KR101070414B1 - 플라즈마처리장치 - Google Patents

플라즈마처리장치 Download PDF

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Publication number
KR101070414B1
KR101070414B1 KR1020090026756A KR20090026756A KR101070414B1 KR 101070414 B1 KR101070414 B1 KR 101070414B1 KR 1020090026756 A KR1020090026756 A KR 1020090026756A KR 20090026756 A KR20090026756 A KR 20090026756A KR 101070414 B1 KR101070414 B1 KR 101070414B1
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South Korea
Prior art keywords
processing chamber
plasma
exhaust
exhaust port
sample
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020090026756A
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English (en)
Korean (ko)
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KR20100098254A (ko
Inventor
료타 기타니
노부히데 누노무라
야스키요 모리오카
모토히코 요시가이
Original Assignee
가부시키가이샤 히다치 하이테크놀로지즈
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Publication of KR20100098254A publication Critical patent/KR20100098254A/ko
Application granted granted Critical
Publication of KR101070414B1 publication Critical patent/KR101070414B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32871—Means for trapping or directing unwanted particles

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020090026756A 2009-02-27 2009-03-30 플라즈마처리장치 Expired - Fee Related KR101070414B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009045046A JP5193904B2 (ja) 2009-02-27 2009-02-27 プラズマ処理装置
JPJP-P-2009-045046 2009-02-27

Publications (2)

Publication Number Publication Date
KR20100098254A KR20100098254A (ko) 2010-09-06
KR101070414B1 true KR101070414B1 (ko) 2011-10-06

Family

ID=42823859

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090026756A Expired - Fee Related KR101070414B1 (ko) 2009-02-27 2009-03-30 플라즈마처리장치

Country Status (2)

Country Link
JP (1) JP5193904B2 (enrdf_load_stackoverflow)
KR (1) KR101070414B1 (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5663259B2 (ja) * 2010-10-04 2015-02-04 株式会社日立ハイテクノロジーズ プラズマ処理装置
WO2014173778A2 (en) * 2013-04-24 2014-10-30 Oce-Technologies B.V. Method and apparatus for surface pre-treatment of ink-receiving substrates, printing method and printer
US20160118225A1 (en) * 2014-03-31 2016-04-28 Spp Technologies Co., Ltd. Plasma Processing Apparatus and Opening and Closing Mechanism used therein
KR101555208B1 (ko) 2014-03-31 2015-09-23 에스피피 테크놀로지스 컴퍼니 리미티드 플라즈마 처리 장치 및 이에 이용되는 개폐 기구
CN107078052B (zh) * 2014-09-30 2021-04-23 株式会社国际电气 衬底处理装置、半导体器件的制造方法及记录介质
JP7022982B2 (ja) * 2018-02-19 2022-02-21 サムコ株式会社 プラズマ処理室用排気構造
WO2021044622A1 (ja) 2019-09-06 2021-03-11 キヤノンアネルバ株式会社 ロードロック装置
JP7418285B2 (ja) * 2020-05-27 2024-01-19 東京エレクトロン株式会社 基板処理装置とその製造方法、及び排気構造

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000306844A (ja) 1999-04-19 2000-11-02 Canon Inc 処理装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007180467A (ja) * 2005-03-02 2007-07-12 Tokyo Electron Ltd 反射装置、連通管、排気ポンプ、排気システム、該システムの洗浄方法、記憶媒体、基板処理装置及びパーティクル捕捉部品
JP5250201B2 (ja) * 2006-12-07 2013-07-31 エドワーズ株式会社 真空ポンプ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000306844A (ja) 1999-04-19 2000-11-02 Canon Inc 処理装置

Also Published As

Publication number Publication date
JP5193904B2 (ja) 2013-05-08
JP2010199461A (ja) 2010-09-09
KR20100098254A (ko) 2010-09-06

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