KR101163436B1 - 절연 피복 도전 입자 - Google Patents

절연 피복 도전 입자 Download PDF

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Publication number
KR101163436B1
KR101163436B1 KR1020077014409A KR20077014409A KR101163436B1 KR 101163436 B1 KR101163436 B1 KR 101163436B1 KR 1020077014409 A KR1020077014409 A KR 1020077014409A KR 20077014409 A KR20077014409 A KR 20077014409A KR 101163436 B1 KR101163436 B1 KR 101163436B1
Authority
KR
South Korea
Prior art keywords
insulating resin
insulating
functional group
particle
anisotropic conductive
Prior art date
Application number
KR1020077014409A
Other languages
English (en)
Korean (ko)
Other versions
KR20070105972A (ko
Inventor
미사오 고니시
노리아키 구도
Original Assignee
소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 filed Critical 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤
Publication of KR20070105972A publication Critical patent/KR20070105972A/ko
Application granted granted Critical
Publication of KR101163436B1 publication Critical patent/KR101163436B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/10—Treatment with macromolecular organic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/40—Electric properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
  • Paints Or Removers (AREA)
KR1020077014409A 2005-02-24 2005-02-25 절연 피복 도전 입자 KR101163436B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005048948A JP5099284B2 (ja) 2005-02-24 2005-02-24 異方性接続シート材料
JPJP-P-2005-00048948 2005-02-24
PCT/JP2005/003115 WO2006090467A1 (ja) 2005-02-24 2005-02-25 絶縁被覆導電粒子

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020117027982A Division KR101246516B1 (ko) 2005-02-24 2005-02-25 절연 피복 도전 입자

Publications (2)

Publication Number Publication Date
KR20070105972A KR20070105972A (ko) 2007-10-31
KR101163436B1 true KR101163436B1 (ko) 2012-07-13

Family

ID=36927118

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020117027982A KR101246516B1 (ko) 2005-02-24 2005-02-25 절연 피복 도전 입자
KR1020077014409A KR101163436B1 (ko) 2005-02-24 2005-02-25 절연 피복 도전 입자

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020117027982A KR101246516B1 (ko) 2005-02-24 2005-02-25 절연 피복 도전 입자

Country Status (6)

Country Link
JP (1) JP5099284B2 (zh)
KR (2) KR101246516B1 (zh)
CN (1) CN101128886B (zh)
HK (1) HK1116595A1 (zh)
TW (1) TWI257741B (zh)
WO (1) WO2006090467A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100133486A1 (en) * 2006-10-17 2010-06-03 Hitachi Chemical Company, Ltd. Coated particle and method for producing the same, anisotropic conductive adhesive composition using coated particle, and anisotropic conductive adhesive film
JP4957695B2 (ja) * 2007-10-02 2012-06-20 日立化成工業株式会社 導電粒子、その製造方法及び絶縁被覆導電粒子の製造方法、並びに異方導電性接着剤フィルム
KR101148143B1 (ko) * 2008-12-17 2012-05-23 제일모직주식회사 절연 전도성 입자 및 이를 포함하는 이방 전도성 필름용 조성물
JP5788130B2 (ja) * 2008-12-26 2015-09-30 日本発條株式会社 導電性樹脂フィルム及びその製造方法
JP4957838B2 (ja) 2009-08-06 2012-06-20 日立化成工業株式会社 導電性微粒子及び異方性導電材料
JP5398455B2 (ja) * 2009-09-30 2014-01-29 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
JP2015079586A (ja) * 2013-10-15 2015-04-23 デクセリアルズ株式会社 異方性導電フィルム
JP6518101B2 (ja) * 2014-03-26 2019-05-22 積水化学工業株式会社 光硬化性導電材料、接続構造体及び接続構造体の製造方法
WO2016080515A1 (ja) * 2014-11-20 2016-05-26 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
JP6592350B2 (ja) * 2014-12-26 2019-10-16 積水化学工業株式会社 異方性導電材料、接続構造体及び接続構造体の製造方法
JP6082843B2 (ja) * 2015-02-19 2017-02-15 積水化学工業株式会社 導電ペースト及び接続構造体
CN106318244A (zh) * 2015-07-02 2017-01-11 玮锋科技股份有限公司 核层技术异方性导电胶膜
WO2017033934A1 (ja) * 2015-08-24 2017-03-02 積水化学工業株式会社 導電材料及び接続構造体
CN110875101A (zh) * 2018-08-31 2020-03-10 玮锋科技股份有限公司 异方性导电膜结构及其制作方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001106928A (ja) 1999-07-30 2001-04-17 Dainippon Ink & Chem Inc 導電材料カプセル化樹脂粒子およびその製法

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
US596506A (en) * 1898-01-04 Electric switch
JPH0559338A (ja) * 1991-08-30 1993-03-09 Sekisui Chem Co Ltd 粘着剤組成物、粘着加工品および粘着加工品の製造方法
JP4080573B2 (ja) * 1997-08-01 2008-04-23 ソニー株式会社 平面型レンズ及びその製造方法並びに背面投射型プロジェクタ用スクリーン
JP3296306B2 (ja) * 1997-10-28 2002-06-24 ソニーケミカル株式会社 異方導電性接着剤および接着用膜
US5965064A (en) * 1997-10-28 1999-10-12 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
JP2000305181A (ja) * 1999-04-23 2000-11-02 Sony Corp 平面型レンズ及びその製造方法、並びに背面投射型プロジェクタ用スクリーン
DE10016041A1 (de) * 2000-03-31 2001-10-04 Stockhausen Chem Fab Gmbh Pulverförmige an der Oberfläche vernetzte Polymerisate
EP1335389A4 (en) * 2000-10-23 2006-08-02 Sekisui Chemical Co Ltd COATED PARTICLE
JP5060692B2 (ja) * 2001-07-13 2012-10-31 株式会社日本触媒 異方導電性材料
TW557237B (en) * 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
JP4050086B2 (ja) * 2002-04-24 2008-02-20 ナトコ株式会社 導電性粒子、導電性材料および異方性導電膜
JP2005063804A (ja) * 2003-08-12 2005-03-10 Matsushita Electric Works Ltd 遠隔監視制御システムの照度センサ装置
JP4539813B2 (ja) * 2003-08-19 2010-09-08 ソニーケミカル＆インフォメーションデバイス株式会社 絶縁被覆導電粒子
JP5177439B2 (ja) * 2009-06-23 2013-04-03 デクセリアルズ株式会社 絶縁被覆導電粒子

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001106928A (ja) 1999-07-30 2001-04-17 Dainippon Ink & Chem Inc 導電材料カプセル化樹脂粒子およびその製法

Also Published As

Publication number Publication date
WO2006090467A1 (ja) 2006-08-31
TWI257741B (en) 2006-07-01
JP2006236759A (ja) 2006-09-07
TW200631240A (en) 2006-09-01
KR20070105972A (ko) 2007-10-31
HK1116595A1 (zh) 2008-12-24
KR101246516B1 (ko) 2013-03-26
KR20110134946A (ko) 2011-12-15
JP5099284B2 (ja) 2012-12-19
CN101128886A (zh) 2008-02-20
CN101128886B (zh) 2014-03-26

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