CN104327778B - A kind of preparation of acrylated epoxy material - Google Patents
A kind of preparation of acrylated epoxy material Download PDFInfo
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- CN104327778B CN104327778B CN201410569120.3A CN201410569120A CN104327778B CN 104327778 B CN104327778 B CN 104327778B CN 201410569120 A CN201410569120 A CN 201410569120A CN 104327778 B CN104327778 B CN 104327778B
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Abstract
The present invention relates to the preparation of a kind of acrylated epoxy material, including: acrylic acid modified resin 20-40 part, double F resin 30-50 part, reactive diluent toluene 40-50 part, PN-40? 10-15 part, dibenzoyl peroxide 30-50 part, hydroquinone 10-30 part, join in reactor, 80 degree are stirred 120 minutes, filler silicon powder 40-60 part is divided three times and is joined in reactor, continues stirring 60 minutes, mix homogeneously discharging.
Description
Technical field
The present invention relates to the preparation of a kind of acrylated epoxy material, belong to adhesive field.
Background technology
The advantage of acrylate and epoxy resin, acrylate monomer viscosity is all relatively low, can improve the ambient temperature mobility of underfill and the wettability to base material thereof. Acrylate monomer passes through radical polymerization, has the less coefficient of expansion after solidification.
Epoxy resin is the organic compound referring to and containing two or more epoxide groups in molecule, and except indivedual, their relative molecular mass is not high. The molecular structure of epoxy resin is to be its feature containing active epoxide group in strand, and epoxide group may be located at the end of strand, centre or structure circlewise. Due in molecular structure containing active epoxide group, make they can with polytype firming agent generation cross-linking reaction and formed and insoluble, not molten there is the cancellated high polymer of three-dimensional.
Summary of the invention
The present invention provides the preparation of a kind of acrylated epoxy material, including: acrylic acid modified resin 20-40 part, double F resin 30-50 part, reactive diluent toluene 40-50 part, PN-4010-15 part, dibenzoyl peroxide 30-50 part, hydroquinone 10-30 part, join in reactor, 80 degree are stirred 120 minutes, filler silicon powder 40-60 part is divided three times and is joined in reactor, continues stirring 60 minutes, mix homogeneously discharging.
The invention has the beneficial effects as follows: acrylated epoxy material prepared by the present invention has good toughness, thus ensureing that it has good bending resistance and reworkable property.
Detailed description of the invention
Hereinafter principles of the invention and feature being described, example is served only for explaining the present invention, is not intended to limit the scope of the present invention.
Embodiment 1
Acrylic acid modified resin 20 parts, double F resin 30 parts, reactive diluent toluene 40 parts, PN-4010 part, dibenzoyl peroxide 50 parts, hydroquinone 30 parts, joining in reactor, 80 degree are stirred 120 minutes, and filler silicon powder 45 parts points joins in reactor three times, continue stirring 60 minutes, mix homogeneously discharging.
Embodiment 2
Acrylic acid modified resin 40 parts, double F resin 50 parts, reactive diluent toluene 50 parts, PN-4015 part, dibenzoyl peroxide 50 parts, hydroquinone 30 parts, joining in reactor, 80 degree are stirred 120 minutes, and filler silicon powder 60 parts points joins in reactor three times, continue stirring 60 minutes, mix homogeneously discharging.
Embodiment 3
Acrylic acid modified resin 30 parts, double F resin 30 parts, reactive diluent toluene 50 parts, PN-4015 part, dibenzoyl peroxide 50 parts, hydroquinone 30 parts, joining in reactor, 80 degree are stirred 120 minutes, and filler silicon powder 57 parts points joins in reactor three times, continue stirring 60 minutes, mix homogeneously discharging.
The result of the test of embodiment 1-3 is in Table 1.
