WO2012043922A1 - Adhesive composition and film for preparing semiconductor - Google Patents

Adhesive composition and film for preparing semiconductor Download PDF

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Publication number
WO2012043922A1
WO2012043922A1 PCT/KR2010/007840 KR2010007840W WO2012043922A1 WO 2012043922 A1 WO2012043922 A1 WO 2012043922A1 KR 2010007840 W KR2010007840 W KR 2010007840W WO 2012043922 A1 WO2012043922 A1 WO 2012043922A1
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WO
WIPO (PCT)
Prior art keywords
adhesive composition
adhesive
epoxy resin
resin
semiconductor
Prior art date
Application number
PCT/KR2010/007840
Other languages
French (fr)
Korean (ko)
Inventor
김진원
김성수
신광호
조경남
황교성
정창범
Original Assignee
주식회사 케이씨씨
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Publication date
Application filed by 주식회사 케이씨씨 filed Critical 주식회사 케이씨씨
Priority to CN201080069341.4A priority Critical patent/CN103124778B/en
Publication of WO2012043922A1 publication Critical patent/WO2012043922A1/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/18—Homopolymers or copolymers of nitriles
    • C09J133/20—Homopolymers or copolymers of acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/18—Homopolymers or copolymers of nitriles
    • C08L33/20—Homopolymers or copolymers of acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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Definitions

  • the present invention relates to adhesive compositions and films for semiconductor manufacturing, and more particularly, to acrylonitrile-containing acrylic resins, mixtures of epoxy compounds and phenol resins and fillers, and to wafer up process characteristics during semiconductor manufacturing processes.
  • the present invention relates to an adhesive composition for manufacturing a semiconductor having excellent adhesion to a wafer, a lead frame, a PCB substrate, and an adhesive film for manufacturing a semiconductor including a coating layer of the composition.
  • the chip is divided by the dicing process for cutting the wafer of the film with the adhesive film into chips, the expansion and pick-up process for reorganizing the cut chips into individual chips, and the pick-up process.
  • the bonding process for mounting the on a substrate it is possible to stack a multi-layer chip, unlike the liquid adhesive.
  • the metal wiring process for electrical connection between the stacked chip and the substrate and the epoxy molding process for protecting the chip are subsequently performed. After cutting the wafer in the above process to produce a chip form, the adhesive film is used for use in subsequent processes.
  • the adhesive sheet is attached to the back surface of the wafer in advance to perform a dicing process and the chip is bonded to a lead frame or a flexible printed circuit board.
  • the adhesive film should have excellent adhesion without bubbles during lamination with the wafer before the dicing process, and the adhesive film and the back surface of the wafer or dicing by the water and air used for the process water and cleaning used in the dicing process No peeling or immersion should occur between the films.
  • the pick-up from the dicing film should be made without difficulty in picking up the separated chip in the dicing process, and in the bonding process, it should show excellent adhesion to the chip and the lead frame or the flexible printed circuit board.
  • the adhesive force of the die bonding adhesive film between the chip and the flexible printed circuit board in the semiconductor chip manufacturing process must be high. If sufficient adhesion is not seen in the bonding of the flexible printed circuit board and the chip, the chip may deviate from the flexible printed circuit board during the chip manufacturing process.
  • Republic of Korea Patent No. 10-0826420 provides an adhesive film composition using a rubber-based resin having a double bond in the main chain.
  • the presence of a double bond in the main chain of the resin may lower the adhesion to the flexible printed circuit board due to the vulcanization of the double bond.
  • Republic of Korea Patent No. 10-0447014 provides an adhesive film using a high heat resistance polyimide adhesive composition.
  • the composition of this patent has a problem that the adhesive strength is low, instead of high heat resistance.
  • the present invention has been made to solve the problems of the prior art as described above, the adhesive composition for semiconductor manufacturing excellent in the wafer pickup process characteristics of the semiconductor manufacturing process, excellent adhesion to the wafer, lead frame, PCB substrate and coating layer of the composition It is a technical object of the present invention to provide an adhesive film for manufacturing a semiconductor.
  • the present invention is 15 to 75 parts by weight of an acrylic resin containing 15 to 40% by weight of acrylonitrile monomer units; 5 to 60 parts by weight of a mixture of an epoxy compound and a phenol resin; And it provides an adhesive composition for manufacturing a semiconductor comprising 10 to 80 parts by weight of a filler.
  • an adhesive film for manufacturing a semiconductor comprising a coating layer of the adhesive composition of the present invention.
  • the adhesion and adhesion to the wafer during lamination with the wafer are excellent, the pick-up property from the dicing film is excellent, and the adhesion is excellent in the bonding process.
  • the workability of the package manufacturing process can be improved, and the reliability of the manufactured semiconductor product can be improved.
  • FIG. 1 is a schematic view showing one embodiment of a state in which the adhesive film according to the present invention is applied to a wafer.
  • Figure 2 is a schematic diagram (top) showing the layer structure of one embodiment of the adhesive film according to the present invention and a schematic diagram (bottom) showing a state in which the release film is removed immediately before use thereof.
  • Figure 3 is a schematic diagram showing the layer configuration of one embodiment of the dicing / die bonding film comprising an adhesive film according to the present invention.
  • the adhesive composition of this invention contains an acrylonitrile containing acrylic resin component.
  • the acrylic resin component contains 15 to 40% by weight, more preferably 20 to 40% by weight of acrylonitrile monomer units with respect to 100% by weight of the resin.
  • an acrylic resin component obtained by polymerizing 15 to 40 parts by weight of an acrylonitrile compound and 60 to 85 parts by weight of an acrylate compound such as ethyl or butyl acrylate may be used. If the acrylonitrile monomer unit content is less than 15% by weight, the compatibility with the epoxy compound is inferior, and if it exceeds 40% by weight, there is a problem that the resin molecular weight rises too rapidly.
  • the weight average molecular weight of an acrylonitrile containing acrylic resin becomes like this.
  • it is 300,000-2 million, More preferably, it is 500,000-1,500,000.
  • the glass transition temperature becomes like this.
  • it is -20 degreeC-50 degreeC, More preferably, it is 0 degreeC-40 degreeC. If the weight average molecular weight of the acrylic resin is less than 300,000, the viscosity of the resin is too low to be too soft at the time of the composition of the adhesive film, the film configuration may be difficult, and if more than 2 million, the viscosity may be too high, there may be difficulty in the production of the film.
  • the glass transition temperature of the acrylic resin is less than -20 ° C, the surface wettability of the adhesive film may be too high, and the separation property from the adhesive film may be deteriorated when the film is processed. If the glass transition temperature is higher than 50 ° C, the adhesion force with the wafer is degraded in the semiconductor package process. Separation of the adhesive film may occur on the bed.
  • the adhesive composition of the present invention contains 15 to 75 parts by weight of the acrylonitrile-containing acrylic resin.
  • content of acrylonitrile-containing acrylic resin in the composition is less than this, there is a problem in that the coating property is poor in the physical properties of the entire film and the film is broken too easily. There is a problem of poor reliability.
  • the adhesive composition of the present invention comprises a mixture of an epoxy compound and a phenol resin.
  • Examples of the epoxy compound usable in the present invention include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, alicyclic epoxy resins, aliphatic chain epoxy resins, phenol novolac type epoxy resins, and cresol novolac types.
  • the phenol resin usable in the present invention is not particularly limited, and a phenol resin having a hydroxy equivalent weight of 100 eq / kg to 300 eq / kg is preferable.
  • the mixing ratio of both in the mixture of the said epoxy compound and a phenol resin is 1: 0.8-1: 1.2 in ratio of epoxy equivalent in epoxy compound: hydroxy equivalent in phenol resin. If this mixing ratio is out of the above level, there may be a problem in the reliability evaluation after the semiconductor chip manufacturing process due to over- or uncured due to the lack of the epoxy-phenol curing system.
  • the adhesive composition of the present invention contains 5 to 60 parts by weight of a mixture of an epoxy compound and a phenol resin. If the content of the mixture of the epoxy compound and the phenol resin in the composition is less than this, there is a problem in long-term use due to weak physical properties of the cured product at a high temperature, on the contrary, if the content is more than this, the film becomes too hard and the coating on the film is difficult.
  • the adhesive composition of the present invention includes a filler.
  • a filler an epoxy-based high molecular compound having a low miscibility with the acrylic resin component, particles in a spherical or agglomerated form, and the like may be used.
  • the epoxy compound having a low miscibility with the acrylic resin component has a weight average molecular weight of 50,000 or more. It is not specifically limited to this. According to one embodiment of the present invention, bisphenol A type, F type or a mixture of type A and F can be used as an epoxy polymer filler, and its weight average molecular weight is 10,000 to 100,000.
  • Particulate fillers include silica (e.g. fused silica, dry silica), alumina (e.g. spherical, square, plate or flake alumina), silver, gold coated beads, silicon beads, carbon black, aluminum hydroxide, magnesium hydroxide, boron nitride, Particles, such as titanium dioxide and a ceramic, are mentioned.
