CN102638944B - 电路连接用粘接薄膜、连接结构体以及其制造方法 - Google Patents

电路连接用粘接薄膜、连接结构体以及其制造方法 Download PDF

Info

Publication number
CN102638944B
CN102638944B CN201210096198.9A CN201210096198A CN102638944B CN 102638944 B CN102638944 B CN 102638944B CN 201210096198 A CN201210096198 A CN 201210096198A CN 102638944 B CN102638944 B CN 102638944B
Authority
CN
China
Prior art keywords
adhesive layer
circuit
adhesive
adhesive film
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201210096198.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN102638944A (zh
Inventor
有福征宏
望月日臣
小林宏治
小岛和良
中泽孝
广泽幸寿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN102638944A publication Critical patent/CN102638944A/zh
Application granted granted Critical
Publication of CN102638944B publication Critical patent/CN102638944B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
CN201210096198.9A 2007-04-19 2008-04-17 电路连接用粘接薄膜、连接结构体以及其制造方法 Active CN102638944B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-110385 2007-04-19
JP2007110385 2007-04-19
JP2008002577A JP5181220B2 (ja) 2007-04-19 2008-01-09 回路接続用接着フィルム、接続構造体及びその製造方法
JP2008-002577 2008-01-09

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2008800049491A Division CN101611659B (zh) 2007-04-19 2008-04-17 电路连接用粘接薄膜、连接结构体以及其制造方法

Publications (2)

Publication Number Publication Date
CN102638944A CN102638944A (zh) 2012-08-15
CN102638944B true CN102638944B (zh) 2014-12-10

Family

ID=40147951

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201210096198.9A Active CN102638944B (zh) 2007-04-19 2008-04-17 电路连接用粘接薄膜、连接结构体以及其制造方法
CN2008800049491A Active CN101611659B (zh) 2007-04-19 2008-04-17 电路连接用粘接薄膜、连接结构体以及其制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2008800049491A Active CN101611659B (zh) 2007-04-19 2008-04-17 电路连接用粘接薄膜、连接结构体以及其制造方法

Country Status (4)

Country Link
JP (1) JP5181220B2 (https=)
KR (1) KR101139073B1 (https=)
CN (2) CN102638944B (https=)
TW (1) TWI399420B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5521848B2 (ja) 2010-07-21 2014-06-18 デクセリアルズ株式会社 異方性導電フィルム、接続構造体及びそれらの製造方法
JP5823117B2 (ja) * 2010-11-16 2015-11-25 デクセリアルズ株式会社 異方性導電フィルム、接合体、及び接合体の製造方法
JP5972009B2 (ja) * 2012-03-30 2016-08-17 デクセリアルズ株式会社 回路接続材料、及びこれを用いた実装体の製造方法
CN105225729B (zh) * 2015-08-26 2017-02-22 京东方科技集团股份有限公司 各向异性导电膜、及覆晶薄膜与柔性电路板的邦定方法
JP2017098077A (ja) * 2015-11-24 2017-06-01 デクセリアルズ株式会社 異方性導電フィルム、及び接続方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1214455C (zh) * 2000-04-25 2005-08-10 日立化成工业株式会社 电路连接用粘接剂、使用其的电路连接方法及电路连接结构体
CN1218439C (zh) * 1997-02-27 2005-09-07 精工爱普生株式会社 连接结构体、液晶装置、电子装置和各向异性导电性粘接剂及其制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4214416B2 (ja) * 1997-02-27 2009-01-28 セイコーエプソン株式会社 接着方法及び液晶装置の製造方法
JP4011157B2 (ja) * 1997-08-08 2007-11-21 日立化成フィルテック株式会社 包装用ラップフィルムの収納ケース
JP4747396B2 (ja) * 2000-05-17 2011-08-17 日立化成工業株式会社 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP2003049152A (ja) * 2001-08-02 2003-02-21 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた接続方法、接続構造体
JP4325379B2 (ja) * 2003-12-02 2009-09-02 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1218439C (zh) * 1997-02-27 2005-09-07 精工爱普生株式会社 连接结构体、液晶装置、电子装置和各向异性导电性粘接剂及其制造方法
CN1214455C (zh) * 2000-04-25 2005-08-10 日立化成工业株式会社 电路连接用粘接剂、使用其的电路连接方法及电路连接结构体

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2003-49152A 2003.02.21 *

Also Published As

Publication number Publication date
JP5181220B2 (ja) 2013-04-10
CN102638944A (zh) 2012-08-15
TW200911950A (en) 2009-03-16
CN101611659B (zh) 2012-05-23
CN101611659A (zh) 2009-12-23
JP2008288551A (ja) 2008-11-27
TWI399420B (zh) 2013-06-21
KR101139073B1 (ko) 2012-04-30
KR20100002284A (ko) 2010-01-06

Similar Documents

Publication Publication Date Title
JP5163789B2 (ja) 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法
CN101897245A (zh) 电路连接材料及电路部件的连接结构
CN102417794A (zh) 电路连接材料、连接方法、连接结构体及制造方法和用途
CN107254264B (zh) 电路连接材料、电路部件的连接结构及其制造方法
CN102638944B (zh) 电路连接用粘接薄膜、连接结构体以及其制造方法
JP4844003B2 (ja) 回路接続材料、回路部材の接続構造及び回路部材の接続方法。
CN101502188B (zh) 电路连接材料、电路部件的连接结构及电路部件的连接方法
JP4844677B2 (ja) 回路接続材料、回路部材の接続構造及び回路部材の接続方法。
JP4900490B2 (ja) 回路接続材料、回路部材の接続構造及び回路部材の接続方法。
CN102167964B (zh) 电路连接材料、电路部件的连接结构及电路部件的连接方法
CN101787245B (zh) 电路连接材料、电路部件的连接结构及电路部件的连接方法
TWI412305B (zh) A circuit connection material, a connection structure of a circuit component, and a connection method of a circuit component
TWI432106B (zh) A circuit connection material, a connection structure of the circuit member, and a connection method of the circuit component
JP2011032479A (ja) 回路接続材料、回路部材の接続構造及び回路部材の接続方法。
JP2012219111A (ja) 回路接続材料

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C53 Correction of patent of invention or patent application
CB02 Change of applicant information

Address after: Japan Tokyo Chiyoda Marunouchi yidingmu 9 No. 2

Applicant after: HITACHI CHEMICAL Co.,Ltd.

Address before: Tokyo, Japan

Applicant before: HITACHI CHEMICAL Co.,Ltd.

COR Change of bibliographic data

Free format text: CORRECT: APPLICANT; FROM: HITACHI CHEMICAL CO. LTD. TO: HITACHI CHEMICAL CO., LTD.

C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Japan Tokyo Chiyoda Marunouchi yidingmu 9 No. 2

Patentee after: Lishennoco Co.,Ltd.

Address before: Japan Tokyo Chiyoda Marunouchi yidingmu 9 No. 2

Patentee before: HITACHI CHEMICAL Co.,Ltd.