TWI773825B - 雷射加工裝置 - Google Patents

雷射加工裝置 Download PDF

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TWI773825B
TWI773825B TW107131740A TW107131740A TWI773825B TW I773825 B TWI773825 B TW I773825B TW 107131740 A TW107131740 A TW 107131740A TW 107131740 A TW107131740 A TW 107131740A TW I773825 B TWI773825 B TW I773825B
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laser light
pulsed laser
polygon mirror
mirror
chuck table
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TW201914719A (zh
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能丸圭司
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日商迪思科股份有限公司
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Abstract

[課題]提供一種可因應工件而將脈衝雷射光線分散在適當區域的雷射加工裝置。[解決手段]雷射加工裝置具備：卡盤台，保持工件；雷射光線照射單元，照射脈衝雷射光線於卡盤台所保持的工件；以及加工進給單元，將卡盤台與雷射光線照射單元相對地在X軸方向上加工進給。雷射光線照射單元包含：雷射振盪器，射出脈衝雷射光線；多角鏡，分散從雷射振盪器所射出的脈衝雷射光線；聚光器，將藉由多角鏡分散的脈衝雷射光線聚光，並照射於卡盤台所保持的工件；以及AOD或EOD，配設於雷射振盪器與多角鏡之間，使脈衝雷射光線跟隨構成多角鏡之反射鏡的旋轉方向，並控制脈衝雷射光線的分散區域。

Description

雷射加工裝置
本發明係關於一種可因應工件而將脈衝雷射光線分散在適當區域的雷射加工裝置。
表面藉由分割預定線劃分形成有IC、LSI（Large Scale Integration，大型積體電路）等複數個元件的晶圓，係藉由切割裝置、雷射加工裝置分割成各個元件晶片，所分割的各元件晶片則利用於行動電話、個人電腦等的電子設備。
雷射加工裝置係至少具備下述要件所構成：卡盤台，保持工件；雷射光線照射單元，將雷射光線照射在卡盤台所保持的工件；以及加工進給單元，將卡盤台與雷射光線照射單元相對地進行加工進給。再者，為了避免重作（recast）之目的，而有具備多角鏡之雷射加工裝置（參照例如專利文獻1）的提案。 [習知技術文獻] [專利文獻]
[專利文獻1]日本特許第4044539號公報
[發明所欲解決的課題] 但，上述專利文獻1所揭示的雷射加工裝置中，由於脈衝雷射光線係分散在藉由多角鏡所設定的區域且照射於工件，故無法將脈衝雷射光線因應工件而分散在適當的區域，而有無法獲致因應工件之加工品質的問題。
因此，本發明之目的係在提供一種可因應工件而將脈衝雷射光線分散在適當區域的雷射加工裝置。
[解決課題的技術手段] 若依據本發明，係提供一種雷射加工裝置，具備：卡盤台，保持工件；雷射光線照射單元，照射脈衝雷射光線於該卡盤台所保持的工件；以及加工進給單元，使該卡盤台與該雷射光線照射單元相對地在X軸方向上進行加工進給；該雷射光線照射單元包含：雷射振盪器，射出脈衝雷射光線；多角鏡，將該雷射振盪器射出的脈衝雷射光線分散；聚光器，將藉由該多角鏡分散的脈衝雷射光線聚光並照射於該卡盤台所保持的工件；以及分散區域調整手段，配設於該雷射振盪器與該多角鏡之間，使脈衝雷射光線跟隨構成該多角鏡之反射鏡的旋轉方向，並控制脈衝雷射光線的分散區域。
