CN102964534A - Solvent-free resin composition for vacuum impregnation - Google Patents
Solvent-free resin composition for vacuum impregnation Download PDFInfo
- Publication number
- CN102964534A CN102964534A CN2012104483308A CN201210448330A CN102964534A CN 102964534 A CN102964534 A CN 102964534A CN 2012104483308 A CN2012104483308 A CN 2012104483308A CN 201210448330 A CN201210448330 A CN 201210448330A CN 102964534 A CN102964534 A CN 102964534A
- Authority
- CN
- China
- Prior art keywords
- epoxy
- parts
- resin composition
- vacuum impregnation
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Abstract
The invention relates to a solvent-free resin composition for vacuum impregnation, which comprises epoxy resins, reactive diluent, epoxy resin curing agent, polymerization inhibitor, initiator and accelerator. The solvent-free resin composition comprises the following components: 40-60 parts of I-type epoxy resin, 20-40 parts of II-type epoxy resin, 10-30 parts of non-styrene reactive diluent, 4-6 parts of latent epoxy resin curing agent, 0.2-1.0 part of polymerization inhibitor, 1-2 parts of initiator and 0.2-1.0 part of accelerator. The invention does not use volatile styrene as the diluent or use easily-hydrolyzable acid anhydride as the curing agent; and thus, the composition is non-toxic and environment-friendly, has the advantages of excellent storage stability, excellent impregnation processibility, high heat resistance, low water absorptivity, strong binding power and excellent electric insulation property, and thus, is a new-generation resin composition suitable for vacuum impregnation.
Description
Technical field
The present invention relates to the electric insulation field, be specifically related to vacuum pressure resin impregnation technology, particularly a kind of solvent-free impregnating resin particularly relates to a kind of solvent-free impregnating resin for vacuum pressure impregnation of high voltage motor.
Background technology
Vacuum pressure impregnation (Vacuum Pressure Impregnation, VPI) is current classic insulation processing technology.The insulation layer of processing through VPI has the advantage without air gap, good integrity, has improved motor and electrical equipment protection against the tide and heat dispersion, has improved serviceability, makes the electrical equipment and electrical can be at the medium-term and long-term reliability service of severe environment.
The performance quality of VPI insulating material depends on top 5 factor: (1) solvent impregnated resin; (2) dry mica paper tape; (3) VPI technique; (4) VPI equipment and belting machine; (5) anti-corona technology and other.Five large factors are to be mutually related, and wherein lack the interaction between adhesive tape and the solvent impregnated resin and affect the most key.In the chapter 1 of IEC371 and two standards of JB/T6488.4-1995 all clear and definite " the final curing performance of mica powder depends primarily on used vacuum pressure impregnating resin ", emphasize that the performance of the insulating device that VPI technique is made mainly depends on solvent impregnated resin.
The main flow vacuum pressure impregnating resin is mainly epoxy-acid anhydrides-vinylbenzene system both at home and abroad at present.Mainly there are the following problems in application process for this series products: (1) volatile vinylbenzene contaminate environment, infringement workers ' health; (2) adopt superoxide to cause vinylbenzene radical polymerization in the system, the danger of autohemagglutination and implode is arranged in storage and use procedure; (3) the resin losing issue in the vacuum impregnation after fixing process; (4) vinylbenzene has weakened the texturing temperature of insulating device; (5) high temperature dielectric loss is higher, thereby can not use in the high-temperature electric machine device, also exists the long term operation meeting to cause the hidden danger (CN 102153708A) of insulation breakdown simultaneously.
For above problem, industry has been developed simple epoxy anhydride class system, but this system cooperate after viscosity larger, need to improve temperature to 60-70 ℃ of viscosity lower and suitable insulation impregnating.In addition, pair skin irritation is little although anhydride curing agent has, the usage period is long, the condensate performance of itself and Resins, epoxy is good, particularly dielectric properties are more excellent than amine cured article, but anhydride curing agent also has following significant shortcoming: (1) solidification value is high, owing to be heated to more than 120 ℃ and could react, longer than other solidifying agent shaping cycles, and the acid anhydride type curing agent kind is limited; (2) acidity is very high, and is influential to naked copper, and acid anhydrides accounts for 40%-60% in epoxy-anhydride-cured system, and acidity is very high; (3) contain a large amount of acid anhydrides in this system, easily suction and facile hydrolysis are acid, and the VPI lacquer in use can't be avoided the moisture absorption, thereby the existing strong corrodibility of this system, also separate out easily (crystalline deposit) and become muddy, can reduce like this dipping ability of resin, make the dipping difficult; (4) the volatilization deal is less, but the composition of acid is larger to the vacuum system destructiveness; (5) the vacuum impregnation lacquer requires the storage stability (especially for large-scale dipping paint can) that lives forever, and most of epoxy-anhydride system storage period is short, and system viscosity can increase gradually; (6) water-repellancy: the water-repellancy of epoxy-anhydride-cured system is poor than unsaturated polyester.A large amount of ester groups is arranged, facile hydrolysis after epoxy-anhydride-cured; (7) thermotolerance: although the UL approval, whether it can bear long term heat ageing is a query.
