KR101019947B1 - 유기 반도체 제조장치 - Google Patents

유기 반도체 제조장치 Download PDF

Info

Publication number
KR101019947B1
KR101019947B1 KR1020100055019A KR20100055019A KR101019947B1 KR 101019947 B1 KR101019947 B1 KR 101019947B1 KR 1020100055019 A KR1020100055019 A KR 1020100055019A KR 20100055019 A KR20100055019 A KR 20100055019A KR 101019947 B1 KR101019947 B1 KR 101019947B1
Authority
KR
South Korea
Prior art keywords
deposition material
organic semiconductor
semiconductor manufacturing
manufacturing apparatus
deposition
Prior art date
Application number
KR1020100055019A
Other languages
English (en)
Korean (ko)
Inventor
강창호
권현구
최호중
김정진
Original Assignee
에스엔유 프리시젼 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에스엔유 프리시젼 주식회사 filed Critical 에스엔유 프리시젼 주식회사
Priority to KR1020100055019A priority Critical patent/KR101019947B1/ko
Priority to JP2013514087A priority patent/JP5553131B2/ja
Priority to PCT/KR2010/003809 priority patent/WO2011155651A1/ko
Priority to CN201080067316.2A priority patent/CN102934253B/zh
Priority to TW099119652A priority patent/TWI431831B/zh
Application granted granted Critical
Publication of KR101019947B1 publication Critical patent/KR101019947B1/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/52—Means for observation of the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/544—Controlling the film thickness or evaporation rate using measurement in the gas phase
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
KR1020100055019A 2010-06-10 2010-06-10 유기 반도체 제조장치 KR101019947B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020100055019A KR101019947B1 (ko) 2010-06-10 2010-06-10 유기 반도체 제조장치
JP2013514087A JP5553131B2 (ja) 2010-06-10 2010-06-14 有機半導体製造装置
PCT/KR2010/003809 WO2011155651A1 (ko) 2010-06-10 2010-06-14 유기 반도체 제조장치
CN201080067316.2A CN102934253B (zh) 2010-06-10 2010-06-14 有机半导体制造设备
TW099119652A TWI431831B (zh) 2010-06-10 2010-06-17 製造有機半導體的裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100055019A KR101019947B1 (ko) 2010-06-10 2010-06-10 유기 반도체 제조장치

Publications (1)

Publication Number Publication Date
KR101019947B1 true KR101019947B1 (ko) 2011-03-09

Family

ID=43938499

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100055019A KR101019947B1 (ko) 2010-06-10 2010-06-10 유기 반도체 제조장치

Country Status (5)

Country Link
JP (1) JP5553131B2 (zh)
KR (1) KR101019947B1 (zh)
CN (1) CN102934253B (zh)
TW (1) TWI431831B (zh)
WO (1) WO2011155651A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160018043A (ko) * 2014-08-07 2016-02-17 주식회사 선익시스템 증착 장치

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140105670A (ko) * 2013-02-22 2014-09-02 삼성디스플레이 주식회사 유기 박막 두께 측정 유닛 및 이를 구비한 유기 박막 증착 장치
CN105177510B (zh) * 2015-10-21 2018-04-03 京东方科技集团股份有限公司 蒸镀设备及蒸镀方法
CN114525474A (zh) * 2022-03-10 2022-05-24 武汉华星光电半导体显示技术有限公司 蒸镀坩埚及蒸镀装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060018746A (ko) * 2004-08-25 2006-03-02 삼성에스디아이 주식회사 유기물 증착 장치
KR100658710B1 (ko) * 2003-11-24 2006-12-15 삼성에스디아이 주식회사 유기 발광 소자의 수직 증착 방법 및 그 장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004225058A (ja) * 2002-11-29 2004-08-12 Sony Corp 成膜装置および表示パネルの製造装置とその方法
JP4013859B2 (ja) * 2003-07-17 2007-11-28 富士電機ホールディングス株式会社 有機薄膜の製造装置
JP4366226B2 (ja) * 2004-03-30 2009-11-18 東北パイオニア株式会社 有機ｅｌパネルの製造方法、有機ｅｌパネルの成膜装置
KR20070043541A (ko) * 2005-10-21 2007-04-25 삼성에스디아이 주식회사 박막 증착장치 및 이를 이용한 박막 증착방법
JP4844867B2 (ja) * 2005-11-15 2011-12-28 住友電気工業株式会社 真空蒸着装置の運転方法および真空蒸着装置
KR100753145B1 (ko) * 2005-11-23 2007-08-30 주식회사 탑 엔지니어링 유기발광소자의 유기물질 증착장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100658710B1 (ko) * 2003-11-24 2006-12-15 삼성에스디아이 주식회사 유기 발광 소자의 수직 증착 방법 및 그 장치
KR20060018746A (ko) * 2004-08-25 2006-03-02 삼성에스디아이 주식회사 유기물 증착 장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160018043A (ko) * 2014-08-07 2016-02-17 주식회사 선익시스템 증착 장치
KR102158138B1 (ko) * 2014-08-07 2020-09-23 주식회사 선익시스템 증착 장치

Also Published As

Publication number Publication date
CN102934253A (zh) 2013-02-13
JP2013529257A (ja) 2013-07-18
JP5553131B2 (ja) 2014-07-16
TWI431831B (zh) 2014-03-21
WO2011155651A1 (ko) 2011-12-15
CN102934253B (zh) 2015-06-17
TW201145638A (en) 2011-12-16

Similar Documents

Publication Publication Date Title
KR101019947B1 (ko) 유기 반도체 제조장치
US9279177B2 (en) Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
KR102002849B1 (ko) 증착 장치
KR101754356B1 (ko) 증발원, 증착물질 공급장치, 및 이를 포함하는 증착장치
KR102098741B1 (ko) 증착용 기판 이동부, 이를 포함하는 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
CN103305796A (zh) 蒸发源装置及真空蒸镀装置、以及有机el显示装置的制造方法
KR20060084042A (ko) 증발원, 증착장치 및 이를 이용한 증착방법
JP2011175921A (ja) エレクトロスプレーデポジション装置及び局所成膜方法
KR102144783B1 (ko) 선형 증발원 및 이를 포함하는 증착장치
CN103031520A (zh) 蒸发源及成膜装置
KR102211969B1 (ko) 증착 장치
CN101372736A (zh) 坩埚加热装置和包括该坩埚加热装置的淀积装置
JP2013185252A (ja) 蒸発源装置及び真空蒸着装置及び有機ｅｌ表示装置の製造方法
CN103572215A (zh) 蒸镀装置及利用此的蒸镀量测量方法
CN105296928A (zh) 线光源及具备此线光源的薄膜蒸镀装置
KR101644470B1 (ko) 증착 장치
KR20130080241A (ko) 연속박막증착장치
KR101200641B1 (ko) 대면적 유기발광소자 제작용 증발원 정렬방법
KR100966089B1 (ko) 박막 코팅 장치
KR100748451B1 (ko) 유기발광소자의 증착장치
CN109708602A (zh) 测量装置
JP2013129887A (ja) 複合電極の形成方法
JP2012216374A (ja) 真空蒸着装置、真空蒸着方法、および、有機ｅｌ表示装置の製造方法
KR102427674B1 (ko) 마스크 조립체 및 이를 이용한 표시 장치의 제조장치
KR102092251B1 (ko) 증착시스템

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
E902 Notification of reason for refusal
E90F Notification of reason for final refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20140103

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20150105

Year of fee payment: 5

LAPS Lapse due to unpaid annual fee