KR101118435B1 - 반도체 봉지용 에폭시 수지 조성물 및 반도체 장치 - Google Patents

반도체 봉지용 에폭시 수지 조성물 및 반도체 장치 Download PDF

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Publication number
KR101118435B1
KR101118435B1 KR1020067019465A KR20067019465A KR101118435B1 KR 101118435 B1 KR101118435 B1 KR 101118435B1 KR 1020067019465 A KR1020067019465 A KR 1020067019465A KR 20067019465 A KR20067019465 A KR 20067019465A KR 101118435 B1 KR101118435 B1 KR 101118435B1
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KR
South Korea
Prior art keywords
epoxy resin
resin composition
hydrotalcite
semiconductor
glycerin
Prior art date
Application number
KR1020067019465A
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English (en)
Korean (ko)
Other versions
KR20070012654A (ko
Inventor
다이스케 히로카네
Original Assignee
스미또모 베이크라이트 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 스미또모 베이크라이트 가부시키가이샤 filed Critical 스미또모 베이크라이트 가부시키가이샤
Publication of KR20070012654A publication Critical patent/KR20070012654A/ko
Application granted granted Critical
Publication of KR101118435B1 publication Critical patent/KR101118435B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020067019465A 2004-03-30 2005-03-10 반도체 봉지용 에폭시 수지 조성물 및 반도체 장치 KR101118435B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00100256 2004-03-30
JP2004100256 2004-03-30
PCT/JP2005/004705 WO2005097892A1 (fr) 2004-03-30 2005-03-10 Composition de résine d'époxy pour l’encapsulation de semi-conducteurs et dispositifs semi-conducteurs

Publications (2)

Publication Number Publication Date
KR20070012654A KR20070012654A (ko) 2007-01-26
KR101118435B1 true KR101118435B1 (ko) 2012-03-06

Family

ID=35125026

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067019465A KR101118435B1 (ko) 2004-03-30 2005-03-10 반도체 봉지용 에폭시 수지 조성물 및 반도체 장치

Country Status (7)

Country Link
US (1) US7723856B2 (fr)
JP (1) JP4788916B2 (fr)
KR (1) KR101118435B1 (fr)
CN (1) CN1934190B (fr)
MY (1) MY145438A (fr)
TW (1) TWI404760B (fr)
WO (1) WO2005097892A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5124808B2 (ja) * 2005-08-05 2013-01-23 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP4956982B2 (ja) * 2005-12-13 2012-06-20 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
WO2008044579A1 (fr) 2006-10-06 2008-04-17 Sumitomo Bakelite Company Limited composition de résine époxy pour le scellement d'un semi-conducteur, et dispositif semi-conducteur
JP5070972B2 (ja) * 2007-07-26 2012-11-14 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
KR100949835B1 (ko) * 2008-02-20 2010-03-29 주식회사 두본 우수한 내열성을 갖는 하이드로탈사이트 및 그의 제조방법
WO2010113451A1 (fr) * 2009-04-03 2010-10-07 株式会社島津製作所 Détecteur de radiation, et dispositif d'imagerie de radiation équipé dudit détecteur
JP5272199B2 (ja) * 2010-11-10 2013-08-28 日立化成株式会社 半導体装置の製法
CN102585845B (zh) * 2010-12-31 2014-04-09 梁清源 一种无机矿物复合阻燃剂及其制备方法
JP6183061B2 (ja) * 2013-08-27 2017-08-23 日立化成株式会社 半導体封止用エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置
CN109219637B (zh) * 2016-05-30 2021-05-25 昭和电工材料株式会社 密封组合物及半导体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002053734A (ja) 2000-08-08 2002-02-19 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP2002080695A (ja) * 2000-09-06 2002-03-19 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2002212393A (ja) 2001-01-17 2002-07-31 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997024402A1 (fr) * 1995-12-28 1997-07-10 Toray Industries, Inc. Composition de resine epoxy
WO1999001507A1 (fr) * 1997-07-02 1999-01-14 Sumitomo Bakelite Company, Ltd. Compositions de resines epoxydes d'encapsulation de semi-conducteurs, et dispositifs a semi-conducteurs
JP2002161193A (ja) * 2000-11-27 2002-06-04 Sumitomo Bakelite Co Ltd 金型離型回復樹脂組成物
JP2002220511A (ja) 2001-01-25 2002-08-09 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物及び半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002053734A (ja) 2000-08-08 2002-02-19 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP2002080695A (ja) * 2000-09-06 2002-03-19 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2002212393A (ja) 2001-01-17 2002-07-31 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置

Also Published As

Publication number Publication date
MY145438A (en) 2012-02-15
CN1934190A (zh) 2007-03-21
JPWO2005097892A1 (ja) 2008-02-28
US20070216040A1 (en) 2007-09-20
TW200617096A (en) 2006-06-01
CN1934190B (zh) 2010-11-24
TWI404760B (zh) 2013-08-11
JP4788916B2 (ja) 2011-10-05
KR20070012654A (ko) 2007-01-26
WO2005097892A1 (fr) 2005-10-20
US7723856B2 (en) 2010-05-25

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