Summary of the invention
One of the technical problem to be solved in the present invention is because containing the toxic large volatile shortcoming of vinylbenzene, to provide a kind of environmental protection solvent impregnated resin that does not contain vinylbenzene isoreactivity thinner for existing solvent impregnated resin.
Two of technical problem to be solved by this invention is, take acid anhydrides as solidifying agent, has the easy moisture absorption and the easy shortcoming of precipitating for existing solvent impregnated resin, and a kind of solvent impregnated resin composition of non-anhydride-cured system is provided.
For solving the problems of the technologies described above, the present invention takes following technical scheme:
A kind of vacuum impregnation no solvent resin composition, by mass parts, its composition of raw materials is as follows:
40～60 parts of I type Resins, epoxy;
20～40 parts of II type Resins, epoxy;
10～30 parts of non-styrenic reactive thinners;
4～6 parts of latent epoxy resin curing agents;
0.2～1.0 part of stopper;
1～2 part of initiator;
0.2～1.0 part of promotor;
Wherein said I type Resins, epoxy, II type Resins, epoxy and reactive thinner quality sum are 100 parts;
Described I type Resins, epoxy is the molecular distillation grade bis phenol A Resins, epoxy that to be selected from 25 ℃ of lower viscosity be 4000～6000mPas, the combination of one or more in the low viscosity phenol aldehyde type epoxy resin that the bisphenol F epoxy resin that 25 ℃ of lower viscosity is 3500～5700mPas and 25 ℃ of lower viscosity are 1100～1700mPas;
Described II type Resins, epoxy is the above Resins, epoxy of two functionality.
Further, described II type Resins, epoxy is the above high boiling point low-viscosity epoxy of two functionality resin, have the effect of reactive thinner concurrently, can be for being selected from one or more the mixture in Hydrogenated Bisphenol A glycidyl ether, ethylene glycol diglycidylether, bisglycidyl ether, glycerin triglycidyl ether, Resorcinol bisglycidyl ether and the Isosorbide-5-Nitrae butanediol diglycidyl ether etc.;
According to a preferred aspect of the present invention, described non-styrenic reactive thinner comprises two kinds of functional groups at least, wherein at least one is that two keys and one are epoxy group(ing), such as thinking one or more the mixture that is selected from glycidyl methacrylate, glycidyl allyl ether, 2-ethenylphenyl glycidyl ether, 4-methyl-2-ethenylphenyl glycidyl ether, the diallyl bisphenol tetraglycidel ether epoxy resin etc.
Further, described latent epoxy resin curing agent is preferably the imidazoles epoxy curing agent, and be dissolvable in water at normal temperatures Resins, epoxy, concrete example such as 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN), it is weak yellow liquid at normal temperatures, can be miscible with Resins, epoxy.
According to the present invention, described stopper can for radical polymerization stopper commonly used, for example can be Resorcinol, para benzoquinone, tertiarybutylhydroquinone, trinitrophenol etc.; Described initiator can be dicumyl peroxide, ditertiary butyl peroxide, and the t-butyl peroxy isopropyl benzene, dual-tert-butyl peroxy isopropyl benzene, benzoyl peroxides etc. preferentially use dicumyl peroxide.
The used initiator of the present invention can for radical initiator commonly used, be preferably dicumyl peroxide, ditertiary butyl peroxide, t-butyl peroxy isopropyl benzene, dual-tert-butyl peroxy isopropyl benzene and benzoyl peroxide.Mainly make the double bond compound polymerization reaction take place in the system.Therefore owing to contain the existence of the reactive thinner of two keys and epoxide group, in system, can form the copolymerization structure that is formed by different polymerization mechanism.
