JP5181220B2 - 回路接続用接着フィルム、接続構造体及びその製造方法 - Google Patents

回路接続用接着フィルム、接続構造体及びその製造方法 Download PDF

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Publication number
JP5181220B2
JP5181220B2 JP2008002577A JP2008002577A JP5181220B2 JP 5181220 B2 JP5181220 B2 JP 5181220B2 JP 2008002577 A JP2008002577 A JP 2008002577A JP 2008002577 A JP2008002577 A JP 2008002577A JP 5181220 B2 JP5181220 B2 JP 5181220B2
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JP
Japan
Prior art keywords
adhesive layer
circuit
connection
circuit member
connection terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008002577A
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English (en)
Japanese (ja)
Other versions
JP2008288551A5 (https=
JP2008288551A (ja
Inventor
征宏 有福
日臣 望月
宏治 小林
和良 小島
孝 中澤
幸寿 廣澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2008002577A priority Critical patent/JP5181220B2/ja
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to CN2008800049491A priority patent/CN101611659B/zh
Priority to CN201210096198.9A priority patent/CN102638944B/zh
Priority to KR1020097023996A priority patent/KR101139073B1/ko
Priority to PCT/JP2008/057534 priority patent/WO2008133186A1/ja
Priority to TW097114352A priority patent/TWI399420B/zh
Publication of JP2008288551A publication Critical patent/JP2008288551A/ja
Publication of JP2008288551A5 publication Critical patent/JP2008288551A5/ja
Application granted granted Critical
Publication of JP5181220B2 publication Critical patent/JP5181220B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
JP2008002577A 2007-04-19 2008-01-09 回路接続用接着フィルム、接続構造体及びその製造方法 Active JP5181220B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008002577A JP5181220B2 (ja) 2007-04-19 2008-01-09 回路接続用接着フィルム、接続構造体及びその製造方法
CN201210096198.9A CN102638944B (zh) 2007-04-19 2008-04-17 电路连接用粘接薄膜、连接结构体以及其制造方法
KR1020097023996A KR101139073B1 (ko) 2007-04-19 2008-04-17 회로 접속용 접착 필름, 접속 구조체 및 그의 제조 방법
PCT/JP2008/057534 WO2008133186A1 (ja) 2007-04-19 2008-04-17 回路接続用接着フィルム、接続構造体及びその製造方法
CN2008800049491A CN101611659B (zh) 2007-04-19 2008-04-17 电路连接用粘接薄膜、连接结构体以及其制造方法
TW097114352A TWI399420B (zh) 2007-04-19 2008-04-18 Circuit connecting adhesive film, connection structure and a manufacturing method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007110385 2007-04-19
JP2007110385 2007-04-19
JP2008002577A JP5181220B2 (ja) 2007-04-19 2008-01-09 回路接続用接着フィルム、接続構造体及びその製造方法

Publications (3)

Publication Number Publication Date
JP2008288551A JP2008288551A (ja) 2008-11-27
JP2008288551A5 JP2008288551A5 (https=) 2010-10-14
JP5181220B2 true JP5181220B2 (ja) 2013-04-10

Family

ID=40147951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008002577A Active JP5181220B2 (ja) 2007-04-19 2008-01-09 回路接続用接着フィルム、接続構造体及びその製造方法

Country Status (4)

Country Link
JP (1) JP5181220B2 (https=)
KR (1) KR101139073B1 (https=)
CN (2) CN102638944B (https=)
TW (1) TWI399420B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5521848B2 (ja) 2010-07-21 2014-06-18 デクセリアルズ株式会社 異方性導電フィルム、接続構造体及びそれらの製造方法
JP5823117B2 (ja) * 2010-11-16 2015-11-25 デクセリアルズ株式会社 異方性導電フィルム、接合体、及び接合体の製造方法
JP5972009B2 (ja) * 2012-03-30 2016-08-17 デクセリアルズ株式会社 回路接続材料、及びこれを用いた実装体の製造方法
CN105225729B (zh) * 2015-08-26 2017-02-22 京东方科技集团股份有限公司 各向异性导电膜、及覆晶薄膜与柔性电路板的邦定方法
JP2017098077A (ja) * 2015-11-24 2017-06-01 デクセリアルズ株式会社 異方性導電フィルム、及び接続方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4214416B2 (ja) * 1997-02-27 2009-01-28 セイコーエプソン株式会社 接着方法及び液晶装置の製造方法
WO1998038701A1 (fr) * 1997-02-27 1998-09-03 Seiko Epson Corporation Structure de connexion, dispositif a cristaux liquides, equipement electronique, adhesif conducteur anisotrope, et procede de production d'un tel adhesif
JP4011157B2 (ja) * 1997-08-08 2007-11-21 日立化成フィルテック株式会社 包装用ラップフィルムの収納ケース
CN1214455C (zh) * 2000-04-25 2005-08-10 日立化成工业株式会社 电路连接用粘接剂、使用其的电路连接方法及电路连接结构体
JP4747396B2 (ja) * 2000-05-17 2011-08-17 日立化成工業株式会社 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP2003049152A (ja) * 2001-08-02 2003-02-21 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた接続方法、接続構造体
JP4325379B2 (ja) * 2003-12-02 2009-09-02 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法

Also Published As

Publication number Publication date
CN102638944A (zh) 2012-08-15
CN102638944B (zh) 2014-12-10
TW200911950A (en) 2009-03-16
CN101611659B (zh) 2012-05-23
CN101611659A (zh) 2009-12-23
JP2008288551A (ja) 2008-11-27
TWI399420B (zh) 2013-06-21
KR101139073B1 (ko) 2012-04-30
KR20100002284A (ko) 2010-01-06

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