JP6997566B2 - レーザー加工装置 - Google Patents
レーザー加工装置 Download PDFInfo
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- JP6997566B2 JP6997566B2 JP2017176632A JP2017176632A JP6997566B2 JP 6997566 B2 JP6997566 B2 JP 6997566B2 JP 2017176632 A JP2017176632 A JP 2017176632A JP 2017176632 A JP2017176632 A JP 2017176632A JP 6997566 B2 JP6997566 B2 JP 6997566B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
- B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/704—Beam dispersers, e.g. beam wells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Description
また、本発明によれば、被加工物を保持する保持手段と、該保持手段に保持された被加工物にパルスレーザー光線を照射するレーザー光線照射手段と、該保持手段と該レーザー光線照射手段とを相対的にX軸方向に加工送りする加工送り手段と、を少なくとも備えたレーザー加工装置であって、該レーザー光線照射手段は、パルスレーザー光線を発振する発振器と、該発振器が発振したパルスレーザー光線を分散するポリゴンミラーと、該ポリゴンミラーによって分散されたパルスレーザー光線を集光し該保持手段に保持された被加工物に照射する集光器と、該発振器と該ポリゴンミラーとの間に配設され該ポリゴンミラーを構成するミラーの回転方向にパルスレーザー光線を追随させ、n枚(ただし、nは1以上の整数)おきに該ポリゴンミラーのミラーにパルスレーザー光線を照射してパルスレーザー光線の分散領域を制御する分散領域調整手段と、を少なくとも備えたレーザー加工装置が提供される。
また、本発明のレーザー加工装置は、被加工物を保持する保持手段と、該保持手段に保持された被加工物にパルスレーザー光線を照射するレーザー光線照射手段と、該保持手段と該レーザー光線照射手段とを相対的にX軸方向に加工送りする加工送り手段と、を少なくとも備えたレーザー加工装置であって、該レーザー光線照射手段は、パルスレーザー光線を発振する発振器と、該発振器が発振したパルスレーザー光線を分散するポリゴンミラーと、該ポリゴンミラーによって分散されたパルスレーザー光線を集光し該保持手段に保持された被加工物に照射する集光器と、該発振器と該ポリゴンミラーとの間に配設され該ポリゴンミラーを構成するミラーの回転方向にパルスレーザー光線を追随させ、n枚(ただし、nは1以上の整数)おきに該ポリゴンミラーのミラーにパルスレーザー光線を照射してパルスレーザー光線の分散領域を制御する分散領域調整手段と、を少なくとも備えているので、被加工物に応じて適正な領域にパルスレーザー光線を分散でき、したがって被加工物に応じた加工品質が得られる。
パルスレーザー光線の波長 :355nm
繰り返し周波数 :72MHz
平均出力 :3W
ポリゴンミラーの直径 :φ55mm
ポリゴンミラーのミラー枚数 :18枚
ポリゴンミラーの回転数 :24000rpm
なお、上記加工条件においてパルスレーザー光線LBをミラーMの回転方向Aに追随させない場合に1枚のミラーによって分散されるパルスレーザー光線LBのパルス数Pnは、繰り返し周波数Fと、ポリゴンミラー40のミラーMの枚数Mn及び回転数Nから以下のとおりにして導かれる。
Pn=F/(Mn×N)
=72(MHz)/(18枚×24000rpm)
=72×106(1/s)/(18枚×400(1/s))
=10000(パルス/枚)
また、上記加工条件においてパルスレーザー光線LBをミラーMの回転方向Aに上述したとおりに追随させる場合、すなわち、ポリゴンミラー40が40度回転する間、同一のミラーMにパルスレーザー光線LBを追随させ、したがって1枚おきにミラーMにパルスレーザー光線LBを照射させる場合は、1枚のミラーによって分散されるパルスレーザー光線LBのパルス数Pn’は、上記Pnの2倍の20000(パルス/枚)となる。
4:保持手段
6:レーザー光線照射手段
8:加工送り手段
38:発振器
40:ポリゴンミラー
M:ミラー
42:集光器
44:分散領域調整手段
LB:パルスレーザー光線
R:分散領域
Claims (3)
- 被加工物を保持する保持手段と、該保持手段に保持された被加工物にパルスレーザー光線を照射するレーザー光線照射手段と、該保持手段と該レーザー光線照射手段とを相対的にX軸方向に加工送りする加工送り手段と、を少なくとも備えたレーザー加工装置であって、
該レーザー光線照射手段は、パルスレーザー光線を発振する発振器と、該発振器が発振したパルスレーザー光線を分散するポリゴンミラーと、該ポリゴンミラーによって分散されたパルスレーザー光線を集光し該保持手段に保持された被加工物に照射する集光器と、被加工物にパルスレーザー光線が照射される領域が所望する分散領域になるように、該発振器と該ポリゴンミラーとの間に配設され該ポリゴンミラーを構成するミラーの回転方向に、所定時間パルスレーザー光線を追随させてパルスレーザー光線の該分散領域を制御する分散領域調整手段と、
を少なくとも備えたレーザー加工装置。 - 被加工物を保持する保持手段と、該保持手段に保持された被加工物にパルスレーザー光線を照射するレーザー光線照射手段と、該保持手段と該レーザー光線照射手段とを相対的にX軸方向に加工送りする加工送り手段と、を少なくとも備えたレーザー加工装置であって、
該レーザー光線照射手段は、パルスレーザー光線を発振する発振器と、該発振器が発振したパルスレーザー光線を分散するポリゴンミラーと、該ポリゴンミラーによって分散されたパルスレーザー光線を集光し該保持手段に保持された被加工物に照射する集光器と、該発振器と該ポリゴンミラーとの間に配設され該ポリゴンミラーを構成するミラーの回転方向にパルスレーザー光線を追随させ、n枚(ただし、nは1以上の整数)おきに該ポリゴンミラーのミラーにパルスレーザー光線を照射してパルスレーザー光線の分散領域を制御する分散領域調整手段と、
