KR101118361B1 - 도전성 페이스트 및 그 도전성 페이스트를 이용한 세라믹 다층회로기판 제조방법 - Google Patents

도전성 페이스트 및 그 도전성 페이스트를 이용한 세라믹 다층회로기판 제조방법 Download PDF

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Publication number
KR101118361B1
KR101118361B1 KR1020060032083A KR20060032083A KR101118361B1 KR 101118361 B1 KR101118361 B1 KR 101118361B1 KR 1020060032083 A KR1020060032083 A KR 1020060032083A KR 20060032083 A KR20060032083 A KR 20060032083A KR 101118361 B1 KR101118361 B1 KR 101118361B1
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KR
South Korea
Prior art keywords
conductive paste
powder
circuit board
multilayer circuit
wiring pattern
Prior art date
Application number
KR1020060032083A
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English (en)
Korean (ko)
Other versions
KR20070079548A (ko
Inventor
마사토시 수에히로
히로시 오치
노부오 오치아이
키미히토 니시카와
히로마사 미요시
Original Assignee
교토 에렉스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 교토 에렉스 가부시키가이샤 filed Critical 교토 에렉스 가부시키가이샤
Publication of KR20070079548A publication Critical patent/KR20070079548A/ko
Application granted granted Critical
Publication of KR101118361B1 publication Critical patent/KR101118361B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020060032083A 2006-02-02 2006-04-07 도전성 페이스트 및 그 도전성 페이스트를 이용한 세라믹 다층회로기판 제조방법 KR101118361B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00025826 2006-02-02
JP2006025826A JP4819516B2 (ja) 2006-02-02 2006-02-02 導電性ペースト及びその導電性ペーストを用いたセラミック多層回路基板

Publications (2)

Publication Number Publication Date
KR20070079548A KR20070079548A (ko) 2007-08-07
KR101118361B1 true KR101118361B1 (ko) 2012-03-09

Family

ID=38486870

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060032083A KR101118361B1 (ko) 2006-02-02 2006-04-07 도전성 페이스트 및 그 도전성 페이스트를 이용한 세라믹 다층회로기판 제조방법

Country Status (3)

Country Link
JP (1) JP4819516B2 (zh)
KR (1) KR101118361B1 (zh)
TW (1) TW200731293A (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100866577B1 (ko) * 2007-09-28 2008-11-03 삼성전기주식회사 인쇄회로기판의 층간 도통방법
US8968608B2 (en) 2008-01-17 2015-03-03 Nichia Corporation Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device
JP5313526B2 (ja) * 2008-03-17 2013-10-09 京都エレックス株式会社 低温焼成多層基板用導電性ペースト
KR100946589B1 (ko) * 2008-04-03 2010-03-09 엘지이노텍 주식회사 반도체 소자 제조용 접착 페이스트 조성물
JP5814204B2 (ja) * 2012-09-10 2015-11-17 京都エレックス株式会社 Ｌｅｄ用セラミックパッケージ用ペースト
JP5849036B2 (ja) * 2012-09-27 2016-01-27 富士フイルム株式会社 導電ペースト、プリント配線基板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001307549A (ja) 2000-04-21 2001-11-02 Furuya Kinzoku:Kk 銀ペースト及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0613756A (ja) * 1992-06-25 1994-01-21 Matsushita Electric Ind Co Ltd 導体ペースト組成物
JP3757211B2 (ja) * 2003-03-14 2006-03-22 富士通株式会社 配線基板及びその製造方法
JP2005293851A (ja) * 2004-03-10 2005-10-20 Toyobo Co Ltd 導電性ペースト
JP2005267900A (ja) * 2004-03-16 2005-09-29 Sumitomo Osaka Cement Co Ltd 導電性ペースト及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001307549A (ja) 2000-04-21 2001-11-02 Furuya Kinzoku:Kk 銀ペースト及びその製造方法

Also Published As

Publication number Publication date
TW200731293A (en) 2007-08-16
JP4819516B2 (ja) 2011-11-24
KR20070079548A (ko) 2007-08-07
TWI322995B (zh) 2010-04-01
JP2007207604A (ja) 2007-08-16

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