TW200618143A - Metal-containing polymeric film with circuit board metal and its manufacturing method - Google Patents
Metal-containing polymeric film with circuit board metal and its manufacturing methodInfo
- Publication number
- TW200618143A TW200618143A TW094132340A TW94132340A TW200618143A TW 200618143 A TW200618143 A TW 200618143A TW 094132340 A TW094132340 A TW 094132340A TW 94132340 A TW94132340 A TW 94132340A TW 200618143 A TW200618143 A TW 200618143A
- Authority
- TW
- Taiwan
- Prior art keywords
- metal
- polymeric film
- circuit board
- manufacturing
- copper plating
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title abstract 5
- 239000002184 metal Substances 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 3
- 229910052802 copper Inorganic materials 0.000 abstract 3
- 239000010949 copper Substances 0.000 abstract 3
- 238000007747 plating Methods 0.000 abstract 3
- 239000004962 Polyamide-imide Substances 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 2
- 229920002312 polyamide-imide Polymers 0.000 abstract 2
- JYLNVJYYQQXNEK-UHFFFAOYSA-N 3-amino-2-(4-chlorophenyl)-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(CN)C1=CC=C(Cl)C=C1 JYLNVJYYQQXNEK-UHFFFAOYSA-N 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000012286 potassium permanganate Substances 0.000 abstract 1
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
Abstract
The invention is to provide a manufacturing method of a metal-containing polymeric film with circuit board metal, which can inexpensively manufacture the polyamideimide film with metal, where a conductor layer is stuck to the polyamideimide film with high adhesion strength, by comparatively small number of processes without using a special material. The polymeric film including inorganic fill is processed by alkaline permanganic acid solution. Non-electrolytic copper plating is performed or non-electrolytic copper plating and electrolytic copper plating are sequentially performed. It is preferable that alkaline permanganic acid solution is potassium permanganate solution or sodium permanganate solution.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004289165A JP4701667B2 (en) | 2004-09-30 | 2004-09-30 | Metallic polyimide film for circuit board and method for producing the same |
| JP2004289113A JP4654647B2 (en) | 2004-09-30 | 2004-09-30 | Polyamideimide film with metal for circuit board and method for producing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200618143A true TW200618143A (en) | 2006-06-01 |
| TWI431700B TWI431700B (en) | 2014-03-21 |
Family
ID=37150100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW94132340A TWI431700B (en) | 2004-09-30 | 2005-09-19 | A metal-attached polymer film for a circuit board, and a method for producing the same |
Country Status (2)
| Country | Link |
|---|---|
| KR (2) | KR101203400B1 (en) |
| TW (1) | TWI431700B (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004051975A (en) | 2002-05-30 | 2004-02-19 | Sekisui Chem Co Ltd | Method for roughening resin sheet |
| JP2004014611A (en) | 2002-06-04 | 2004-01-15 | Hitachi Chem Co Ltd | Insulation film with supports, multilayer printed circuit board, and its manufacturing method |
-
2005
- 2005-09-19 TW TW94132340A patent/TWI431700B/en not_active IP Right Cessation
- 2005-09-29 KR KR20050091134A patent/KR101203400B1/en active IP Right Grant
-
2012
- 2012-09-19 KR KR1020120104241A patent/KR20120112329A/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI431700B (en) | 2014-03-21 |
| KR101203400B1 (en) | 2012-11-21 |
| KR20060051825A (en) | 2006-05-19 |
| KR20120112329A (en) | 2012-10-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |