CN104327780A - Double-component epoxy bonding material - Google Patents
Double-component epoxy bonding material Download PDFInfo
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- CN104327780A CN104327780A CN201410569273.8A CN201410569273A CN104327780A CN 104327780 A CN104327780 A CN 104327780A CN 201410569273 A CN201410569273 A CN 201410569273A CN 104327780 A CN104327780 A CN 104327780A
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Abstract
The invention relates to a double-component epoxy bonding material which comprises 20-40 parts of bisphenol A resin, 30-50 parts of bisphenol F resin, 40-50 parts of an active diluent methyl acrylate, 10-15 parts of PN-40, 30-50 parts of dibenzoyl peroxide, 10-30 parts of hydroquinone and 30-50 parts of packing talcum powder.
Description
Technical field
The present invention relates to a kind of two component epoxy adhesives, belong to adhesive field.
Background technology
Epoxy resin is the organic compound containing two or more epoxide groups in general reference molecule, and except indivedual, their relative molecular mass is not high.The molecular structure of epoxy resin be with in molecular chain containing active epoxide group for its feature, epoxide group can be positioned at the end of molecular chain, centre or structure circlewise.Due in molecular structure containing active epoxide group, make they can with polytype solidifying agent generation crosslinking reaction and formed and insoluble, not molten there is the cancellated superpolymer of three-dimensional.
Summary of the invention
The present invention is directed to the deficiencies in the prior art, a kind of two component epoxy adhesives is provided, comprise: double A resin 20-40 part, double F resin 30-50 part, reactive thinner methyl acrylate 40-50 part, PN-40 10-15 part, dibenzoyl peroxide 30-50 part, Resorcinol 10-30 part, filler talcum powder 30-50 part.
A kind of preparation method of two component epoxy adhesives, comprise: double A resin 20-40 part, double F resin 30-50 part, reactive thinner methyl acrylate 40-50 part, PN-40 10-15 part, dibenzoyl peroxide 30-50 part, Resorcinol 10-30 part, joins in reactor, 80 degree of stirrings 120 minutes, filler talcum powder divides and joins in reactor three times, continues stirring 60 minutes, mixes discharging.
The invention has the beneficial effects as follows: two component epoxy adhesives of the present invention can provide its adhesiveproperties and hardness, and epoxy material has good toughness, 20 thus ensure that it has good resistance to bending and reworkable property.
Embodiment
Be described principle of the present invention and feature below, example, only for explaining the present invention, is not intended to limit scope of the present invention.
Embodiment 1
Double A resin 20 parts, double F resin 30 parts, reactive thinner methyl acrylate 40 parts, PN-40 10 parts, dibenzoyl peroxide 30 parts, Resorcinol 10 parts, join in reactor, 80 degree of stirrings 120 minutes, filler talcum powder divides and joins in reactor three times, continue stirring 60 minutes, mix discharging.
Embodiment 2
Double A resin 40 parts, double F resin 50 parts, reactive thinner methyl acrylate 50 parts, PN-40 15 parts, dibenzoyl peroxide 50 parts, Resorcinol 30 parts, join in reactor, 80 degree of stirrings 120 minutes, filler talcum powder divides and joins in reactor three times, continue stirring 60 minutes, mix discharging.
Embodiment 3
Double A resin 30 parts, double F resin 40 parts, reactive thinner methyl acrylate 50 parts, PN-40 12 parts, dibenzoyl peroxide 40 parts, Resorcinol 30 parts, join in reactor, 80 degree of stirrings 120 minutes, filler talcum powder divides and joins in reactor three times, continue stirring 60 minutes, mix discharging.
The test-results of embodiment 1-3 is in table 1.
the concrete verification experimental verification of table 1
| Embodiment 1 | Embodiment 2 | Embodiment 3 | |
| Viscosity (25 DEG C, mPa.s) | 500 | 550 | 600 |
Two component epoxy adhesives of the present invention can provide its adhesiveproperties and hardness, and epoxy material has good toughness, thus ensures that it has good resistance to bending and reworkable property.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (2)
1. a two component epoxy adhesives, comprising: double A resin 20-40 part, double F resin 30-50 part, reactive thinner methyl acrylate 40-50 part, PN-40 10-15 part, dibenzoyl peroxide 30-50 part, Resorcinol 10-30 part, filler talcum powder 30-50 part.
2. the preparation method of a kind of two component epoxy adhesives according to claim 1, comprise: double A resin 20-40 part, double F resin 30-50 part, reactive thinner methyl acrylate 40-50 part, PN-40 10-15 part, dibenzoyl peroxide 30-50 part, Resorcinol 10-30 part, joins in reactor, 80 degree of stirrings 120 minutes, filler talcum powder divides and joins in reactor three times, continues stirring 60 minutes, mixes discharging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410569273.8A CN104327780A (en) | 2014-10-23 | 2014-10-23 | Double-component epoxy bonding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410569273.8A CN104327780A (en) | 2014-10-23 | 2014-10-23 | Double-component epoxy bonding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104327780A true CN104327780A (en) | 2015-02-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410569273.8A Pending CN104327780A (en) | 2014-10-23 | 2014-10-23 | Double-component epoxy bonding material |
Country Status (1)
| Country | Link |
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| CN (1) | CN104327780A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107674161A (en) * | 2017-10-17 | 2018-02-09 | 江苏宝安电缆有限公司 | A kind of epoxide resin material for strengthening metal adhesion and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004104403A (en) * | 2002-09-09 | 2004-04-02 | Samsung Electronics Co Ltd | Transmitter, receiver, and communication method for ultra-broadband radio |
| CN102676064A (en) * | 2012-04-28 | 2012-09-19 | 烟台德邦科技有限公司 | Matte adhesive and preparation method thereof |
| CN102964534A (en) * | 2012-11-12 | 2013-03-13 | 吴江市太湖绝缘材料有限公司 | Solvent-free resin composition for vacuum impregnation |
| CN103113842A (en) * | 2013-02-26 | 2013-05-22 | 烟台信友电子有限公司 | Single-component low-viscosity heat curing double-system structural adhesive and preparation method thereof |
-
2014
- 2014-10-23 CN CN201410569273.8A patent/CN104327780A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004104403A (en) * | 2002-09-09 | 2004-04-02 | Samsung Electronics Co Ltd | Transmitter, receiver, and communication method for ultra-broadband radio |
| CN102676064A (en) * | 2012-04-28 | 2012-09-19 | 烟台德邦科技有限公司 | Matte adhesive and preparation method thereof |
| CN102964534A (en) * | 2012-11-12 | 2013-03-13 | 吴江市太湖绝缘材料有限公司 | Solvent-free resin composition for vacuum impregnation |
| CN103113842A (en) * | 2013-02-26 | 2013-05-22 | 烟台信友电子有限公司 | Single-component low-viscosity heat curing double-system structural adhesive and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 李广宇: "《胶粘密封新技术》", 31 January 2006, 国防工业出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107674161A (en) * | 2017-10-17 | 2018-02-09 | 江苏宝安电缆有限公司 | A kind of epoxide resin material for strengthening metal adhesion and preparation method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150204 |