WO2012043922A1 - 반도체 제조용 접착제 조성물 및 필름 - Google Patents

반도체 제조용 접착제 조성물 및 필름 Download PDF

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Publication number
WO2012043922A1
WO2012043922A1 PCT/KR2010/007840 KR2010007840W WO2012043922A1 WO 2012043922 A1 WO2012043922 A1 WO 2012043922A1 KR 2010007840 W KR2010007840 W KR 2010007840W WO 2012043922 A1 WO2012043922 A1 WO 2012043922A1
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WIPO (PCT)
Prior art keywords
adhesive composition
adhesive
epoxy resin
resin
semiconductor
Prior art date
Application number
PCT/KR2010/007840
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English (en)
French (fr)
Korean (ko)
Inventor
김진원
김성수
신광호
조경남
황교성
정창범
Original Assignee
주식회사 케이씨씨
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Application filed by 주식회사 케이씨씨 filed Critical 주식회사 케이씨씨
Priority to CN201080069341.4A priority Critical patent/CN103124778B/zh
Publication of WO2012043922A1 publication Critical patent/WO2012043922A1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/18—Homopolymers or copolymers of nitriles
    • C09J133/20—Homopolymers or copolymers of acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/18—Homopolymers or copolymers of nitriles
    • C08L33/20—Homopolymers or copolymers of acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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    • H01L2224/93—Batch processes
    • H01L2224/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices

Definitions

  • the present invention relates to adhesive compositions and films for semiconductor manufacturing, and more particularly, to acrylonitrile-containing acrylic resins, mixtures of epoxy compounds and phenol resins and fillers, and to wafer up process characteristics during semiconductor manufacturing processes.
  • the present invention relates to an adhesive composition for manufacturing a semiconductor having excellent adhesion to a wafer, a lead frame, a PCB substrate, and an adhesive film for manufacturing a semiconductor including a coating layer of the composition.
  • the chip is divided by the dicing process for cutting the wafer of the film with the adhesive film into chips, the expansion and pick-up process for reorganizing the cut chips into individual chips, and the pick-up process.
  • the bonding process for mounting the on a substrate it is possible to stack a multi-layer chip, unlike the liquid adhesive.
  • the metal wiring process for electrical connection between the stacked chip and the substrate and the epoxy molding process for protecting the chip are subsequently performed. After cutting the wafer in the above process to produce a chip form, the adhesive film is used for use in subsequent processes.
  • the adhesive sheet is attached to the back surface of the wafer in advance to perform a dicing process and the chip is bonded to a lead frame or a flexible printed circuit board.
  • the adhesive film should have excellent adhesion without bubbles during lamination with the wafer before the dicing process, and the adhesive film and the back surface of the wafer or dicing by the water and air used for the process water and cleaning used in the dicing process No peeling or immersion should occur between the films.
  • the pick-up from the dicing film should be made without difficulty in picking up the separated chip in the dicing process, and in the bonding process, it should show excellent adhesion to the chip and the lead frame or the flexible printed circuit board.
  • the adhesive force of the die bonding adhesive film between the chip and the flexible printed circuit board in the semiconductor chip manufacturing process must be high. If sufficient adhesion is not seen in the bonding of the flexible printed circuit board and the chip, the chip may deviate from the flexible printed circuit board during the chip manufacturing process.
  • Republic of Korea Patent No. 10-0826420 provides an adhesive film composition using a rubber-based resin having a double bond in the main chain.
  • the presence of a double bond in the main chain of the resin may lower the adhesion to the flexible printed circuit board due to the vulcanization of the double bond.
  • Republic of Korea Patent No. 10-0447014 provides an adhesive film using a high heat resistance polyimide adhesive composition.
  • the composition of this patent has a problem that the adhesive strength is low, instead of high heat resistance.
  • the present invention has been made to solve the problems of the prior art as described above, the adhesive composition for semiconductor manufacturing excellent in the wafer pickup process characteristics of the semiconductor manufacturing process, excellent adhesion to the wafer, lead frame, PCB substrate and coating layer of the composition It is a technical object of the present invention to provide an adhesive film for manufacturing a semiconductor.
  • the present invention is 15 to 75 parts by weight of an acrylic resin containing 15 to 40% by weight of acrylonitrile monomer units; 5 to 60 parts by weight of a mixture of an epoxy compound and a phenol resin; And it provides an adhesive composition for manufacturing a semiconductor comprising 10 to 80 parts by weight of a filler.
  • an adhesive film for manufacturing a semiconductor comprising a coating layer of the adhesive composition of the present invention.
