JP4471708B2 - 基板搬送装置 - Google Patents

基板搬送装置 Download PDF

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Publication number
JP4471708B2
JP4471708B2 JP2004105072A JP2004105072A JP4471708B2 JP 4471708 B2 JP4471708 B2 JP 4471708B2 JP 2004105072 A JP2004105072 A JP 2004105072A JP 2004105072 A JP2004105072 A JP 2004105072A JP 4471708 B2 JP4471708 B2 JP 4471708B2
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JP
Japan
Prior art keywords
substrate
magnet
carrier
transport
tray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004105072A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005289556A (ja
JP2005289556A5 (enExample
Inventor
梶原雄二
岡本直之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Canon Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Anelva Corp filed Critical Canon Anelva Corp
Priority to JP2004105072A priority Critical patent/JP4471708B2/ja
Priority to TW094102869A priority patent/TWI334401B/zh
Priority to KR1020050009809A priority patent/KR101088665B1/ko
Priority to CN2005100598529A priority patent/CN1676445B/zh
Publication of JP2005289556A publication Critical patent/JP2005289556A/ja
Publication of JP2005289556A5 publication Critical patent/JP2005289556A5/ja
Application granted granted Critical
Publication of JP4471708B2 publication Critical patent/JP4471708B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/04—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members
    • E04F15/041—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members with a top layer of wood in combination with a lower layer of other material
    • E04F15/043—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members with a top layer of wood in combination with a lower layer of other material the lower layer being of organic plastic with or without reinforcements or filling materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/02—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board the layer being formed of fibres, chips, or particles, e.g. MDF, HDF, OSB, chipboard, particle board, hardboard
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
    • E04F15/102—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials of fibrous or chipped materials, e.g. bonded with synthetic resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Framework For Endless Conveyors (AREA)
  • Non-Mechanical Conveyors (AREA)
JP2004105072A 2004-03-31 2004-03-31 基板搬送装置 Expired - Fee Related JP4471708B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004105072A JP4471708B2 (ja) 2004-03-31 2004-03-31 基板搬送装置
TW094102869A TWI334401B (en) 2004-03-31 2005-01-31 Substrate transport apparatus
KR1020050009809A KR101088665B1 (ko) 2004-03-31 2005-02-03 기판 반송 장치
CN2005100598529A CN1676445B (zh) 2004-03-31 2005-03-31 基板搬送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004105072A JP4471708B2 (ja) 2004-03-31 2004-03-31 基板搬送装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010022829A Division JP4745447B2 (ja) 2010-02-04 2010-02-04 基板搬送装置及び真空処理装置

Publications (3)

Publication Number Publication Date
JP2005289556A JP2005289556A (ja) 2005-10-20
JP2005289556A5 JP2005289556A5 (enExample) 2007-04-26
JP4471708B2 true JP4471708B2 (ja) 2010-06-02

Family

ID=35049218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004105072A Expired - Fee Related JP4471708B2 (ja) 2004-03-31 2004-03-31 基板搬送装置

Country Status (4)

