KR101092510B1 - 진공처리장치 - Google Patents

진공처리장치 Download PDF

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Publication number
KR101092510B1
KR101092510B1 KR1020080080620A KR20080080620A KR101092510B1 KR 101092510 B1 KR101092510 B1 KR 101092510B1 KR 1020080080620 A KR1020080080620 A KR 1020080080620A KR 20080080620 A KR20080080620 A KR 20080080620A KR 101092510 B1 KR101092510 B1 KR 101092510B1
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KR
South Korea
Prior art keywords
vacuum
sample
processing
vacuum processing
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020080080620A
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English (en)
Korean (ko)
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KR20100002018A (ko
Inventor
마사카즈 이소자키
아키타카 마키노
신고 기무라
미노루 야토미
Original Assignee
가부시키가이샤 히다치 하이테크놀로지즈
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 가부시키가이샤 히다치 하이테크놀로지즈 filed Critical 가부시키가이샤 히다치 하이테크놀로지즈
Publication of KR20100002018A publication Critical patent/KR20100002018A/ko
Application granted granted Critical
Publication of KR101092510B1 publication Critical patent/KR101092510B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020080080620A 2008-06-27 2008-08-18 진공처리장치 Active KR101092510B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-00168053 2008-06-27
JP2008168053A JP5097627B2 (ja) 2008-06-27 2008-06-27 真空処理装置

Publications (2)

Publication Number Publication Date
KR20100002018A KR20100002018A (ko) 2010-01-06
KR101092510B1 true KR101092510B1 (ko) 2011-12-13

Family

ID=41447675

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080080620A Active KR101092510B1 (ko) 2008-06-27 2008-08-18 진공처리장치

Country Status (3)

Country Link
US (1) US8100620B2 (https=)
JP (1) JP5097627B2 (https=)
KR (1) KR101092510B1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120062681A (ko) 2003-11-27 2012-06-14 가부시키가이샤 시세이도 부전각화 억제제 및 피부 외용 조성물
US20110269314A1 (en) * 2010-04-30 2011-11-03 Applied Materials, Inc. Process chambers having shared resources and methods of use thereof
KR102497795B1 (ko) * 2016-07-04 2023-02-09 세메스 주식회사 기판 처리 장치
US11107713B2 (en) * 2019-05-29 2021-08-31 Taiwan Semiconductor Manufacturing Company Ltd. Conveying system and method for operating the same
WO2021122654A1 (en) 2019-12-18 2021-06-24 Brooks Automation (Germany) Gmbh Core module for semiconductor production facility machinery
US12288701B2 (en) * 2022-02-28 2025-04-29 Syskey Technology Co., Ltd. Multi-chamber semiconductor manufacturing system

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4852516A (en) * 1986-05-19 1989-08-01 Machine Technology, Inc. Modular processing apparatus for processing semiconductor wafers
US6312525B1 (en) * 1997-07-11 2001-11-06 Applied Materials, Inc. Modular architecture for semiconductor wafer fabrication equipment
TW442891B (en) * 1998-11-17 2001-06-23 Tokyo Electron Ltd Vacuum processing system
US7032614B2 (en) * 2000-11-03 2006-04-25 Applied Materials, Inc. Facilities connection box for pre-facilitation of wafer fabrication equipment
JP2004006665A (ja) * 2002-02-20 2004-01-08 Tokyo Electron Ltd 真空処理装置
SG115630A1 (en) * 2003-03-11 2005-10-28 Asml Netherlands Bv Temperature conditioned load lock, lithographic apparatus comprising such a load lock and method of manufacturing a substrate with such a load lock
JP4522795B2 (ja) * 2003-09-04 2010-08-11 株式会社日立ハイテクノロジーズ 真空処理装置
JP4426343B2 (ja) * 2004-03-08 2010-03-03 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP4961893B2 (ja) * 2006-08-23 2012-06-27 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法

Also Published As

Publication number Publication date
US8100620B2 (en) 2012-01-24
JP5097627B2 (ja) 2012-12-12
US20090324367A1 (en) 2009-12-31
KR20100002018A (ko) 2010-01-06
JP2010010398A (ja) 2010-01-14

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