Promotor of the present invention can be acetylacetonate, can be aluminium acetylacetonate, chromium acetylacetonate etc.;
Preferably, in the described raw material, resin components and stopper are mixed in proportion independent packaging, and solidifying agent and promotor are mixed in proportion independent packaging.So, resin part and inhibitor mixture, solidifying agent separate low-temperature storage with accelerator mixture, and the time spent is mixed in proportion again.
Theoretical basis of the present invention and principle are: 1, use low-viscosity bisphenol A epoxy or bisphenol F epoxy resin or low viscosity phenol aldehyde type epoxy resin, can reduce to greatest extent system viscosity, reduce the consumption of thinner, with the introducing of the avoiding thinner impact on final condensate performance; 2, introduce the non-vinylbenzene thinner of multifunctional activity and can avoid the cinnamic introducing of toxic chemical substance, and can further regulate the viscosity of resin combination, and introduce simultaneously reactive thinner with double bond functional group and epoxy functionality, not only guaranteed the dilution requirement, epoxy group(ing) can be connected together with the epoxy systems covalent linkage simultaneously.In addition, use radical initiator, can cause double-bond polymerization, form inierpeneirating network structure system to a certain degree, improved the heat-drawn wire of system, guaranteed thermostability and the electrical insulation capability of final curing system; 3, original anhydride-cured system is changed into resting form imidazoles curing system, can significantly improve the storage stability of system, and because selected imidazoles is dissolvable in water Resins, epoxy, and the imidazole curing agent consumption is less, thereby has avoided the easy moisture absorption of anhydrides curing system easily to separate out the defective that affects dipping effect.
Compared with prior art, the present invention has following advantage and significant beneficial effect:
1, do not contain poisonous volatile vinylbenzene isoreactivity thinner, clean environment firendly has reduced the generation of toxic gas in the production process, meets the development need of environmental protection, belongs to environmentally friendly product;
2, this kind solvent impregnated resin vapour pressure is little, and does not contain acidic substance, can a large amount of volatilizations as the thinners such as vinylbenzene under wet vacuum state, and cause resin viscosity to raise rapidly, can not corrode Vacuum Pressure Impregnation Equipment yet;
3, hot setting is fast, in the solidification process mass loss little, it is large to hang the lacquer amount, can realize that single-steeping cures, and can satisfy the insulation processing requirement;
4, adopt the two curing technologies of radical polymerization and epoxy addition addition polymerization, state of cure is high, can form the interpenetrating(polymer)networks crosslinking structure, and the cured article heat-drawn wire is high, rate of expansion is little, water-intake rate is little, and good heat resistance has good electrical insulation capability;
5, the various composition purity of solvent impregnated resin are higher, and resin part is separated storage with solidifying agent and promotor, and storage stability is excellent, and viscosity increasess slowly, and storage period and usage period prolong greatly.
Embodiment
The present invention will be described in detail below in conjunction with specific embodiment.Below among each embodiment, all raw materials are commercially available, described umber is mass parts.With reference to GB/T15023-1994 electric insulation solventless polymerisable resinous compound test method, the definition of GB/T15022-1994 electric insulation solventless polymerisable resinous compound and general requirement, GB/T11027-1999 has solvent insulating lacquer standard, individual event MAT'L specification with the performance test methods of no solvent resin composition in vacuum impregnation, to the standard implementation that requires of thermofixation impregnating varnish.
Embodiment 1
A kind of vacuum impregnation no solvent resin composition, composition of raw materials is as follows:
Resin components: 30 parts of molecular distillation low-viscosity bisphenol A epoxide resin (DER332,4000-6000mPas), 10 parts of low viscosity bisphenol F epoxy resin (DER354,3500-5700mPas), 20 parts of hydrogenated bisphenol A epoxy resin (EPALLOY5000,1300-2500mPas), 10 parts of ethylene glycol diglycidylethers, 10 parts of bisglycidyl ethers;
Reactive thinner: 10 parts of glycidyl methacrylate, 10 parts of 2-ethenylphenyl glycidyl ethers;
Solidifying agent: 4 parts of 2E4MZ-CN;
Stopper: 0.2 part of Resorcinol;
Initiator: 1 part of dicumyl peroxide;
Promotor: 0.2 part of aluminium acetylacetonate.
