KR101212473B1 - 집적 회로 및 회로 기판의 직접 칩 실장 결합 구성에서의 열에너지 분산을 개선하기 위한 방법 및 장치 - Google Patents
집적 회로 및 회로 기판의 직접 칩 실장 결합 구성에서의 열에너지 분산을 개선하기 위한 방법 및 장치 Download PDFInfo
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- KR101212473B1 KR101212473B1 KR1020087024806A KR20087024806A KR101212473B1 KR 101212473 B1 KR101212473 B1 KR 101212473B1 KR 1020087024806 A KR1020087024806 A KR 1020087024806A KR 20087024806 A KR20087024806 A KR 20087024806A KR 101212473 B1 KR101212473 B1 KR 101212473B1
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- Physics & Mathematics (AREA)
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/US2006/014009 WO2007120124A1 (en) | 2006-04-14 | 2006-04-14 | Method and apparatus for improving thermal energy dissipation in a direct-chip-attach coupling configuration of an integrated circuit and a circuit board |
Publications (2)
Publication Number | Publication Date |
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KR20090004941A KR20090004941A (ko) | 2009-01-12 |
KR101212473B1 true KR101212473B1 (ko) | 2012-12-18 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020087024806A KR101212473B1 (ko) | 2006-04-14 | 2006-04-14 | 집적 회로 및 회로 기판의 직접 칩 실장 결합 구성에서의 열에너지 분산을 개선하기 위한 방법 및 장치 |
Country Status (3)
Country | Link |
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JP (1) | JP2009533865A (ja) |
KR (1) | KR101212473B1 (ja) |
WO (1) | WO2007120124A1 (ja) |
Citations (1)
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JP2003046022A (ja) * | 2001-05-22 | 2003-02-14 | Hitachi Ltd | 電子装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH05109943A (ja) * | 1991-10-21 | 1993-04-30 | Fujitsu Ltd | 集積回路の冷却構造 |
JPH05243415A (ja) * | 1992-02-26 | 1993-09-21 | Sony Corp | 配線基板 |
JP2000012723A (ja) * | 1998-06-23 | 2000-01-14 | Nitto Denko Corp | 回路基板の実装構造体およびそれに用いる多層回路基板 |
JP3446826B2 (ja) * | 2000-04-06 | 2003-09-16 | 沖電気工業株式会社 | 半導体装置及びその製造方法 |
US6744135B2 (en) * | 2001-05-22 | 2004-06-01 | Hitachi, Ltd. | Electronic apparatus |
JP2003200535A (ja) * | 2001-10-25 | 2003-07-15 | Matsushita Electric Ind Co Ltd | プリプレグおよび回路基板、ならびにそれらの製造方法 |
JP4462473B2 (ja) * | 2002-07-01 | 2010-05-12 | 富士通株式会社 | 高周波回路基板及びそれを用いた半導体装置 |
US7199466B2 (en) * | 2004-05-03 | 2007-04-03 | Intel Corporation | Package design using thermal linkage from die to printed circuit board |
US7453157B2 (en) * | 2004-06-25 | 2008-11-18 | Tessera, Inc. | Microelectronic packages and methods therefor |
-
2006
- 2006-04-14 WO PCT/US2006/014009 patent/WO2007120124A1/en active Application Filing
- 2006-04-14 KR KR1020087024806A patent/KR101212473B1/ko not_active IP Right Cessation
- 2006-04-14 JP JP2009505342A patent/JP2009533865A/ja active Pending
Patent Citations (1)
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JP2003046022A (ja) * | 2001-05-22 | 2003-02-14 | Hitachi Ltd | 電子装置 |
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WO2007120124A1 (en) | 2007-10-25 |
JP2009533865A (ja) | 2009-09-17 |
KR20090004941A (ko) | 2009-01-12 |
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