The concrete verification experimental verification of table 1
| Embodiment 1 | Embodiment 2 | Embodiment 3 | |
| Viscosity (25 DEG C, mPa.s) | 1000 | 1100 | 1100 |
Acrylated epoxy material prepared by the present invention has good toughness, thus ensureing that it has good bending resistance and reworkable property.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all within the spirit and principles in the present invention, any amendment of making, equivalent replacement, improvement etc., should be included within protection scope of the present invention.
Claims (3)
1. an acrylated epoxy material, it is characterised in that including: acrylic acid modified resin 20 parts, bisphenol F resin 30 parts, toluene 40 parts, PN-4010 part, dibenzoyl peroxide 50 parts, hydroquinone 30 parts, joining in reactor, 80 degree are stirred 120 minutes, and filler silicon powder 45 parts points joins in reactor three times, continue stirring 60 minutes, mix homogeneously discharging.
2. an acrylated epoxy material, it is characterised in that including: acrylic acid modified resin 40 parts, bisphenol F resin 50 parts, toluene 50 parts, PN-4015 part, dibenzoyl peroxide 50 parts, hydroquinone 30 parts, joining in reactor, 80 degree are stirred 120 minutes, and filler silicon powder 60 parts points joins in reactor three times, continue stirring 60 minutes, mix homogeneously discharging.
3. an acrylated epoxy material, it is characterised in that including: acrylic acid modified resin 30 parts, bisphenol F resin 30 parts, toluene 50 parts, PN-4015 part, dibenzoyl peroxide 50 parts, hydroquinone 30 parts, joining in reactor, 80 degree are stirred 120 minutes, and filler silicon powder 57 parts points joins in reactor three times, continue stirring 60 minutes, mix homogeneously discharging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410569120.3A CN104327778B (en) | 2014-10-23 | 2014-10-23 | A kind of preparation of acrylated epoxy material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410569120.3A CN104327778B (en) | 2014-10-23 | 2014-10-23 | A kind of preparation of acrylated epoxy material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104327778A CN104327778A (en) | 2015-02-04 |
| CN104327778B true CN104327778B (en) | 2016-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410569120.3A Active CN104327778B (en) | 2014-10-23 | 2014-10-23 | A kind of preparation of acrylated epoxy material |
Country Status (1)
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| CN (1) | CN104327778B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012043922A1 (en) * | 2010-09-28 | 2012-04-05 | 주식회사 케이씨씨 | Adhesive composition and film for preparing semiconductor |
| CN103113842A (en) * | 2013-02-26 | 2013-05-22 | 烟台信友电子有限公司 | Single-component low-viscosity heat curing double-system structural adhesive and preparation method thereof |
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2014
- 2014-10-23 CN CN201410569120.3A patent/CN104327778B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012043922A1 (en) * | 2010-09-28 | 2012-04-05 | 주식회사 케이씨씨 | Adhesive composition and film for preparing semiconductor |
| CN103113842A (en) * | 2013-02-26 | 2013-05-22 | 烟台信友电子有限公司 | Single-component low-viscosity heat curing double-system structural adhesive and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN104327778A (en) | 2015-02-04 |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Sun Qingmeng Inventor after: Qi Suli Inventor before: Qi Suli |
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| COR | Change of bibliographic data | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zhou Kai Inventor before: Sun Qingmeng Inventor before: Qi Suli |
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| COR | Change of bibliographic data | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20160512 Address after: 201400, No. 19, No. 4, Lang Lu, Shanghai, Fengxian District Applicant after: Tao Sheng Tianhe (Shanghai) materials science and technology limited company Address before: 265400, Yantai, Shandong province Zhaoyuan dream Chi office Zhang Hua Wang Village Applicant before: ZHAOYUAN HONGRUI PRINTING AND DYEING CO., LTD. |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 201400, No. 19, No. 4, Lang Lu, Shanghai, Fengxian District Patentee after: Daosheng Tianhe material technology (Shanghai) Co., Ltd Address before: 201400, No. 19, No. 4, Lang Lu, Shanghai, Fengxian District Patentee before: TECHSTORM ADVANCED MATERIAL Co.,Ltd. |