JP6050235B2 - 光印刷回路基板及びその製造方法 - Google Patents

光印刷回路基板及びその製造方法 Download PDF

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Publication number
JP6050235B2
JP6050235B2 JP2013532726A JP2013532726A JP6050235B2 JP 6050235 B2 JP6050235 B2 JP 6050235B2 JP 2013532726 A JP2013532726 A JP 2013532726A JP 2013532726 A JP2013532726 A JP 2013532726A JP 6050235 B2 JP6050235 B2 JP 6050235B2
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JP
Japan
Prior art keywords
insulating layer
optical waveguide
optical
hole
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013532726A
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English (en)
Japanese (ja)
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JP2013539082A5 (enExample
JP2013539082A (ja
Inventor
ボム キム、ジェ
ボム キム、ジェ
ド チュン、キ
ド チュン、キ
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LG Innotek Co Ltd
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LG Innotek Co Ltd
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Publication date
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Publication of JP2013539082A publication Critical patent/JP2013539082A/ja
Publication of JP2013539082A5 publication Critical patent/JP2013539082A5/ja
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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0005—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
    • G02B6/0008—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type the light being emitted at the end of the fibre
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73257—Bump and wire connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
JP2013532726A 2010-10-06 2011-10-05 光印刷回路基板及びその製造方法 Active JP6050235B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2010-0097472 2010-10-06
KR1020100097472A KR101251732B1 (ko) 2010-10-06 2010-10-06 광 인쇄회로기판 및 그의 제조 방법
PCT/KR2011/007378 WO2012047024A2 (en) 2010-10-06 2011-10-05 Optical printed circuit board and method for manufacturing the same

Publications (3)

Publication Number Publication Date
JP2013539082A JP2013539082A (ja) 2013-10-17
JP2013539082A5 JP2013539082A5 (enExample) 2014-11-27
JP6050235B2 true JP6050235B2 (ja) 2016-12-21

Family

ID=45928225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013532726A Active JP6050235B2 (ja) 2010-10-06 2011-10-05 光印刷回路基板及びその製造方法

Country Status (4)

Country Link
US (1) US9459391B2 (enExample)
JP (1) JP6050235B2 (enExample)
KR (1) KR101251732B1 (enExample)
WO (1) WO2012047024A2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9857544B2 (en) * 2015-10-09 2018-01-02 Te Connectivity Nederland B.V. Carrier having ablation-susceptible and ablation-insusceptible materials
CN109073203A (zh) * 2016-04-13 2018-12-21 塔科图特科有限责任公司 具有嵌入的区域光源的照明的多层结构
WO2018152647A1 (en) * 2017-02-24 2018-08-30 Reflex Photonics Inc. Wirebonding for side-packaged optical engine
US11071199B2 (en) 2018-10-09 2021-07-20 City University Of Hong Kong Optical printed circuit board and its fabrication method
CN113467109A (zh) * 2020-03-31 2021-10-01 Tdk株式会社 光调制器
EP4152060B1 (en) * 2021-09-15 2025-05-21 Intel Corporation Photonic interconnect and components in glass
WO2023114260A1 (en) * 2021-12-14 2023-06-22 Aayuna Inc. Glass-based optical-to-optical coupling arrangement in high density interconnection configurations
US11899255B2 (en) 2022-06-17 2024-02-13 City University Of Hong Kong Optical printed circuit board and its fabricating method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08110446A (ja) 1994-10-12 1996-04-30 Hitachi Ltd 光伝送モジュール
JP2000081524A (ja) * 1998-09-07 2000-03-21 Sony Corp 光送受信システム
JP2002071963A (ja) 2000-08-31 2002-03-12 Kyocera Corp ファイバスタブ型光デバイス及びそれを用いた光モジュール
US7070207B2 (en) * 2003-04-22 2006-07-04 Ibiden Co., Ltd. Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication
US20050063637A1 (en) 2003-09-22 2005-03-24 Mershon Jayne L. Connecting a component with an embedded optical fiber
KR100770853B1 (ko) * 2006-02-09 2007-10-26 삼성전자주식회사 광 모듈
JP4876263B2 (ja) * 2006-04-03 2012-02-15 国立大学法人 東京大学 信号伝送機器
KR100810665B1 (ko) * 2007-03-30 2008-03-07 전자부품연구원 광전변환모듈 및 그 제조방법
JP2009003096A (ja) 2007-06-20 2009-01-08 Sumitomo Bakelite Co Ltd 光導波路モジュール、光導波路モジュールの製造方法
JP2009086238A (ja) 2007-09-28 2009-04-23 Nec Corp 平面光波回路及びその製造方法並びに光導波路デバイス
KR101012757B1 (ko) * 2009-05-14 2011-02-08 전자부품연구원 인쇄 회로 기판에 형성되는 광전 변환 모듈 및 이를 포함하는 ｌｓｉ 패키지

Also Published As

Publication number Publication date
KR20120035757A (ko) 2012-04-16
US9459391B2 (en) 2016-10-04
WO2012047024A2 (en) 2012-04-12
WO2012047024A3 (en) 2012-06-21
JP2013539082A (ja) 2013-10-17
US20130286676A1 (en) 2013-10-31
KR101251732B1 (ko) 2013-04-05

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