該分散區域調整手段較佳為以AOD、EOD、共振掃描儀之任一者所構成。
[發明功效] 若依據本發明，可因應工件分散脈衝雷射光線於適當區域，從而獲得因應工件的加工品質。
以下，參照附圖說明有關按照本發明所構成之雷射加工裝置的實施方式。
圖1所示之雷射加工裝置2至少具備：保持單元4，保持工件；雷射光線照射單元6，照射脈衝雷射光線於保持單元4所保持的工件；以及加工進給單元8，將保持單元4與雷射光線照射單元6相對地在圖1中以箭號X標示的X軸方向上進行加工進給。另外，以箭號Y標示在圖1的Y軸方向為正交於X軸方向的方向，X軸方向與Y軸方向所界定的平面實質上為水平。
如圖1所示，保持單元4包含：X軸方向可動板12，在X軸方向上移動自如地搭載於基台10；Y軸方向可動板14，在Y軸方向上移動自如地搭載於X軸方向可動板12；支柱16，固定於Y軸方向可動板14的上表面；以及蓋板18，固定在支柱16的上端。蓋板18形成有延伸於Y軸方向的長孔18a，通過長孔18a向上方延伸的卡盤台20係旋轉自如地搭載於支柱16之上端。卡盤台20則藉內設於支柱16的旋轉裝置（未圖示）而旋轉。卡盤台20的上表面配置有和吸引手段（未圖示）連接的多孔質吸附卡盤22。其次，卡盤台20係透過以吸引手段在吸附卡盤22上表面產生吸引力，藉以能將吸附卡盤22上表面所載置的工件吸附並保持。此外，卡盤台20的周緣，在圓周方向上保持間隔地配置有複數個夾具24。
加工進給單元8具有：滾珠螺桿26，在基台10上於X軸方向上延伸；以及馬達28，連結於滾珠螺桿26的單側端部。滾珠螺桿26的螺帽部（未圖示）係固定於X軸方向可動板12的下表面。此外，加工進給單元8係藉由滾珠螺桿26將馬達28的旋轉運動變換成直線運動並傳達至X軸方向可動板12，沿著基台10上的導軌10a使X軸方向可動板12進退於X軸方向，藉以將卡盤台20相對於雷射光線照射單元6加工進給於X軸方向。而且，保持單元4的Y軸方向可動板14係藉分度進給單元34沿著X軸方向可動板12上的導軌12a進退於Y軸方向，而分度進給單元34則具有：在X軸方向可動板12上延伸於Y軸方向的滾珠螺桿30；以及連結於滾珠螺桿30的馬達32。意即，藉由分度進給單元34，使卡盤台20係相對於雷射光線照射單元6在Y軸方向上分度進給。
參照圖1及圖2，針對雷射光線照射單元6加以說明。如圖1所示，雷射光線照射單元6包括框體36，其係從基台10的上表面向上方延伸，然後，實質上水平延伸。如圖2所示，框體36包含：雷射振盪器38，射出脈衝雷射光線LB；多角鏡40，分散從雷射振盪器38射出的脈衝雷射光線LB；聚光器42，將藉多角鏡40分散的脈衝雷射光線LB加以聚光並照射在保持單元4所保持的工件；及分散區域調整手段44，配設於雷射振盪器38與多角鏡40之間，使脈衝雷射光線LB跟隨構成多角鏡40之反射鏡M的旋轉方向，並控制脈衝雷射光線LB的分散區域。本實施方式中，如圖2所示，雷射光線照射單元6又具備：減衰器（attenuator）46，調整從雷射振盪器38射出的脈衝雷射光線LB之輸出；第一反射鏡48，將已藉減衰器46調整輸出的脈衝雷射光線LB反射，並引導至分散區域調整手段44；第二反射鏡50及第三反射鏡52，將通過分散區域調整手段44的脈衝雷射光線LB進行反射，並引導至多角鏡40；旋轉角度檢測單元54，檢測多角鏡40的旋轉角度；控制單元56；以及聚光點位置調整手段（未圖示），調整脈衝雷射光線LB的聚光點的上下方向位置。
