TWI398937B - Flip chip substrate - Google Patents

Flip chip substrate Download PDF

Info

Publication number
TWI398937B
TWI398937B TW098122795A TW98122795A TWI398937B TW I398937 B TWI398937 B TW I398937B TW 098122795 A TW098122795 A TW 098122795A TW 98122795 A TW98122795 A TW 98122795A TW I398937 B TWI398937 B TW I398937B
Authority
TW
Taiwan
Prior art keywords
heat dissipation
bending direction
chip
insulating film
bending
Prior art date
Application number
TW098122795A
Other languages
English (en)
Chinese (zh)
Other versions
TW201023321A (en
Inventor
Yoshihiro Inoue
Original Assignee
Sumitomo Metal Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co filed Critical Sumitomo Metal Mining Co
Publication of TW201023321A publication Critical patent/TW201023321A/zh
Application granted granted Critical
Publication of TWI398937B publication Critical patent/TWI398937B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
TW098122795A 2008-08-22 2009-07-06 Flip chip substrate TWI398937B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008213921A JP4605272B2 (ja) 2008-08-22 2008-08-22 Ｃｏｆ基板

Publications (2)

Publication Number Publication Date
TW201023321A TW201023321A (en) 2010-06-16
TWI398937B true TWI398937B (zh) 2013-06-11

Family

ID=42067172

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098122795A TWI398937B (zh) 2008-08-22 2009-07-06 Flip chip substrate

Country Status (3)

Country Link
JP (1) JP4605272B2 (ja)
KR (1) KR101061278B1 (ja)
TW (1) TWI398937B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101979361B1 (ko) * 2012-10-25 2019-05-17 삼성디스플레이 주식회사 칩 온 필름 및 이를 포함하는 표시 장치
KR102059942B1 (ko) 2013-07-24 2019-12-30 삼성디스플레이 주식회사 유기 발광 표시 장치
KR102194822B1 (ko) 2014-01-16 2020-12-24 삼성디스플레이 주식회사 디스플레이 장치
JP6301738B2 (ja) * 2014-05-29 2018-03-28 京セラ株式会社 電子素子搭載用パッケージおよび電子装置
CN114845464A (zh) * 2022-05-20 2022-08-02 广州华星光电半导体显示技术有限公司 覆晶薄膜及其补偿方法、显示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5554885A (en) * 1993-06-04 1996-09-10 Seiko Epson Corporation Semiconductor device including means for dispersing and absorbing tensile forces acting on film tape
JP2001351953A (ja) * 2001-04-09 2001-12-21 Seiko Epson Corp テープキャリア

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002232086A (ja) * 2001-02-06 2002-08-16 Matsushita Electric Ind Co Ltd フレキシブル基板
JP2006294929A (ja) * 2005-04-12 2006-10-26 Fuji Photo Film Co Ltd フレキシブルプリント配線板、及び、カメラモジュール
KR100771890B1 (ko) 2006-07-20 2007-11-01 삼성전자주식회사 씨오에프(ｃｏｆ)형 반도체 패키지
JP5489394B2 (ja) * 2006-07-20 2014-05-14 三星電子株式会社 Ｃｏｆ型半導体パッケージ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5554885A (en) * 1993-06-04 1996-09-10 Seiko Epson Corporation Semiconductor device including means for dispersing and absorbing tensile forces acting on film tape
JP2001351953A (ja) * 2001-04-09 2001-12-21 Seiko Epson Corp テープキャリア

Also Published As

Publication number Publication date
JP2010050330A (ja) 2010-03-04
KR20100023739A (ko) 2010-03-04
KR101061278B1 (ko) 2011-08-31
TW201023321A (en) 2010-06-16
JP4605272B2 (ja) 2011-01-05

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