  • the average particle size of the particulate filler is preferably from 10 nanometers to 10 micrometers, more preferably from 20 nanometers to 5 micrometers.
  • spherical: angular alumina may be mixed in a weight ratio of 1: 3 to 1: 6.
  • the adhesive composition of this invention contains 10-80 weight part of fillers. When the content of the filler in the composition is less than this, there is a problem in that the strength of the adhesive is lowered.
  • the adhesive composition of the present invention may further include components conventionally used in the adhesive composition for semiconductor processing, such as acetone, methyl ethyl ketone, toluene, ethyl acetate, and the like in an appropriate amount.
  • the method of preparing the adhesive composition of the present invention can be prepared by a conventional process using equipment for preparing an adhesive composition.
  • other components such as the acrylonitrile-containing acrylic resin, epoxy compound, phenol resin, filler, and solvent described above are dispersed and mixed at room temperature to an appropriately elevated temperature using a mixing equipment such as a bead mill.
  • the adhesive composition of this invention can be manufactured by mixing.
  • an adhesive film for producing a semiconductor comprising a coating layer of the adhesive composition of the present invention as described above.
  • Adhesive film for semiconductor production according to the present invention is characterized in that it comprises a coating layer of the adhesive composition of the present invention, in addition to one or more substrate (film) layer [release (film) layer or protective (film) according to the film configuration needs Layer) and an adhesive (film) layer may be further included.
  • Adhesive film for semiconductor production according to an embodiment of the present invention is an adhesive composition layer + pressure-sensitive adhesive layer; Base layer + adhesive composition layer + base layer; Adhesive composition layer + base layer; It may have a layer configuration such as a base layer + adhesive composition layer + adhesive layer, but is not limited thereto.
  • the base layer material that can be included in the adhesive film for manufacturing a semiconductor of the present invention is not particularly limited, and those commonly available as the substrate film of the adhesive film for manufacturing a semiconductor, such as polyethylene terephthalate, polyolefin-based or polyvinyl chloride-based materials, may be used.
  • the adhesive layer such as an acrylic material containing a photoreactive oligomer, may be used an adhesive material commonly used in the adhesive film for semiconductor production.
  • the thickness of the coating layer of the adhesive composition may vary depending on a specific layer configuration within a range of 5 to 300 ⁇ m.
  • the coating layer thickness of the adhesive composition may be in the range of 5 to 80 ⁇ m when configured with the adhesive layer, and may be in the range of 20 to 100 ⁇ m when configured between the two base layers, and is configured with one base layer. In this case, the range may be 40 to 300 ⁇ m, but is not limited thereto.
  • the adhesive film of the present invention may be prepared by a conventional process using a conventional multilayer adhesive film production equipment.
  • the adhesive composition of the present invention after coating the adhesive composition of the present invention on a polyethylene terephthalate base material layer, it may be laminated with an adhesive film coated with an acrylic adhesive, if necessary, to prepare the adhesive film of the present invention. have.
  • the adhesive film prepared in the embodiment of the present invention was pressed through a roll-shaped bar at a temperature of 65 ° C. using a tape mounting facility (DT-MWM 1230A, Dynatech) to confirm the presence of a void between the wafer and the adhesive film.
  • DT-MWM 1230A Dynatech
  • the adhesive film thus prepared was attached to a 200-inch wafer of 8 inches, and then subjected to a cutting and cleaning process using a dicing apparatus (Disco, DFD6361), followed by visual and optical microscopy.
  • the cutting process was carried out under the conditions of chip size ⁇ 10mm, feeding speed 70mm / s, blade height 70 ⁇ m, blade rotation speed 30,000rpm, and cleaning process was performed by spraying ultrapure water and pressure air while the wafer was rotating. The chipping (chipping) and the number of chips scattered were recorded.
  • the wafer after the cutting and cleaning process was irradiated with UV at 150 mJ / cm 2 using an ultraviolet irradiator, and then left at room temperature for 20 minutes to evaluate pick-up characteristics using a die attach device (Secron, SDB-30US).
  • the pick-up process was carried out for 100 chips in the center of the wafer in a pin stroke range of 200 ⁇ m to 800 ⁇ m after setting the chip size 10 mm ⁇ 10 mm, the number of pins, and the extension 5 mm.
  • the case where all chips were picked up by the process was evaluated as (circle), the case where all the chips were picked up by 2 or 3 pick-up process was evaluated as (triangle
  • a phenol resin MEH-7800SS (Meywa Co., Ltd., hydroxyl group equivalent of 175) 20 parts by weight of silica as a phase particle was dispersed in 20 parts by weight of a methyl ethyl ketone solvent using a bead mill, and then coated on a 38 ⁇ m-thick polyethylene terephthalate release film with a dry thickness of 20 ⁇ m to prepare an adhesive film.
  • the prepared adhesive film was laminated with a 100 ⁇ m-thick polyolefin film coated with a 10 ⁇ m-thick acrylic adhesive containing a photoreactive oligomer. Adhesion evaluation on a 200 ⁇ m wafer was performed using the laminated film and the results are shown in Table 5.
  • Acrylic polymer CS-200 resin having a content of acrylonitrile monomer unit of 20% by weight, a glass transition temperature of 10 ° C. and a molecular weight of 900,000, an epoxy / phenol resin mixture as used in Examples 1 to 3, and an average as a filler
  • An adhesive film was prepared in the same manner as in Examples 1 to 3 using fumed silica having a particle diameter of 20 nanometers (trade name R-972, manufactured by Degus Co., Ltd.) in the amounts shown in Table 2.
  • the adhesive film was evaluated in the same manner as in Examples 1 to 3, and the results are shown in Table 5.
  • Alumina Spherical alumina (trade name ASFP-20, manufactured by Denka Corporation) having an average particle diameter of 0.5 micrometer: 1: 5 of each phase alumina (trade name A-43-M manufactured by Showa Co., Ltd.) having an average particle diameter of 1 micrometer.
  • Weight ratio mixture [Spherical alumina (trade name ASFP-20, manufactured by Denka Corporation) having an average particle diameter of 0.5 micrometer: 1: 5 of each phase alumina (trade name A-43-M manufactured by Showa Co., Ltd.) having an average particle diameter of 1 micrometer. Weight ratio mixture]
  • An adhesive film was prepared in the same manner as in Examples 1 to 3 using an acrylic polymer CS-200 resin as shown in Table 4, and an epoxy / phenol resin mixture and a filler as used in Examples 1 to 3.
  • the adhesive film was evaluated in the same manner as in Examples 1 to 3, and the results are shown in Table 7.
  • Adhesion Adhesion before UV irradiation between adhesive composition layer and pressure sensitive adhesive layer
  • Peeling force * adhesive force after ultraviolet irradiation between the adhesive composition layer and the pressure-sensitive adhesive layer
  • Adhesion ** Adhesion between wafer and adhesive film
  • Adhesion *** Adhesion between flexible circuit board and adhesive film
  • Adhesion Adhesion before UV irradiation between adhesive composition layer and pressure sensitive adhesive layer
  • Peeling force * adhesive force after ultraviolet irradiation between the adhesive composition layer and the pressure-sensitive adhesive layer
  • Adhesion ** Adhesion between wafer and adhesive film
  • Adhesion *** Adhesion between flexible circuit board and adhesive film
  • Adhesion Adhesion before UV irradiation between adhesive composition layer and pressure sensitive adhesive layer
  • Peeling force * adhesive force after ultraviolet irradiation between the adhesive composition layer and the pressure-sensitive adhesive layer
  • Adhesion ** Adhesion between wafer and adhesive film
  • Adhesion *** Adhesion between flexible circuit board and adhesive film
  • the adhesion between the wafer and the flexible circuit board is increased to prevent chip damage that may occur during the wafer cutting process, thereby obtaining an adhesive film having excellent pickup properties.

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Abstract

The present invention relates to an adhesive composition and film for preparing a semiconductor, and more specifically, an adhesive composition for preparing a semiconductor which comprises an acrylic resin containing acrylonitrile, a mixture of an epoxy compound and a phenolic resin, and a filler, having excellent wafer pick-up characteristics during a semiconductor manufacturing process, and has excellent adhesive strength to a wafer, a lead frame and a PCB substrate, and an adhesive film for preparing a semiconductor, containing a coating layer of the composition.

Description

반도체 제조용 접착제 조성물 및 필름Adhesive Compositions and Films for Semiconductor Manufacturing
본 발명은 반도체 제조용 접착제 조성물 및 필름에 관한 것으로서, 보다 상세하게는, 아크릴로니트릴 함유 아크릴 수지, 에폭시 화합물과 페놀 수지의 혼합물 및 충전제를 포함하며, 반도체 제조 공정 중 웨이퍼 픽업(Pick up) 공정 특성이 우수하고, 웨이퍼, 리드프레임, PCB 기판(PCB Substrate)에 대한 접착력이 우수한 반도체 제조용 접착제 조성물 및 이 조성물의 코팅층을 포함하는 반도체 제조용 접착필름에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to adhesive compositions and films for semiconductor manufacturing, and more particularly, to acrylonitrile-containing acrylic resins, mixtures of epoxy compounds and phenol resins and fillers, and to wafer up process characteristics during semiconductor manufacturing processes. The present invention relates to an adhesive composition for manufacturing a semiconductor having excellent adhesion to a wafer, a lead frame, a PCB substrate, and an adhesive film for manufacturing a semiconductor including a coating layer of the composition.
