KR101236881B1 - 전자 부품재 - Google Patents

전자 부품재 Download PDF

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Publication number
KR101236881B1
KR101236881B1 KR1020110091949A KR20110091949A KR101236881B1 KR 101236881 B1 KR101236881 B1 KR 101236881B1 KR 1020110091949 A KR1020110091949 A KR 1020110091949A KR 20110091949 A KR20110091949 A KR 20110091949A KR 101236881 B1 KR101236881 B1 KR 101236881B1
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KR
South Korea
Prior art keywords
mass
less
alloy
plating layer
electronic component
Prior art date
Application number
KR1020110091949A
Other languages
English (en)
Korean (ko)
Other versions
KR20120031439A (ko
Inventor
도시유키 미쓰이
시게루 이세키
사토루 가타야마
마사야스 니시무라
히데하루 마쓰다
Original Assignee
신코 리드믹 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from JP2011127581A external-priority patent/JP4918621B1/ja
Application filed by 신코 리드믹 가부시키가이샤 filed Critical 신코 리드믹 가부시키가이샤
Publication of KR20120031439A publication Critical patent/KR20120031439A/ko
Application granted granted Critical
Publication of KR101236881B1 publication Critical patent/KR101236881B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
KR1020110091949A 2010-09-24 2011-09-09 전자 부품재 KR101236881B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2010-214078 2010-09-24
JP2010214078 2010-09-24
JPJP-P-2011-127581 2011-06-07
JP2011127581A JP4918621B1 (ja) 2010-09-24 2011-06-07 電子部品材

Publications (2)

Publication Number Publication Date
KR20120031439A KR20120031439A (ko) 2012-04-03
KR101236881B1 true KR101236881B1 (ko) 2013-02-26

Family

ID=45941490

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110091949A KR101236881B1 (ko) 2010-09-24 2011-09-09 전자 부품재

Country Status (2)

Country Link
KR (1) KR101236881B1 (zh)
CN (1) CN102416725B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104480352B (zh) * 2014-12-09 2016-08-24 常州大学 一种具有交替型层片组织特征的Al-Co-W合金及其制备方法
CN105087969A (zh) * 2015-08-04 2015-11-25 常州市鼎日环保科技有限公司 一种高导电铝合金线材
CN106410467B (zh) * 2016-09-19 2018-11-02 中国电子科技集团公司第十八研究所 一种铝汇流条的加工工艺
CN109913714B (zh) * 2017-12-12 2021-10-29 东莞顺成五金制造有限公司 一种食品机械用合金连接件及其制备工艺
CN110157960A (zh) * 2019-05-10 2019-08-23 天津市津和双金属线材有限公司 一种5154合金杆的制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005050780A (ja) * 2003-07-15 2005-02-24 Hitachi Cable Ltd 平角導体及びその製造方法並びにリード線

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0578889A (ja) * 1991-09-25 1993-03-30 Kobe Steel Ltd 端子用アルミニウム合金板
JP2004006065A (ja) * 2002-03-25 2004-01-08 Mitsubishi Shindoh Co Ltd 電気接続用嵌合型接続端子
JP2003301292A (ja) * 2002-04-12 2003-10-24 Totoku Electric Co Ltd めっきアルミニウム線およびエナメル被覆めっきアルミニウム線

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005050780A (ja) * 2003-07-15 2005-02-24 Hitachi Cable Ltd 平角導体及びその製造方法並びにリード線

Also Published As

Publication number Publication date
CN102416725B (zh) 2015-05-06
CN102416725A (zh) 2012-04-18
KR20120031439A (ko) 2012-04-03

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