藉控制單元56實施控制的雷射振盪器38係將按照加工的類型而適當決定波長（例如355nm）的脈衝雷射光線LB施行振盪。分散區域調整手段44係由AOD（音響光學元件）、EOD（電光學元件）、共振掃描儀之任一者所構成。本實施方式中的分散區域調整手段44係以AOD構成，其係按照從控制單元56輸出的電壓訊號而改變脈衝雷射光線LB從AOD的出射角度，並藉由調整脈衝雷射光線LB向多角鏡40的入射位置，使脈衝雷射光線LB跟隨構成多角鏡40之反射鏡M的旋轉方向，並控制藉多角鏡40所形成的脈衝雷射光線LB的分散區域。多角鏡40係由複數片（本實施方式中為18片，中心角20度）反射鏡M對著旋轉軸O配置成同心狀，並藉多角鏡用馬達（未圖示）朝著圖2中以箭號A標示的方向旋轉。多角鏡用馬達係以控制單元56施行控制。旋轉角度檢測單元54具有：發光元件58，向多角鏡40發射光線；及光接收元件60，將藉多角鏡40之反射鏡M所反射的發光元件58之光予以接收。光接收元件60係配置成：多角鏡40的反射鏡M對發光元件58之角度達到預定的角度時，將在多角鏡40的反射鏡M所反射的發光元件58的光接收，接收到光時，即向控制單元56輸出光接收訊號。聚光器42係配置於框體36的前端下表面（參照圖1），且具有將藉由多角鏡40分散的脈衝雷射光線LB聚光的fθ透鏡62（參照圖2）。此外，如圖1所示，在框體36的前端下表面，和聚光器42在X軸方向上保持間隔地裝設有攝像單元64，其係用以拍攝卡盤台20所保持的工件並檢測應進行雷射加工的區域。
圖3表示有作為工件的一例的圓盤狀晶圓70。晶圓70的正面70a係藉格子狀的分割預定線72劃分成複數個矩形區域，且複數個矩形區域各自形成有元件74。本實施方式中，晶圓70的背面70b係貼附在周緣固定於環狀框架76的黏膠膜78。
以晶圓70作為工件，使用上述雷射加工裝置2沿著晶圓70的分割預定線72實施雷射加工時，首先，將晶圓70的正面70a朝上，使晶圓70吸附在卡盤台20的上表面，並且以複數個夾具24將環狀框架76的外周緣部固定。接著，用攝像單元64從上方拍攝晶圓70。其次，藉由根據攝像單元64拍攝的晶圓70的影像，以加工進給單元8、分度進給單元34及旋轉單元令卡盤台20移動及旋轉，使格子狀的分割預定線72和X軸方向一致，同時將聚光器42定位在和X軸方向一致的分割預定線72之單側端部的上方。然後，藉由聚光點位置調整單元將聚光點定位於分割預定線72的所需位置。接著，對於聚光點，一邊將卡盤台20藉加工進給單元8以預定的加工進給速度在X軸方向上加工進給，一邊將脈衝雷射光線LB從聚光器42照射於晶圓70。依此方式，將脈衝雷射光線LB照射於晶圓70，並沿著分割預定線72進行加工時，即可例如將聚光點定位於晶圓70的正面70a，將對晶圓70具有吸收性波長之脈衝雷射光線LB照射於晶圓70，對晶圓70進行燒蝕切割（ablation）加工。聚光點一旦到達分割預定線72的另一端部，即停止脈衝雷射光線LB的照射，並按照分割預定線72的間隔量，對於聚光點，以分度進給單元34將卡盤台20在Y軸方向上分度進給。接著，藉由反覆交替進行燒蝕切割加工等的脈衝雷射光線LB照射及分度進給，對在第1方向上延伸的全部分割預定線72照射脈衝雷射光線LB。接著，藉由旋轉單元將卡盤台20旋轉90度後，亦透過交替反覆進行脈衝雷射光線LB照射及分度進給，對正交於在第1方向上延伸之分割預定線72的全部分割預定線72照射脈衝雷射光線LB，沿著格子狀的分割預定線72施行雷射加工。
對晶圓70照射脈衝雷射光線LB時，係藉多角鏡用馬達使多角鏡40以適當的旋轉速度旋轉，並用多角鏡40使脈衝雷射光線LB分散，同時以分散區域調整手段44使脈衝雷射光線LB跟隨多角鏡40的旋轉方向A，藉以控制脈衝雷射光線LB的分散區域。詳言之，對晶圓70照射脈衝雷射光線LB時，控制單元56首先係根據輸出自旋轉角度檢測裝置54之光接收元件60的光接收訊號來檢測多角鏡40的旋轉角度。接著，控制單元56會根據檢測所得的多角鏡40的旋轉角度來決定要輸出至作為分散區域調整手段44之AOD的電壓訊號形態。其次，控制單元56會根據所決定的電壓訊號形態，向分散區域調整手段44輸出電壓訊號。按照該電壓訊號，分散區域調整手段44就會將脈衝雷射光線LB向多角鏡40入射的位置進行調整，藉由脈衝雷射光線LB對該同一反射鏡M照射預定時間，使脈衝雷射光線LB跟隨多角鏡40的旋轉方向A，藉以控制脈衝雷射光線LB的分散區域。脈衝雷射光線LB對該同一反射鏡M照射預定時間後，以脈衝雷射光線LB對多角鏡40之旋轉方向A下游側之反射鏡M照射預定時間的方式，反覆進行脈衝雷射光線LB向多角鏡40之入射位置的調整。另外，多角鏡40的旋轉速度、或脈衝雷射光線LB的分散方向（例如X軸方向或Y軸方向）得因應工件來適當決定。