Before the use, accurately take by weighing above-mentioned raw materials, fully mix, form the vacuum impregnation no solvent resin composition, its performance perameter sees Table 1.
Embodiment 2
A kind of vacuum impregnation no solvent resin composition, composition of raw materials is as follows:
Resin components: 20 parts of molecular distillation low-viscosity bisphenol A epoxide resin (DER332,4000-6000mPas), 20 parts of low viscosity bisphenol F epoxy resin (DER354,3500-5700mPas), 10 parts of low viscosity phenol aldehyde type epoxy resin (DEN431,1100-1700mPas), 10 parts of ethylene glycol diglycidylethers, 10 parts of glycerol epoxy resins;
Reactive thinner: 10 parts of glycidyl allyl ethers, 10 parts of 2-ethenylphenyl glycidyl ethers, 10 parts of 4-methyl 2-ethylphenyl glycidyl ethers;
Solidifying agent: 5.2 parts of 2E4MZ-CN;
Stopper: 0.4 part of para benzoquinone;
Initiator: 2 parts of ditertiary butyl peroxides;
Promotor: 1 part of chromium acetylacetonate.
Before the use, above-mentioned raw materials is fully mixed, form the vacuum impregnation no solvent resin composition, its performance perameter sees Table 1.
Embodiment 3
A kind of vacuum impregnation no solvent resin composition, composition of raw materials is as follows:
Resin components: 30 parts of molecular distillation low-viscosity bisphenol A epoxide resin (DER332,4000-6000mPas), 10 parts of low viscosity phenol aldehyde type epoxy resin (DEN431,1100-1700mPas), 10 parts of hydrogenated bisphenol A epoxy resin (EPALLOY5000,1300-2500mPas), 10 parts of bisglycidyl ethers, 10 parts of Resorcinol bisglycidyl ethers;
Reactive thinner: 10 parts of glycidyl methacrylate, 10 parts of glycidyl allyl ethers, 10 parts of diallyl bisphenol glycidyl ethers;
Solidifying agent: 4.8 parts of 2E4MZ-CN;
Stopper: 0.6 part of tertiarybutylhydroquinone;
Initiator: 1 portion of t-butyl peroxy isopropyl benzene;
Promotor: 0.8 part of aluminium acetylacetonate.
Before the use, above-mentioned raw materials is fully mixed, form the vacuum impregnation no solvent resin composition, its performance perameter sees Table 1.
Embodiment 4
A kind of vacuum impregnation no solvent resin composition, composition of raw materials is as follows:
Resin components: 30 parts of molecular distillation low-viscosity bisphenol A epoxide resin (DER332,4000-6000mPas), 30 parts of low viscosity phenol aldehyde type epoxy resin (DEN431,1100-1700mPas), 15 parts of ethylene glycol diglycidylethers, 5 parts of glycerol epoxy resins, 10 parts of BDO glycidyl ethers;
Reactive thinner: 10 parts of 4-methyl 2-ethylphenyl glycidyl ethers;
Solidifying agent: 6 parts of 2E4MZ-CN;
Stopper: 0.2 part of Resorcinol, 0.4 part of trinitrophenol;
Initiator: 1.5 parts of dual-tert-butyl peroxy isopropyl benzene;
Promotor: 0.6 part of aluminium acetylacetonate.
Before the use, above-mentioned raw materials is fully mixed, form the vacuum impregnation no solvent resin composition, its performance perameter sees Table 1.
Embodiment 5
A kind of vacuum impregnation no solvent resin composition, composition of raw materials is as follows:
Resin components: 20 parts of molecular distillation low-viscosity bisphenol A epoxide resin (DER332,4000-6000mPas), 10 parts of low viscosity bisphenol F epoxy resin (DER354,3500-5700mPas), 10 parts of low viscosity phenol aldehyde type epoxy resins (DEN431,1100-1700mPas), 10 parts of bisglycidyl ethers, 10 parts of glycerol epoxy resins, 20 parts of BDO glycidyl ethers;
Reactive thinner: 10 parts of glycidyl methacrylate, 10 parts of 2-ethylphenyl glycidyl ethers;
Solidifying agent: 5.8 parts of 2E4MZ-CN;
Stopper: 0.2 part of para benzoquinone, 0.4 part of trinitrophenol;
Initiator: 0.2 part of tertiarybutylhydroquinone, 1.4 parts of benzoyl peroxides;
Promotor: 0.4 part of chromium acetylacetonate.
