KR101088665B1 - 기판 반송 장치 - Google Patents

기판 반송 장치 Download PDF

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Publication number
KR101088665B1
KR101088665B1 KR1020050009809A KR20050009809A KR101088665B1 KR 101088665 B1 KR101088665 B1 KR 101088665B1 KR 1020050009809 A KR1020050009809 A KR 1020050009809A KR 20050009809 A KR20050009809 A KR 20050009809A KR 101088665 B1 KR101088665 B1 KR 101088665B1
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KR
South Korea
Prior art keywords
magnet
substrate
carrier
board
conveying
Prior art date
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Expired - Fee Related
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KR1020050009809A
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English (en)
Korean (ko)
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KR20060041618A (ko
Inventor
유지 가지와라
나오유키 오카모토
Original Assignee
캐논 아네르바 가부시키가이샤
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Publication of KR20060041618A publication Critical patent/KR20060041618A/ko
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Publication of KR101088665B1 publication Critical patent/KR101088665B1/ko
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    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/04—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members
    • E04F15/041—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members with a top layer of wood in combination with a lower layer of other material
    • E04F15/043—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members with a top layer of wood in combination with a lower layer of other material the lower layer being of organic plastic with or without reinforcements or filling materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/02—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board the layer being formed of fibres, chips, or particles, e.g. MDF, HDF, OSB, chipboard, particle board, hardboard
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
    • E04F15/102—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials of fibrous or chipped materials, e.g. bonded with synthetic resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Framework For Endless Conveyors (AREA)
  • Non-Mechanical Conveyors (AREA)
KR1020050009809A 2004-03-31 2005-02-03 기판 반송 장치 Expired - Fee Related KR101088665B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004105072A JP4471708B2 (ja) 2004-03-31 2004-03-31 基板搬送装置
JPJP-P-2004-00105072 2004-03-31

Publications (2)

Publication Number Publication Date
KR20060041618A KR20060041618A (ko) 2006-05-12
KR101088665B1 true KR101088665B1 (ko) 2011-12-01

Family

ID=35049218

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050009809A Expired - Fee Related KR101088665B1 (ko) 2004-03-31 2005-02-03 기판 반송 장치

Country Status (4)