반도체 제조 공정에서 웨이퍼를 칩으로 절단하여, 개개의 칩을 리드프레임이나 플렉서블 프린티드서킷보드에 본딩하는 공정재료로서 단층 칩 패키지에서는 액상 형태의 접착제를 적용하였으나, 반도체의 제조 공정의 고도화로 인하여 다층 칩 적층 기술을 이용한 반도체 실장 패키지가 많은 부분을 차지하게 되었다. 이러한 다층 칩 적층 패키지에 액상 접착제를 사용하면 공정 작업성이 어려워지기 때문에, 다층 칩 적층 패키지에는 접착제를 필름상으로 적용하게 되었다. 이러한 필름형태의 접착제는 회로가 식각된 웨이퍼의 그라인딩 공정 이후에 라미네이션 설비를 이용하여 적용되며, 열에 의해 접착력을 발휘하게 된다. 그 결과, 접착필름이 부착된 필름의 웨이퍼를 칩으로 절단하기 위한 다이싱 공정, 절단된 칩을 개개의 칩으로 개편하기 위한 확장 및 픽업(pick-up)공정, 픽업공정에 의해서 개편화된 칩을 기판에 실장하기 위한 본딩 공정을 통하여 액상 접착제와 달리 다층의 칩을 적층할 수 있게 한다. 이렇게 적층된 칩과 기판의 전기적 연결을 위한 금속 와이어링 공정 및 칩의 보호를 위한 에폭시 몰딩 공정이 후속하여 진행된다. 상기와 같은 공정 중에서 웨이퍼를 절단하여 칩 형태로 제조한 다음, 이후의 공정에 사용하기 위하여 접착필름이 활용된다.In the semiconductor manufacturing process, wafers are cut into chips and individual chips are bonded to leadframes or flexible printed circuit boards. As a single-layer chip package, a liquid adhesive is applied, but due to the advancement of the semiconductor manufacturing process, Semiconductor mounting packages using chip stacking techniques have become a large part. When the liquid adhesive is used in such a multilayer chip stack package, the process workability becomes difficult, and thus the adhesive is applied to the multilayer chip stack package in a film form. The adhesive in the form of a film is applied using a lamination facility after the grinding process of the wafer on which the circuit is etched, and exhibits adhesive force by heat. As a result, the chip is divided by the dicing process for cutting the wafer of the film with the adhesive film into chips, the expansion and pick-up process for reorganizing the cut chips into individual chips, and the pick-up process. Through the bonding process for mounting the on a substrate it is possible to stack a multi-layer chip, unlike the liquid adhesive. The metal wiring process for electrical connection between the stacked chip and the substrate and the epoxy molding process for protecting the chip are subsequently performed. After cutting the wafer in the above process to produce a chip form, the adhesive film is used for use in subsequent processes.
완성된 칩을 기판에 부착하기 위한 기존의 수단으로는 액상 에폭시 수지 조성물을 준비된 리드프레임이나 플렉서블 프린티드서킷보드(FPCB) 위에 일정 형상으로 도포하고, 웨이퍼 보호용 점착쉬트를 이용하여 미리 가공된 개편화된 칩을 실장하는 방식이 있다. 그러나 액상 에폭시 수지 조성물을 도포하는 공정은 도포두께의 균일도를 제어하기 어렵고, 칩 부착시 가해지는 압력에 의해 블리딩 등이 발생하기 쉽다. 액상 접착제 조성물의 요변지수를 조절하여 그 흐름성을 제어할 수는 있으나, 다층 칩의 제조에는 적용이 어려워 단일 칩의 제조에만 국한되고 있다.Existing means for attaching the finished chip to the substrate is to apply a liquid epoxy resin composition to the prepared lead frame or flexible printed circuit board (FPCB) in a predetermined shape, and the previously processed individualized by using a wafer protective adhesive sheet There is a way to mount the chip. However, in the process of applying the liquid epoxy resin composition, it is difficult to control the uniformity of the coating thickness, and bleeding is likely to occur due to the pressure applied when the chip is attached. Although it is possible to control the flowability by adjusting the thixotropy index of the liquid adhesive composition, it is difficult to apply to the manufacture of the multilayer chip is limited to the production of a single chip.
상기 액상 접착제로부터 수반되는 문제를 해결하기 위하여 액상 접착제를 적절한 수지 조성물로 개질하여 쉬트상으로 제공하는 방법이 제안되어 왔다. 쉬트상 접착제는 칩과 유사한 크기의 릴(rill) 형태로 제조된 후, 이 접착쉬트를 칩 크기로 절단하고 본딩할 수 있는 특정장비를 사용하여 절단하고 기판에 부착시킨 후 개편화된 칩을 부착하는 방식으로 사용된다. 그러나 이러한 공정은 접착쉬트를 절단하고 부착하기 위한 특정장비와 추가 공정을 필요로 하는 문제가 있어 그 활용이 줄어들고 있다.In order to solve the problem accompanying the said liquid adhesive, the method of modifying a liquid adhesive with a suitable resin composition and providing it in the sheet form has been proposed. Sheet-like adhesives are manufactured in the form of reels similar to chips, and then cut using a special equipment that can cut and bond the adhesive sheets to chip sizes, attach them to the substrate, and then attach the fragmented chips. It is used in such a way. However, this process has a problem that requires a specific equipment and additional processes for cutting and attaching the adhesive sheet has been reduced its utilization.
현재의 반도체 칩 부착 공정에서는, 접착쉬트를 웨이퍼 이면에 미리 부착하여 다이싱 공정을 진행하고 칩을 리드프레임 또는 플렉서블 프린티드서킷보드에 본딩하게 된다. 이러한 본딩 공정에서 접착 필름은 다이싱 공정전 웨이퍼와의 라미네이션시 기포없이 우수한 밀착력을 가져야 하며, 다이싱 공정에서 사용되는 공정 용수 및 크리닝에 사용되는 물과 에어에 의하여 접착필름과 웨이퍼 이면 또는 다이싱 필름 사이에서 박리 내지 수침이 발생되지 않아야 한다. 또한 다이싱 공정에서 분리된 칩을 픽업하는 공정에서 어려움 없이 다이싱 필름으로부터 픽업이 이루어져야 하며, 본딩공정에서는 칩과 리드프레임 또는 플렉서블 프린티드서킷보드에 대해 우수한 접착력을 나타내어야 한다.In the current semiconductor chip attaching process, the adhesive sheet is attached to the back surface of the wafer in advance to perform a dicing process and the chip is bonded to a lead frame or a flexible printed circuit board. In this bonding process, the adhesive film should have excellent adhesion without bubbles during lamination with the wafer before the dicing process, and the adhesive film and the back surface of the wafer or dicing by the water and air used for the process water and cleaning used in the dicing process No peeling or immersion should occur between the films. In addition, the pick-up from the dicing film should be made without difficulty in picking up the separated chip in the dicing process, and in the bonding process, it should show excellent adhesion to the chip and the lead frame or the flexible printed circuit board.
높은 처리 속도와 높은 메모리를 요구하는 제품의 경우, 반도체 칩 제조 공정에서 칩과 플렉서블 프린티드서킷보드 사이의 다이 본딩용 접착 필름의 접착력이 높아야 한다. 플렉서블 프린티드서킷보드와 칩의 본딩에서 충분한 접착력이 나타나지 않으면 칩 제조 공정 중에 플렉서블 프린티드서킷보드로부터 칩이 이탈할 수 있다. For products requiring high processing speed and high memory, the adhesive force of the die bonding adhesive film between the chip and the flexible printed circuit board in the semiconductor chip manufacturing process must be high. If sufficient adhesion is not seen in the bonding of the flexible printed circuit board and the chip, the chip may deviate from the flexible printed circuit board during the chip manufacturing process.
대한민국 등록특허 제10-0826420호는 주쇄에 이중결합을 가지는 고무계 수지를 사용한 접착필름 조성물을 제공하고 있다. 그러나 이 특허의 조성물에서와 같이 수지의 주쇄에 이중결합이 존재하면 이중결합의 가류로 인하여 플렉서블 프린티드서킷보드에 대한 접착력이 오히려 낮아질 수 있다.Republic of Korea Patent No. 10-0826420 provides an adhesive film composition using a rubber-based resin having a double bond in the main chain. However, as in the composition of this patent, the presence of a double bond in the main chain of the resin may lower the adhesion to the flexible printed circuit board due to the vulcanization of the double bond.
