KR101175696B1 - 처리 장치 - Google Patents
처리 장치 Download PDFInfo
- Publication number
- KR101175696B1 KR101175696B1 KR1020107008859A KR20107008859A KR101175696B1 KR 101175696 B1 KR101175696 B1 KR 101175696B1 KR 1020107008859 A KR1020107008859 A KR 1020107008859A KR 20107008859 A KR20107008859 A KR 20107008859A KR 101175696 B1 KR101175696 B1 KR 101175696B1
- Authority
- KR
- South Korea
- Prior art keywords
- cleaning mechanism
- wafer
- washing
- cleaning
- peripheral portion
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
- H01L21/02087—Cleaning of wafer edges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2008-156902 | 2008-06-16 | ||
JPJP-P-2008-156919 | 2008-06-16 | ||
JP2008156919A JP4932792B2 (ja) | 2008-06-16 | 2008-06-16 | 処理装置 |
JP2008156902A JP5026351B2 (ja) | 2008-06-16 | 2008-06-16 | 処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100075532A KR20100075532A (ko) | 2010-07-02 |
KR101175696B1 true KR101175696B1 (ko) | 2012-08-22 |
Family
ID=41433991
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020107008859A KR101175696B1 (ko) | 2008-06-16 | 2009-06-02 | 처리 장치 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR101175696B1 (ja) |
TW (1) | TWI383465B (ja) |
WO (1) | WO2009154075A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104465448B (zh) * | 2013-09-18 | 2017-06-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种片盒升降装置、传输系统及半导体加工设备 |
JP7479194B2 (ja) * | 2020-05-20 | 2024-05-08 | 東京エレクトロン株式会社 | 基板処理装置、及び基板処理方法 |
CN116525507B (zh) * | 2023-07-05 | 2023-08-29 | 光微半导体(吉林)有限公司 | 倒装毛刷清洗装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11176790A (ja) * | 1997-12-12 | 1999-07-02 | Tokyo Electron Ltd | 洗浄装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7777203B2 (en) * | 2006-09-27 | 2010-08-17 | Applied Materials, Inc. | Substrate holding apparatus |
JP2008098440A (ja) * | 2006-10-12 | 2008-04-24 | Matsushita Electric Ind Co Ltd | 半導体装置の洗浄装置及び洗浄方法 |
-
2009
- 2009-06-02 KR KR1020107008859A patent/KR101175696B1/ko not_active IP Right Cessation
- 2009-06-02 WO PCT/JP2009/060015 patent/WO2009154075A1/ja active Application Filing
- 2009-06-12 TW TW98119745A patent/TWI383465B/zh not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11176790A (ja) * | 1997-12-12 | 1999-07-02 | Tokyo Electron Ltd | 洗浄装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201013810A (en) | 2010-04-01 |
TWI383465B (zh) | 2013-01-21 |
WO2009154075A1 (ja) | 2009-12-23 |
KR20100075532A (ko) | 2010-07-02 |
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Legal Events
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A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20150716 Year of fee payment: 4 |
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FPAY | Annual fee payment |
Payment date: 20160721 Year of fee payment: 5 |
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LAPS | Lapse due to unpaid annual fee |