KR101170764B1 - 다층 회로기판 제조방법 - Google Patents

다층 회로기판 제조방법 Download PDF

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Publication number
KR101170764B1
KR101170764B1 KR1020060111952A KR20060111952A KR101170764B1 KR 101170764 B1 KR101170764 B1 KR 101170764B1 KR 1020060111952 A KR1020060111952 A KR 1020060111952A KR 20060111952 A KR20060111952 A KR 20060111952A KR 101170764 B1 KR101170764 B1 KR 101170764B1
Authority
KR
South Korea
Prior art keywords
circuit board
interlayer connection
connection hole
forming
hole
Prior art date
Application number
KR1020060111952A
Other languages
English (en)
Korean (ko)
Other versions
KR20070082492A (ko
Inventor
후미히코 마츠다
Original Assignee
니폰 메크트론 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 니폰 메크트론 가부시키가이샤 filed Critical 니폰 메크트론 가부시키가이샤
Publication of KR20070082492A publication Critical patent/KR20070082492A/ko
Application granted granted Critical
Publication of KR101170764B1 publication Critical patent/KR101170764B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020060111952A 2006-02-16 2006-11-14 다층 회로기판 제조방법 KR101170764B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006039380A JP4813204B2 (ja) 2006-02-16 2006-02-16 多層回路基板の製造方法
JPJP-P-2006-00039380 2006-02-16

Publications (2)

Publication Number Publication Date
KR20070082492A KR20070082492A (ko) 2007-08-21
KR101170764B1 true KR101170764B1 (ko) 2012-08-03

Family

ID=38497840

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060111952A KR101170764B1 (ko) 2006-02-16 2006-11-14 다층 회로기판 제조방법

Country Status (4)

Country Link
JP (1) JP4813204B2 (ja)
KR (1) KR101170764B1 (ja)
CN (1) CN100594758C (ja)
TW (1) TWI391063B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101946989B1 (ko) * 2011-12-09 2019-02-12 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
KR101390696B1 (ko) * 2012-11-27 2014-04-30 대덕지디에스 주식회사 인쇄회로기판 및 그 제조방법
CN106163141A (zh) * 2016-07-08 2016-11-23 台山市精诚达电路有限公司 四层fpc的制作方法
JP7381323B2 (ja) * 2019-12-17 2023-11-15 日東電工株式会社 両面配線回路基板の製造方法および両面配線回路基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11150370A (ja) * 1997-11-18 1999-06-02 Kyocera Corp 多層配線基板
JP2004228446A (ja) 2003-01-24 2004-08-12 Nec Corp プリント基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09246724A (ja) * 1996-03-04 1997-09-19 Hitachi Chem Co Ltd 多層プリント配線板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11150370A (ja) * 1997-11-18 1999-06-02 Kyocera Corp 多層配線基板
JP2004228446A (ja) 2003-01-24 2004-08-12 Nec Corp プリント基板

Also Published As

Publication number Publication date
JP2007220893A (ja) 2007-08-30
CN100594758C (zh) 2010-03-17
TW200742523A (en) 2007-11-01
CN101022697A (zh) 2007-08-22
JP4813204B2 (ja) 2011-11-09
TWI391063B (zh) 2013-03-21
KR20070082492A (ko) 2007-08-21

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