KR101061278B1 - Ｃｏｆ 기판 - Google Patents

Ｃｏｆ 기판 Download PDF

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Publication number
KR101061278B1
KR101061278B1 KR1020090069256A KR20090069256A KR101061278B1 KR 101061278 B1 KR101061278 B1 KR 101061278B1 KR 1020090069256 A KR1020090069256 A KR 1020090069256A KR 20090069256 A KR20090069256 A KR 20090069256A KR 101061278 B1 KR101061278 B1 KR 101061278B1
Authority
KR
South Korea
Prior art keywords
substrate
cof
insulating film
heat dissipation
bending direction
Prior art date
Application number
KR1020090069256A
Other languages
English (en)
Korean (ko)
Other versions
KR20100023739A (ko
Inventor
요시히로 이누에
Original Assignee
스미토모 긴조쿠 고잔 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미토모 긴조쿠 고잔 가부시키가이샤 filed Critical 스미토모 긴조쿠 고잔 가부시키가이샤
Publication of KR20100023739A publication Critical patent/KR20100023739A/ko
Application granted granted Critical
Publication of KR101061278B1 publication Critical patent/KR101061278B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
KR1020090069256A 2008-08-22 2009-07-29 Ｃｏｆ 기판 KR101061278B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-213921 2008-08-22
JP2008213921A JP4605272B2 (ja) 2008-08-22 2008-08-22 Ｃｏｆ基板

Publications (2)

Publication Number Publication Date
KR20100023739A KR20100023739A (ko) 2010-03-04
KR101061278B1 true KR101061278B1 (ko) 2011-08-31

Family

ID=42067172

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090069256A KR101061278B1 (ko) 2008-08-22 2009-07-29 Ｃｏｆ 기판

Country Status (3)

Country Link
JP (1) JP4605272B2 (ja)
KR (1) KR101061278B1 (ja)
TW (1) TWI398937B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101979361B1 (ko) * 2012-10-25 2019-05-17 삼성디스플레이 주식회사 칩 온 필름 및 이를 포함하는 표시 장치
KR102059942B1 (ko) 2013-07-24 2019-12-30 삼성디스플레이 주식회사 유기 발광 표시 장치
KR102194822B1 (ko) 2014-01-16 2020-12-24 삼성디스플레이 주식회사 디스플레이 장치
JP6301738B2 (ja) * 2014-05-29 2018-03-28 京セラ株式会社 電子素子搭載用パッケージおよび電子装置
CN114845464A (zh) * 2022-05-20 2022-08-02 广州华星光电半导体显示技术有限公司 覆晶薄膜及其补偿方法、显示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006294929A (ja) 2005-04-12 2006-10-26 Fuji Photo Film Co Ltd フレキシブルプリント配線板、及び、カメラモジュール
KR100771890B1 (ko) 2006-07-20 2007-11-01 삼성전자주식회사 씨오에프(ｃｏｆ)형 반도체 패키지

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3329073B2 (ja) * 1993-06-04 2002-09-30 セイコーエプソン株式会社 半導体装置およびその製造方法
JP2002232086A (ja) * 2001-02-06 2002-08-16 Matsushita Electric Ind Co Ltd フレキシブル基板
JP3539401B2 (ja) * 2001-04-09 2004-07-07 セイコーエプソン株式会社 テープキャリア
JP5489394B2 (ja) * 2006-07-20 2014-05-14 三星電子株式会社 Ｃｏｆ型半導体パッケージ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006294929A (ja) 2005-04-12 2006-10-26 Fuji Photo Film Co Ltd フレキシブルプリント配線板、及び、カメラモジュール
KR100771890B1 (ko) 2006-07-20 2007-11-01 삼성전자주식회사 씨오에프(ｃｏｆ)형 반도체 패키지

Also Published As

Publication number Publication date
TWI398937B (zh) 2013-06-11
JP2010050330A (ja) 2010-03-04
KR20100023739A (ko) 2010-03-04
TW201023321A (en) 2010-06-16
JP4605272B2 (ja) 2011-01-05

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