KR101175696B1 - 처리 장치 - Google Patents

처리 장치 Download PDF

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Publication number
KR101175696B1
KR101175696B1 KR1020107008859A KR20107008859A KR101175696B1 KR 101175696 B1 KR101175696 B1 KR 101175696B1 KR 1020107008859 A KR1020107008859 A KR 1020107008859A KR 20107008859 A KR20107008859 A KR 20107008859A KR 101175696 B1 KR101175696 B1 KR 101175696B1
Authority
KR
South Korea
Prior art keywords
cleaning mechanism
wafer
washing
cleaning
peripheral portion
Prior art date
Application number
KR1020107008859A
Other languages
English (en)
Korean (ko)
Other versions
KR20100075532A (ko
Inventor
코헤이 모리
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008156919A external-priority patent/JP4932792B2/ja
Priority claimed from JP2008156902A external-priority patent/JP5026351B2/ja
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20100075532A publication Critical patent/KR20100075532A/ko
Application granted granted Critical
Publication of KR101175696B1 publication Critical patent/KR101175696B1/ko

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02082Cleaning product to be cleaned
    • H01L21/02087Cleaning of wafer edges
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020107008859A 2008-06-16 2009-06-02 처리 장치 KR101175696B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2008-156902 2008-06-16
JPJP-P-2008-156919 2008-06-16
JP2008156919A JP4932792B2 (ja) 2008-06-16 2008-06-16 処理装置
JP2008156902A JP5026351B2 (ja) 2008-06-16 2008-06-16 処理装置

Publications (2)

Publication Number Publication Date
KR20100075532A KR20100075532A (ko) 2010-07-02
KR101175696B1 true KR101175696B1 (ko) 2012-08-22

Family

ID=41433991

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107008859A KR101175696B1 (ko) 2008-06-16 2009-06-02 처리 장치

Country Status (3)

Country Link
KR (1) KR101175696B1 (ja)
TW (1) TWI383465B (ja)
WO (1) WO2009154075A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104465448B (zh) * 2013-09-18 2017-06-06 北京北方微电子基地设备工艺研究中心有限责任公司 一种片盒升降装置、传输系统及半导体加工设备
JP7479194B2 (ja) * 2020-05-20 2024-05-08 東京エレクトロン株式会社 基板処理装置、及び基板処理方法
CN116525507B (zh) * 2023-07-05 2023-08-29 光微半导体(吉林)有限公司 倒装毛刷清洗装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11176790A (ja) * 1997-12-12 1999-07-02 Tokyo Electron Ltd 洗浄装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7777203B2 (en) * 2006-09-27 2010-08-17 Applied Materials, Inc. Substrate holding apparatus
JP2008098440A (ja) * 2006-10-12 2008-04-24 Matsushita Electric Ind Co Ltd 半導体装置の洗浄装置及び洗浄方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11176790A (ja) * 1997-12-12 1999-07-02 Tokyo Electron Ltd 洗浄装置

Also Published As

Publication number Publication date
TW201013810A (en) 2010-04-01
TWI383465B (zh) 2013-01-21
WO2009154075A1 (ja) 2009-12-23
KR20100075532A (ko) 2010-07-02

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