KR101088785B1 - 폴리싱장치 및 폴리싱방법 - Google Patents

폴리싱장치 및 폴리싱방법 Download PDF

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Publication number
KR101088785B1
KR101088785B1 KR1020077013603A KR20077013603A KR101088785B1 KR 101088785 B1 KR101088785 B1 KR 101088785B1 KR 1020077013603 A KR1020077013603 A KR 1020077013603A KR 20077013603 A KR20077013603 A KR 20077013603A KR 101088785 B1 KR101088785 B1 KR 101088785B1
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KR
South Korea
Prior art keywords
polishing
workpiece
liquid supply
polishing liquid
polishing surface
Prior art date
Application number
KR1020077013603A
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English (en)
Korean (ko)
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KR20070086291A (ko
Inventor
다츠야 고하마
이츠키 고바타
도시카즈 노무라
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication of KR20070086291A publication Critical patent/KR20070086291A/ko
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Publication of KR101088785B1 publication Critical patent/KR101088785B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020077013603A 2004-11-18 2005-11-15 폴리싱장치 및 폴리싱방법 KR101088785B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00334548 2004-11-18
JP2004334548A JP2006147773A (ja) 2004-11-18 2004-11-18 研磨装置および研磨方法
PCT/JP2005/021314 WO2006054732A2 (en) 2004-11-18 2005-11-15 Polishing apparatus and polishing method

Publications (2)

Publication Number Publication Date
KR20070086291A KR20070086291A (ko) 2007-08-27
KR101088785B1 true KR101088785B1 (ko) 2011-12-01

Family

ID=35726381

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077013603A KR101088785B1 (ko) 2004-11-18 2005-11-15 폴리싱장치 및 폴리싱방법

Country Status (6)

Country Link
US (2) US20060105678A1 (zh)
EP (1) EP1830985A2 (zh)
JP (1) JP2006147773A (zh)
KR (1) KR101088785B1 (zh)
TW (1) TWI290507B (zh)
WO (1) WO2006054732A2 (zh)

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KR20160003905A (ko) * 2014-07-01 2016-01-12 주식회사 케이씨텍 화학 기계적 연마 장치 및 그 방법
US11676824B2 (en) 2018-12-10 2023-06-13 Samsung Electronics Co., Ltd. Chemical mechanical polishing apparatus for controlling polishing uniformity

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US7520796B2 (en) * 2007-01-31 2009-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to reduce slurry consumption
US8047899B2 (en) * 2007-07-26 2011-11-01 Macronix International Co., Ltd. Pad and method for chemical mechanical polishing
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US8360817B2 (en) * 2009-04-01 2013-01-29 Ebara Corporation Polishing apparatus and polishing method
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US10065288B2 (en) * 2012-02-14 2018-09-04 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing (CMP) platform for local profile control
US20140080229A1 (en) * 2012-09-14 2014-03-20 Stmicroelectronics, Inc. Adaptive semiconductor processing using feedback from measurement devices
JP5890768B2 (ja) * 2012-11-19 2016-03-22 株式会社東京精密 半導体ウエハ加工装置
JP5890767B2 (ja) * 2012-11-19 2016-03-22 株式会社東京精密 半導体ウエハの厚み測定方法及び半導体ウエハ加工装置
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TWI517935B (zh) 2013-04-16 2016-01-21 國立台灣科技大學 氣體添加硏磨液的供應系統及其方法
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JP6970601B2 (ja) * 2017-12-06 2021-11-24 株式会社荏原製作所 半導体製造装置の設計方法
JP7083722B2 (ja) * 2018-08-06 2022-06-13 株式会社荏原製作所 研磨装置、及び、研磨方法
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JP7145098B2 (ja) 2019-02-21 2022-09-30 株式会社荏原製作所 研磨装置、研磨方法、および研磨液供給位置決定プログラムを記録した記録媒体
US11819976B2 (en) * 2021-06-25 2023-11-21 Applied Materials, Inc. Spray system for slurry reduction during chemical mechanical polishing (cmp)
JP2023009482A (ja) 2021-07-07 2023-01-20 株式会社荏原製作所 研磨装置および研磨方法
CN115229646B (zh) * 2022-07-05 2023-11-10 肇庆宏旺金属实业有限公司 一种用于硅钢片加工的抛光装置及其使用方法

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Cited By (3)

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Publication number Priority date Publication date Assignee Title
KR20160003905A (ko) * 2014-07-01 2016-01-12 주식회사 케이씨텍 화학 기계적 연마 장치 및 그 방법
KR101637537B1 (ko) 2014-07-01 2016-07-08 주식회사 케이씨텍 화학 기계적 연마 장치 및 그 방법
US11676824B2 (en) 2018-12-10 2023-06-13 Samsung Electronics Co., Ltd. Chemical mechanical polishing apparatus for controlling polishing uniformity

Also Published As

Publication number Publication date
EP1830985A2 (en) 2007-09-12
TWI290507B (en) 2007-12-01
WO2006054732A3 (en) 2006-08-03
TW200624224A (en) 2006-07-16
KR20070086291A (ko) 2007-08-27
WO2006054732A2 (en) 2006-05-26
US20060105678A1 (en) 2006-05-18
US20090142990A1 (en) 2009-06-04
JP2006147773A (ja) 2006-06-08

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