ATE376902T1 - Laserbearbeitungsvorrichtung mit einem polygonspiegel - Google Patents

Laserbearbeitungsvorrichtung mit einem polygonspiegel

Info

Publication number
ATE376902T1
ATE376902T1 AT04014434T AT04014434T ATE376902T1 AT E376902 T1 ATE376902 T1 AT E376902T1 AT 04014434 T AT04014434 T AT 04014434T AT 04014434 T AT04014434 T AT 04014434T AT E376902 T1 ATE376902 T1 AT E376902T1
Authority
AT
Austria
Prior art keywords
wafer
laser beam
cutout
polygon mirror
laser
Prior art date
Application number
AT04014434T
Other languages
English (en)
Inventor
You-Hie Han
Original Assignee
Eo Technics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eo Technics Co Ltd filed Critical Eo Technics Co Ltd
Application granted granted Critical
Publication of ATE376902T1 publication Critical patent/ATE376902T1/de

Links

Classifications

    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63F—CARD, BOARD, OR ROULETTE GAMES; INDOOR GAMES USING SMALL MOVING PLAYING BODIES; VIDEO GAMES; GAMES NOT OTHERWISE PROVIDED FOR
    • A63F7/00—Indoor games using small moving playing bodies, e.g. balls, discs or blocks
    • A63F7/02—Indoor games using small moving playing bodies, e.g. balls, discs or blocks using falling playing bodies or playing bodies running on an inclined surface, e.g. pinball games
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07F—COIN-FREED OR LIKE APPARATUS
    • G07F17/00—Coin-freed apparatus for hiring articles; Coin-freed facilities or services
    • G07F17/32—Coin-freed apparatus for hiring articles; Coin-freed facilities or services for games, toys, sports, or amusements
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63F—CARD, BOARD, OR ROULETTE GAMES; INDOOR GAMES USING SMALL MOVING PLAYING BODIES; VIDEO GAMES; GAMES NOT OTHERWISE PROVIDED FOR
    • A63F7/00—Indoor games using small moving playing bodies, e.g. balls, discs or blocks
    • A63F7/22—Accessories; Details
    • A63F7/34—Other devices for handling the playing bodies, e.g. bonus ball return means
    • A63F2007/341—Ball collecting devices or dispensers
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63F—CARD, BOARD, OR ROULETTE GAMES; INDOOR GAMES USING SMALL MOVING PLAYING BODIES; VIDEO GAMES; GAMES NOT OTHERWISE PROVIDED FOR
    • A63F2250/00—Miscellaneous game characteristics
    • A63F2250/14—Coin operated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Multimedia (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Recrystallisation Techniques (AREA)
AT04014434T 2004-03-31 2004-06-19 Laserbearbeitungsvorrichtung mit einem polygonspiegel ATE376902T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040022270A KR100462358B1 (ko) 2004-03-31 2004-03-31 폴리곤 미러를 이용한 레이저 가공장치

Publications (1)

Publication Number Publication Date
ATE376902T1 true ATE376902T1 (de) 2007-11-15

Family

ID=34925414

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04014434T ATE376902T1 (de) 2004-03-31 2004-06-19 Laserbearbeitungsvorrichtung mit einem polygonspiegel

Country Status (11)

Country Link
US (1) US20050218128A1 (de)
EP (1) EP1586406B1 (de)
JP (1) JP4044539B2 (de)
KR (1) KR100462358B1 (de)
CN (1) CN100363143C (de)
AT (1) ATE376902T1 (de)
CA (1) CA2472411A1 (de)
DE (1) DE602004009754T2 (de)
MY (1) MY137166A (de)
SG (1) SG130943A1 (de)
TW (1) TWI241060B (de)

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KR20080028559A (ko) 2006-09-27 2008-04-01 주식회사 이오테크닉스 폴리곤 미러를 이용한 대상물 다중 가공 방법
EP1990168B1 (de) * 2007-05-10 2012-06-27 Grenzebach Maschinenbau GmbH Verfahren zum laserthermischen Trennen von keramischem oder anderem spröden Plattenmaterial
DE502007002935D1 (de) * 2007-06-30 2010-04-08 Trumpf Werkzeugmaschinen Gmbh Werkzeugmaschine und Verfahren zum Bearbeiten eines Werkstückes
DE502007005140D1 (de) 2007-06-30 2010-11-04 Trumpf Werkzeugmaschinen Gmbh Maschine zum Bearbeiten von Werkstücken und Verfahren zum maschinellen Bearbeiten von Werkstücken
KR100884629B1 (ko) * 2007-08-06 2009-02-23 주식회사 이오테크닉스 레이저 가공 장치 및 방법
CN102046345A (zh) 2008-04-15 2011-05-04 三星钻石工业股份有限公司 脆性材料基板的加工方法
CN101829846A (zh) * 2010-05-11 2010-09-15 苏州市博海激光科技有限公司 高功率激光辊类表面集成聚焦毛化加工方法及装置
CN101913026A (zh) * 2010-06-30 2010-12-15 苏州市博海激光科技有限公司 卷烟接装纸双头集成激光打孔装置
DE102011108405A1 (de) * 2011-07-23 2013-01-24 Volkswagen Aktiengesellschaft Verfahren und Vorrichtung zum Einbringen einer Schnittfuge in ein Werkstück
KR101312937B1 (ko) 2011-10-19 2013-10-01 한국기계연구원 웨이퍼 다이싱용 레이저 개질 장치 및 웨이퍼 다이싱 방법
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WO2014126020A1 (ja) * 2013-02-13 2014-08-21 住友化学株式会社 レーザー光照射装置及び光学部材貼合体の製造装置
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JP6189178B2 (ja) * 2013-10-29 2017-08-30 株式会社ディスコ レーザー加工装置
JP6434360B2 (ja) * 2015-04-27 2018-12-05 株式会社ディスコ レーザー加工装置
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CN112292608B (zh) 2018-02-23 2024-09-20 图达通智能美国有限公司 用于lidar系统的二维操纵系统
JP6592564B1 (ja) 2018-07-06 2019-10-16 株式会社アマダホールディングス レーザ加工機及びレーザ加工方法
JP6592563B1 (ja) 2018-07-06 2019-10-16 株式会社アマダホールディングス レーザ加工機及びレーザ加工方法
DE102018212281A1 (de) * 2018-07-24 2020-01-30 Amada Holdings Co., Ltd. Laserverarbeitungsmaschine und Laserverarbeitungsverfahren
JP7011557B2 (ja) * 2018-09-07 2022-01-26 川崎重工業株式会社 レーザ光走査装置及びレーザ加工装置
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Also Published As

Publication number Publication date
SG130943A1 (en) 2007-04-26
EP1586406B1 (de) 2007-10-31
CA2472411A1 (en) 2005-09-30
TW200533022A (en) 2005-10-01
CN1676269A (zh) 2005-10-05
DE602004009754T2 (de) 2008-08-28
KR100462358B1 (ko) 2004-12-17
JP2005288541A (ja) 2005-10-20
JP4044539B2 (ja) 2008-02-06
CN100363143C (zh) 2008-01-23
TWI241060B (en) 2005-10-01
US20050218128A1 (en) 2005-10-06
MY137166A (en) 2009-01-30
EP1586406A1 (de) 2005-10-19
DE602004009754D1 (de) 2007-12-13

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