  • the adhesion and adhesion to the wafer during lamination with the wafer are excellent, the pick-up property from the dicing film is excellent, and the adhesion is excellent in the bonding process.
  • the workability of the package manufacturing process can be improved, and the reliability of the manufactured semiconductor product can be improved.
  • FIG. 1 is a schematic view showing one embodiment of a state in which the adhesive film according to the present invention is applied to a wafer.
  • Figure 2 is a schematic diagram (top) showing the layer structure of one embodiment of the adhesive film according to the present invention and a schematic diagram (bottom) showing a state in which the release film is removed immediately before use thereof.
  • Figure 3 is a schematic diagram showing the layer configuration of one embodiment of the dicing / die bonding film comprising an adhesive film according to the present invention.
  • the adhesive composition of this invention contains an acrylonitrile containing acrylic resin component.
  • the acrylic resin component contains 15 to 40% by weight, more preferably 20 to 40% by weight of acrylonitrile monomer units with respect to 100% by weight of the resin.
  • an acrylic resin component obtained by polymerizing 15 to 40 parts by weight of an acrylonitrile compound and 60 to 85 parts by weight of an acrylate compound such as ethyl or butyl acrylate may be used. If the acrylonitrile monomer unit content is less than 15% by weight, the compatibility with the epoxy compound is inferior, and if it exceeds 40% by weight, there is a problem that the resin molecular weight rises too rapidly.
  • the weight average molecular weight of an acrylonitrile containing acrylic resin becomes like this.
  • it is 300,000-2 million, More preferably, it is 500,000-1,500,000.
  • the glass transition temperature becomes like this.
  • it is -20 degreeC-50 degreeC, More preferably, it is 0 degreeC-40 degreeC. If the weight average molecular weight of the acrylic resin is less than 300,000, the viscosity of the resin is too low to be too soft at the time of the composition of the adhesive film, the film configuration may be difficult, and if more than 2 million, the viscosity may be too high, there may be difficulty in the production of the film.
  • the glass transition temperature of the acrylic resin is less than -20 ° C, the surface wettability of the adhesive film may be too high, and the separation property from the adhesive film may be deteriorated when the film is processed. If the glass transition temperature is higher than 50 ° C, the adhesion force with the wafer is degraded in the semiconductor package process. Separation of the adhesive film may occur on the bed.
  • the adhesive composition of the present invention contains 15 to 75 parts by weight of the acrylonitrile-containing acrylic resin.
  • content of acrylonitrile-containing acrylic resin in the composition is less than this, there is a problem in that the coating property is poor in the physical properties of the entire film and the film is broken too easily. There is a problem of poor reliability.
  • the adhesive composition of the present invention comprises a mixture of an epoxy compound and a phenol resin.
  • Examples of the epoxy compound usable in the present invention include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, alicyclic epoxy resins, aliphatic chain epoxy resins, phenol novolac type epoxy resins, and cresol novolac types.
  • the phenol resin usable in the present invention is not particularly limited, and a phenol resin having a hydroxy equivalent weight of 100 eq / kg to 300 eq / kg is preferable.
  • the mixing ratio of both in the mixture of the said epoxy compound and a phenol resin is 1: 0.8-1: 1.2 in ratio of epoxy equivalent in epoxy compound: hydroxy equivalent in phenol resin. If this mixing ratio is out of the above level, there may be a problem in the reliability evaluation after the semiconductor chip manufacturing process due to over- or uncured due to the lack of the epoxy-phenol curing system.
  • the adhesive composition of the present invention contains 5 to 60 parts by weight of a mixture of an epoxy compound and a phenol resin. If the content of the mixture of the epoxy compound and the phenol resin in the composition is less than this, there is a problem in long-term use due to weak physical properties of the cured product at a high temperature, on the contrary, if the content is more than this, the film becomes too hard and the coating on the film is difficult.
  • the adhesive composition of the present invention includes a filler.
  • a filler an epoxy-based high molecular compound having a low miscibility with the acrylic resin component, particles in a spherical or agglomerated form, and the like may be used.
  • the epoxy compound having a low miscibility with the acrylic resin component has a weight average molecular weight of 50,000 or more. It is not specifically limited to this. According to one embodiment of the present invention, bisphenol A type, F type or a mixture of type A and F can be used as an epoxy polymer filler, and its weight average molecular weight is 10,000 to 100,000.
  • Particulate fillers include silica (e.g. fused silica, dry silica), alumina (e.g. spherical, square, plate or flake alumina), silver, gold coated beads, silicon beads, carbon black, aluminum hydroxide, magnesium hydroxide, boron nitride, Particles, such as titanium dioxide and a ceramic, are mentioned.
  • the average particle size of the particulate filler is preferably from 10 nanometers to 10 micrometers, more preferably from 20 nanometers to 5 micrometers.
  • spherical: angular alumina may be mixed in a weight ratio of 1: 3 to 1: 6.
  • the adhesive composition of this invention contains 10-80 weight part of fillers. When the content of the filler in the composition is less than this, there is a problem in that the strength of the adhesive is lowered.
  • the adhesive composition of the present invention may further include components conventionally used in the adhesive composition for semiconductor processing, such as acetone, methyl ethyl ketone, toluene, ethyl acetate, and the like in an appropriate amount.
  • the method of preparing the adhesive composition of the present invention can be prepared by a conventional process using equipment for preparing an adhesive composition.
  • other components such as the acrylonitrile-containing acrylic resin, epoxy compound, phenol resin, filler, and solvent described above are dispersed and mixed at room temperature to an appropriately elevated temperature using a mixing equipment such as a bead mill.
  • the adhesive composition of this invention can be manufactured by mixing.
  • an adhesive film for producing a semiconductor comprising a coating layer of the adhesive composition of the present invention as described above.
  • Adhesive film for semiconductor production according to the present invention is characterized in that it comprises a coating layer of the adhesive composition of the present invention, in addition to one or more substrate (film) layer [release (film) layer or protective (film) according to the film configuration needs Layer) and an adhesive (film) layer may be further included.
  • Adhesive film for semiconductor production according to an embodiment of the present invention is an adhesive composition layer + pressure-sensitive adhesive layer; Base layer + adhesive composition layer + base layer; Adhesive composition layer + base layer; It may have a layer configuration such as a base layer + adhesive composition layer + adhesive layer, but is not limited thereto.
  • the base layer material that can be included in the adhesive film for manufacturing a semiconductor of the present invention is not particularly limited, and those commonly available as the substrate film of the adhesive film for manufacturing a semiconductor, such as polyethylene terephthalate, polyolefin-based or polyvinyl chloride-based materials, may be used.
  • the adhesive layer such as an acrylic material containing a photoreactive oligomer, may be used an adhesive material commonly used in the adhesive film for semiconductor production.
  • the thickness of the coating layer of the adhesive composition may vary depending on a specific layer configuration within a range of 5 to 300 ⁇ m.
  • the coating layer thickness of the adhesive composition may be in the range of 5 to 80 ⁇ m when configured with the adhesive layer, and may be in the range of 20 to 100 ⁇ m when configured between the two base layers, and is configured with one base layer. In this case, the range may be 40 to 300 ⁇ m, but is not limited thereto.
  • the adhesive film of the present invention may be prepared by a conventional process using a conventional multilayer adhesive film production equipment.
  • the adhesive composition of the present invention after coating the adhesive composition of the present invention on a polyethylene terephthalate base material layer, it may be laminated with an adhesive film coated with an acrylic adhesive, if necessary, to prepare the adhesive film of the present invention. have.
  • the adhesive film prepared in the embodiment of the present invention was pressed through a roll-shaped bar at a temperature of 65 ° C. using a tape mounting facility (DT-MWM 1230A, Dynatech) to confirm the presence of a void between the wafer and the adhesive film.
  • DT-MWM 1230A Dynatech
  • the adhesive film thus prepared was attached to a 200-inch wafer of 8 inches, and then subjected to a cutting and cleaning process using a dicing apparatus (Disco, DFD6361), followed by visual and optical microscopy.
  • the cutting process was carried out under the conditions of chip size ⁇ 10mm, feeding speed 70mm / s, blade height 70 ⁇ m, blade rotation speed 30,000rpm, and cleaning process was performed by spraying ultrapure water and pressure air while the wafer was rotating. The chipping (chipping) and the number of chips scattered were recorded.
  • the wafer after the cutting and cleaning process was irradiated with UV at 150 mJ / cm 2 using an ultraviolet irradiator, and then left at room temperature for 20 minutes to evaluate pick-up characteristics using a die attach device (Secron, SDB-30US).
  • the pick-up process was carried out for 100 chips in the center of the wafer in a pin stroke range of 200 ⁇ m to 800 ⁇ m after setting the chip size 10 mm ⁇ 10 mm, the number of pins, and the extension 5 mm.
  • the case where all chips were picked up by the process was evaluated as (circle), the case where all the chips were picked up by 2 or 3 pick-up process was evaluated as (triangle
  • a phenol resin MEH-7800SS (Meywa Co., Ltd., hydroxyl group equivalent of 175) 20 parts by weight of silica as a phase particle was dispersed in 20 parts by weight of a methyl ethyl ketone solvent using a bead mill, and then coated on a 38 ⁇ m-thick polyethylene terephthalate release film with a dry thickness of 20 ⁇ m to prepare an adhesive film.
  • the prepared adhesive film was laminated with a 100 ⁇ m-thick polyolefin film coated with a 10 ⁇ m-thick acrylic adhesive containing a photoreactive oligomer. Adhesion evaluation on a 200 ⁇ m wafer was performed using the laminated film and the results are shown in Table 5.
  • Acrylic polymer CS-200 resin having a content of acrylonitrile monomer unit of 20% by weight, a glass transition temperature of 10 ° C. and a molecular weight of 900,000, an epoxy / phenol resin mixture as used in Examples 1 to 3, and an average as a filler
  • An adhesive film was prepared in the same manner as in Examples 1 to 3 using fumed silica having a particle diameter of 20 nanometers (trade name R-972, manufactured by Degus Co., Ltd.) in the amounts shown in Table 2.
  • the adhesive film was evaluated in the same manner as in Examples 1 to 3, and the results are shown in Table 5.
  • Alumina Spherical alumina (trade name ASFP-20, manufactured by Denka Corporation) having an average particle diameter of 0.5 micrometer: 1: 5 of each phase alumina (trade name A-43-M manufactured by Showa Co., Ltd.) having an average particle diameter of 1 micrometer.
  • Weight ratio mixture [Spherical alumina (trade name ASFP-20, manufactured by Denka Corporation) having an average particle diameter of 0.5 micrometer: 1: 5 of each phase alumina (trade name A-43-M manufactured by Showa Co., Ltd.) having an average particle diameter of 1 micrometer. Weight ratio mixture]
  • An adhesive film was prepared in the same manner as in Examples 1 to 3 using an acrylic polymer CS-200 resin as shown in Table 4, and an epoxy / phenol resin mixture and a filler as used in Examples 1 to 3.
  • the adhesive film was evaluated in the same manner as in Examples 1 to 3, and the results are shown in Table 7.
  • Adhesion Adhesion before UV irradiation between adhesive composition layer and pressure sensitive adhesive layer
  • Peeling force * adhesive force after ultraviolet irradiation between the adhesive composition layer and the pressure-sensitive adhesive layer
  • Adhesion ** Adhesion between wafer and adhesive film
  • Adhesion *** Adhesion between flexible circuit board and adhesive film
  • Adhesion Adhesion before UV irradiation between adhesive composition layer and pressure sensitive adhesive layer
  • Peeling force * adhesive force after ultraviolet irradiation between the adhesive composition layer and the pressure-sensitive adhesive layer
  • Adhesion ** Adhesion between wafer and adhesive film
  • Adhesion *** Adhesion between flexible circuit board and adhesive film
  • Adhesion Adhesion before UV irradiation between adhesive composition layer and pressure sensitive adhesive layer
  • Peeling force * adhesive force after ultraviolet irradiation between the adhesive composition layer and the pressure-sensitive adhesive layer
  • Adhesion ** Adhesion between wafer and adhesive film
  • Adhesion *** Adhesion between flexible circuit board and adhesive film
  • the adhesion between the wafer and the flexible circuit board is increased to prevent chip damage that may occur during the wafer cutting process, thereby obtaining an adhesive film having excellent pickup properties.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
PCT/KR2010/007840 2010-09-28 2010-11-08 반도체 제조용 접착제 조성물 및 필름 WO2012043922A1 (ko)

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JP6101492B2 (ja) * 2013-01-10 2017-03-22 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
CN103642415A (zh) * 2013-11-27 2014-03-19 常熟市富邦胶带有限责任公司 一种导热双面胶带
CN103642408A (zh) * 2013-11-27 2014-03-19 常熟市富邦胶带有限责任公司 一种以bn为导热剂导热双面胶带及其制备工艺
JP5828881B2 (ja) * 2013-12-24 2015-12-09 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
KR101722137B1 (ko) 2014-01-03 2017-03-31 주식회사 엘지화학 다이싱 필름 및 다이싱 다이본딩 필름
WO2015102342A1 (ko) * 2014-01-03 2015-07-09 주식회사 엘지화학 다이싱 필름 및 다이싱 다이본딩 필름
KR101582224B1 (ko) * 2014-09-05 2016-01-11 윈엔윈(주) Cnt가 첨가된 접착제를 이용한 카본섬유 강화 복합소재 제작방법
KR101676025B1 (ko) * 2016-06-30 2016-11-15 (주) 화인테크놀리지 반도체 웨이퍼의 하프커팅 후 이면 연삭 가공용 자외선 경화형 점착시트

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