Before the use, above-mentioned raw materials is fully mixed, form the vacuum impregnation no solvent resin composition, its performance perameter sees Table 1.
Embodiment 6
A kind of vacuum impregnation no solvent resin composition, composition of raw materials is as follows:
Resin components: 20 parts of molecular distillation low-viscosity bisphenol A epoxide resin (DER332,4000-6000mPas), 10 parts of low viscosity bisphenol F epoxy resin (DER354,3500-5700mPas), 20 parts of low viscosity phenol aldehyde type epoxy resins (DEN431,1100-1700mPas), 10 parts of ethylene glycol diglycidylethers, 5 parts of bisglycidyl ethers, 15 parts of Resorcinol bisglycidyl ethers;
Reactive thinner: 10 parts of glycidyl methacrylate, 5 parts of 2-ethylphenyl glycidyl ethers, 5 parts of diallyl bisphenol glycidyl ethers;
Solidifying agent: 5.4 parts of 2E4MZ-CN;
Stopper: 0.4 part of Resorcinol;
Initiator: 0.2 part of tertiarybutylhydroquinone, 2 parts of dicumyl peroxides;
Promotor: 0.4 part of aluminium acetylacetonate.
Before the use, above-mentioned raw materials is fully mixed, form the vacuum impregnation no solvent resin composition, its performance perameter sees Table 1.
Embodiment 7
Accurately take by weighing 10 parts of molecular distillation low-viscosity bisphenol A epoxide resins, 20 parts of low viscosity bisphenol F epoxy resins, 30 parts of low viscosity phenol aldehyde type epoxy resins, 5 parts of hydrogenated bisphenol A epoxy resins, 10 parts of ethylene glycol diglycidylethers, 15 parts of glycerine epoxies, 5 parts of glycidyl allyl ether esters, 5 parts of 4-methyl 2-ethylphenyl glycidyl ethers, 4.6 part 2E4MZ-CN, 0.2 part para benzoquinone, 0.2 part of trinitrophenol, 1.4 parts of dicumyl peroxides, 0.2 part chromium acetylacetonate, above-mentioned raw materials is fully mixed, form the vacuum impregnation no solvent resin composition, its performance perameter sees Table 1.
Embodiment 8
Accurately take by weighing 15 parts of molecular distillation low-viscosity bisphenol A epoxide resins, 15 parts of low viscosity bisphenol F epoxy resins, 20 parts of low viscosity phenol aldehyde type epoxy resins, 5 parts of ethylene glycol diglycidylethers, 10 parts of glycerine epoxies, 10 parts of butanediol diglycidyl ethers, 15 parts of glycidyl methacrylate, 5 parts of glycidyl allyl ether esters, 5 parts of diallyl bisphenol glycidyl ethers, 4.7 parts of 2E4MZ-CN, 0.2 part Resorcinol, 0.2 part tertiarybutylhydroquinone, 1.6 parts of dicumyl peroxides, 0.2 part of aluminium acetylacetonate, 0.2 part chromium acetylacetonate, above-mentioned raw materials is fully mixed, form the vacuum impregnation no solvent resin composition, its performance perameter sees Table 1.
Table 1
As seen from Table 1, the present composition has excellent package stability and impregnation technology, its good heat resistance, and water-intake rate is little, and cohesive force is strong, and electrical insulation properties is excellent; In addition, the present composition neither uses volatile vinylbenzene to be thinner, does not also use the acid anhydrides of facile hydrolysis to be solidifying agent, and the composition asepsis environment-protecting is that a new generation is applicable to vacuum-impregnated resin combination.
Above-described embodiment only is explanation technical conceive of the present invention and characteristics; its purpose is to allow the personage who is familiar with technique can understand content of the present invention and according to this enforcement; can not limit protection scope of the present invention with this; all equivalences that spirit is done according to the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (9)
1. vacuum impregnation no solvent resin composition, it is characterized in that: by mass parts, the composition of raw materials of described resin combination is as follows:
40 ~ 60 parts of I type Resins, epoxy;
20 ~ 40 parts of II type Resins, epoxy;
10 ~ 30 parts of non-styrenic reactive thinners;
4 ~ 6 parts of latent epoxy resin curing agents;
0.2 ~ 1.0 part of stopper;
1 ~ 2 part of initiator;
0.2 ~ 1.0 part of promotor;
Wherein said I type Resins, epoxy, II type Resins, epoxy and reactive thinner quality sum are 100 parts;
Described I type Resins, epoxy is the molecular distillation grade bis phenol A Resins, epoxy that to be selected from 25 ℃ of lower viscosity be 4000 ~ 6000mPas, the combination of one or more in the low viscosity phenol aldehyde type epoxy resin that the bisphenol F epoxy resin that 25 ℃ of lower viscosity is 3500 ~ 5700mPas and 25 ℃ of lower viscosity are 1100 ~ 1700mPas;
Described II type Resins, epoxy is the above Resins, epoxy of two functionality.
