JP5593390B2 - 光印刷回路基板及びその製造方法 - Google Patents
光印刷回路基板及びその製造方法 Download PDFInfo
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- JP5593390B2 JP5593390B2 JP2012536643A JP2012536643A JP5593390B2 JP 5593390 B2 JP5593390 B2 JP 5593390B2 JP 2012536643 A JP2012536643 A JP 2012536643A JP 2012536643 A JP2012536643 A JP 2012536643A JP 5593390 B2 JP5593390 B2 JP 5593390B2
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- JP
- Japan
- Prior art keywords
- optical fiber
- insulating member
- support member
- optical
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000003287 optical effect Effects 0.000 title claims description 52
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 239000013307 optical fiber Substances 0.000 claims description 75
- 238000000034 method Methods 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 2
- 238000005253 cladding Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3608—Fibre wiring boards, i.e. where fibres are embedded or attached in a pattern on or to a substrate, e.g. flexible sheets
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
- G02B6/3644—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the coupling means being through-holes or wall apertures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Guides In General And Applications Therefor (AREA)
- Structure Of Printed Boards (AREA)
Description
Claims (11)
- 絶縁部材と、
前記絶縁部材の内部に配置され、両端部が絶縁部材の一側に露出される光ファイバーと、
前記光ファイバーの両端部に結合されて前記光ファイバーが折り曲げられるようにガイドするガイド部が形成された支持部材と、を含み、
前記ガイド部は、前記支持部材を貫通し、前記絶縁部材の主面に対して傾斜した傾斜面を有するガイドホールであり、
前記光ファイバーは、前記ガイドホール内で前記傾斜面に接触して、前記傾斜面の傾斜角度に対応する角度に折り曲げられて前記ガイドホール内に挿入されることを特徴とする、光印刷回路基板。 - 前記ガイドホールは、前記支持部材の両面に形成される第1開口及び第2開口を含み、前記第1開口は前記第2開口に比べて前記絶縁部材の表面に隣接し、面積が小さいことを特徴とする、請求項1に記載の光印刷回路基板。
- 前記絶縁部材は、第1絶縁部材、及び前記第1絶縁部材及び前記光ファイバーと融着される第2絶縁部材を含むことを特徴とする、請求項1に記載の光印刷回路基板。
- 前記支持部材は第1支持部材及び第2支持部材を含み、前記第1支持部材と第2支持部材とは互いに離隔して少なくとも一部分が前記絶縁部材の外部に露出されることを特徴とする、請求項1に記載の光印刷回路基板。
- 前記光ファイバーは、両端部が前記第1支持部材及び第2支持部材を通じて前記絶縁部材の外部に露出されることを特徴とする、請求項4に記載の光印刷回路基板。
- 前記第1支持部材により外部に露出された光ファイバーに対向して配置される送信モジュール、及び前記第2支持部材により外部に露出された光ファイバーに対向して配置される受信モジュールを含むことを特徴とする、請求項4に記載の光印刷回路基板。
- 第1絶縁部材に光ファイバー配置領域を設けるステップと、
前記光ファイバー配置領域に光ファイバー及び前記光ファイバーの両端部に結合された第1及び第2支持部材を取り付けるステップと、
前記光ファイバー配置領域を第2絶縁部材で覆うステップと、
を含み、
前記第1及び第2支持部材は、
前記第1絶縁部材の主面に対して傾斜した傾斜面を有し、前記光ファイバーが折り曲げられるようにガイドするガイドホールを含み、
前記光ファイバーは、前記ガイドホール内で前記傾斜面に接触して、前記傾斜面の傾斜角度に対応する角度に折り曲げられて前記ガイドホール内に挿入されることを特徴とする、光印刷回路基板の製造方法。 - 前記第1絶縁部材に光ファイバー配置領域を設けるステップの以後、前記光ファイバー配置領域に前記第1及び第2支持部材が取り付けられる取付ホールを設けるステップをさらに含むことを特徴とする、請求項7に記載の光印刷回路基板の製造方法。
- 前記第2絶縁部材は、加圧成形により前記第1絶縁部材と結合されることを特徴とする、請求項7に記載の光印刷回路基板の製造方法。
- 前記第1支持部材と第2支持部材とは互いに離隔して、少なくとも一部分が前記第1絶縁部材及び第2絶縁部材の外部に露出されることを特徴とする、請求項7に記載の光印刷回路基板の製造方法。
- 前記第1支持部材により外部に露出された光ファイバーに対向するように送信モジュールを設置するステップ、及び前記第2支持部材により外部に露出された光ファイバーに対向するように受信モジュールを設置するステップを含むことを特徴とする、請求項7に記載の光印刷回路基板の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/KR2009/006490 WO2011055868A1 (ko) | 2009-11-05 | 2009-11-05 | 광 인쇄회로기판 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013510330A JP2013510330A (ja) | 2013-03-21 |
JP5593390B2 true JP5593390B2 (ja) | 2014-09-24 |
Family
ID=43970098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012536643A Expired - Fee Related JP5593390B2 (ja) | 2009-11-05 | 2009-11-05 | 光印刷回路基板及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9057854B2 (ja) |