대한민국 등록특허 제10-0447014호는 내열성이 높은 폴리이미드계 접착제 조성물을 이용한 접착 필름을 제공하고 있다. 그러나 이 특허의 조성물은 내열성은 높은 대신 접착력이 낮다는 문제점이 있다.Republic of Korea Patent No. 10-0447014 provides an adhesive film using a high heat resistance polyimide adhesive composition. However, the composition of this patent has a problem that the adhesive strength is low, instead of high heat resistance.
본 발명은 상기한 바와 같은 종래기술의 문제점을 해결하고자 한 것으로, 반도체 제조 공정 중 웨이퍼 픽업 공정 특성이 우수하고, 웨이퍼, 리드프레임, PCB 기판에 대한 접착력이 우수한 반도체 제조용 접착제 조성물 및 이 조성물의 코팅층을 포함하는 반도체 제조용 접착필름을 제공하는 것을 기술적 과제로 한다.The present invention has been made to solve the problems of the prior art as described above, the adhesive composition for semiconductor manufacturing excellent in the wafer pickup process characteristics of the semiconductor manufacturing process, excellent adhesion to the wafer, lead frame, PCB substrate and coating layer of the composition It is a technical object of the present invention to provide an adhesive film for manufacturing a semiconductor.
상기한 기술적 과제를 달성하고자, 본 발명은 15~40중량%의 아크릴로니트릴 모노머 단위를 함유하는 아크릴 수지 15~75중량부; 에폭시 화합물과 페놀 수지의 혼합물 5~60중량부; 및 충전제 10~80중량부를 포함하는 반도체 제조용 접착제 조성물을 제공한다.In order to achieve the above technical problem, the present invention is 15 to 75 parts by weight of an acrylic resin containing 15 to 40% by weight of acrylonitrile monomer units; 5 to 60 parts by weight of a mixture of an epoxy compound and a phenol resin; And it provides an adhesive composition for manufacturing a semiconductor comprising 10 to 80 parts by weight of a filler.
본 발명의 다른 측면에 따르면, 본 발명의 접착제 조성물의 코팅층을 포함하는 것을 특징으로 하는 반도체 제조용 접착필름이 제공된다.According to another aspect of the present invention, there is provided an adhesive film for manufacturing a semiconductor comprising a coating layer of the adhesive composition of the present invention.
본 발명의 접착제 조성물 및 접착필름을 반도체 제조공정 중에 사용하면, 웨이퍼와의 라미네이션시 웨이퍼에 대한 부착력과 점착력이 우수하고, 다이싱 필름으로부터의 픽업 특성이 우수하며, 본딩공정에서 접착력이 우수하여 반도체 패키지 제조 공정의 작업성을 높이고, 제조된 반도체 제품의 신뢰성을 높일 수 있다.When the adhesive composition and the adhesive film of the present invention are used during the semiconductor manufacturing process, the adhesion and adhesion to the wafer during lamination with the wafer are excellent, the pick-up property from the dicing film is excellent, and the adhesion is excellent in the bonding process. The workability of the package manufacturing process can be improved, and the reliability of the manufactured semiconductor product can be improved.
도 1은 본 발명에 따른 접착필름이 웨이퍼에 적용된 상태의 일 구체예를 나타낸 개략도이다.1 is a schematic view showing one embodiment of a state in which the adhesive film according to the present invention is applied to a wafer.
도 2는 본 발명에 따른 접착필름의 일 구체예의 층구성을 나타낸 개략도(위쪽) 및 그 사용 직전에 이형필름을 제거한 상태를 나타낸 개략도(아래쪽)이다.Figure 2 is a schematic diagram (top) showing the layer structure of one embodiment of the adhesive film according to the present invention and a schematic diagram (bottom) showing a state in which the release film is removed immediately before use thereof.
도 3은 본 발명에 따른 접착필름을 포함하는 다이싱/다이본딩 필름의 일 구체예의 층구성을 나타낸 개략도이다.Figure 3 is a schematic diagram showing the layer configuration of one embodiment of the dicing / die bonding film comprising an adhesive film according to the present invention.
<부호의 설명><Description of the code>
1. 웨이퍼1. Wafer
2. 접착제 조성물 코팅층2. Adhesive composition coating layer
3. 점착제 층 3. Adhesive layer
4. 기재층 (이형층)4. Base layer (release layer)
이하에서 본 발명을 상세히 설명한다.Hereinafter, the present invention will be described in detail.
본 발명의 접착제 조성물은 아크릴로니트릴 함유 아크릴 수지 성분을 포함한다. 이 아크릴 수지 성분은, 수지 100중량%에 대하여 15~40중량%, 보다 바람직하게는 20~40중량%의 아크릴로니트릴 모노머 단위를 함유한다. 본 발명의 일 구체예에 따르면, 아크릴로니트릴 화합물 15 내지 40중량부와 아크릴레이트 화합물, 예컨대 에틸 또는 부틸 아크릴레이트 60 내지 85중량부를 중합반응하여 얻어진 아크릴 수지 성분이 사용될 수 있다. 아크릴로니트릴 모노머 단위 함량이 15중량% 미만이면 에폭시 화합물과의 상용성이 떨어지고, 40중량%를 초과하면 수지 분자량이 너무 급격하게 올라가는 문제점이 있다.The adhesive composition of this invention contains an acrylonitrile containing acrylic resin component. The acrylic resin component contains 15 to 40% by weight, more preferably 20 to 40% by weight of acrylonitrile monomer units with respect to 100% by weight of the resin. According to one embodiment of the present invention, an acrylic resin component obtained by polymerizing 15 to 40 parts by weight of an acrylonitrile compound and 60 to 85 parts by weight of an acrylate compound such as ethyl or butyl acrylate may be used. If the acrylonitrile monomer unit content is less than 15% by weight, the compatibility with the epoxy compound is inferior, and if it exceeds 40% by weight, there is a problem that the resin molecular weight rises too rapidly.
본 발명에 있어서, 아크릴로니트릴 함유 아크릴 수지의 중량평균 분자량은 바람직하게는 30만 내지 200만이며, 보다 바람직하게는 50만 내지 150만이다. 또한 그 유리전이온도는 바람직하게는 -20℃ 내지 50℃이고, 보다 바람직하게는 0℃ 내지 40℃이다. 아크릴 수지의 중량평균 분자량이 30만 미만이면 수지의 점도가 너무 낮아져 접착필름 구성시 너무 소프트해져 필름 구성이 어려울 수 있으며, 200만을 초과하면 점도가 너무 높아져 필름의 제조에 어려움이 있을 수 있다. 아크릴 수지의 유리전이온도가 -20℃ 미만이면 접착필름의 표면 젖음성이 너무 높아져 필름 가공시 점착필름과의 분리성이 나빠질 수 있고, 50℃를 초과하면 반도체 패키지 공정에서 웨이퍼와의 부착력이 나빠져 공정상에서 접착필름의 분리가 발생할 수 있다.In this invention, the weight average molecular weight of an acrylonitrile containing acrylic resin becomes like this. Preferably it is 300,000-2 million, More preferably, it is 500,000-1,500,000. Moreover, the glass transition temperature becomes like this. Preferably it is -20 degreeC-50 degreeC, More preferably, it is 0 degreeC-40 degreeC. If the weight average molecular weight of the acrylic resin is less than 300,000, the viscosity of the resin is too low to be too soft at the time of the composition of the adhesive film, the film configuration may be difficult, and if more than 2 million, the viscosity may be too high, there may be difficulty in the production of the film. If the glass transition temperature of the acrylic resin is less than -20 ° C, the surface wettability of the adhesive film may be too high, and the separation property from the adhesive film may be deteriorated when the film is processed. If the glass transition temperature is higher than 50 ° C, the adhesion force with the wafer is degraded in the semiconductor package process. Separation of the adhesive film may occur on the bed.
본 발명의 접착제 조성물에는 상기 아크릴로니트릴 함유 아크릴 수지가 15~75중량부 포함된다. 조성물 내 아크릴로니트릴 함유 아크릴 수지 함량이 이보다 적으면 전체 필름의 물성에서 코팅성이 나빠지고 필름이 너무 쉽게 부서지는 문제점이 있고, 반대로 이보다 많으면 필름 형성은 잘되지만 접착력 부족으로 인하여 반도체 칩 제조 공정에서 신뢰성이 나빠지는 문제점이 있다.The adhesive composition of the present invention contains 15 to 75 parts by weight of the acrylonitrile-containing acrylic resin. When the content of acrylonitrile-containing acrylic resin in the composition is less than this, there is a problem in that the coating property is poor in the physical properties of the entire film and the film is broken too easily. There is a problem of poor reliability.
본 발명의 접착제 조성물은 에폭시 화합물과 페놀 수지의 혼합물을 포함한다. The adhesive composition of the present invention comprises a mixture of an epoxy compound and a phenol resin.
본 발명에서 사용가능한 에폭시 화합물로는 예컨대, 비스페놀A형 에폭시 수지, 비스페놀F형 에폭시 수지, 비스페놀S형 에폭시 수지, 지환식 에폭시 수지, 지방족 쇄상 에폭시 수지, 페놀노볼락형 에폭시 수지, 크레졸노볼락형 에폭시 수지, 비스페놀A 노볼락형 에폭시 수지, 비페놀의 디글리시딜에테르화물, 나프탈렌디올의 디글리시딜에테르화물, 페놀류의 디글리시딜에테르화물, 알코올류의 디글리시딜에테르화물 및 이들의 알킬 치환체, 할로겐화물 또는 수소첨가물, 다관능 에폭시 수지, 복소환 함유 에폭시 수지 등을 포함하여 일반적으로 알려져 있는 것들을 들 수 있고, 이들은 단독으로 또는 2종류 이상을 조합하여 사용할 수 있다. 보다 구체적으로는, 예컨대 시판의 것으로, 에피코트807, 에피코트815, 에피코트825, 에피코트827, 에피코트828, 에피코트834, 에피코트1001, 에피코트1002, 에피코트1003, 에피코트1055, 에피코트1004, 에피코트1004AF, 에피코트1007, 에피코트1009, 에피코트1003F, 에피코트1004F(이상, 재팬에폭시레진주식회사제, 상품명), YD011, YD-012, YD-013K, YD-014, YD-017, YD-112, YD-113, YD-114, YD-115, YD-127, YD-128(이상, 국도화학주식회사제, 상품명), SE-187, SE-187P (이상, 신화T&C사제, 상품명) 등의 비스페놀A형 에폭시 수지, YDF-161,YDF-162, YDF-170 (국도화학주식회사제, 상품명), SE-187, SE-187P (이상, 신화T&C사제, 상품명) 등의 비스페놀F형 에폭시 수지, EPPN-201, EPPN-501, EPPN-501HY, EPPN-502(이상, 니뽄화약주식회사제, 상품명), YDPN-631, YDPN-636, YDPN-638 (이상, 국도화학주식회사제, 상품명) 등의 페놀노볼락형 에폭시 수지, YDCN-500-1P, YDCN-500-4P, YDCN-500-5P, YDCN-500-7P, YDCN-500-10P, YDCN-500-80P (이상, 국도화학주식회사제, 상품명), EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1020, EOCN-1025, EOCN-1027(이상, 니뽄화약주식회사제, 상품명)등의 크레졸 노볼락형 에폭시 수지 등을 들 수 있고, 이들은 단독으로 또는 2종류 이상을 조합하여 사용할 수 있다. Examples of the epoxy compound usable in the present invention include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, alicyclic epoxy resins, aliphatic chain epoxy resins, phenol novolac type epoxy resins, and cresol novolac types. Epoxy resin, bisphenol A novolak type epoxy resin, diglycidyl etherate of biphenol, diglycidyl etherate of naphthalenediol, diglycidyl etherate of phenols, diglycidyl etherate of alcohols, and Those generally known, including these alkyl substituents, halide or hydrogenated substance, polyfunctional epoxy resin, heterocyclic containing epoxy resin, etc. are mentioned, These can be used individually or in combination of 2 or more types. More specifically, it is commercially available, for example, Epicoat 807, Epicoat 815, Epicoat 825, Epicoat 827, Epicoat 828, Epicoat 834, Epicoat 1001, Epicoat 1002, Epicoat 1003, Epicoat 1055, Epicoat 1004, Epicoat 1004AF, Epicoat 1007, Epicoat 1009, Epicoat 1003F, Epicoat 1004F (above, Japan Epoxy Resin Co., Ltd., brand name), YD011, YD-012, YD-013K, YD-014, YD -017, YD-112, YD-113, YD-114, YD-115, YD-127, YD-128 (above, manufactured by Kukdo Chemical Co., Ltd., product name), SE-187, SE-187P (above, made by Shinhwa T & C Co., Ltd.) Bisphenols such as bisphenol-A epoxy resins such as YB-161, YDF-162, YDF-170 (manufactured by Kukdo Chemical Co., Ltd.), SE-187, SE-187P (above, manufactured by Xinhua T & C Co., Ltd.) F type epoxy resin, EPPN-201, EPPN-501, EPPN-501HY, EPPN-502 (above, Nippon Kayaku Co., Ltd., brand name), YDPN-631, YDPN-636, YDPN-638 (above, Kukdo Chemical Co., Ltd., Phenol novolac-type epoxy, such as a brand name) G, YDCN-500-1P, YDCN-500-4P, YDCN-500-5P, YDCN-500-7P, YDCN-500-10P, YDCN-500-80P (above, Kukdo Chemical Co., Ltd., brand name), EOCN- Cresol novolak-type epoxy resins, such as 102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1020, EOCN-1025, EOCN-1027 (above, Nippon Kayaku Co., Ltd. brand name), etc. are mentioned, These are mentioned. It can be used individually or in combination of 2 or more types.
본 발명에서 사용가능한 페놀 수지에는 특별한 제한이 없으며, 하이드록시 당량이 100eq/kg 내지 300eq/kg인 페놀 수지가 바람직하다. The phenol resin usable in the present invention is not particularly limited, and a phenol resin having a hydroxy equivalent weight of 100 eq / kg to 300 eq / kg is preferable.
상기 에폭시 화합물과 페놀 수지의 혼합물 내 양자의 혼합비는, 에폭시 화합물 내 에폭시 당량 : 페놀 수지 내 하이드록시 당량비로 1:0.8 내지 1:1.2인 것이 바람직하다. 이 혼합비가 상기 수준을 벗어나면, 에폭시-페놀 경화시스템의 부족으로 인하여 과경화 또는 미경화되어 반도체 칩 제조 공정 후 신뢰성 평가에서 문제가 있을 수 있다.It is preferable that the mixing ratio of both in the mixture of the said epoxy compound and a phenol resin is 1: 0.8-1: 1.2 in ratio of epoxy equivalent in epoxy compound: hydroxy equivalent in phenol resin. If this mixing ratio is out of the above level, there may be a problem in the reliability evaluation after the semiconductor chip manufacturing process due to over- or uncured due to the lack of the epoxy-phenol curing system.
본 발명의 접착제 조성물에는 에폭시 화합물과 페놀수지의 혼합물이 5~60중량부 포함된다. 조성물 내 에폭시 화합물과 페놀수지의 혼합물 함량이 이보다 적으면 고온에서 경화물의 물성이 약해져 장기 사용상에 있어서 문제점이 있고, 반대로 이보다 많으면 필름이 너무 딱딱해지며, 필름상 코팅이 어려운 문제점이 있다.The adhesive composition of the present invention contains 5 to 60 parts by weight of a mixture of an epoxy compound and a phenol resin. If the content of the mixture of the epoxy compound and the phenol resin in the composition is less than this, there is a problem in long-term use due to weak physical properties of the cured product at a high temperature, on the contrary, if the content is more than this, the film becomes too hard and the coating on the film is difficult.
본 발명의 접착제 조성물은 충전제를 포함한다. 충전제로는 상기 아크릴 수지 성분과의 혼화성이 낮은 에폭시계 고분자 화합물, 구상 또는 뭉침 상 형태의 입자 등이 사용가능하다. The adhesive composition of the present invention includes a filler. As the filler, an epoxy-based high molecular compound having a low miscibility with the acrylic resin component, particles in a spherical or agglomerated form, and the like may be used.
아크릴 수지 성분과의 혼화성이 낮은 에폭시계 고분자 화합물로는 중량평균분자량이 50,000이상인 것이 바람직하나. 이에 특별히 한정되는 것은 아니다. 본 발명의 일 구체예에 따르면, 비스페놀 A형, F형 또는 A형과 F형의 혼합물이 에폭시계 고분자 충전제로 사용가능하며, 그 중량평균분자량은 1만 내지 10만이다.The epoxy compound having a low miscibility with the acrylic resin component has a weight average molecular weight of 50,000 or more. It is not specifically limited to this. According to one embodiment of the present invention, bisphenol A type, F type or a mixture of type A and F can be used as an epoxy polymer filler, and its weight average molecular weight is 10,000 to 100,000.
입자상의 충전제로는 실리카(예컨대 용융실리카, 건식실리카), 알루미나(예컨대 구상, 각상, 판상 또는 플레이크상 알루미나), 실버, 골드코팅비드, 실리콘비드, 카본블랙, 수산화알루미늄, 수산화마그네슘, 질화붕소, 이산화티타늄, 세라믹 등의 입자를 들 수 있다. 입자상의 충전제의 평균 입자 크기는 바람직하게는 10 나노미터 내지 10 마이크로미터이며, 보다 바람직하게는 20 나노미터 내지 5 마이크로미터이다. 입자상의 충전제로는 구상 내지 입자 뭉침상의 형태를 갖는 것을 사용할 수 있다. 본 발명의 일 구체예에 따르면, 알루미나의 경우 구상:각상 알루미나를 중량비로 1:3 내지 1:6의 범위로 혼합하여 사용할 수도 있다.Particulate fillers include silica (e.g. fused silica, dry silica), alumina (e.g. spherical, square, plate or flake alumina), silver, gold coated beads, silicon beads, carbon black, aluminum hydroxide, magnesium hydroxide, boron nitride, Particles, such as titanium dioxide and a ceramic, are mentioned. The average particle size of the particulate filler is preferably from 10 nanometers to 10 micrometers, more preferably from 20 nanometers to 5 micrometers. As the particulate filler, those having a spherical to agglomerated form can be used. According to one embodiment of the present invention, in the case of alumina, spherical: angular alumina may be mixed in a weight ratio of 1: 3 to 1: 6.