本實施方式中，如圖4（a）所示，分散區域調整手段44會將脈衝雷射光線LB向多角鏡40的入射位置加以調整，並使脈衝雷射光線LB可照射在位於預定位置的任意反射鏡M（以下，權稱為「反射鏡M1」)。接著，在位於預定位置的反射鏡M1所反射的脈衝雷射光線LB係藉聚光器42的fθ透鏡62實施聚光，並在位置P1照射於晶圓70。圖4（b）係表示多角鏡40從圖4（a）所示狀態朝旋轉方向A旋轉20度的狀態。本實施方式中，分散區域調整手段44會令脈衝雷射光線LB跟隨多角鏡40的旋轉方向A，並在圖4（b）所示的狀態下，脈衝雷射光線LB也可照射於反射鏡M1。圖4（b）所示的狀態中，以反射鏡M1反射的脈衝雷射光線LB係在位置P2照射於晶圓70。其次，圖4（c）中係表示使多角鏡40從圖4（b）所示狀態朝旋轉方向A再旋轉20度的狀態。本實施方式中，分散區域調整手段44係使脈衝雷射光線LB跟隨多角鏡40的旋轉方向A，即使在圖4（c）所示的狀態下，脈衝雷射光線LB也可照射於反射鏡M1。圖4（c）所示的狀態中，以反射鏡M1反射的脈衝雷射光線LB係在位置P3中照射於晶圓70。另外，圖4（a）中，脈衝雷射光線LB的軌跡在圖4（b）及圖4（c）中係以一點鏈線表示，圖4（b）中，脈衝雷射光線LB的軌跡在圖4（c）中則以兩點鏈線表示。透過參照圖4（a）至圖4（c）即可瞭解，在多角鏡40從圖4（a）所示狀態至圖4（c）所示狀態的旋轉40度之間，分散區域調整手段44係使脈衝雷射光線LB跟隨多角鏡40的旋轉方向A，將脈衝雷射光線LB的分散區域R從位置P1控制到位置P3，使脈衝雷射光線LB繼續照射於反射鏡M1。脈衝雷射光線LB對反射鏡M1照射預定時間而成為圖4（c）所示狀態時，在旋轉方向A中，較反射鏡M1靠下游側2個反射鏡量的反射鏡M係位於預定位置（圖4（a）中反射鏡M1之位置），而為了使脈衝雷射光線LB能對位於預定位置的反射鏡M照射預定時間，分散區域調整手段44會調整脈衝雷射光線LB向多角鏡40入射的位置。然後，反覆實現圖4（a）至圖4（c）所示的狀態，使反射鏡M所反射的脈衝雷射光線LB能在位置P1至位置P3的分散區域R中照射於晶圓70。另外，實施雷射加工時，係如上所述，由於藉加工進給單元8使保持晶圓70的卡盤台20在X軸方向上進行加工進給，故分散區域R係對晶圓70相對地移動。使用此種雷射加工裝置2的加工方法可以例如下列加工條件來實施。 　　脈衝雷射光線的波長　：355nm 　　重複頻率　　　　　　：72MHz 　　平均輸出　　　　　　：3W 　　多角鏡的直徑　　　　：55mm 　　多角鏡的反射鏡片數　：18片 　　多角鏡的旋轉數　　　：24000rpm 另外，上述加工條件中，不使脈衝雷射光線LB跟隨反射鏡M的旋轉方向A時，藉1片反射鏡M所分散的脈衝雷射光線LB的脈衝數Pn，可由重複頻率F、與多角鏡40之反射鏡M的片數Mn及旋轉數N依下述方式導出。 　　Pn＝F/(Mn×N) 　　　＝72(MHz)/(18片×24000rpm) 　　　＝72×106(1/s)/(18片×400(1/s)) 　　　＝10000(脈衝/片) 再者，上述加工條件中，要使脈衝雷射光線LB依上述方式跟隨反射鏡M的旋轉方向A時，亦即，在多角鏡40旋轉40度期間，係使脈衝雷射光線LB跟隨同一反射鏡M，從而，脈衝雷射光線LB照射於每隔1片的反射鏡M時，藉由1片反射鏡所分散的脈衝雷射光線LB的脈衝數Pn’即為上述Pn之2倍的20000（脈衝/片）。
如上所述，本實施方式的雷射光線照射單元6因具備：雷射振盪器38，射出脈衝雷射光線LB；多角鏡40，分散從雷射振盪器38射出的脈衝雷射光線LB；聚光器42，將藉多角鏡40分散的脈衝雷射光線LB聚光，且照射於保持單元4之卡盤台20所保持的工件；以及分散區域調整手段44，配設於雷射振盪器38與多角鏡40之間，且使脈衝雷射光線LB跟隨構成多角鏡40之反射鏡M的旋轉方向A，並控制脈衝雷射光線LB的分散區域R；故可因應工件而使脈衝雷射光線LB分散在適當區域，從而可獲得因應工件的加工品質。
一般而言，為了使多角鏡的旋轉速度高速化，並使脈衝雷射光線的分散速度（掃描速度）高速化，必須藉由增加反射鏡的片數，使多角鏡的外周形狀接近真圓來減少多角鏡的空氣阻力。另一方面，反射鏡的片數增加時，會使中心角減少，故各反射鏡所形成的分散區域減少。然而，本實施方式中，因係使脈衝雷射光線LB跟隨構成多角鏡40之反射鏡M的旋轉方向A，故即使增加多角鏡40的反射鏡M的片數，也可依上述方式藉由例如使脈衝雷射光線LB照射每隔1片的反射鏡M（亦即，在中心角加倍的區域中，將脈衝雷射光線LB照射在1片反射鏡M）來防止分散區域R的減少，並且可使多角鏡40之反射鏡M的片數增加，以減少空氣對多角鏡40旋轉的阻力，且可讓多角鏡40以高速旋轉。亦即，本實施方式中，可以防止分散區域R的減少，同時使多角鏡40的旋轉速度高速化，並使脈衝雷射光線LB的分散速度（掃描速度）高速化。
2‧‧‧雷射加工裝置4‧‧‧保持單元6‧‧‧雷射光線照射單元8‧‧‧加工進給單元38‧‧‧雷射振盪器40‧‧‧多角鏡M‧‧‧反射鏡42‧‧‧聚光器44‧‧‧分散區域調整手段LB‧‧‧脈衝雷射光線R‧‧‧分散區域
圖1為本發明實施方式之雷射加工裝置的立體圖。 圖2為圖1所示雷射光線照射單元的方塊圖。 圖3為透過黏著膠膜支持於環狀框架之晶圓的立體圖。 圖4（a）為藉多角鏡分散之脈衝雷射光線的軌跡示意圖，圖4（b）為使多角鏡從圖4（a）所示之狀態旋轉20度的狀態中的脈衝雷射光線軌跡示意圖，圖4（c）為使多角鏡從圖4（b）所示之狀態再旋轉20度的狀態中的脈衝雷射光線軌跡示意圖。
6‧‧‧雷射光線照射單元
20‧‧‧卡盤台
38‧‧‧雷射震盪器
40‧‧‧多角鏡
42‧‧‧聚光器
44‧‧‧分散區域調整手段
46‧‧‧減衰器
48‧‧‧第一反射鏡
50‧‧‧第二反射鏡
52‧‧‧第三反射鏡
54‧‧‧旋轉角度檢測單元
56‧‧‧控制單元
58‧‧‧發光元件
60‧‧‧光接收元件
62‧‧‧fθ透鏡
70‧‧‧晶圓
A‧‧‧旋轉方向
LB‧‧‧脈衝雷射光線
M‧‧‧反射鏡
P1、P2、P3‧‧‧位置
R‧‧‧分散區域

Claims (3)

  1. 一種雷射加工裝置，具備：卡盤台，保持工件；雷射光線照射單元，照射脈衝雷射光線於該卡盤台所保持的工件；以及加工進給單元，將該卡盤台與該雷射光線照射單元相對地在X軸方向上進行加工進給；該雷射光線照射單元包含：雷射振盪器，射出脈衝雷射光線；多角鏡，分散該雷射振盪器所射出的脈衝雷射光線；聚光器，將藉由該多角鏡分散的脈衝雷射光線聚光，並照射於該卡盤台所保持的工件；以及分散區域調整手段，以使工件被脈衝雷射光線照射的區域會成為期望的分散區域之方式，配設於該雷射振盪器與該多角鏡之間，使脈衝雷射光線以預定時間跟隨構成該多角鏡之反射鏡的旋轉方向，以控制脈衝雷射光線的該分散區域。
  2. 一種雷射加工裝置，具備：卡盤台，保持工件；雷射光線照射單元，照射脈衝雷射光線於該卡盤台所保持的工件；以及加工進給單元，將該卡盤台與該雷射光線照射單元相對地在X軸方向上進行加工進給；該雷射光線照射單元包含：雷射振盪器，射出脈衝雷射光線；多角鏡，分散該雷射振盪器所射出的脈衝雷射光線；聚光器，將藉由該多角鏡分散的脈衝雷射光線聚光，並照射於該卡盤台所保持的工件；以及分散區域調整手段，配設於該雷射振盪器與該多角鏡之間，使脈衝雷射光線跟隨構成該多角鏡之反射鏡的旋轉方向，且將脈衝雷射光線照射於每隔n片的該多角鏡之反射鏡，以控制脈衝雷射光線的分散區域，前述n為1以上的整數。
  3. 如申請專利範圍第1項或第2項所述之雷射加工裝置，其中，該分散區域調整手段係以AOD、EOD、共振掃描儀之任一者所構成。
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