JP (1) | JP5593390B2 (ja) |
KR (1) | KR101509872B1 (ja) |
CN (1) | CN102132179B (ja) |
WO (1) | WO2011055868A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102928936B (zh) * | 2012-11-12 | 2017-03-22 | 依利安达(广州)电子有限公司 | 一种光学印刷电路板的制造方法 |
WO2014146204A1 (en) * | 2013-03-22 | 2014-09-25 | Canadian Microelectronics Corporation | Wafer-level fiber to coupler connector |
KR101968827B1 (ko) | 2017-08-17 | 2019-04-12 | 김현춘 | Vcm 방식 카메라 모듈 조립용 볼 공급장치 |
KR101980970B1 (ko) | 2017-08-17 | 2019-05-21 | 김현춘 | Vcm 방식 카메라 모듈 조립용 마그네트 공급장치 |
US10234644B1 (en) * | 2017-10-20 | 2019-03-19 | Corning Optical Communications LLC | Optical-electrical printed circuit boards with integrated optical waveguide arrays and photonic assemblies using same |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3967877A (en) * | 1974-07-16 | 1976-07-06 | International Business Machines (Ibm) | Coupler for coupling optical energy transmitted by optical fiber to optical waveguide and method of manufacture |
JP2780789B2 (ja) | 1988-09-26 | 1998-07-30 | 株式会社日立製作所 | 光コネクタ付き基板 |
JPH04152587A (ja) | 1990-10-16 | 1992-05-26 | Mitsubishi Electric Corp | プリント配線基板 |
FR2685098B1 (fr) * | 1991-12-12 | 1995-02-10 | Andre Schiltz | Procede de montage et de couplage optique sur un substrat et substrat equipe d'une fibre optique. |
US6137930A (en) * | 1998-07-08 | 2000-10-24 | Optical Switch Corporation | Method and apparatus for aligning optical fibers |
US6527456B1 (en) * | 1999-10-13 | 2003-03-04 | Teraconnect, Inc. | Cluster integration approach to optical transceiver arrays and fiber bundles |
US6623177B1 (en) * | 2001-07-09 | 2003-09-23 | Emc Corporation | Systems and methods for providing fiber optic communications between circuit boards |
KR100569237B1 (ko) * | 2004-08-19 | 2006-04-10 | 인하대학교 산학협력단 | 광섬유 완충부를 형성한 인쇄회로기판 및 그의 제조 방법 |
KR100623477B1 (ko) | 2004-08-25 | 2006-09-19 | 한국정보통신대학교 산학협력단 | 광섬유 다발을 이용한 광 인쇄회로기판 및 광연결 블록 |
US7389013B2 (en) * | 2004-09-30 | 2008-06-17 | Stmicroelectronics, Inc. | Method and system for vertical optical coupling on semiconductor substrate |
US7586747B2 (en) * | 2005-08-01 | 2009-09-08 | Salmon Technologies, Llc. | Scalable subsystem architecture having integrated cooling channels |
KR100905140B1 (ko) | 2007-09-28 | 2009-06-29 | 한국정보통신대학교 산학협력단 | 광 도파로가 적층된 광 인쇄회로기판을 이용한 광연결시스템 |
KR100976654B1 (ko) | 2008-02-26 | 2010-08-18 | 한국과학기술원 | 광 인쇄회로기판 및 그 제조 방법 |
-
2009
- 2009-11-05 JP JP2012536643A patent/JP5593390B2/ja not_active Expired - Fee Related
- 2009-11-05 WO PCT/KR2009/006490 patent/WO2011055868A1/ko active Application Filing
- 2009-11-05 CN CN200980132697.5A patent/CN102132179B/zh not_active Expired - Fee Related
- 2009-11-05 US US13/060,313 patent/US9057854B2/en not_active Expired - Fee Related
- 2009-11-05 KR KR1020127014649A patent/KR101509872B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2013510330A (ja) | 2013-03-21 |
CN102132179B (zh) | 2015-07-15 |
WO2011055868A1 (ko) | 2011-05-12 |
US20110216999A1 (en) | 2011-09-08 |
US9057854B2 (en) | 2015-06-16 |
KR101509872B1 (ko) | 2015-04-06 |
KR20120085890A (ko) | 2012-08-01 |
CN102132179A (zh) | 2011-07-20 |
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