2. vacuum impregnation no solvent resin composition according to claim 1, it is characterized in that: described II type Resins, epoxy is for being selected from the Hydrogenated Bisphenol A glycidyl ether, ethylene glycol diglycidylether, bisglycidyl ether, glycerin triglycidyl ether, the combination of one or more in Resorcinol bisglycidyl ether and the BDDE.
3. vacuum impregnation no solvent resin composition according to claim 1 is characterized in that: described non-styrenic reactive thinner comprises at least one two keys and an epoxy group(ing).
4. vacuum impregnation no solvent resin composition according to claim 3 is characterized in that: described non-styrenic reactive thinner is one or more the combination that is selected from glycidyl methacrylate, glycidyl allyl ether, 2-ethenylphenyl glycidyl ether, 4-methyl-2-ethenylphenyl glycidyl ether and the diallyl bisphenol tetraglycidel ether epoxy resin.
5. vacuum impregnation no solvent resin composition according to claim 1, it is characterized in that: described latent epoxy resin curing agent is the imidazoles epoxy curing agent, and is dissolvable in water Resins, epoxy under the normal temperature.
6. vacuum impregnation no solvent resin composition according to claim 1 is characterized in that: described stopper is one or more the combination that is selected from Resorcinol, para benzoquinone, tertiarybutylhydroquinone and the trinitrophenol.
7. vacuum impregnation no solvent resin composition according to claim 1 is characterized in that: described initiator is one or more the combination that is selected from dicumyl peroxide, ditertiary butyl peroxide, t-butyl peroxy isopropyl benzene, dual-tert-butyl peroxy isopropyl benzene and the benzoyl peroxide.
8. vacuum impregnation no solvent resin composition according to claim 1, it is characterized in that: described promotor is aluminium acetylacetonate or chromium acetylacetonate or the combination of the two.
9. vacuum impregnation no solvent resin composition according to claim 1, it is characterized in that: in the described raw material, resin components and stopper are mixed in proportion independent packaging, and solidifying agent and promotor are mixed in proportion independent packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210448330.8A CN102964534B (en) | 2012-11-12 | 2012-11-12 | Solvent-free resin composition for vacuum impregnation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210448330.8A CN102964534B (en) | 2012-11-12 | 2012-11-12 | Solvent-free resin composition for vacuum impregnation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102964534A true CN102964534A (en) | 2013-03-13 |
| CN102964534B CN102964534B (en) | 2014-07-23 |
Family
ID=47794988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210448330.8A Active CN102964534B (en) | 2012-11-12 | 2012-11-12 | Solvent-free resin composition for vacuum impregnation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102964534B (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103554436A (en) * | 2013-10-18 | 2014-02-05 | 苏州巨峰电气绝缘系统股份有限公司 | Anhydride-free molecular distilled epoxy VPI (vacuum pressure impregnation) impregnated resin and preparation method thereof |
| CN104327780A (en) * | 2014-10-23 | 2015-02-04 | 招远鸿瑞印染有限公司 | Double-component epoxy bonding material |
| CN105038492A (en) * | 2015-06-16 | 2015-11-11 | 湘潭瑞鑫电气科技有限责任公司 | Special solventless epoxy mass-impregnating varnish used for amorphous alloys and preparation method thereof |
| CN105593261A (en) * | 2013-09-30 | 2016-05-18 | 东丽株式会社 | Two-pack epoxy resin composition for fiber-reinforced composite material, and the fiber-reinforced composite material |
| CN106280276A (en) * | 2016-08-12 | 2017-01-04 | 中国电建集团西北勘测设计研究院有限公司 | A kind of environmental protection low viscosity high-strength epoxy radicals chemical grouting material |
| CN106280277A (en) * | 2016-08-12 | 2017-01-04 | 中国电建集团西北勘测设计研究院有限公司 | A kind of preparation method and application of environmental protection low viscosity high-strength epoxy radicals grouting material |
