KR101108767B1 - 다관절 로봇 및 배선 방법 - Google Patents
다관절 로봇 및 배선 방법 Download PDFInfo
- Publication number
- KR101108767B1 KR101108767B1 KR1020087023056A KR20087023056A KR101108767B1 KR 101108767 B1 KR101108767 B1 KR 101108767B1 KR 1020087023056 A KR1020087023056 A KR 1020087023056A KR 20087023056 A KR20087023056 A KR 20087023056A KR 101108767 B1 KR101108767 B1 KR 101108767B1
- Authority
- KR
- South Korea
- Prior art keywords
- joint
- cable
- arm
- core cable
- connection hole
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/0025—Means for supplying energy to the end effector
- B25J19/0029—Means for supplying energy to the end effector arranged within the different robot elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2006-00190823 | 2006-07-11 | ||
JP2006190823 | 2006-07-11 | ||
PCT/JP2007/062156 WO2008007517A1 (fr) | 2006-07-11 | 2007-06-15 | Robot à articulations multiples et procédé de câblage |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080102223A KR20080102223A (ko) | 2008-11-24 |
KR101108767B1 true KR101108767B1 (ko) | 2012-03-13 |
Family
ID=38923082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020087023056A KR101108767B1 (ko) | 2006-07-11 | 2007-06-15 | 다관절 로봇 및 배선 방법 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4911371B2 (zh) |
KR (1) | KR101108767B1 (zh) |
CN (1) | CN101484281B (zh) |
TW (1) | TW200817150A (zh) |
WO (1) | WO2008007517A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008007516A1 (fr) * | 2006-07-11 | 2008-01-17 | Kabushiki Kaisha Yaskawa Denki | Robot à articulations multiples |
JP2010064219A (ja) * | 2008-09-12 | 2010-03-25 | Yaskawa Electric Corp | 多関節ロボット |
JP5263945B2 (ja) * | 2008-09-17 | 2013-08-14 | 株式会社レクザム | ダブルアーム型ロボット |
EP2872301B1 (en) * | 2012-07-13 | 2017-01-11 | ABB Schweiz AG | Structure used for robot |
CN103802131A (zh) * | 2012-11-08 | 2014-05-21 | 沈阳新松机器人自动化股份有限公司 | 堆垛机手臂结构及其走线布置方法 |
JP6108859B2 (ja) * | 2013-02-13 | 2017-04-05 | 日本電産サンキョー株式会社 | 産業用ロボット |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5639890A (en) * | 1979-09-04 | 1981-04-15 | Meidensha Electric Mfg Co Ltd | Joint in manipulator*etc* |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6258188A (ja) * | 1985-09-09 | 1987-03-13 | Rhythm Watch Co Ltd | アナログデジタル表示時計のアナログ指針退避装置 |
JPS6258188U (zh) * | 1985-09-27 | 1987-04-10 | ||
JP2559807B2 (ja) * | 1988-06-01 | 1996-12-04 | ファナック株式会社 | 産業用ロボットの関節部におけるケーブル処理装置 |
JPH04269193A (ja) * | 1991-02-19 | 1992-09-25 | Canon Inc | 産業用ロボツト |
JP4269193B2 (ja) * | 1997-05-26 | 2009-05-27 | 株式会社大一商会 | パチンコ機 |
JP3973006B2 (ja) * | 2000-03-23 | 2007-09-05 | 日本電産サンキョー株式会社 | ダブルアーム型ロボット |
JP2002079487A (ja) * | 2000-09-05 | 2002-03-19 | Nachi Fujikoshi Corp | 産業用ロボットの手首装置 |
JP2007015053A (ja) * | 2005-07-07 | 2007-01-25 | Fanuc Ltd | 産業用ロボット |
-
2007
- 2007-06-15 WO PCT/JP2007/062156 patent/WO2008007517A1/ja active Application Filing
- 2007-06-15 CN CN2007800255988A patent/CN101484281B/zh not_active Expired - Fee Related
- 2007-06-15 JP JP2008524741A patent/JP4911371B2/ja not_active Expired - Fee Related
- 2007-06-15 KR KR1020087023056A patent/KR101108767B1/ko not_active IP Right Cessation
- 2007-07-05 TW TW96124500A patent/TW200817150A/zh not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5639890A (en) * | 1979-09-04 | 1981-04-15 | Meidensha Electric Mfg Co Ltd | Joint in manipulator*etc* |
Also Published As
Publication number | Publication date |
---|---|
TWI329558B (zh) | 2010-09-01 |
JP4911371B2 (ja) | 2012-04-04 |
TW200817150A (en) | 2008-04-16 |
CN101484281B (zh) | 2011-10-26 |
WO2008007517A1 (fr) | 2008-01-17 |
KR20080102223A (ko) | 2008-11-24 |
CN101484281A (zh) | 2009-07-15 |
JPWO2008007517A1 (ja) | 2009-12-10 |
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E902 | Notification of reason for refusal | ||
E90F | Notification of reason for final refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20150116 Year of fee payment: 4 |
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LAPS | Lapse due to unpaid annual fee |