CN103642415A - Heat-conducting double-sided tape - Google Patents
Heat-conducting double-sided tape Download PDFInfo
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- CN103642415A CN103642415A CN201310612632.9A CN201310612632A CN103642415A CN 103642415 A CN103642415 A CN 103642415A CN 201310612632 A CN201310612632 A CN 201310612632A CN 103642415 A CN103642415 A CN 103642415A
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- boron nitride
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Abstract
The invention discloses a heat-conducting double-sided tape which comprises two release paper layers and a heat-conducting layer, wherein the release paper layers respectively cover the front side and the back of the heat-conducting layer; the heat-conducting layer comprises the following components: 75-95 percent of novolac epoxy resin and 5-25 percent of heat-conducting agent; the heat-conducting agent consists of boron nitride, aluminum nitride and aluminum oxide; the particle size of the aluminum nitride, boron nitride and aluminum oxide is 20-100nm; the heat-conducting agent is uniformly distributed in the novolac epoxy resin and is subjected to surface modification with PVP or EDTA-2Na. The heat-conducting double-sided tape is simple in process and high in heat-conducting performance.
Description
Technical field
The present invention relates generally to a kind of heat-conducting double-sided adhesive tape, especially take the heat-conducting double-sided adhesive tape that boron nitride, aluminium nitride, aluminium sesquioxide be thermal conducting agent.
Background technology
Along with the fast development of electron trade, the miniaturization of electronic product forward, lightening future development, require more and more higher to the heat radiation of electronic devices and components.Heat-conducting double-sided adhesive tape is as a kind of widely used thermally conductive material, and the heat conductivility that how to improve heat-conducting double-sided adhesive tape is the problem of studying in the industry always.A kind of common method is wherein in heat-conducting glue, to add thermal conducting agent, to improve the thermal conductivity of heat-conducting double-sided adhesive tape.
Heat-conducting insulation material mainly contains boron nitride, aluminium nitride, silicon nitride, aluminum oxide, beryllium oxide, silicon carbide etc.But aluminium nitride is expensive, be not suitable for use in enormous quantities.And beryllium oxide has severe toxicity, also limited the scope of its application.Boron nitride is also not suitable as single thermal conducting agent filling, because addition can not be excessive, crosses the mobility that conference affects heat-conducting glue.The thermal conductivity coefficient of aluminum oxide is lower again, so the selection of heat-conducting glue component seems particularly important.
Meanwhile, particle diameter is also an important factor that affects thermal conducting agent additive effect.When using the larger thermal conducting agent of particle diameter ratio, void ratio during due to contact between thermal conducting agent is larger, easily by residual air adsorption or by the heat-conducting glue of low heat conductivity, inserts, and affects the heat conductivility of whole system, adopt nano material as thermal conducting agent, obtained approval in the industry.Yet how to solve the agglomeration traits of nano material, preparation be take BN as thermal conducting agent has the nanometer double sticky tape of excellent thermal property, is a significant research topic.
Summary of the invention
The object of this invention is to provide the good heat-conducting double-sided adhesive tape of a kind of conductivity.
Technical scheme of the present invention is: described heat-conducting double-sided adhesive tape, comprise two off-style paper layers and heat-conducting layer, the front of described heat-conducting layer and the back side are coated with respectively off-style paper layer, and described heat-conducting layer comprises following component: novolac epoxy: 75%-95%, thermal conducting agent: 5%-25%; Described thermal conducting agent is comprised of boron nitride, aluminium nitride and aluminium sesquioxide, the particle diameter of described aluminium nitride, boron nitride and aluminium sesquioxide is 20nm ~ 100nm, described thermal conducting agent is uniformly distributed in described novolac epoxy, and described thermal conducting agent is through the surface modification of PVP or EDTA-2Na.
Further, described thermal conducting agent comprises following component in weight part: 10 ~ 20 parts of aluminium nitride, 30 ~ 50 parts of boron nitride, 30 ~ 50 parts of aluminium sesquioxides.
As an improvement of the present invention, the ratio of described aluminium nitride, boron nitride and aluminium sesquioxide is 1:2:2.