| CN110003864A (en) * | 2019-04-03 | 2019-07-12 | 新疆格瑞迪斯石油技术股份有限公司 | Leak stopping sealing agent and preparation method thereof in a kind of drilling fluid |
| CN111349215A (en) * | 2020-04-30 | 2020-06-30 | 西安天元化工有限责任公司 | Thermally initiated free radical reaction curing and conventional curing combined epoxy resin compositions |
| CN111489849A (en) * | 2020-04-17 | 2020-08-04 | 江苏中广核金沃电子科技有限公司 | High-strength mica tape |
| US10778058B2 (en) * | 2016-03-09 | 2020-09-15 | Siemens Aktiengesellschaft | Solid insulation material |
| CN114991730A (en) * | 2022-06-13 | 2022-09-02 | 中海石油(中国)有限公司 | Thick oil thermal recovery simulation interlayer and manufacturing method thereof |
| CN116285595A (en) * | 2022-09-26 | 2023-06-23 | 苏州巨峰电气绝缘系统股份有限公司 | Insulation drip-impregnated resin and preparation method thereof |
| CN116640492A (en) * | 2023-05-31 | 2023-08-25 | 上海电气集团上海电机厂有限公司 | High-pressure solvent-free impregnating varnish with high storage stability and preparation method and application thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104356965B (en) * | 2014-10-23 | 2016-07-06 | 招远鸿瑞印染有限公司 | A kind of preparation of heat conduction epoxy material |
| CN109251737B (en) * | 2018-09-28 | 2020-09-11 | 四川大学 | Epoxy-phenolic aldehyde system water plugging agent for oil and gas field exploitation |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102153708A (en) * | 2011-01-12 | 2011-08-17 | 宁波工程学院 | Vacuum pressure impregnating resin based on interpenetrating network technology and preparation method thereof |
-
2012
- 2012-11-12 CN CN201210448330.8A patent/CN102964534B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102153708A (en) * | 2011-01-12 | 2011-08-17 | 宁波工程学院 | Vacuum pressure impregnating resin based on interpenetrating network technology and preparation method thereof |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105593261A (en) * | 2013-09-30 | 2016-05-18 | 东丽株式会社 | Two-pack epoxy resin composition for fiber-reinforced composite material, and the fiber-reinforced composite material |
| CN103554436A (en) * | 2013-10-18 | 2014-02-05 | 苏州巨峰电气绝缘系统股份有限公司 | Anhydride-free molecular distilled epoxy VPI (vacuum pressure impregnation) impregnated resin and preparation method thereof |
| CN103554436B (en) * | 2013-10-18 | 2016-01-20 | 苏州巨峰电气绝缘系统股份有限公司 | A kind of molecular distillation epoxy VPI solvent impregnated resin without acid anhydrides and preparation method thereof |
| CN104327780A (en) * | 2014-10-23 | 2015-02-04 | 招远鸿瑞印染有限公司 | Double-component epoxy bonding material |
| CN105038492A (en) * | 2015-06-16 | 2015-11-11 | 湘潭瑞鑫电气科技有限责任公司 | Special solventless epoxy mass-impregnating varnish used for amorphous alloys and preparation method thereof |
| US10778058B2 (en) * | 2016-03-09 | 2020-09-15 | Siemens Aktiengesellschaft | Solid insulation material |
| CN106280277A (en) * | 2016-08-12 | 2017-01-04 | 中国电建集团西北勘测设计研究院有限公司 | A kind of preparation method and application of environmental protection low viscosity high-strength epoxy radicals grouting material |
| CN106280276B (en) * | 2016-08-12 | 2019-03-15 | 中国电建集团西北勘测设计研究院有限公司 | A kind of environmental protection low viscosity high-strength epoxy group chemical grouting material |
| CN106280277B (en) * | 2016-08-12 | 2019-06-04 | 中国电建集团西北勘测设计研究院有限公司 | A kind of preparation method and application of environmental protection low viscosity high-strength epoxy base grouting material |
| CN106280276A (en) * | 2016-08-12 | 2017-01-04 | 中国电建集团西北勘测设计研究院有限公司 | A kind of environmental protection low viscosity high-strength epoxy radicals chemical grouting material |
| CN110003864A (en) * | 2019-04-03 | 2019-07-12 | 新疆格瑞迪斯石油技术股份有限公司 | Leak stopping sealing agent and preparation method thereof in a kind of drilling fluid |
| CN111489849A (en) * | 2020-04-17 | 2020-08-04 | 江苏中广核金沃电子科技有限公司 | High-strength mica tape |
