CN100594758C - 多层电路板及其制造方法 - Google Patents

多层电路板及其制造方法 Download PDF

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Publication number
CN100594758C
CN100594758C CN200610166785A CN200610166785A CN100594758C CN 100594758 C CN100594758 C CN 100594758C CN 200610166785 A CN200610166785 A CN 200610166785A CN 200610166785 A CN200610166785 A CN 200610166785A CN 100594758 C CN100594758 C CN 100594758C
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CN
China
Prior art keywords
circuit board
mentioned
layer
connecting hole
multilayer circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200610166785A
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English (en)
Chinese (zh)
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CN101022697A (zh
Inventor
松田文彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
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Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Publication of CN101022697A publication Critical patent/CN101022697A/zh
Application granted granted Critical
Publication of CN100594758C publication Critical patent/CN100594758C/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN200610166785A 2006-02-16 2006-11-30 多层电路板及其制造方法 Active CN100594758C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006039380 2006-02-16
JP2006039380A JP4813204B2 (ja) 2006-02-16 2006-02-16 多層回路基板の製造方法

Publications (2)

Publication Number Publication Date
CN101022697A CN101022697A (zh) 2007-08-22
CN100594758C true CN100594758C (zh) 2010-03-17

Family

ID=38497840

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200610166785A Active CN100594758C (zh) 2006-02-16 2006-11-30 多层电路板及其制造方法

Country Status (4)

Country Link
JP (1) JP4813204B2 (ja)
KR (1) KR101170764B1 (ja)
CN (1) CN100594758C (ja)
TW (1) TWI391063B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101946989B1 (ko) * 2011-12-09 2019-02-12 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
KR101390696B1 (ko) * 2012-11-27 2014-04-30 대덕지디에스 주식회사 인쇄회로기판 및 그 제조방법
CN106163141A (zh) * 2016-07-08 2016-11-23 台山市精诚达电路有限公司 四层fpc的制作方法
JP7381323B2 (ja) * 2019-12-17 2023-11-15 日東電工株式会社 両面配線回路基板の製造方法および両面配線回路基板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09246724A (ja) * 1996-03-04 1997-09-19 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JPH11150370A (ja) * 1997-11-18 1999-06-02 Kyocera Corp 多層配線基板
JP2004228446A (ja) * 2003-01-24 2004-08-12 Nec Corp プリント基板

Also Published As

Publication number Publication date
JP2007220893A (ja) 2007-08-30
CN101022697A (zh) 2007-08-22
TWI391063B (zh) 2013-03-21
TW200742523A (en) 2007-11-01
JP4813204B2 (ja) 2011-11-09
KR101170764B1 (ko) 2012-08-03
KR20070082492A (ko) 2007-08-21

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