The present invention adopts the mixture of nm-class boron nitride, nano aluminum nitride, nano-aluminium oxide to add in novolac epoxy as thermal conducting agent, can solve simple use boron nitride addition unsuitable too high, use merely the too low and simple technical problem of using the cost costliness of nano aluminum nitride of the thermal conductivity of nano-aluminium oxide.Boron nitride, nano aluminum nitride, nano-aluminium oxide are obtained to the thermal conducting agent of a kind of moderate cost, thermal conducting agent excellent performance.Meanwhile, because the boron nitride, aluminium nitride, the aluminium sesquioxide that use are nano material, therefore can produce agglomeration.Adopt three kinds of nano materials that different-grain diameter distributes to mix, after the nano level particle of part self is piled up, have probability in the space of piling up, to insert other than piling up the less particle of space particle diameter, therefore can form more closely and pile up.Can alleviate the agglomeration of nano material to a certain extent.And the Content of thermal conducting agent is difficult to form thermal conductance chain lower than 5% boron nitride in novolac epoxy, add nano oxidized boron not obvious to the thermal conductivity contribution of whole system.But thermal conducting agent too high levels easily causes the mobility of whole system not good.The present invention adopts PVP or EDTA-2Na to carry out surface modification to described thermal conducting agent, reduces the surfactivity of nanoparticle, affects the reunion of nanoparticle.Increase the heat conductivility of whole system.In preparation process, consider electroconductibility and thermotolerance that heat-conducting glue is good, can add MENA as solidifying agent.
Heat-conducting double-sided adhesive tape of the present invention, employing novolac epoxy as thermal conducting agent, improves the thermal conductivity of heat-conducting double-sided adhesive tape as heat-conducting glue, employing nm-class boron nitride by nm-class boron nitride being carried out to surface modification.Heat-conducting double-sided adhesive tape of the present invention, good heat conductivity.
Embodiment
Described heat-conducting double-sided adhesive tape comprises two off-style paper layers and heat-conducting layer, and the front of described heat-conducting layer and the back side are coated with respectively off-style paper layer.Described heat-conducting layer comprises heat-conducting glue novolac epoxy and thermal conducting agent, and described thermal conducting agent is uniformly distributed in described novolac epoxy, and described thermal conducting agent forms heat conduction network chain on the direction of heat flow of heat-conducting layer.
Below in conjunction with series of experiments example, the present invention is described further:
Experimental example 1
Formula: novolac epoxy: 85%, boron nitride: 6%, aluminium sesquioxide: 6%, aluminium nitride: 3%.
Preparation technology: a, boron nitride, aluminium sesquioxide, aluminum nitride nanometer powder physical mixed are evenly put into vacuum drying oven inner drying half an hour as thermal conducting agent;
B, take a certain amount of thermal conducting agent powder and join in PVP and carry out surface modification, in modifying process, stir 24 hours;
C, pass through the steps such as centrifugal, filtration afterwards, the thermal conducting agent powder after surface modification is put into vacuum drying oven and be dried.
D, dried thermal conducting agent powder is added in the novolac epoxy of crossing through 15% acetone diluted, stir 2 hours, guarantee to stir.
E, gluing: use glue application device that the glue stirring is evenly coated on release film, in gluing process, note controlling glue thickness and ridity.
F, under 70 degrees Celsius, solidify 8 hours.
G, detect prepared heat-conducting double-sided adhesive tape thermal conductivity, testing apparatus: thermal conductivity coefficient tester
Under h, 70 ℃ of envrionment temperatures, detect prepared heat-conducting double-sided adhesive tape 180 degree clinging powers.
Experimental example 2
Novolac epoxy: 85%, boron nitride: 6%, aluminium sesquioxide: 6%, aluminium nitride: 3%.
Preparation technology: a, boron nitride, aluminium sesquioxide, aluminum nitride nanometer powder physical mixed are evenly put into vacuum drying oven inner drying half an hour as thermal conducting agent;
B, take a certain amount of thermal conducting agent powder and join in EDTA-2Na and carry out surface modification, in modifying process, stir 24 hours;
C, pass through the steps such as centrifugal, filtration afterwards, the thermal conducting agent powder after surface modification is put into vacuum drying oven and be dried.
