KR101028598B1 - 레이저 조사 장치 - Google Patents

레이저 조사 장치 Download PDF

Info

Publication number
KR101028598B1
KR101028598B1 KR1020087023807A KR20087023807A KR101028598B1 KR 101028598 B1 KR101028598 B1 KR 101028598B1 KR 1020087023807 A KR1020087023807 A KR 1020087023807A KR 20087023807 A KR20087023807 A KR 20087023807A KR 101028598 B1 KR101028598 B1 KR 101028598B1
Authority
KR
South Korea
Prior art keywords
laser beam
laser
axis direction
strip
irradiation area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020087023807A
Other languages
English (en)
Korean (ko)
Other versions
KR20080109788A (ko
Inventor
료타로 도가시
도시오 이나미
준이치 시다
히데아키 구사마
나오유키 고바야시
Original Assignee
더 재팬 스틸 워크스 엘티디
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 더 재팬 스틸 워크스 엘티디 filed Critical 더 재팬 스틸 워크스 엘티디
Publication of KR20080109788A publication Critical patent/KR20080109788A/ko
Application granted granted Critical
Publication of KR101028598B1 publication Critical patent/KR101028598B1/ko
Assigned to 제이에스더블유 악티나 시스템 가부시키가이샤 reassignment 제이에스더블유 악티나 시스템 가부시키가이샤 권리의 전부이전등록 Assignors: 더 재팬 스틸 워크스 엘티디
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
  • Recrystallisation Techniques (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Semiconductor Lasers (AREA)
KR1020087023807A 2006-03-30 2007-02-13 레이저 조사 장치 Active KR101028598B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00094484 2006-03-30
JP2006094484A JP4549996B2 (ja) 2006-03-30 2006-03-30 レーザ照射装置

Publications (2)

Publication Number Publication Date
KR20080109788A KR20080109788A (ko) 2008-12-17
KR101028598B1 true KR101028598B1 (ko) 2011-04-11

Family

ID=38580878

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087023807A Active KR101028598B1 (ko) 2006-03-30 2007-02-13 레이저 조사 장치

Country Status (5)

Country Link
JP (1) JP4549996B2 (https=)
KR (1) KR101028598B1 (https=)
DE (1) DE112007000735T5 (https=)
TW (1) TW200737352A (https=)
WO (1) WO2007116576A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9209347B2 (en) * 2011-10-27 2015-12-08 Applied Materials, Inc. Laser crystallization and polycrystal efficiency improvement for thin film solar
KR101881423B1 (ko) 2011-11-24 2018-07-25 삼성디스플레이 주식회사 결정화 장치, 결정화 방법 및 유기 발광 표시 장치의 제조 방법
KR101997095B1 (ko) * 2016-07-22 2019-07-08 전자부품연구원 수평 분해능 및 영상획득 프레임이 제어되는 스캐닝 라이다
JP7270652B2 (ja) * 2019-01-23 2023-05-10 ギガフォトン株式会社 レーザ加工装置及び被加工物の加工方法
JP7795880B2 (ja) * 2021-07-12 2026-01-08 住友重機械工業株式会社 アニール装置の制御装置、アニール装置、及びアニール方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52143755A (en) 1976-05-26 1977-11-30 Hitachi Ltd Laser, zone melting device
JPH09260684A (ja) * 1996-01-17 1997-10-03 Toshiba Corp 液晶表示装置の製造方法
JP2004349415A (ja) 2003-05-21 2004-12-09 Hitachi Ltd アクティブ・マトリクス基板の製造方法およびこれを用いた画像表示装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0410216A (ja) 1990-04-26 1992-01-14 Fuji Photo Film Co Ltd 磁気記録媒体及びその製造方法
KR20050070109A (ko) * 2002-11-05 2005-07-05 소니 가부시끼 가이샤 광조사장치 및 광조사방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52143755A (en) 1976-05-26 1977-11-30 Hitachi Ltd Laser, zone melting device
JPH09260684A (ja) * 1996-01-17 1997-10-03 Toshiba Corp 液晶表示装置の製造方法
JP2004349415A (ja) 2003-05-21 2004-12-09 Hitachi Ltd アクティブ・マトリクス基板の製造方法およびこれを用いた画像表示装置

Also Published As

Publication number Publication date
JP2007273539A (ja) 2007-10-18
TWI380369B (https=) 2012-12-21
KR20080109788A (ko) 2008-12-17
TW200737352A (en) 2007-10-01
WO2007116576A1 (ja) 2007-10-18
DE112007000735T5 (de) 2009-01-22
JP4549996B2 (ja) 2010-09-22

Similar Documents

Publication Publication Date Title
JP5468627B2 (ja) レーザ加工装置
US9012806B2 (en) Pulse laser processing device
US8933374B2 (en) Pulse laser machining apparatus and pulse laser machining method
KR101028598B1 (ko) 레이저 조사 장치
JP5305442B2 (ja) レーザービーム・ミクロスムージング
EP3217208B1 (en) Head device of three-dimensional modeling equipment having unidirectionally rotating polygon mirrors, scanning method for modeling plane using same, and three-dimensional modeling device using same
KR101001551B1 (ko) 레이저 어닐링 장치
JP6484272B2 (ja) レーザ加工装置およびレーザ加工方法
JP2010501354A (ja) Ｘ−ｙ高速穴あけシステム
ATE376902T1 (de) Laserbearbeitungsvorrichtung mit einem polygonspiegel
JP2013527120A (ja) 重ね合わせスキャン要素を用いた単一スキャンラインスキャン結晶化
JP6163035B2 (ja) レーザ加工装置
JPWO2019236616A5 (https=)
KR101221828B1 (ko) 레이저 가공장치 및 이를 이용한 웨이퍼 다이싱 방법
JP2005262219A (ja) レーザ加工装置及びレーザ描画方法
JP5465120B2 (ja) 光軸調整方法及びレーザ加工装置
JP2004146823A5 (https=)
KR20160002468A (ko) 고속 레이저 가공 광학계 시스템 및 이를 이용한 고속 레이저 가공 방법
KR20240123798A (ko) 기판 절단 및 쪼개기를 위한 기판 준비
JP4169264B2 (ja) 光ビーム生成装置
JP4395110B2 (ja) 透明材料へのマーキング方法およびこれを用いた装置
JPH07120697A (ja) レーザビームスキャンニング装置
JP2004343092A5 (https=)
JP2008060314A (ja) レーザアニール装置、レーザアニール方法、及び半導体装置の製造方法
JP2008113026A (ja) レーザ光ビームの整形方法およびレーザ光薄膜結晶化装置

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20140313

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20150310

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20160404

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20170404

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20180323

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20190318

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 15

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000