| CN111349215A (en) * | 2020-04-30 | 2020-06-30 | 西安天元化工有限责任公司 | Thermally initiated free radical reaction curing and conventional curing combined epoxy resin compositions |
| CN114991730A (en) * | 2022-06-13 | 2022-09-02 | 中海石油(中国)有限公司 | Thick oil thermal recovery simulation interlayer and manufacturing method thereof |
| CN116285595A (en) * | 2022-09-26 | 2023-06-23 | 苏州巨峰电气绝缘系统股份有限公司 | Insulation drip-impregnated resin and preparation method thereof |
| CN116285595B (en) * | 2022-09-26 | 2024-04-19 | 苏州巨峰电气绝缘系统股份有限公司 | Insulation drip-impregnated resin and preparation method thereof |
| CN116640492A (en) * | 2023-05-31 | 2023-08-25 | 上海电气集团上海电机厂有限公司 | High-pressure solvent-free impregnating varnish with high storage stability and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102964534B (en) | 2014-07-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102964534B (en) | Solvent-free resin composition for vacuum impregnation | |
| CN101486870B (en) | Solvent-free insulated paint | |
| CN103130964A (en) | Solvent-free impregnating resin for low voltage motor and medium voltage motor and solidification method | |
| CN100420715C (en) | Solvent-free impregnating resin for vacuum pressure impregnation of high-voltage motor | |
| CN101864059A (en) | Heat-resistant epoxy anhydride resin suitable for vacuum pressure impregnation (VPI) and preparing method and application thereof | |
| CN103102457B (en) | Styrene modified cashew nut shell oil alkyd resin and preparation method thereof | |
| CN103589119A (en) | Epoxy-resin insulating material for outer coating and preparation method thereof | |
| CN101864058B (en) | Normal temperature dipping-type epoxy anhydride heat-resistant resin as well as preparation method and application thereof | |
| EP2736941A1 (en) | Curable epoxy resin composition | |
| CN103554436B (en) | A kind of molecular distillation epoxy VPI solvent impregnated resin without acid anhydrides and preparation method thereof | |
| CN102942839A (en) | Nanofiller modified solvent-free insulating paint and preparation method thereof | |
| CN106800864A (en) | Water-based insulating paint | |
| CN107286841A (en) | A kind of safety and stability High performance lacquer enamel and preparation method thereof | |
| CN105484103A (en) | Preparation method for epoxy-resin-combined modified vegetable-fiber insulation paper | |
| CN104974474A (en) | Preparation method of flame-retardant high-thermal-conductivity composite material | |
| CN107384058A (en) | A kind of microcomputer harmonic elimination device acetal wire enamel | |
| CN103724597B (en) | There is modified epoxy solvent impregnated resin and the preparation method of high heat resistance | |
| CN105199533A (en) | Phenolic insulating varnish | |
| CN104789112B (en) | High-voltage motor insulating impregnating varnish and preparation method thereof | |
| CN102153708B (en) | Vacuum pressure impregnating resin based on interpenetrating network technology and preparation method thereof | |
| CN110408295A (en) | A kind of preparation method of acidproof waterproof corrosion-resistant epoxy paint | |
| CN102190778B (en) | Epoxy resin latent curing agent with coupling property | |
| CN106479122A (en) | A kind of high voltage insulating materials | |
| CN104152091A (en) | Antiflaming epoxy resin pouring sealant of capacitor | |
| Xia et al. | Developing a novel environmental friendly polyester-imide impregnating resin |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: Yucai Road Beishe 215214 Jiangsu city of Suzhou province Wujiang city FENHU Economic Development Zone No. 36 Applicant after: Suzhou Taihu Electric New Material Co., Ltd. Address before: Yucai Road Beishe 215214 Jiangsu city of Suzhou province Wujiang city FENHU Economic Development Zone No. 36 Applicant before: Wujiang City Taihu Insulation Material Co., Ltd. |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: WUJIANG TAIHU INSULATING MATERIAL CO., LTD. TO: SUZHOU TAIHU ELECTRIC NEWMATERIAL CO. LTD. |
|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |