KR101106921B1 - 감광성 페이스트 조성물 및 패턴 형성 방법 - Google Patents

감광성 페이스트 조성물 및 패턴 형성 방법 Download PDF

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KR101106921B1
KR101106921B1 KR1020080065947A KR20080065947A KR101106921B1 KR 101106921 B1 KR101106921 B1 KR 101106921B1 KR 1020080065947 A KR1020080065947 A KR 1020080065947A KR 20080065947 A KR20080065947 A KR 20080065947A KR 101106921 B1 KR101106921 B1 KR 101106921B1
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KR
South Korea
Prior art keywords
photosensitive paste
paste composition
pattern
acid
meth
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KR1020080065947A
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English (en)
Korean (ko)
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KR20090005990A (ko
Inventor
가즈나리 구도우
고우지 이따노
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제이에스알 가부시끼가이샤
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Publication of KR20090005990A publication Critical patent/KR20090005990A/ko
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Publication of KR101106921B1 publication Critical patent/KR101106921B1/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
KR1020080065947A 2007-07-09 2008-07-08 감광성 페이스트 조성물 및 패턴 형성 방법 KR101106921B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00179179 2007-07-09
JP2007179179 2007-07-09

Publications (2)

Publication Number Publication Date
KR20090005990A KR20090005990A (ko) 2009-01-14
KR101106921B1 true KR101106921B1 (ko) 2012-01-25

Family

ID=40307395

Family Applications (1)

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KR1020080065947A KR101106921B1 (ko) 2007-07-09 2008-07-08 감광성 페이스트 조성물 및 패턴 형성 방법

Country Status (3)

Country Link
JP (2) JP4640460B2 (nl)
KR (1) KR101106921B1 (nl)
CN (1) CN101354533B (nl)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5120119B2 (ja) * 2008-07-10 2013-01-16 Ｊｓｒ株式会社 感光性ペースト組成物およびパターン形成方法
JP5120120B2 (ja) * 2008-07-15 2013-01-16 Ｊｓｒ株式会社 感光性ペースト組成物およびパターン形成方法
JP2010102200A (ja) * 2008-10-24 2010-05-06 Jsr Corp 感光性ペースト組成物およびパターン形成方法
KR101138795B1 (ko) * 2008-12-23 2012-04-24 제일모직주식회사 감광성 페이스트 조성물 이를 이용하여 제조한 플라즈마 디스플레이 전극
JP5287397B2 (ja) * 2009-03-18 2013-09-11 Ｊｓｒ株式会社 アルミニウム含有感光性樹脂組成物およびパターン形成方法
JP5347665B2 (ja) * 2009-04-07 2013-11-20 Ｊｓｒ株式会社 アルミニウム含有感光性組成物および電極の製造方法
JP2011007864A (ja) * 2009-06-23 2011-01-13 Jsr Corp 感光性ペースト組成物およびパターン形成方法
CN103295659B (zh) * 2012-02-24 2016-03-30 比亚迪股份有限公司 太阳能电池用导电浆料及其制备方法
JP5884556B2 (ja) * 2012-03-02 2016-03-15 東レ株式会社 感光性導電ペースト
WO2013165223A1 (ko) * 2012-05-03 2013-11-07 주식회사 엘지화학 태양전지 제조에서 이용 가능한 잉크 조성물 및 이를 이용한 패턴형성방법
KR101431485B1 (ko) * 2012-05-03 2014-08-26 주식회사 엘지화학 태양전지 제조에서 이용 가능한 잉크 조성물 및 이를 이용한 패턴형성방법
KR101765707B1 (ko) 2012-06-15 2017-08-07 가부시키가이샤 무라타 세이사쿠쇼 도전성 페이스트, 그리고 적층 세라믹 전자부품 및 그 제조방법
CN113196170A (zh) * 2018-10-03 2021-07-30 艾曲迪微系统股份有限公司 感光性树脂组合物、图案固化物的制造方法、固化物、层间绝缘膜、覆盖涂层、表面保护膜及电子部件
JP7238316B2 (ja) * 2018-10-03 2023-03-14 Ｈｄマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10269848A (ja) * 1997-03-26 1998-10-09 Taiyo Ink Mfg Ltd アルカリ現像型光硬化性導電性ペースト組成物及びそれを用いて電極形成したプラズマディスプレイパネル
JP2006086123A (ja) * 2004-09-09 2006-03-30 Samsung Sdi Co Ltd 感光性ペースト組成物，感光性ペースト組成物を用いた電極およびグリーンシート
JP2006126354A (ja) * 2004-10-27 2006-05-18 Sumitomo Bakelite Co Ltd 感光性樹脂組成物及びパターン形成樹脂層の製造方法、並びに該感光性樹脂組成物を含む半導体装置及び表示素子
JP2006219660A (ja) * 2005-01-11 2006-08-24 Jsr Corp 無機粉体含有樹脂組成物、転写フィルムおよびプラズマディスプレイパネルの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4253306B2 (ja) * 2005-03-01 2009-04-08 太陽インキ製造株式会社 感光性ペースト及びそれを用いて形成した焼成物パターン

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10269848A (ja) * 1997-03-26 1998-10-09 Taiyo Ink Mfg Ltd アルカリ現像型光硬化性導電性ペースト組成物及びそれを用いて電極形成したプラズマディスプレイパネル
JP2006086123A (ja) * 2004-09-09 2006-03-30 Samsung Sdi Co Ltd 感光性ペースト組成物，感光性ペースト組成物を用いた電極およびグリーンシート
JP2006126354A (ja) * 2004-10-27 2006-05-18 Sumitomo Bakelite Co Ltd 感光性樹脂組成物及びパターン形成樹脂層の製造方法、並びに該感光性樹脂組成物を含む半導体装置及び表示素子
JP2006219660A (ja) * 2005-01-11 2006-08-24 Jsr Corp 無機粉体含有樹脂組成物、転写フィルムおよびプラズマディスプレイパネルの製造方法

Also Published As

Publication number Publication date
KR20090005990A (ko) 2009-01-14
CN101354533A (zh) 2009-01-28
JP4645774B1 (ja) 2011-03-09
JP4640460B2 (ja) 2011-03-02
JP2009037232A (ja) 2009-02-19
JP2011065166A (ja) 2011-03-31
CN101354533B (zh) 2012-10-10

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