본 발명의 접착제 조성물에는 충전제가 10~80중량부 포함된다. 조성물 내 충전제 함량이 이보다 적으면 접착제의 강도가 저하되는 문제점이 있고, 반대로 이보다 많으면 점착필름과의 밀착력이 떨어져 공정 작업성이 떨어지는 문제점이 있다.The adhesive composition of this invention contains 10-80 weight part of fillers. When the content of the filler in the composition is less than this, there is a problem in that the strength of the adhesive is lowered.
본 발명의 접착제 조성물에는 상기한 성분들 이외에 반도체 공정용 접착제 조성물에 통상적으로 사용되는 성분들, 예컨대, 아세톤, 메틸에틸케톤, 톨루엔, 에틸아세테이트 등과 같은 용제가 적절한 양으로 추가로 포함될 수 있다.In addition to the above components, the adhesive composition of the present invention may further include components conventionally used in the adhesive composition for semiconductor processing, such as acetone, methyl ethyl ketone, toluene, ethyl acetate, and the like in an appropriate amount.
본 발명의 접착제 조성물 제조방법에는 특별한 제한이 없으며, 통상의 접착제 조성물 제조용 장비를 사용하여 통상의 공정으로 제조할 수 있다. 본 발명의 일 구체예에 따르면, 상기 설명한 아크릴로니트릴 함유 아크릴 수지, 에폭시 화합물, 페놀수지, 충전제 및 용제 등의 기타 성분을 비드밀 등의 혼합장비를 사용하여 실온 내지 적절히 승온된 온도에서 분산 및 혼합함으로써 본 발명의 접착제 조성물을 제조할 수 있다. There is no particular limitation on the method of preparing the adhesive composition of the present invention, and it can be prepared by a conventional process using equipment for preparing an adhesive composition. According to one embodiment of the present invention, other components such as the acrylonitrile-containing acrylic resin, epoxy compound, phenol resin, filler, and solvent described above are dispersed and mixed at room temperature to an appropriately elevated temperature using a mixing equipment such as a bead mill. The adhesive composition of this invention can be manufactured by mixing.
본 발명의 다른 측면에 따르면, 상기 설명한 바와 같은 본 발명의 접착제 조성물의 코팅층을 포함하는 것을 특징으로 하는 반도체 제조용 접착필름이 제공된다.According to another aspect of the present invention, there is provided an adhesive film for producing a semiconductor comprising a coating layer of the adhesive composition of the present invention as described above.
본 발명에 따른 반도체 제조용 접착필름은 상기 본 발명의 접착제 조성물의 코팅층을 포함하는 것을 특징으로 하며, 그 외에 필름구성상 필요에 따라 하나 이상의 기재(필름)층[이형(필름)층 또는 보호(필름)층이라고도 함) 및 점착(필름)층을 더 포함할 수 있다. 본 발명의 일 구체예에 따른 반도체 제조용 접착필름은 접착제 조성물 층 + 점착층; 기재층 + 접착제 조성물 층 + 기재층; 접착제 조성물 층 + 기재층; 기재층 + 접착제 조성물 층 + 점착층 등과 같은 층 구성을 가질 수 있으나, 이에 제한되는 것은 아니다. Adhesive film for semiconductor production according to the present invention is characterized in that it comprises a coating layer of the adhesive composition of the present invention, in addition to one or more substrate (film) layer [release (film) layer or protective (film) according to the film configuration needs Layer) and an adhesive (film) layer may be further included. Adhesive film for semiconductor production according to an embodiment of the present invention is an adhesive composition layer + pressure-sensitive adhesive layer; Base layer + adhesive composition layer + base layer; Adhesive composition layer + base layer; It may have a layer configuration such as a base layer + adhesive composition layer + adhesive layer, but is not limited thereto.
본 발명의 반도체 제조용 접착필름에 포함가능한 기재층 재질에는 특별한 제한이 없으며, 폴리에틸렌 테레프탈레이트, 폴리올레핀계 또는 폴리비닐클로라이드계 물질과 같이 반도체 제조용 접착필름의 기재필름으로서 통상 사용가능한 것들을 활용할 수 있다. 또한 점착층으로는, 광반응성 올리고머를 포함하는 아크릴계 물질과 같이 반도체 제조용 접착필름에 통상 사용되는 점착성 물질이 사용될 수 있다. The base layer material that can be included in the adhesive film for manufacturing a semiconductor of the present invention is not particularly limited, and those commonly available as the substrate film of the adhesive film for manufacturing a semiconductor, such as polyethylene terephthalate, polyolefin-based or polyvinyl chloride-based materials, may be used. In addition, the adhesive layer, such as an acrylic material containing a photoreactive oligomer, may be used an adhesive material commonly used in the adhesive film for semiconductor production.
본 발명의 반도체 제조용 접착필름에 있어서, 상기 접착제 조성물의 코팅층 두께에는 특별한 제한이 없으며, 통상 5 내지 300μm 범위 내에서 구체적인 층구성에 따라 달라질 수 있다. 예컨대 접착제 조성물의 코팅층 두께가, 점착층과 함께 구성되는 경우에는 5 내지 80μm 범위일 수 있고, 두개의 기재층 사이에 구성되는 경우에는 20 내지 100μm 범위일 수 있으며, 1개의 기재층과 함께 구성되는 경우에는 40 내지 300μm 범위일 수 있으나, 이에 한정되는 것은 아니다. In the adhesive film for manufacturing a semiconductor of the present invention, there is no particular limitation on the thickness of the coating layer of the adhesive composition, and may vary depending on a specific layer configuration within a range of 5 to 300 μm. For example, the coating layer thickness of the adhesive composition may be in the range of 5 to 80 μm when configured with the adhesive layer, and may be in the range of 20 to 100 μm when configured between the two base layers, and is configured with one base layer. In this case, the range may be 40 to 300 μm, but is not limited thereto.
본 발명의 접착필름 제조방법에는 특별한 제한이 없으며, 통상의 다층접착필름 제조용 장비를 사용하여 통상의 공정으로 제조할 수 있다. 본 발명의 일 구체예에 따르면, 본 발명의 접착제 조성물을 폴리에틸렌 테레프탈레이트 재질의 기재층에 코팅한 후, 이를 필요에 따라 아크릴 점착제가 코팅된 점착필름과 합지하여 본 발명의 접착필름을 제조할 수 있다. There is no particular limitation on the method of manufacturing the adhesive film of the present invention, and it may be prepared by a conventional process using a conventional multilayer adhesive film production equipment. According to one embodiment of the present invention, after coating the adhesive composition of the present invention on a polyethylene terephthalate base material layer, it may be laminated with an adhesive film coated with an acrylic adhesive, if necessary, to prepare the adhesive film of the present invention. have.
이하 실시예를 통해 본 발명을 보다 구체적으로 설명한다. 그러나 이들 실시예는 본 발명의 이해를 돕기 위한 것일 뿐 어떤 의미로든 본 발명의 범위가 이들 실시예로 한정되는 것은 아니다. The present invention will be described in more detail with reference to the following Examples. However, these examples are only for the understanding of the present invention, and the scope of the present invention in any sense is not limited to these examples.
이하의 실시예에서, 접착필름의 물성평가는 하기 방법으로 수행하였다.In the following examples, the physical property evaluation of the adhesive film was performed by the following method.
접착력 평가Adhesion Evaluation
본 발명의 실시예 및 비교예에서 제조된 접착필름의 접착력 측정을 위하여, JIS Z 0237 규격 및 KSA 1107 규격에 의거하여 만능시험기를 사용하여 180°박리력을 시험하였다. In order to measure the adhesion of the adhesive films prepared in Examples and Comparative Examples of the present invention, 180 ° peeling strength was tested using a universal testing machine based on JIS Z 0237 standard and KSA 1107 standard.
자외선 조사 이후 박리력은 자외선 조사장치를 사용하여 80mW/cm2 강도의 자외선을 150mJ/cm2로 조사한 후 상온에서 20분간 방치하여 180°박리력을 시험하였다. Peeling force after the ultraviolet irradiation was irradiated with ultraviolet radiation of 80mW / cm 2 intensity to 150mJ / cm 2 using an ultraviolet irradiation device and left for 20 minutes at room temperature to test the 180 ° peeling force.
웨이퍼와 접착필름의 Void 확인Void check of wafer and adhesive film
본 발명의 실시예에서 제조된 접착필름을 테이프마운팅설비 (DT-MWM 1230A, 다이나테크)를 이용하여 65℃ 온도에서 롤형태의 바를 통하여 압착하여 웨이퍼와 접착필름 사이의 Void 유무를 확인하였다. The adhesive film prepared in the embodiment of the present invention was pressed through a roll-shaped bar at a temperature of 65 ° C. using a tape mounting facility (DT-MWM 1230A, Dynatech) to confirm the presence of a void between the wafer and the adhesive film.
칩핑 및 칩 비산(flying) 평가Chipping and Chip Flying Evaluation
제조된 접착필름을 8인치의 200㎛ 웨이퍼에 부착한 후, 다이싱 장치(디스코社, DFD6361)를 사용하여 절단 및 세정공정을 실시한 후 육안 및 광학현미경으로 관찰하였다. 절단공정은 칩 크기 × 10mm, 피딩속도 70mm/s, 블레이드 높이 70㎛, 블레이드 회전수 30,000rpm의 조건으로 실시하였고, 세정공정은 웨이퍼가 회전하는 동안 초순수 및 압력공기를 분사하여 실시하여, 칩 모서리가 손상되는 불량인 칩핑(chipping)과 칩이 비산되는 개수를 기록하였다.The adhesive film thus prepared was attached to a 200-inch wafer of 8 inches, and then subjected to a cutting and cleaning process using a dicing apparatus (Disco, DFD6361), followed by visual and optical microscopy. The cutting process was carried out under the conditions of chip size × 10mm, feeding speed 70mm / s, blade height 70㎛, blade rotation speed 30,000rpm, and cleaning process was performed by spraying ultrapure water and pressure air while the wafer was rotating. The chipping (chipping) and the number of chips scattered were recorded.
픽업 특성 평가Pickup characteristic evaluation
절단 및 세정공정이 끝난 웨이퍼를 자외선 조사장치를 사용하여 150mJ/cm2 양으로 자외선을 조사한 후 상온에서 20분간 방치하여 다이어태치 장비(세크론社, SDB-30US)를 사용하여 픽업특성을 평가하였다. 픽업 공정은 칩 크기 10mm × 10mm, 핀 수 10 개, 확장 5mm의 조건으로 설정한 후 핀 스트로크 200㎛ 내지 800㎛의 범위에서 웨이퍼 중앙부의 칩 100개에 대하여 실시하였고 임의의 핀 스트로크에서 1회의 픽업공정으로 모든 칩이 픽업되었을 경우를 ○ 로, 2 내지 3회의 픽업공정으로 모든 칩이 픽업되었을 경우를 △ 로, 그 이상의 픽업 공정이 필요한 경우를 X 로 평가하였다. The wafer after the cutting and cleaning process was irradiated with UV at 150 mJ / cm 2 using an ultraviolet irradiator, and then left at room temperature for 20 minutes to evaluate pick-up characteristics using a die attach device (Secron, SDB-30US). The pick-up process was carried out for 100 chips in the center of the wafer in a pin stroke range of 200 µm to 800 µm after setting the chip size 10 mm × 10 mm, the number of pins, and the extension 5 mm. The case where all chips were picked up by the process was evaluated as (circle), the case where all the chips were picked up by 2 or 3 pick-up process was evaluated as (triangle | delta), and the case where the further pick-up process was needed was evaluated by X.
실시예 1 ~ 실시예 3Example 1 to Example 3
표 1에 나타낸 바와 같이, 아크릴로니트릴(AN) 모노머 단위의 함량을 조정하여 제조된 아크릴 고분자 수지 CS-200 (주식회사태화사제, 제품명) 60중량부, 에폭시수지 YDCN-500-4P (국도화학사제, 상품명, 에폭시당량 200, 연화점 62℃)와 페놀수지 MEH-7800SS(메이화주식회사, 하이드록시기 당량 175)의 혼합물 20중량부(에폭시수지 10중량부 + 페놀수지 10중량부), 충전제로서 뭉침상 입자인 실리카 20중량부를 비드밀을 사용하여 메틸에틸케톤 용제 20중량부에 분산한 다음, 38μm 두께의 폴리에틸렌 테레프탈레이트 이형필름에 건조 두께 20μm로 코팅하여 접착필름을 제조하였다. As shown in Table 1, 60 parts by weight of acrylic polymer resin CS-200 (manufactured by Taehwa Co., Ltd., product name) prepared by adjusting the content of acrylonitrile (AN) monomer unit, epoxy resin YDCN-500-4P (manufactured by Kukdo Chemical Co., Ltd.) 20 parts by weight (10 parts by weight of epoxy resin + 10 parts by weight of phenol resin) of a mixture of a product name, an epoxy equivalent of 200 and a softening point of 62 ° C. and a phenol resin MEH-7800SS (Meywa Co., Ltd., hydroxyl group equivalent of 175) 20 parts by weight of silica as a phase particle was dispersed in 20 parts by weight of a methyl ethyl ketone solvent using a bead mill, and then coated on a 38 μm-thick polyethylene terephthalate release film with a dry thickness of 20 μm to prepare an adhesive film.
제조된 접착필름을 광반응성 올리고머가 포함된 아크릴 점착제가 10μm두께로 코팅된 100μm두께의 폴리올레핀 필름과 합지하였다. 합지된 필름을 사용하여 200㎛ 웨이퍼에 대한 부착 평가를 수행하였고, 그 결과를 표 5에 나타내었다.The prepared adhesive film was laminated with a 100 μm-thick polyolefin film coated with a 10 μm-thick acrylic adhesive containing a photoreactive oligomer. Adhesion evaluation on a 200 μm wafer was performed using the laminated film and the results are shown in Table 5.
표 1
Figure PCTKR2010007840-appb-T000001
 Table 1
Figure PCTKR2010007840-appb-T000001
실시예 4 ~ 실시예 8Example 4-Example 8
아크릴로니트릴 모노머 단위의 함량이 20중량%이고, 유리전이온도가 10℃이며, 분자량이 90만인 아크릴 고분자 CS-200수지, 실시예 1~3에서 사용한 바와 같은 에폭시/페놀 수지 혼합물, 충전제로서 평균입경이 20나노미터인 흄드실리카 (데구사제 상품명 R-972)를 표 2에 나타낸 바와 같은 양으로 사용하여 실시예 1~3과 동일한 방법으로 접착필름을 제조하였다. 접착 필름에 대해 실시예 1~3과 동일한 방법으로 평가하여, 그 결과를 표 5에 나타내었다.Acrylic polymer CS-200 resin having a content of acrylonitrile monomer unit of 20% by weight, a glass transition temperature of 10 ° C. and a molecular weight of 900,000, an epoxy / phenol resin mixture as used in Examples 1 to 3, and an average as a filler An adhesive film was prepared in the same manner as in Examples 1 to 3 using fumed silica having a particle diameter of 20 nanometers (trade name R-972, manufactured by Degus Co., Ltd.) in the amounts shown in Table 2. The adhesive film was evaluated in the same manner as in Examples 1 to 3, and the results are shown in Table 5.
표 2
Figure PCTKR2010007840-appb-T000002
 TABLE 2
Figure PCTKR2010007840-appb-T000002
실시예 9 ~ 실시예 15Example 9- Example 15
아크릴로니트릴 모노머 단위의 함량이 20중량%이고, 유리전이온도가 10℃이며, 분자량이 90만인 아크릴 고분자 CS-200수지 및 실시예 1~3에서 사용한 바와 같은 에폭시/페놀 수지 혼합물과 함께, 다양한 충전제를 표 3에 나타낸 바와 같은 양으로 사용하여 실시예 1~3과 동일한 방법으로 접착필름을 제조하였다. 접착 필름에 대해 실시예 1~3과 동일한 방법으로 평가하여, 그 결과를 표 6에 나타내었다.Along with the acrylic polymer CS-200 resin having a content of 20% by weight of acrylonitrile monomer unit, a glass transition temperature of 10 ° C. and a molecular weight of 900,000, and an epoxy / phenol resin mixture as used in Examples 1 to 3, An adhesive film was prepared in the same manner as in Examples 1 to 3 using the filler in the amounts as shown in Table 3. The adhesive film was evaluated in the same manner as in Examples 1 to 3, and the results are shown in Table 6.
