KR101178712B1 - 반도체 제조용 접착제 조성물 및 필름 - Google Patents

반도체 제조용 접착제 조성물 및 필름 Download PDF

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KR101178712B1
KR101178712B1 KR1020100093610A KR20100093610A KR101178712B1 KR 101178712 B1 KR101178712 B1 KR 101178712B1 KR 1020100093610 A KR1020100093610 A KR 1020100093610A KR 20100093610 A KR20100093610 A KR 20100093610A KR 101178712 B1 KR101178712 B1 KR 101178712B1
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South Korea
Prior art keywords
adhesive
adhesive composition
resin
epoxy resin
weight
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KR1020100093610A
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English (en)
Korean (ko)
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KR20120032141A (ko
Inventor
김진원
김성수
신광호
조경남
황교성
정창범
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주식회사 케이씨씨
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Priority to KR1020100093610A priority Critical patent/KR101178712B1/ko
Priority to CN201080069341.4A priority patent/CN103124778B/zh
Priority to PCT/KR2010/007840 priority patent/WO2012043922A1/ko
Priority to TW099138784A priority patent/TWI512070B/zh
Publication of KR20120032141A publication Critical patent/KR20120032141A/ko
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Publication of KR101178712B1 publication Critical patent/KR101178712B1/ko

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    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/18—Homopolymers or copolymers of nitriles
    • C09J133/20—Homopolymers or copolymers of acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/18—Homopolymers or copolymers of nitriles
    • C08L33/20—Homopolymers or copolymers of acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
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    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices

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CN201080069341.4A CN103124778B (zh) 2010-09-28 2010-11-08 用于制备半导体的粘合剂组合物及薄膜
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WO2015102342A1 (ko) * 2014-01-03 2015-07-09 주식회사 엘지화학 다이싱 필름 및 다이싱 다이본딩 필름
KR101582224B1 (ko) * 2014-09-05 2016-01-11 윈엔윈(주) Cnt가 첨가된 접착제를 이용한 카본섬유 강화 복합소재 제작방법
US9761476B2 (en) 2014-01-03 2017-09-12 Lg Chem, Ltd. Dicing film and dicing die-bonding film

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JP6101492B2 (ja) * 2013-01-10 2017-03-22 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
CN103642415A (zh) * 2013-11-27 2014-03-19 常熟市富邦胶带有限责任公司 一种导热双面胶带
CN103642408A (zh) * 2013-11-27 2014-03-19 常熟市富邦胶带有限责任公司 一种以bn为导热剂导热双面胶带及其制备工艺
JP5828881B2 (ja) * 2013-12-24 2015-12-09 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
CN104327778B (zh) * 2014-10-23 2016-06-08 道生天合材料科技（上海）有限公司 一种丙烯酸改性环氧材料的制备
KR101676025B1 (ko) * 2016-06-30 2016-11-15 (주) 화인테크놀리지 반도체 웨이퍼의 하프커팅 후 이면 연삭 가공용 자외선 경화형 점착시트

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JP2007009058A (ja) 2005-06-30 2007-01-18 Nitto Denko Corp 接着組成物及び接着シート

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JP4600640B2 (ja) * 2003-11-10 2010-12-15 信越化学工業株式会社 アクリル系接着剤シート
CN1754933A (zh) * 2004-09-29 2006-04-05 信越化学工业株式会社 丙烯酸类粘合剂组合物和丙烯酸类粘合片材
JP2009096851A (ja) * 2007-10-15 2009-05-07 Three M Innovative Properties Co 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法

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JP2007009058A (ja) 2005-06-30 2007-01-18 Nitto Denko Corp 接着組成物及び接着シート

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015102342A1 (ko) * 2014-01-03 2015-07-09 주식회사 엘지화학 다이싱 필름 및 다이싱 다이본딩 필름
US9761476B2 (en) 2014-01-03 2017-09-12 Lg Chem, Ltd. Dicing film and dicing die-bonding film
KR101582224B1 (ko) * 2014-09-05 2016-01-11 윈엔윈(주) Cnt가 첨가된 접착제를 이용한 카본섬유 강화 복합소재 제작방법

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