JP6050235B2 - 光印刷回路基板及びその製造方法 - Google Patents
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- 230000003287 optical effect Effects 0.000 title claims description 215
- 238000004519 manufacturing process Methods 0.000 title claims description 36
- 239000000758 substrate Substances 0.000 claims description 53
- 238000000034 method Methods 0.000 claims description 26
- 238000005530 etching Methods 0.000 claims description 7
- 238000012546 transfer Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910003471 inorganic composite material Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0005—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
- G02B6/0008—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type the light being emitted at the end of the fibre
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/46—Processes or apparatus adapted for installing or repairing optical fibres or optical cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73257—Bump and wire connectors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
Description
Claims (12)
- 絶縁基板と、
前記絶縁基板の上に配置され、一定間隔をおいて第1ホール及び第2ホールが形成された第1絶縁層と、
前記第1ホール及び前記第2ホールの間の前記第1絶縁層の上に配置される光導波路と、
前記第1絶縁層の第1ホール及び第2ホールを露出する第3ホール及び第4ホールを含み、前記第1絶縁層及び前記光導波路の上に配置され、前記第1絶縁層の上面及び前記光導波路の上面を覆う第2絶縁層と、
前記第1ホール及び前記第3ホール内に実装され、少なくとも一面が前記光導波路の一面と直接接触して、前記接触した光導波路の一面を通じて光信号を出力する発光素子と、
前記第2ホール及び前記第4ホール内に実装され、少なくとも一面が前記光導波路の他面と直接接触して、前記接触した光導波路の他面を通じて伝えられる光信号を受信する受光素子と、を含み、
前記第1絶縁層は、上面に前記光導波路が配置される第1領域と、前記第1領域を除外した前記絶縁基板の上に形成され、前記第1領域と同一の厚さを有し、前記発光素子と受光素子とを連結する仮想直線上に前記光導波路を整列させるための第2領域とを含み、
前記第2絶縁層は、前記光導波路の上に形成される第3領域と、前記第1領域を除外した前記第1絶縁層の第2領域の上に形成され、前記第3領域の厚さより厚い厚さを有する第4領域とを含み、
前記第4領域の厚さは、前記第3領域と前記光導波路の厚さの和に相応することを特徴とする光印刷回路基板。 - 前記光導波路の一面は前記第1ホール及び前記第3ホールを通じて露出され、
前記光導波路の他面は前記第2ホール及び前記第4ホールを通じて露出され、
前記発光素子及び受光素子は、
前記第1ホール及び前記第2ホール及び前記第3ホール及び前記第4ホールを通じて各々露出される光導波路の一面及び他面と直接接触しながら配置されることを特徴とする請求項1に記載の光印刷回路基板。 - 前記光導波路は、前記第1絶縁層の上で前記発光素子と受光素子とを連結する仮想直線上に配置されることを特徴とする請求項1または2に記載の光印刷回路基板。
- 前記第1ホール及び前記第3ホール内に配置される第1集積回路と、
前記第2ホール及び前記第4ホール内に配置される第2集積回路と、
をさらに含むことを特徴とする請求項1乃至3のいずれか1項に記載の光印刷回路基板。 - 絶縁基板を準備するステップと、
前記絶縁基板の上に一定間隔をおいて発光素子及び受光素子を実装するステップと、
前記絶縁基板の上に前記発光素子及び受光素子を露出させる第1絶縁層を形成するステップと、
前記発光素子及び受光素子の間に形成された第1絶縁層の上に光導波路を形成するステップと、を含み、
前記光導波路を形成するステップは、
一面が前記発光素子の少なくとも一面と直接接触し、他面が前記受光素子の少なくとも一面と直接接触して、前記接触した発光素子の少なくとも一面を通じて伝えられる光信号を前記接触した受光素子の少なくとも一面に伝達する光導波路を形成するステップを含むことを特徴とする光印刷回路基板の製造方法。 - 前記光導波路を形成するステップは、
前記発光素子と受光素子とを連結する仮想直線上に前記光導波路を形成するステップであることを特徴とする請求項5に記載の光印刷回路基板の製造方法。 - 前記光導波路が形成された部分を除外した第1絶縁層の上に第2絶縁層を形成するステップと、
前記第2絶縁層及び光導波路の上に第3絶縁層を形成するステップと、
をさらに含むことを特徴とする請求項5または6に記載の光印刷回路基板の製造方法。 - 前記第2絶縁層は、前記形成された光導波路と同一の厚さを有することを特徴とする請求項7に記載の光印刷回路基板の製造方法。
- 前記第1絶縁層及び光導波路の上に第2絶縁層を形成するステップと、
前記形成された第2絶縁層をデスミア処理するステップと、
をさらに含むことを特徴とする請求項5乃至8のいずれか1項に記載の光印刷回路基板の製造方法。 - 絶縁基板を準備するステップと、
前記絶縁基板の上に第1絶縁層を形成するステップと、
前記形成された第1絶縁層をエッチングして複数のキャビティを形成するステップと、
前記形成された複数のキャビティに発光素子及び受光素子を各々実装するステップと、
前記複数のキャビティの間に形成された第1絶縁層の上に光導波路を形成するステップと、を含み、
前記光導波路を形成するステップは、
一面が前記発光素子の少なくとも一面と直接接触し、他面が前記受光素子の少なくとも一面と直接接触して、前記接触した発光素子の少なくとも一面を通じて伝えられる光信号を前記接触した受光素子の少なくとも一面に伝達する光導波路を形成するステップを含むことを特徴とする光印刷回路基板の製造方法。 - 前記形成される第1絶縁層の厚さは、前記発光素子及び受光素子を連結する仮想直線上に前記光導波路を整列させるための高さを有することを特徴とする請求項10に記載の光印刷回路基板の製造方法。
- 前記第1絶縁層及び光導波路の上に前記形成された光導波路を保護する第2絶縁層を形成するステップをさらに含むことを特徴とする請求項10または11に記載の光印刷回路基板の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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KR1020100097472A KR101251732B1 (ko) | 2010-10-06 | 2010-10-06 | 광 인쇄회로기판 및 그의 제조 방법 |
KR10-2010-0097472 | 2010-10-06 | ||
PCT/KR2011/007378 WO2012047024A2 (en) | 2010-10-06 | 2011-10-05 | Optical printed circuit board and method for manufacturing the same |
Publications (3)
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JP2013539082A JP2013539082A (ja) | 2013-10-17 |
JP2013539082A5 JP2013539082A5 (ja) | 2014-11-27 |
JP6050235B2 true JP6050235B2 (ja) | 2016-12-21 |
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JP2013532726A Active JP6050235B2 (ja) | 2010-10-06 | 2011-10-05 | 光印刷回路基板及びその製造方法 |
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US (1) | US9459391B2 (ja) |
JP (1) | JP6050235B2 (ja) |
KR (1) | KR101251732B1 (ja) |
WO (1) | WO2012047024A2 (ja) |
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US9857544B2 (en) * | 2015-10-09 | 2018-01-02 | Te Connectivity Nederland B.V. | Carrier having ablation-susceptible and ablation-insusceptible materials |
JP7041071B2 (ja) * | 2016-04-13 | 2022-03-23 | タクトテク オーユー | 埋め込まれた面光源を有する照明多層構造体 |
WO2018152647A1 (en) * | 2017-02-24 | 2018-08-30 | Reflex Photonics Inc. | Wirebonding for side-packaged optical engine |
US11071199B2 (en) | 2018-10-09 | 2021-07-20 | City University Of Hong Kong | Optical printed circuit board and its fabrication method |
US20230083222A1 (en) * | 2021-09-15 | 2023-03-16 | Intel Corporation | Photonic interconnect and components in glass |
WO2023114260A1 (en) * | 2021-12-14 | 2023-06-22 | Aayuna Inc. | Glass-based optical-to-optical coupling arrangement in high density interconnection configurations |
US11899255B2 (en) | 2022-06-17 | 2024-02-13 | City University Of Hong Kong | Optical printed circuit board and its fabricating method |
Family Cites Families (11)
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JPH08110446A (ja) * | 1994-10-12 | 1996-04-30 | Hitachi Ltd | 光伝送モジュール |
JP2000081524A (ja) | 1998-09-07 | 2000-03-21 | Sony Corp | 光送受信システム |
JP2002071963A (ja) | 2000-08-31 | 2002-03-12 | Kyocera Corp | ファイバスタブ型光デバイス及びそれを用いた光モジュール |
US7070207B2 (en) * | 2003-04-22 | 2006-07-04 | Ibiden Co., Ltd. | Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication |
US20050063637A1 (en) | 2003-09-22 | 2005-03-24 | Mershon Jayne L. | Connecting a component with an embedded optical fiber |
KR100770853B1 (ko) * | 2006-02-09 | 2007-10-26 | 삼성전자주식회사 | 광 모듈 |
WO2007114384A1 (ja) * | 2006-04-03 | 2007-10-11 | The University Of Tokyo | 信号伝送機器 |
KR100810665B1 (ko) | 2007-03-30 | 2008-03-07 | 전자부품연구원 | 광전변환모듈 및 그 제조방법 |
JP2009003096A (ja) | 2007-06-20 | 2009-01-08 | Sumitomo Bakelite Co Ltd | 光導波路モジュール、光導波路モジュールの製造方法 |
JP2009086238A (ja) | 2007-09-28 | 2009-04-23 | Nec Corp | 平面光波回路及びその製造方法並びに光導波路デバイス |
KR101012757B1 (ko) * | 2009-05-14 | 2011-02-08 | 전자부품연구원 | 인쇄 회로 기판에 형성되는 광전 변환 모듈 및 이를 포함하는 lsi 패키지 |
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- 2010-10-06 KR KR1020100097472A patent/KR101251732B1/ko not_active IP Right Cessation
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- 2011-10-05 US US13/878,326 patent/US9459391B2/en active Active
- 2011-10-05 JP JP2013532726A patent/JP6050235B2/ja active Active
- 2011-10-05 WO PCT/KR2011/007378 patent/WO2012047024A2/en active Application Filing
Also Published As
Publication number | Publication date |
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KR20120035757A (ko) | 2012-04-16 |
JP2013539082A (ja) | 2013-10-17 |
KR101251732B1 (ko) | 2013-04-05 |
WO2012047024A3 (en) | 2012-06-21 |
US20130286676A1 (en) | 2013-10-31 |
WO2012047024A2 (en) | 2012-04-12 |
US9459391B2 (en) | 2016-10-04 |
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