표 3
Figure PCTKR2010007840-appb-T000003
 TABLE 3
Figure PCTKR2010007840-appb-T000003
*: 실리카 [평균입경 1.2 마이크로미터인 용융실리카 (다쯔모리사제 상품명 SO-31R)]*: Silica [Molten silica having an average particle diameter of 1.2 micrometers (trade name SO-31R manufactured by Tatsumori Corporation)]
**: 고분자량 에폭시 (페녹시 수지) (국도화학사제 상품명 YP-50, YP-70)**: High molecular weight epoxy (phenoxy resin) (trade name YP-50, YP-70)
***: 알루미나 [평균입경이 0.5마이크로미터인 구상 알루미나 (덴카사제 상품명 ASFP-20):평균입경이 1마이크로미터인 각상 알루미나 (쇼와데코사제 상품명 A-43-M)의 1:5 중량비 혼합물]***: Alumina [Spherical alumina (trade name ASFP-20, manufactured by Denka Corporation) having an average particle diameter of 0.5 micrometer: 1: 5 of each phase alumina (trade name A-43-M manufactured by Showa Co., Ltd.) having an average particle diameter of 1 micrometer. Weight ratio mixture]
****: 실버 [평균입경이 1 내지 5마이크로미터인 실버 플레이크 (코나텍사의 KSDF-50300)]****: Silver [Silver flakes with an average particle diameter of 1 to 5 micrometers (KSDF-50300, manufactured by Conatec)]
비교예 1 내지 6Comparative Examples 1 to 6
하기 표 4에 나타낸 바와 같은 아크릴 고분자 CS-200수지, 및 실시예 1~3에서 사용한 바와 같은 에폭시/페놀 수지 혼합물 및 충전제를 사용하여 실시예 1~3과 동일한 방법으로 접착필름을 제조하였다. 접착 필름에 대해 실시예 1~3과 동일한 방법으로 평가하여, 그 결과를 표 7에 나타내었다.An adhesive film was prepared in the same manner as in Examples 1 to 3 using an acrylic polymer CS-200 resin as shown in Table 4, and an epoxy / phenol resin mixture and a filler as used in Examples 1 to 3. The adhesive film was evaluated in the same manner as in Examples 1 to 3, and the results are shown in Table 7.
표 4
Figure PCTKR2010007840-appb-T000004
 Table 4
Figure PCTKR2010007840-appb-T000004
표 5
Figure PCTKR2010007840-appb-T000005
 Table 5
Figure PCTKR2010007840-appb-T000005
접착력 : 접착제 조성물 층과 점착제 층 사이의 자외선 조사 이전의 접착력Adhesion: Adhesion before UV irradiation between adhesive composition layer and pressure sensitive adhesive layer
박리력 *: 접착제 조성물 층과 점착제 층 사이의 자외선 조사 이후의 접착력Peeling force *: adhesive force after ultraviolet irradiation between the adhesive composition layer and the pressure-sensitive adhesive layer
접착력 **: Wafer와 접착필름 사이의 접착력Adhesion **: Adhesion between wafer and adhesive film
접착력 ***: 플렉서블 서킷보드와 접착필름 사이의 접착력Adhesion ***: Adhesion between flexible circuit board and adhesive film
표 6
Figure PCTKR2010007840-appb-T000006
 Table 6
Figure PCTKR2010007840-appb-T000006
접착력 : 접착제 조성물 층과 점착제 층 사이의 자외선 조사 이전의 접착력Adhesion: Adhesion before UV irradiation between adhesive composition layer and pressure sensitive adhesive layer
박리력 *: 접착제 조성물 층과 점착제 층 사이의 자외선 조사 이후의 접착력Peeling force *: adhesive force after ultraviolet irradiation between the adhesive composition layer and the pressure-sensitive adhesive layer
접착력 **: Wafer와 접착필름 사이의 접착력Adhesion **: Adhesion between wafer and adhesive film
접착력 ***: 플렉서블 서킷보드와 접착필름 사이의 접착력Adhesion ***: Adhesion between flexible circuit board and adhesive film
표 7
Figure PCTKR2010007840-appb-T000007
 TABLE 7
Figure PCTKR2010007840-appb-T000007
접착력 : 접착제 조성물 층과 점착제 층 사이의 자외선 조사 이전의 접착력Adhesion: Adhesion before UV irradiation between adhesive composition layer and pressure sensitive adhesive layer
박리력 *: 접착제 조성물 층과 점착제 층 사이의 자외선 조사 이후의 접착력Peeling force *: adhesive force after ultraviolet irradiation between the adhesive composition layer and the pressure-sensitive adhesive layer
접착력 **: Wafer와 접착필름 사이의 접착력Adhesion **: Adhesion between wafer and adhesive film
접착력 ***: 플렉서블 서킷보드와 접착필름 사이의 접착력Adhesion ***: Adhesion between flexible circuit board and adhesive film
이상의 평가 결과에서 알 수 있듯이, 본 발명에 따르면, 웨이퍼와 플렉서블 서킷보드와의 밀착력이 높아져 웨이퍼 절단 공정시 발생될 수 있는 칩 손상을 방지하고, 픽업성이 우수한 접착필름를 얻을 수 있었다.As can be seen from the above evaluation results, according to the present invention, the adhesion between the wafer and the flexible circuit board is increased to prevent chip damage that may occur during the wafer cutting process, thereby obtaining an adhesive film having excellent pickup properties.

Claims (8)

15~40중량%의 아크릴로니트릴 모노머 단위를 함유하는 아크릴 수지 15~75중량부; 에폭시 화합물과 페놀 수지의 혼합물 5~60중량부; 및 충전제 10~80중량부를 포함하는 반도체 제조용 접착제 조성물.15 to 75 parts by weight of acrylic resin containing 15 to 40% by weight of acrylonitrile monomer units; 5 to 60 parts by weight of a mixture of an epoxy compound and a phenol resin; And 10 to 80 parts by weight of a filler.
제1항에 있어서, 아크릴로니트릴 단위 함유 아크릴 수지의 중량평균 분자량이 30만 내지 200만인 것을 특징으로 하는 반도체 제조용 접착제 조성물.The adhesive composition for semiconductor manufacture of Claim 1 whose weight average molecular weights of an acrylonitrile unit containing acrylic resin are 300,000-2 million.
제1항에 있어서, 아크릴로니트릴 단위 함유 아크릴 수지의 유리전이온도가 -20℃ 내지 50℃인 것을 특징으로 하는 반도체 제조용 접착제 조성물.The adhesive composition for manufacturing a semiconductor according to claim 1, wherein the glass transition temperature of the acrylonitrile unit-containing acrylic resin is -20 ° C to 50 ° C.
제1항에 있어서, 에폭시 화합물이 비스페놀A형 에폭시 수지, 비스페놀F형 에폭시 수지, 비스페놀S형 에폭시 수지, 지환식 에폭시 수지, 지방족 쇄상 에폭시 수지, 페놀노볼락형 에폭시 수지, 크레졸노볼락형 에폭시 수지, 비스페놀A 노볼락형 에폭시 수지, 비페놀의 디글리시딜에테르화물, 나프탈렌디올의 디글리시딜에테르화물, 페놀류의 디글리시딜에테르화물, 알코올류의 디글리시딜에테르화물 및 이들의 알킬 치환체, 할로겐화물 또는 수소첨가물, 다관능 에폭시 수지, 복소환 함유 에폭시 수지 또는 이들의 혼합물인 것을 특징으로 하는 반도체 제조용 접착제 조성물.The epoxy compound of claim 1, wherein the epoxy compound is a bisphenol A epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, an alicyclic epoxy resin, an aliphatic chain epoxy resin, a phenol novolak type epoxy resin, or a cresol novolak type epoxy resin. , Bisphenol A novolac epoxy resin, diglycidyl etherate of biphenol, diglycidyl etherate of naphthalenediol, diglycidyl etherate of phenols, diglycidyl etherate of alcohols and these Adhesive composition for semiconductor manufacture which is an alkyl substituent, a halide or a hydrogenated substance, a polyfunctional epoxy resin, a heterocyclic containing epoxy resin, or a mixture thereof.
제1항에 있어서, 페놀 수지의 하이드록시 당량이 100eq/kg 내지 300eq/kg인 것을 특징으로 하는 반도체 제조용 접착제 조성물.The adhesive composition for manufacturing a semiconductor according to claim 1, wherein the hydroxy equivalent of the phenol resin is 100 eq / kg to 300 eq / kg.
제1항에 있어서, 충전제가 에폭시계 고분자 화합물, 구상 또는 뭉침 상 형태의 입자 또는 이들의 혼합물인 것을 특징으로 하는 반도체 제조용 접착제 조성물.The adhesive composition of claim 1, wherein the filler is an epoxy-based high molecular compound, particles in spherical or agglomerated form, or a mixture thereof.
제6항에 있어서, 입자가 실리카, 알루미나, 실버, 골드코팅비드, 실리콘비드, 카본블랙, 수산화알루미늄, 수산화마그네슘, 질화붕소, 이산화티타늄, 세라믹 또는 이들의 혼합물인 것을 특징으로 하는 반도체 제조용 접착제 조성물.The adhesive composition of claim 6, wherein the particles are silica, alumina, silver, gold coating beads, silicon beads, carbon black, aluminum hydroxide, magnesium hydroxide, boron nitride, titanium dioxide, ceramics, or a mixture thereof. .
제1항 내지 제7항 중 어느 한 항에 따른 접착제 조성물의 코팅층을 포함하는 것을 특징으로 하는 반도체 제조용 접착필름.An adhesive film for producing a semiconductor comprising a coating layer of the adhesive composition according to any one of claims 1 to 7.
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