KR101203400B1 - 회로 기판용 금속 부착 중합체 필름 및 이의 제조방법 - Google Patents
회로 기판용 금속 부착 중합체 필름 및 이의 제조방법 Download PDFInfo
- Publication number
- KR101203400B1 KR101203400B1 KR20050091134A KR20050091134A KR101203400B1 KR 101203400 B1 KR101203400 B1 KR 101203400B1 KR 20050091134 A KR20050091134 A KR 20050091134A KR 20050091134 A KR20050091134 A KR 20050091134A KR 101203400 B1 KR101203400 B1 KR 101203400B1
- Authority
- KR
- South Korea
- Prior art keywords
- polymer film
- metal
- inorganic filler
- layer
- flexible circuit
- Prior art date
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004289165A JP4701667B2 (ja) | 2004-09-30 | 2004-09-30 | 回路基板用金属付きポリイミドフィルム及びその製造方法 |
JP2004289113A JP4654647B2 (ja) | 2004-09-30 | 2004-09-30 | 回路基板用金属付きポリアミドイミドフィルム及びその製造方法 |
JPJP-P-2004-00289165 | 2004-09-30 | ||
JPJP-P-2004-00289113 | 2004-09-30 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020120104241A Division KR20120112329A (ko) | 2004-09-30 | 2012-09-19 | 회로 기판용 금속 부착 중합체 필름 및 이의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060051825A KR20060051825A (ko) | 2006-05-19 |
KR101203400B1 true KR101203400B1 (ko) | 2012-11-21 |
Family
ID=37150100
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20050091134A KR101203400B1 (ko) | 2004-09-30 | 2005-09-29 | 회로 기판용 금속 부착 중합체 필름 및 이의 제조방법 |
KR1020120104241A KR20120112329A (ko) | 2004-09-30 | 2012-09-19 | 회로 기판용 금속 부착 중합체 필름 및 이의 제조방법 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020120104241A KR20120112329A (ko) | 2004-09-30 | 2012-09-19 | 회로 기판용 금속 부착 중합체 필름 및 이의 제조방법 |
Country Status (2)
Country | Link |
---|---|
KR (2) | KR101203400B1 (zh) |
TW (1) | TWI431700B (zh) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004014611A (ja) | 2002-06-04 | 2004-01-15 | Hitachi Chem Co Ltd | 支持体付き絶縁フィルム、多層配線板およびその製造方法 |
JP2004051975A (ja) | 2002-05-30 | 2004-02-19 | Sekisui Chem Co Ltd | 樹脂シートの粗化方法 |
-
2005
- 2005-09-19 TW TW94132340A patent/TWI431700B/zh not_active IP Right Cessation
- 2005-09-29 KR KR20050091134A patent/KR101203400B1/ko active IP Right Grant
-
2012
- 2012-09-19 KR KR1020120104241A patent/KR20120112329A/ko not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004051975A (ja) | 2002-05-30 | 2004-02-19 | Sekisui Chem Co Ltd | 樹脂シートの粗化方法 |
JP2004014611A (ja) | 2002-06-04 | 2004-01-15 | Hitachi Chem Co Ltd | 支持体付き絶縁フィルム、多層配線板およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI431700B (zh) | 2014-03-21 |
KR20060051825A (ko) | 2006-05-19 |
TW200618143A (en) | 2006-06-01 |
KR20120112329A (ko) | 2012-10-11 |
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