KR101139073B1 - 회로 접속용 접착 필름, 접속 구조체 및 그의 제조 방법 - Google Patents

회로 접속용 접착 필름, 접속 구조체 및 그의 제조 방법 Download PDF

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Publication number
KR101139073B1
KR101139073B1 KR1020097023996A KR20097023996A KR101139073B1 KR 101139073 B1 KR101139073 B1 KR 101139073B1 KR 1020097023996 A KR1020097023996 A KR 1020097023996A KR 20097023996 A KR20097023996 A KR 20097023996A KR 101139073 B1 KR101139073 B1 KR 101139073B1
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South Korea
Prior art keywords
adhesive
layer
circuit
circuit member
connection terminal
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KR1020097023996A
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English (en)
Korean (ko)
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KR20100002284A (ko
Inventor
모또히로 아리후꾸
니찌오미 모찌즈끼
고우지 고바야시
가즈요시 고지마
다까시 나까자와
유끼히사 히로사와
Original Assignee
히다치 가세고교 가부시끼가이샤
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Priority claimed from PCT/JP2008/057534 external-priority patent/WO2008133186A1/ja
Publication of KR20100002284A publication Critical patent/KR20100002284A/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020097023996A 2007-04-19 2008-04-17 회로 접속용 접착 필름, 접속 구조체 및 그의 제조 방법 Active KR101139073B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2007110385 2007-04-19
JPJP-P-2007-110385 2007-04-19
JPJP-P-2008-002577 2008-01-09
JP2008002577A JP5181220B2 (ja) 2007-04-19 2008-01-09 回路接続用接着フィルム、接続構造体及びその製造方法
PCT/JP2008/057534 WO2008133186A1 (ja) 2007-04-19 2008-04-17 回路接続用接着フィルム、接続構造体及びその製造方法

Publications (2)

Publication Number Publication Date
KR20100002284A KR20100002284A (ko) 2010-01-06
KR101139073B1 true KR101139073B1 (ko) 2012-04-30

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ID=40147951

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KR1020097023996A Active KR101139073B1 (ko) 2007-04-19 2008-04-17 회로 접속용 접착 필름, 접속 구조체 및 그의 제조 방법

Country Status (4)

Country Link
JP (1) JP5181220B2 (https=)
KR (1) KR101139073B1 (https=)
CN (2) CN102638944B (https=)
TW (1) TWI399420B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5521848B2 (ja) 2010-07-21 2014-06-18 デクセリアルズ株式会社 異方性導電フィルム、接続構造体及びそれらの製造方法
JP5823117B2 (ja) * 2010-11-16 2015-11-25 デクセリアルズ株式会社 異方性導電フィルム、接合体、及び接合体の製造方法
JP5972009B2 (ja) * 2012-03-30 2016-08-17 デクセリアルズ株式会社 回路接続材料、及びこれを用いた実装体の製造方法
CN105225729B (zh) * 2015-08-26 2017-02-22 京东方科技集团股份有限公司 各向异性导电膜、及覆晶薄膜与柔性电路板的邦定方法
JP2017098077A (ja) * 2015-11-24 2017-06-01 デクセリアルズ株式会社 異方性導電フィルム、及び接続方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003049152A (ja) * 2001-08-02 2003-02-21 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた接続方法、接続構造体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4214416B2 (ja) * 1997-02-27 2009-01-28 セイコーエプソン株式会社 接着方法及び液晶装置の製造方法
WO1998038701A1 (fr) * 1997-02-27 1998-09-03 Seiko Epson Corporation Structure de connexion, dispositif a cristaux liquides, equipement electronique, adhesif conducteur anisotrope, et procede de production d'un tel adhesif
JP4011157B2 (ja) * 1997-08-08 2007-11-21 日立化成フィルテック株式会社 包装用ラップフィルムの収納ケース
CN1214455C (zh) * 2000-04-25 2005-08-10 日立化成工业株式会社 电路连接用粘接剂、使用其的电路连接方法及电路连接结构体
JP4747396B2 (ja) * 2000-05-17 2011-08-17 日立化成工業株式会社 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP4325379B2 (ja) * 2003-12-02 2009-09-02 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003049152A (ja) * 2001-08-02 2003-02-21 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた接続方法、接続構造体

Also Published As

Publication number Publication date
JP5181220B2 (ja) 2013-04-10
CN102638944A (zh) 2012-08-15
CN102638944B (zh) 2014-12-10
TW200911950A (en) 2009-03-16
CN101611659B (zh) 2012-05-23
CN101611659A (zh) 2009-12-23
JP2008288551A (ja) 2008-11-27
TWI399420B (zh) 2013-06-21
KR20100002284A (ko) 2010-01-06

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