D, dried thermal conducting agent powder is added in the novolac epoxy of crossing through 15% acetone diluted, stir 2 hours, guarantee to stir.
E, gluing: use glue application device that the glue stirring is evenly coated on release film, in gluing process, note controlling glue thickness and ridity.
F, under 70 degrees Celsius, solidify 8 hours.
G, detect prepared heat-conducting double-sided adhesive tape thermal conductivity, testing apparatus: thermal conductivity coefficient tester
Under h, 70 ℃ of envrionment temperatures, detect prepared heat-conducting double-sided adhesive tape 180 degree clinging powers.
Experimental example 3
Formula: novolac epoxy: 85%, boron nitride: 6%, aluminium sesquioxide: 6%, aluminium nitride: 3%.
Preparation technology: a, boron nitride, aluminium sesquioxide, aluminum nitride nanometer powder physical mixed are evenly put into vacuum drying oven inner drying half an hour as thermal conducting agent;
B, take a certain amount of nano silicon nitride boron powder and join in Silane coupling reagent KH-570 and carry out surface modification, in modifying process, stir 24 hours;
C, pass through the steps such as centrifugal, filtration afterwards, the thermal conducting agent powder after surface modification is put into vacuum drying oven and be dried.
D, dried thermal conducting agent powder is added in the novolac epoxy of crossing through 15% acetone diluted, stir 2 hours, guarantee to stir.
E, gluing: use glue application device that the glue stirring is evenly coated on release film, in gluing process, note controlling glue thickness and ridity.
F, under 70 degrees Celsius, solidify 8 hours.
G, detect prepared heat-conducting double-sided adhesive tape thermal conductivity, testing apparatus: thermal conductivity coefficient tester
Under h, 70 ℃ of envrionment temperatures, detect prepared heat-conducting double-sided adhesive tape 180 degree clinging powers.
Experimental example 4
Formula: novolac epoxy: 85%, boron nitride: 6%, aluminium sesquioxide: 6%, aluminium nitride: 3%.
Preparation technology: a, boron nitride, aluminium sesquioxide, aluminum nitride nanometer powder physical mixed are evenly put into vacuum drying oven inner drying half an hour as thermal conducting agent;
B, take a certain amount of nano silicon nitride boron powder and join in Sodium dodecylbenzene sulfonate and carry out surface modification, in modifying process, stir 24 hours;
C, pass through the steps such as centrifugal, filtration afterwards, the thermal conducting agent powder after surface modification is put into vacuum drying oven and be dried.
D, dried thermal conducting agent powder is added in the novolac epoxy of crossing through 15% acetone diluted, stir 2 hours, guarantee to stir.
E, gluing: use glue application device that the glue stirring is evenly coated on release film, in gluing process, note controlling glue thickness and ridity.
F, under 70 degrees Celsius, solidify 8 hours.
G, detect prepared heat-conducting double-sided adhesive tape thermal conductivity, testing apparatus: thermal conductivity coefficient tester
Under h, 70 ℃ of envrionment temperatures, detect prepared heat-conducting double-sided adhesive tape 180 degree clinging powers.
Experimental example 5
Formula: novolac epoxy: 95%, boron nitride: 2%, aluminium sesquioxide: 2%, aluminium nitride: 1%.
Preparation technology: with embodiment 1.
Experimental example 6
Formula: novolac epoxy: 75%, boron nitride: 10%, aluminium sesquioxide: 10%, aluminium nitride: 5%.
Preparation technology: with embodiment 1.
Comparative example 1
Formula: novolac epoxy: 85%, boron nitride: 10%, aluminium sesquioxide: 4%, aluminium nitride: 1%.
Preparation technology is with experimental example 1.
Comparative example 2
Formula: novolac epoxy: 85%, boron nitride: 3%, aluminium sesquioxide: 10%, aluminium nitride: 2%.
Preparation technology is with experimental example 1.
Comparative example 3
Formula: novolac epoxy: 85%, boron nitride: 15%.
Comparative example 4
Formula: novolac epoxy: 85%, aluminium sesquioxide: 15%.
Preparation technology is with experimental example 1.
