en) * 2021-09-15 2025-05-21 Intel Corporation Photonic interconnect and components in glass
WO2023114260A1 (en) * 2021-12-14 2023-06-22 Aayuna Inc. Glass-based optical-to-optical coupling arrangement in high density interconnection configurations
US11899255B2 (en) 2022-06-17 2024-02-13 City University Of Hong Kong Optical printed circuit board and its fabricating method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000081524A (ja) * 1998-09-07 2000-03-21 Sony Corp 光送受信システム
KR20070080987A (ko) * 2006-02-09 2007-08-14 삼성전자주식회사 광 모듈
KR100810665B1 (ko) * 2007-03-30 2008-03-07 전자부품연구원 광전변환모듈 및 그 제조방법
KR20100123019A (ko) * 2009-05-14 2010-11-24 전자부품연구원 인쇄 회로 기판에 형성되는 광전 변환 모듈 및 이를 포함하는 ｌｓｉ 패키지

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08110446A (ja) * 1994-10-12 1996-04-30 Hitachi Ltd 光伝送モジュール
JP2002071963A (ja) 2000-08-31 2002-03-12 Kyocera Corp ファイバスタブ型光デバイス及びそれを用いた光モジュール
US7070207B2 (en) * 2003-04-22 2006-07-04 Ibiden Co., Ltd. Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication
US20050063637A1 (en) 2003-09-22 2005-03-24 Mershon Jayne L. Connecting a component with an embedded optical fiber
US8014638B2 (en) * 2006-04-03 2011-09-06 The University Of Tokyo Signal transmission device
JP2009003096A (ja) * 2007-06-20 2009-01-08 Sumitomo Bakelite Co Ltd 光導波路モジュール、光導波路モジュールの製造方法
JP2009086238A (ja) * 2007-09-28 2009-04-23 Nec Corp 平面光波回路及びその製造方法並びに光導波路デバイス

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000081524A (ja) * 1998-09-07 2000-03-21 Sony Corp 光送受信システム
KR20070080987A (ko) * 2006-02-09 2007-08-14 삼성전자주식회사 광 모듈
KR100810665B1 (ko) * 2007-03-30 2008-03-07 전자부품연구원 광전변환모듈 및 그 제조방법
KR20100123019A (ko) * 2009-05-14 2010-11-24 전자부품연구원 인쇄 회로 기판에 형성되는 광전 변환 모듈 및 이를 포함하는 ｌｓｉ 패키지

Also Published As

Publication number Publication date
JP6050235B2 (ja) 2016-12-21
US9459391B2 (en) 2016-10-04
JP2013539082A (ja) 2013-10-17
US20130286676A1 (en) 2013-10-31
KR20120035757A (ko) 2012-04-16
WO2012047024A3 (en) 2012-06-21
WO2012047024A2 (en) 2012-04-12

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