JP5097627B2 - 真空処理装置 - Google Patents

真空処理装置 Download PDF

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Publication number
JP5097627B2
JP5097627B2 JP2008168053A JP2008168053A JP5097627B2 JP 5097627 B2 JP5097627 B2 JP 5097627B2 JP 2008168053 A JP2008168053 A JP 2008168053A JP 2008168053 A JP2008168053 A JP 2008168053A JP 5097627 B2 JP5097627 B2 JP 5097627B2
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JP
Japan
Prior art keywords
vacuum
vacuum processing
processing
sample
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008168053A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010010398A5 (https=
JP2010010398A (ja
Inventor
真一 磯崎
昭孝 牧野
伸吾 木村
実 矢富
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Priority to JP2008168053A priority Critical patent/JP5097627B2/ja
Priority to KR1020080080620A priority patent/KR101092510B1/ko
Priority to US12/203,168 priority patent/US8100620B2/en
Publication of JP2010010398A publication Critical patent/JP2010010398A/ja
Publication of JP2010010398A5 publication Critical patent/JP2010010398A5/ja
Application granted granted Critical
Publication of JP5097627B2 publication Critical patent/JP5097627B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2008168053A 2008-06-27 2008-06-27 真空処理装置 Active JP5097627B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008168053A JP5097627B2 (ja) 2008-06-27 2008-06-27 真空処理装置
KR1020080080620A KR101092510B1 (ko) 2008-06-27 2008-08-18 진공처리장치
US12/203,168 US8100620B2 (en) 2008-06-27 2008-09-03 Vacuum processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008168053A JP5097627B2 (ja) 2008-06-27 2008-06-27 真空処理装置

Publications (3)

Publication Number Publication Date
JP2010010398A JP2010010398A (ja) 2010-01-14
JP2010010398A5 JP2010010398A5 (https=) 2011-09-08
JP5097627B2 true JP5097627B2 (ja) 2012-12-12

Family

ID=41447675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008168053A Active JP5097627B2 (ja) 2008-06-27 2008-06-27 真空処理装置

Country Status (3)

Country Link
US (1) US8100620B2 (https=)
JP (1) JP5097627B2 (https=)
KR (1) KR101092510B1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8586638B2 (en) 2003-11-27 2013-11-19 Shiseido Company, Ltd Parakeratosis inhibitor and skin preparation for external use

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110269314A1 (en) * 2010-04-30 2011-11-03 Applied Materials, Inc. Process chambers having shared resources and methods of use thereof
KR102497795B1 (ko) * 2016-07-04 2023-02-09 세메스 주식회사 기판 처리 장치
US11107713B2 (en) * 2019-05-29 2021-08-31 Taiwan Semiconductor Manufacturing Company Ltd. Conveying system and method for operating the same
WO2021122654A1 (en) 2019-12-18 2021-06-24 Brooks Automation (Germany) Gmbh Core module for semiconductor production facility machinery
US12288701B2 (en) * 2022-02-28 2025-04-29 Syskey Technology Co., Ltd. Multi-chamber semiconductor manufacturing system

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4852516A (en) * 1986-05-19 1989-08-01 Machine Technology, Inc. Modular processing apparatus for processing semiconductor wafers
US6312525B1 (en) * 1997-07-11 2001-11-06 Applied Materials, Inc. Modular architecture for semiconductor wafer fabrication equipment
TW442891B (en) * 1998-11-17 2001-06-23 Tokyo Electron Ltd Vacuum processing system
US7032614B2 (en) * 2000-11-03 2006-04-25 Applied Materials, Inc. Facilities connection box for pre-facilitation of wafer fabrication equipment
JP2004006665A (ja) * 2002-02-20 2004-01-08 Tokyo Electron Ltd 真空処理装置
SG115630A1 (en) * 2003-03-11 2005-10-28 Asml Netherlands Bv Temperature conditioned load lock, lithographic apparatus comprising such a load lock and method of manufacturing a substrate with such a load lock
JP4522795B2 (ja) * 2003-09-04 2010-08-11 株式会社日立ハイテクノロジーズ 真空処理装置
JP4426343B2 (ja) * 2004-03-08 2010-03-03 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP4961893B2 (ja) * 2006-08-23 2012-06-27 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8586638B2 (en) 2003-11-27 2013-11-19 Shiseido Company, Ltd Parakeratosis inhibitor and skin preparation for external use

Also Published As

Publication number Publication date
US8100620B2 (en) 2012-01-24
KR101092510B1 (ko) 2011-12-13
US20090324367A1 (en) 2009-12-31
KR20100002018A (ko) 2010-01-06
JP2010010398A (ja) 2010-01-14

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