を少なくとも備えたレーザー加工装置。 - 該分散領域調整手段は、AOD、EOD、レゾナントスキャナーのいずれかで構成され
る請求項1または2に記載のレーザー加工装置。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017176632A JP6997566B2 (ja) | 2017-09-14 | 2017-09-14 | レーザー加工装置 |
KR1020180102072A KR102543779B1 (ko) | 2017-09-14 | 2018-08-29 | 레이저 가공 장치 |
TW107131740A TWI773825B (zh) | 2017-09-14 | 2018-09-10 | 雷射加工裝置 |
CN201811049055.6A CN109514093B (zh) | 2017-09-14 | 2018-09-10 | 激光加工装置 |
DE102018122089.8A DE102018122089A1 (de) | 2017-09-14 | 2018-09-11 | Laserbearbeitungsvorrichtung |
US16/130,427 US20190076961A1 (en) | 2017-09-14 | 2018-09-13 | Laser processing apparatus |
FR1858206A FR3070888B1 (fr) | 2017-09-14 | 2018-09-13 | Appareil de traitement au laser |
US17/448,945 US20220016731A1 (en) | 2017-09-14 | 2021-09-27 | Laser processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017176632A JP6997566B2 (ja) | 2017-09-14 | 2017-09-14 | レーザー加工装置 |
Publications (2)
Publication Number | Publication Date |
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JP2019051536A JP2019051536A (ja) | 2019-04-04 |
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JP7323792B2 (ja) * | 2019-08-13 | 2023-08-09 | 日本製鉄株式会社 | レーザー照射装置及び鋼板の加工システム |
CN110877456B (zh) * | 2019-12-10 | 2023-08-08 | 杭州德迪智能科技有限公司 | 一种高效率旋转扫描平面成像装置及方法 |
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US4441126A (en) * | 1982-05-06 | 1984-04-03 | Sperry Corporation | Adaptive corrector of facet errors in mirror scanning systems |
JPS6373635A (ja) * | 1986-09-17 | 1988-04-04 | Toshiba Corp | 半導体ウエハ表面検査用レ−ザビ−ムの走査方法および走査装置 |
US6037967A (en) * | 1996-12-18 | 2000-03-14 | Etec Systems, Inc. | Short wavelength pulsed laser scanner |
US6737672B2 (en) * | 2000-08-25 | 2004-05-18 | Fujitsu Limited | Semiconductor device, manufacturing method thereof, and semiconductor manufacturing apparatus |
KR100462358B1 (ko) * | 2004-03-31 | 2004-12-17 | 주식회사 이오테크닉스 | 폴리곤 미러를 이용한 레이저 가공장치 |
JP5218049B2 (ja) * | 2006-05-31 | 2013-06-26 | 株式会社ニコン | 露光装置及び露光方法 |
KR20080028559A (ko) * | 2006-09-27 | 2008-04-01 | 주식회사 이오테크닉스 | 폴리곤 미러를 이용한 대상물 다중 가공 방법 |
JP5060880B2 (ja) * | 2007-09-11 | 2012-10-31 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の分断装置および分断方法 |
CN101878088B (zh) * | 2007-11-27 | 2013-08-14 | 三星钻石工业股份有限公司 | 激光加工装置 |
JP6189178B2 (ja) * | 2013-10-29 | 2017-08-30 | 株式会社ディスコ | レーザー加工装置 |
JP2016002585A (ja) * | 2014-06-19 | 2016-01-12 | 株式会社ディスコ | レーザー加工装置 |
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US10083843B2 (en) * | 2014-12-17 | 2018-09-25 | Ultratech, Inc. | Laser annealing systems and methods with ultra-short dwell times |
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