Country Link
JP (1) JP4471708B2 (enExample)
KR (1) KR101088665B1 (enExample)
CN (1) CN1676445B (enExample)
TW (1) TWI334401B (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE514802T1 (de) * 2006-03-29 2011-07-15 Applied Materials Gmbh & Co Kg Vakuumtransportvorrichtung mit beweglicher führungsschiene
JP2007269071A (ja) * 2006-03-30 2007-10-18 Asyst Shinko Inc 無人搬送装置
KR101409524B1 (ko) * 2007-05-28 2014-06-20 엘지디스플레이 주식회사 기판 이송 장치
KR101288599B1 (ko) * 2007-05-29 2013-07-22 엘지디스플레이 주식회사 기판 이송 장치
JP4505002B2 (ja) * 2007-08-27 2010-07-14 キヤノンアネルバ株式会社 搬送装置
US7770714B2 (en) 2007-08-27 2010-08-10 Canon Anelva Corporation Transfer apparatus
DE102008015982B3 (de) 2008-03-27 2009-07-30 Grenzebach Maschinenbau Gmbh Verfahren und Vorrichtung zur Fixierung und den Weitertransport stoßempfindlicher Platten in Sputter-Beschichtungsanlagen, Computerprogramm zur Durchführung des Verfahrens und maschinenlesbarer Träger hierzu
US8226795B2 (en) * 2009-02-03 2012-07-24 Nordson Corporation Magnetic clips and substrate holders for use in a plasma processing system
WO2011007753A1 (ja) 2009-07-14 2011-01-20 キヤノンアネルバ株式会社 基板処理装置
CN101989005B (zh) * 2009-07-30 2013-08-14 北京京东方光电科技有限公司 结构基板、传送装置和对盒装置
JP4745447B2 (ja) * 2010-02-04 2011-08-10 キヤノンアネルバ株式会社 基板搬送装置及び真空処理装置
JP5731838B2 (ja) * 2010-02-10 2015-06-10 キヤノンアネルバ株式会社 トレイ式基板搬送システム、成膜方法及び電子装置の製造方法
CN102190156B (zh) * 2010-02-10 2014-06-25 佳能安内华股份有限公司 托盘式基板输送系统、成膜方法和电子装置的制造方法
WO2011137373A2 (en) * 2010-04-30 2011-11-03 Applied Materials, Inc. Vertical inline cvd system
CN101954625A (zh) * 2010-10-21 2011-01-26 湖南玉丰真空科学技术有限公司 一种工件夹具
TWI476139B (zh) * 2011-06-30 2015-03-11 Sfa Engineering Corp 用於傳送基板的裝置
JP2013021036A (ja) * 2011-07-08 2013-01-31 Canon Anelva Corp 搬送装置
KR101319785B1 (ko) * 2013-03-18 2013-10-18 주식회사 야스 정전기 부상을 이용한 기판이송장치
CN103420165B (zh) * 2013-08-06 2015-09-02 中国电子科技集团公司第四十八研究所 一种基片传输装置
JP6092349B2 (ja) * 2014-11-27 2017-03-08 アルバック コリア リミテッドＵｌｖａｃ Ｋｏｒｅａ，Ｌｔｄ． 基板搬送装置
KR20160063969A (ko) * 2014-11-27 2016-06-07 한국알박(주) 기판 이송 장치
DE102015004582B4 (de) * 2015-04-09 2017-02-09 Mecatronix Ag Vorrichtung zum Halten, Positionieren und Bewegen eines Objekts
CN104820306B (zh) * 2015-05-27 2018-01-26 京东方科技集团股份有限公司 一种基板的剥离方法及层叠结构、显示面板和显示装置
CN106044243B (zh) * 2016-07-08 2019-06-04 佛山格尼斯磁悬浮技术有限公司 面板立式输送装置
KR102111722B1 (ko) * 2017-03-17 2020-05-15 어플라이드 머티어리얼스, 인코포레이티드 기판의 진공 프로세싱을 위한 장치, 기판의 진공 프로세싱을 위한 시스템, 및 진공 챔버 내에서의 기판 캐리어 및 마스크 캐리어의 이송을 위한 방법
CN108519693B (zh) * 2018-04-16 2021-10-29 京东方科技集团股份有限公司 一种基板对位装置、基板及基板对位方法
KR102090645B1 (ko) * 2018-08-27 2020-03-18 엘지전자 주식회사 반송 장치
JP7242414B2 (ja) * 2019-05-08 2023-03-20 株式会社アルバック 真空搬送装置及び成膜装置
CN110453200B (zh) * 2019-08-16 2024-12-24 星弧涂层新材料科技（苏州）股份有限公司 片材纵置运输小车及气相沉积设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4036339C2 (de) * 1990-11-15 1993-10-21 Leybold Ag Vorrichtung für den Transport von Substraten
JP2687306B2 (ja) * 1994-05-16 1997-12-08 株式会社エイコー・エンジニアリング 真空系内基板搬送装置
CH691680A5 (de) * 1996-10-15 2001-09-14 Unaxis Deutschland Gmbh Transportvorrichtung für Werkstücke in einer Vakuumanlage.
AU6016498A (en) * 1997-09-30 1999-04-23 Semitool, Inc. Semiconductor processing apparatus having linear conveyor system
US6206176B1 (en) * 1998-05-20 2001-03-27 Applied Komatsu Technology, Inc. Substrate transfer shuttle having a magnetic drive
JP2000177842A (ja) * 1998-12-10 2000-06-27 Mitsubishi Heavy Ind Ltd 搬送装置及び真空処理システム
JP3842935B2 (ja) * 1999-10-22 2006-11-08 三菱重工業株式会社 トレイレス斜め基板搬送装置

Also Published As

Publication number Publication date
CN1676445B (zh) 2011-06-08
JP2005289556A (ja) 2005-10-20
TW200533582A (en) 2005-10-16
KR101088665B1 (ko) 2011-12-01
CN1676445A (zh) 2005-10-05
KR20060041618A (ko) 2006-05-12
TWI334401B (en) 2010-12-11

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