Use separately aluminium nitride too high as thermal conducting agent cost, therefore do not do related experiment.
Experimental result:
| ? | Thermal conductivity coefficient w/m-k | Mobility |
| Experimental example 1 | 2.53 | Better |
| Experimental example 2 | 2.48 | Better |
| Experimental example 3 | 2.21 | Better |
| Experimental example 4 | 2.24 | Better |
| Experimental example 5 | 1.98 | Good |
| Experimental example 6 | 2.66 | Generally |
| Comparative example 1 | 2.55 | Generally |
| Comparative example 2 | 2.21 | Better |
| Comparative example 3 | 2.55 | Poor |
| Comparative example 4 | 1.62 | Better |
From above-described embodiment and comparative example, can reach a conclusion, adopt PVP or EDTA-2Na to carry out surface modification with respect to the better effects if of using other tensio-active agents to nanometer BN, the massfraction of thermal conducting agent is greater than 5% and is less than 25% for better embodiment.Both guaranteed that thermal conducting agent forms heat conduction chain in heat-conducting glue, can guarantee again the mobility of heat-conducting glue.Use the mixed mode of taking of several thermal conducting agents, can improve to a certain extent the reuniting effect of nanoparticle, solve single use aluminium nitride high cost, single use boron nitride addition is unsuitable excessive, the low problem of single use aluminium nitride thermal conductivity.
Above-described embodiment is only explanation technical conceive of the present invention and feature, and its object is to allow person skilled in the art can understand content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences that spirit is done according to the present invention change or modify, within all should being encompassed in protection scope of the present invention.
Claims (3)
1. a heat-conducting double-sided adhesive tape, comprises two off-style paper layers and heat-conducting layer, and the front of described heat-conducting layer and the back side are coated with respectively off-style paper layer, it is characterized in that: described heat-conducting layer comprises following component: novolac epoxy: 75%-95%, thermal conducting agent: 5%-25%; Described thermal conducting agent is comprised of boron nitride, aluminium nitride and aluminium sesquioxide, the particle diameter of described aluminium nitride, boron nitride and aluminium sesquioxide is 20nm ~ 100nm, described thermal conducting agent is uniformly distributed in described novolac epoxy, and described thermal conducting agent is through the surface modification of PVP or EDTA-2Na.
2. heat-conducting double-sided adhesive tape as claimed in claim 1, is characterized in that: described thermal conducting agent comprises following component in weight part: 10 ~ 20 parts of aluminium nitride, 30 ~ 50 parts of boron nitride, 30 ~ 50 parts of aluminium sesquioxides.
3. heat-conducting double-sided adhesive tape as claimed in claim 1, is characterized in that: the ratio of described aluminium nitride, boron nitride and aluminium sesquioxide is 1:2:2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310612632.9A CN103642415A (en) | 2013-11-27 | 2013-11-27 | Heat-conducting double-sided tape |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310612632.9A CN103642415A (en) | 2013-11-27 | 2013-11-27 | Heat-conducting double-sided tape |
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| CN103642415A true CN103642415A (en) | 2014-03-19 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104486938A (en) * | 2015-01-04 | 2015-04-01 | 东莞市威力固电路板设备有限公司 | Method for preparing water cooling plate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201213477A (en) * | 2010-09-28 | 2012-04-01 | Kcc Corp | Adhesive composition and film for manufacturing semiconductor |
| CN102993994A (en) * | 2011-09-13 | 2013-03-27 | 日东电工株式会社 | Thermal conductive sheet and producing method thereof |
-
2013
- 2013-11-27 CN CN201310612632.9A patent/CN103642415A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201213477A (en) * | 2010-09-28 | 2012-04-01 | Kcc Corp | Adhesive composition and film for manufacturing semiconductor |
| CN102993994A (en) * | 2011-09-13 | 2013-03-27 | 日东电工株式会社 | Thermal conductive sheet and producing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 何延如: "以纳米BN为添加剂的导热胶的制备与性能研究", 《工程科技Ⅰ辑》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104486938A (en) * | 2015-01-04 | 2015-04-01 | 东莞市威力固电路板设备有限公司 | Method for preparing water cooling plate |
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Application publication date: 20140319 |