Country Link
JP (1) JP4471708B2 (enExample)
KR (1) KR101088665B1 (enExample)
CN (1) CN1676445B (enExample)
TW (1) TWI334401B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE514802T1 (de) * 2006-03-29 2011-07-15 Applied Materials Gmbh & Co Kg Vakuumtransportvorrichtung mit beweglicher führungsschiene
JP2007269071A (ja) * 2006-03-30 2007-10-18 Asyst Shinko Inc 無人搬送装置
KR101409524B1 (ko) * 2007-05-28 2014-06-20 엘지디스플레이 주식회사 기판 이송 장치
KR101288599B1 (ko) * 2007-05-29 2013-07-22 엘지디스플레이 주식회사 기판 이송 장치
JP4505002B2 (ja) * 2007-08-27 2010-07-14 キヤノンアネルバ株式会社 搬送装置
US7770714B2 (en) 2007-08-27 2010-08-10 Canon Anelva Corporation Transfer apparatus
DE102008015982B3 (de) 2008-03-27 2009-07-30 Grenzebach Maschinenbau Gmbh Verfahren und Vorrichtung zur Fixierung und den Weitertransport stoßempfindlicher Platten in Sputter-Beschichtungsanlagen, Computerprogramm zur Durchführung des Verfahrens und maschinenlesbarer Träger hierzu
US8226795B2 (en) * 2009-02-03 2012-07-24 Nordson Corporation Magnetic clips and substrate holders for use in a plasma processing system
WO2011007753A1 (ja) 2009-07-14 2011-01-20 キヤノンアネルバ株式会社 基板処理装置
CN101989005B (zh) * 2009-07-30 2013-08-14 北京京东方光电科技有限公司 结构基板、传送装置和对盒装置
JP4745447B2 (ja) * 2010-02-04 2011-08-10 キヤノンアネルバ株式会社 基板搬送装置及び真空処理装置
JP5731838B2 (ja) * 2010-02-10 2015-06-10 キヤノンアネルバ株式会社 トレイ式基板搬送システム、成膜方法及び電子装置の製造方法
CN102190156B (zh) * 2010-02-10 2014-06-25 佳能安内华股份有限公司 托盘式基板输送系统、成膜方法和电子装置的制造方法
WO2011137373A2 (en) * 2010-04-30 2011-11-03 Applied Materials, Inc. Vertical inline cvd system
CN101954625A (zh) * 2010-10-21 2011-01-26 湖南玉丰真空科学技术有限公司 一种工件夹具
TWI476139B (zh) * 2011-06-30 2015-03-11 Sfa Engineering Corp 用於傳送基板的裝置
JP2013021036A (ja) * 2011-07-08 2013-01-31 Canon Anelva Corp 搬送装置
KR101319785B1 (ko) * 2013-03-18 2013-10-18 주식회사 야스 정전기 부상을 이용한 기판이송장치
CN103420165B (zh) * 2013-08-06 2015-09-02 中国电子科技集团公司第四十八研究所 一种基片传输装置
JP6092349B2 (ja) * 2014-11-27 2017-03-08 アルバック コリア リミテッドＵｌｖａｃ Ｋｏｒｅａ，Ｌｔｄ． 基板搬送装置
KR20160063969A (ko) * 2014-11-27 2016-06-07 한국알박(주) 기판 이송 장치
DE102015004582B4 (de) * 2015-04-09 2017-02-09 Mecatronix Ag Vorrichtung zum Halten, Positionieren und Bewegen eines Objekts
CN104820306B (zh) * 2015-05-27 2018-01-26 京东方科技集团股份有限公司 一种基板的剥离方法及层叠结构、显示面板和显示装置
CN106044243B (zh) * 2016-07-08 2019-06-04 佛山格尼斯磁悬浮技术有限公司 面板立式输送装置
KR102111722B1 (ko) * 2017-03-17 2020-05-15 어플라이드 머티어리얼스, 인코포레이티드 기판의 진공 프로세싱을 위한 장치, 기판의 진공 프로세싱을 위한 시스템, 및 진공 챔버 내에서의 기판 캐리어 및 마스크 캐리어의 이송을 위한 방법
CN108519693B (zh) * 2018-04-16 2021-10-29 京东方科技集团股份有限公司 一种基板对位装置、基板及基板对位方法
KR102090645B1 (ko) * 2018-08-27 2020-03-18 엘지전자 주식회사 반송 장치
JP7242414B2 (ja) * 2019-05-08 2023-03-20 株式会社アルバック 真空搬送装置及び成膜装置
CN110453200B (zh) * 2019-08-16 2024-12-24 星弧涂层新材料科技（苏州）股份有限公司 片材纵置运输小车及气相沉积设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07312387A (ja) * 1994-05-16 1995-11-28 Eiko Eng:Kk 真空系内基板搬送装置
JPH10120171A (ja) * 1996-10-15 1998-05-12 Balzers Ag 真空処理システム内で基板を搬送するための装置
JP2000177842A (ja) * 1998-12-10 2000-06-27 Mitsubishi Heavy Ind Ltd 搬送装置及び真空処理システム
JP2001118907A (ja) * 1999-10-22 2001-04-27 Mitsubishi Heavy Ind Ltd トレイレス斜め基板搬送装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4036339C2 (de) * 1990-11-15 1993-10-21 Leybold Ag Vorrichtung für den Transport von Substraten
AU6016498A (en) * 1997-09-30 1999-04-23 Semitool, Inc. Semiconductor processing apparatus having linear conveyor system
US6206176B1 (en) * 1998-05-20 2001-03-27 Applied Komatsu Technology, Inc. Substrate transfer shuttle having a magnetic drive

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07312387A (ja) * 1994-05-16 1995-11-28 Eiko Eng:Kk 真空系内基板搬送装置
JPH10120171A (ja) * 1996-10-15 1998-05-12 Balzers Ag 真空処理システム内で基板を搬送するための装置
JP2000177842A (ja) * 1998-12-10 2000-06-27 Mitsubishi Heavy Ind Ltd 搬送装置及び真空処理システム
JP2001118907A (ja) * 1999-10-22 2001-04-27 Mitsubishi Heavy Ind Ltd トレイレス斜め基板搬送装置

Also Published As

Publication number Publication date
CN1676445B (zh) 2011-06-08
JP2005289556A (ja) 2005-10-20
TW200533582A (en) 2005-10-16
JP4471708B2 (ja) 2010-06-02
CN1676445A (zh) 2005-10-05
KR20060041618A (ko) 2006-05-12
TWI334401B (en) 2010-12-11

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