KR101222505B1 - 소켓 가이드, 소켓, 푸셔 및 전자부품 시험장치 - Google Patents

소켓 가이드, 소켓, 푸셔 및 전자부품 시험장치 Download PDF

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Publication number
KR101222505B1
KR101222505B1 KR1020117001989A KR20117001989A KR101222505B1 KR 101222505 B1 KR101222505 B1 KR 101222505B1 KR 1020117001989 A KR1020117001989 A KR 1020117001989A KR 20117001989 A KR20117001989 A KR 20117001989A KR 101222505 B1 KR101222505 B1 KR 101222505B1
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KR
South Korea
Prior art keywords
socket
atmosphere
electronic component
pusher
partition member
Prior art date
Application number
KR1020117001989A
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English (en)
Korean (ko)
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KR20110022719A (ko
Inventor
미츠오 이시가와
아리토모 키구치
Original Assignee
가부시키가이샤 아드반테스트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 가부시키가이샤 아드반테스트 filed Critical 가부시키가이샤 아드반테스트
Publication of KR20110022719A publication Critical patent/KR20110022719A/ko
Application granted granted Critical
Publication of KR101222505B1 publication Critical patent/KR101222505B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020117001989A 2008-07-14 2008-07-14 소켓 가이드, 소켓, 푸셔 및 전자부품 시험장치 KR101222505B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2008/062682 WO2010007653A1 (ja) 2008-07-14 2008-07-14 ソケットガイド、ソケット、プッシャおよび電子部品試験装置

Publications (2)

Publication Number Publication Date
KR20110022719A KR20110022719A (ko) 2011-03-07
KR101222505B1 true KR101222505B1 (ko) 2013-01-15

Family

ID=41550072

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117001989A KR101222505B1 (ko) 2008-07-14 2008-07-14 소켓 가이드, 소켓, 푸셔 및 전자부품 시험장치

Country Status (3)

Country Link
JP (1) JPWO2010007653A1 (ja)
KR (1) KR101222505B1 (ja)
WO (1) WO2010007653A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9625522B2 (en) 2014-10-31 2017-04-18 Samsung Electronics Co., Ltd. Adaptor structure and apparatus for testing a semiconductor package including the same

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5952645B2 (ja) 2012-06-06 2016-07-13 東京エレクトロン株式会社 ウエハ検査用インターフェース及びウエハ検査装置
KR102037926B1 (ko) * 2013-04-10 2019-10-29 세메스 주식회사 반도체 패키지 검사용 온도 제어 장치
JP2017116369A (ja) * 2015-12-24 2017-06-29 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
JP6719784B2 (ja) 2018-12-21 2020-07-08 株式会社 Ｓｙｎａｘ ハンドラ
JP6770758B2 (ja) * 2019-01-15 2020-10-21 株式会社 Ｓｙｎａｘ コンタクタおよびハンドラ
US20230358803A1 (en) * 2022-05-06 2023-11-09 Nanya Technology Corporation Probing device and inspection method using the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0452572A (ja) * 1990-06-20 1992-02-20 Nec Kyushu Ltd 高温特性測定装置
JP2007113949A (ja) * 2005-10-18 2007-05-10 Genesis Technology Inc デバイス試験機構、ハンドラおよびデバイスの試験方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0719015Y2 (ja) * 1989-12-20 1995-05-01 株式会社アドバンテスト Ｉｃ試験用恒温槽装置
JP3099254B2 (ja) * 1994-02-28 2000-10-16 安藤電気株式会社 浮動機構つき吸着ハンドおよび搬送接触機構
JP3390858B2 (ja) * 1996-08-28 2003-03-31 株式会社アドバンテスト Ｉｃ試験用恒温槽
JP3848785B2 (ja) * 1997-05-12 2006-11-22 株式会社アドバンテスト 半導体デバイス試験装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0452572A (ja) * 1990-06-20 1992-02-20 Nec Kyushu Ltd 高温特性測定装置
JP2007113949A (ja) * 2005-10-18 2007-05-10 Genesis Technology Inc デバイス試験機構、ハンドラおよびデバイスの試験方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9625522B2 (en) 2014-10-31 2017-04-18 Samsung Electronics Co., Ltd. Adaptor structure and apparatus for testing a semiconductor package including the same

Also Published As

Publication number Publication date
JPWO2010007653A1 (ja) 2012-01-05
WO2010007653A1 (ja) 2010-01-21
KR20110022719A (ko) 2011-03-07

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