KR101203400B1 - 회로 기판용 금속 부착 중합체 필름 및 이의 제조방법 - Google Patents

회로 기판용 금속 부착 중합체 필름 및 이의 제조방법 Download PDF

Info

Publication number
KR101203400B1
KR101203400B1 KR20050091134A KR20050091134A KR101203400B1 KR 101203400 B1 KR101203400 B1 KR 101203400B1 KR 20050091134 A KR20050091134 A KR 20050091134A KR 20050091134 A KR20050091134 A KR 20050091134A KR 101203400 B1 KR101203400 B1 KR 101203400B1
Authority
KR
South Korea
Prior art keywords
polymer film
metal
inorganic filler
layer
flexible circuit
Prior art date
Application number
KR20050091134A
Other languages
English (en)
Korean (ko)
Other versions
KR20060051825A (ko
Inventor
히로시 오리카베
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004289165A external-priority patent/JP4701667B2/ja
Priority claimed from JP2004289113A external-priority patent/JP4654647B2/ja
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20060051825A publication Critical patent/KR20060051825A/ko
Application granted granted Critical
Publication of KR101203400B1 publication Critical patent/KR101203400B1/ko

Links

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
KR20050091134A 2004-09-30 2005-09-29 회로 기판용 금속 부착 중합체 필름 및 이의 제조방법 KR101203400B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004289165A JP4701667B2 (ja) 2004-09-30 2004-09-30 回路基板用金属付きポリイミドフィルム及びその製造方法
JP2004289113A JP4654647B2 (ja) 2004-09-30 2004-09-30 回路基板用金属付きポリアミドイミドフィルム及びその製造方法
JPJP-P-2004-00289165 2004-09-30
JPJP-P-2004-00289113 2004-09-30

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020120104241A Division KR20120112329A (ko) 2004-09-30 2012-09-19 회로 기판용 금속 부착 중합체 필름 및 이의 제조방법

Publications (2)

Publication Number Publication Date
KR20060051825A KR20060051825A (ko) 2006-05-19
KR101203400B1 true KR101203400B1 (ko) 2012-11-21

Family

ID=37150100

Family Applications (2)

Application Number Title Priority Date Filing Date
KR20050091134A KR101203400B1 (ko) 2004-09-30 2005-09-29 회로 기판용 금속 부착 중합체 필름 및 이의 제조방법
KR1020120104241A KR20120112329A (ko) 2004-09-30 2012-09-19 회로 기판용 금속 부착 중합체 필름 및 이의 제조방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020120104241A KR20120112329A (ko) 2004-09-30 2012-09-19 회로 기판용 금속 부착 중합체 필름 및 이의 제조방법

Country Status (2)

Country Link
KR (2) KR101203400B1 (zh)
TW (1) TWI431700B (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004014611A (ja) 2002-06-04 2004-01-15 Hitachi Chem Co Ltd 支持体付き絶縁フィルム、多層配線板およびその製造方法
JP2004051975A (ja) 2002-05-30 2004-02-19 Sekisui Chem Co Ltd 樹脂シートの粗化方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004051975A (ja) 2002-05-30 2004-02-19 Sekisui Chem Co Ltd 樹脂シートの粗化方法
JP2004014611A (ja) 2002-06-04 2004-01-15 Hitachi Chem Co Ltd 支持体付き絶縁フィルム、多層配線板およびその製造方法

Also Published As

Publication number Publication date
TWI431700B (zh) 2014-03-21
KR20060051825A (ko) 2006-05-19
TW200618143A (en) 2006-06-01
KR20120112329A (ko) 2012-10-11

Similar Documents

Publication Publication Date Title
TWI455671B (zh) 印刷電路板之製造方法
KR101402635B1 (ko) 메탈라이징용 폴리이미드 필름 및 금속적층 폴리이미드 필름
TWI437937B (zh) 銅配線聚醯亞胺膜之製造方法及銅配線聚醯亞胺膜
TWI395525B (zh) 銅配線聚醯亞胺膜之製造方法
US20060073315A1 (en) Metallized polyamideimide film for substrate and production method thereof
TWI398548B (zh) 溶液、鍍敷用材料、絕緣片材、積層體及印刷線路板
JP5031639B2 (ja) フレキシブル銅張積層板
KR100818483B1 (ko) 폴리이미드 필름의 표면 처리 방법 및 금속 박막을 갖는폴리이미드 필름
JPWO2010126047A1 (ja) 多層ポリイミドフィルム
KR101574587B1 (ko) 플렉시블 동장 적층판
KR20040108808A (ko) 폴리이미드 필름 및 그의 제조 방법, 및 폴리이미드필름을 사용한 폴리이미드/금속 적층체
US20060073314A1 (en) Metallized polyimide film for substrate and production method thereof
JP2007031622A (ja) ポリイミド樹脂およびそれを用いた導体付きフィルム
KR20080014689A (ko) 배선기판용 적층체
KR20150124953A (ko) 도전성 도막의 제조 방법 및 도전성 도막
JP2008095000A (ja) 易接着高弾性ポリイミドフィルム及びその製造方法
KR20140090961A (ko) 절연수지 필름, 상기 필름을 포함하는 금속박 적층판 및 인쇄회로기판, 및 상기 필름을 포함하는 회로기판의 제조방법
JP4006999B2 (ja) ポリイミドフィルムおよび積層体
KR101203400B1 (ko) 회로 기판용 금속 부착 중합체 필름 및 이의 제조방법
JP2009012366A (ja) 積層体及びプリント配線板
TWI683836B (zh) 聚醯亞胺積層膜、聚醯亞胺積層膜之製造方法、熱塑性聚醯亞胺之製造方法、及撓性貼金屬箔積層體之製造方法
KR102272716B1 (ko) 치수안정성 및 접착력이 우수한 다층 폴리이미드 필름 및 이의 제조방법
JP2003264373A (ja) プリント配線板用積層体
JP4876396B2 (ja) プリント配線板
JP2007098906A (ja) 多層ポリイミドフィルム

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
AMND Amendment
E601 Decision to refuse application
J201 Request for trial against refusal decision
A107 Divisional application of patent
AMND Amendment
B701 Decision to grant
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20151016

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20161019

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20171018

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20181030

Year of fee payment: 7